MAX20043FGEEA/V+ [MAXIM]
Power Supply Support Circuit,;
| 型号： | MAX20043FGEEA/V+ |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | Power Supply Support Circuit, |
| 文件： | 总16页 (文件大小：1636K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
EVALUATION KIT AVAILABLE
MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors
General Description
Benefits and Features
● Accurate Bus Current Limiting with
The MAX20042F, MAX20043F, and MAX20044F devices
provide high ESD and short-circuit protection for the
low-voltage internal USB data and USB power line in auto-
motive radio, navigation, connectivity, and USB hub appli-
cations. The devices support USB Hi-Speed (480Mbps),
USB full-speed (12Mbps), and USB low-speed (1.5Mbps)
operation, as well as USB on-the-go (OTG) functionality.
Minimal Voltage Drop
• Low R
90mΩ (max) USB Power Switch
ON
• 0.65A (typ), MAX20042F
• 1.0A (typ), MAX20043F
• 1.3A (typ), MAX20044F
● Targeted Features for Optimized USB Performance
• Two R
4Ω (typ) USB 2.0 Data Switches
ON
The short-circuit protection features include short-to-
battery on the protected HVBUS, HVD+, and HVD-
outputs, as well as short-to-HVBUS on the protected
HVD+ and HVD- outputs. The devices are capable of a
short-to-battery condition of up to +18V. Short-to-GND
protection and overcurrent protection are also provided
on the protected HVBUS output to protect the internal
BUS power rail from an overcurrent fault.
• 480Mbps or 12Mbps USB 2.0 Operation
• 10ms Fault-Recovery Time
• 1ms Overcurrent Blanking Time
• 5.67V (typ) Fixed HVBUS Protection Trip Threshold
● Robust for the Automotive Environment
• Short-to-Battery and Short-to-GND Protection on
Protected HVBUS Output
• Short-to-Battery and Short-to-BUS Protection on
Protected HVD+ and HVD- Outputs
• Tested to ISO 10605 and IEC 61000-4-2 ESD
Standards
The devices feature high ESD protection to ±15kV Air Gap
and ±8kV Contact on the protected HVBUS, HVD+, and
HVD- outputs.
• 16-Pin (3.90mm x 4.94mm) QSOP Package
• -40°C to +105°C Operating Temperature Range
• AEC-Q100 Qualified
The devices feature
90mΩ (max) USB power switch, and two low on-
a low on-resistance (R ),
ON
resistance (R ), 4Ω (typ) USB 2.0 data switches. These
ON
devices also feature an enable input, a fault output, a
10ms fault-recovery time, a 1ms overcurrent blanking
time, and an integrated overcurrent autoretry.
Applications
● Automotive USB Protection
The MAX20042F, MAX20043F, and MAX20044F are
available in a lead-free, 16-pin QSOP package and
operate over the -40°C to +105°C temperature range.
Ordering Information appears at end of data sheet.
Functional Diagram appears at end of data sheet.
Typical Operating Circuit
+3.3V
IN
D-
HVD-
USB
CONNECTOR
FAULT
EN
HVD+
D+
LOW-VOLTAGE
D-
MAX20042F
MAX20043F
MAX20044F
USB
TRANSCEIVER
D+
BUS
GND
HVBUS
+ 5V
BUS
GND
19-8707; Rev 0; 1/17
MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors
Absolute Maximum Ratings
(All voltages referenced to GND.)
Continuous Power Dissipation (T = +70°C)
A
BUS, IN ...................................................................-0.3V to +6V
FAULT, EN, D+, D-..................................................-0.3V to +6V
D+, D- to IN........................................................................+0.3V
HVD+, HVD-, HVBUS ...........................................-0.3V to +18V
16-Pin QSOP (derate 9.6mW/°C above +70°C).......771.5mW
Operating Temperature Range ........................ -40°C to +105°C
Storage Temperature Range............................ -65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
(Note 1)
Package Thermal Characteristics
QSOP
Junction-to-Ambient Thermal Resistance (θ ) .....103.7°C/W
JA
Junction-to-Case Thermal Resistance (θ )...............37°C/W
JC
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V
= 5.0V V = +3.3V, T = T = -40°C to +105°C. R = ∞, unless otherwise noted. Typical values are at V
= 0V or V
= 3.3V
BUS
IN
J
A
L
EN
EN
and T = +25°C, unless otherwise noted.) (Note 2)
A
PARAMETER
POWER SUPPLY
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Power-Supply Range (BUS)
Power-Supply Range (IN)
Input Current (BUS)
V
4.75
3.0
5.5
3.6
V
V
BUS
V
IN
I
V
V
V
= 0V, I = 0A, no fault
400
10
µA
µA
V
BUS
EN
L
Input Current (IN)
I
= 0V, I = 0A, no fault
EN L
IN
BUS Undervoltage Lockout
BUS ANALOG SWITCH
HVBUS Protection Trip Threshold
Voltage Protection Response Time
Protection Recovery Time
V
falling, Figure 1
3.85
5.55
4.2
4.55
UVLO
BUS
V
HVBUS rising, Figure 2
HVBUS rising, Figure 2
HVBUS falling to below V
5.67
0.3
10
5.8
3.0
22
V
OV_BUS
t
µs
ms
FP_BUS
t
, Figure 2
OV_BUS
4.5
0.7
FPR_BUS
HVBUS Short-to-Ground
Threshold
V
SHRT
Figure 3
2.2
V
Short-to-Ground Response Time
Short Detection Time
On-Resistance
t
HVBUS falling to GND, Figure 3
Enabled into short-to-ground
0.3
2
1
µs
ms
mΩ
FPS
t
1
4
SHRT_DET
R
V
= 5V, I = 500mA (Note 2)
BUS
51
90
ON
BUS
MAX20042F, Figure 4
MAX20043F, Figure 4
MAX20044F, Figure 4
Figure 4 (Note 4)
0.57
0.88
1.14
0.35
0.65
1.00
1.30
1.2
0.73
1.12
1.46
2.8
Forward-Current Threshold
(Note 3)
I
A
THR
Overcurrent Blanking Time
Overcurrent-Retry Blanking Time
Overcurrent Autoretry Time
t
ms
ms
ms
BLANK
t
Figure 4
Figure 4
12
BLANK_RETRY
t
128
RETRY
Maxim Integrated
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MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors
Electrical Characteristics (continued)
(V
= 5.0V V = +3.3V, T = T = -40°C to +105°C. R = ∞, unless otherwise noted. Typical values are at V
= 0V or V
= 3.3V
BUS
IN
J
A
L
EN
EN
and T = +25°C, unless otherwise noted.) (Note 2)
A
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
V
V
= 18V, V
= 18V, V
= 4.75V
750
HVBUS
BUS
HVBUS Off-Leakage Current
I
µA
LKGOFF
= 0V, V = 0V
560
+175
15
HVBUS
BUS
IN
Thermal Shutdown
°C
°C
Thermal-Shutdown Hysteresis
D+, D- ANALOG USB SWITCHES
Analog Signal Range
0
3.6
3.9
V
V
HVD+, HVD- rises from V to > V + 1,
Figure 2
IN
IN
Protection Trip Threshold
Protection Response Time
V
OV_D
HVD+, HVD- rises from V to > V + 1,
Figure 2
IN
IN
t
3.0
10
8.0
22
µs
FP_D
HVD+, HVD- falling to below V
Figure 2
,
OV_D
Protection Recovery Time
On-Resistance
t
4.5
ms
FPR_D
R
ON
V
= 5V, I = 40mA, 0 ≤ V ≤ 3.6V
4
Ω
Ω
Ω
BUS
BUS
L
D_
On-Resistance Match Between
Channels
∆R
V
= 5V; I = 40mA; V = 1.5V, 3.0V
0.7
1.5
ON
L
D_
On-Resistance Flatness
R
I = 40mA, V = 0V or 0.4V
D_
1.0
FLAT(ON)
L
V
, V
= 18V; V , V = 0V
-200
+100
+200
HVD+ HVD-
D+ D-
HVD+, HVD- Off-Leakage Current
I
µA
HVD_OFF
V
V
, V
= 18V; V , V = 0V;
BUS
HVD+ HVD- D+ D-
IN
45
= 0V; V
= 0V
HVD+, HVD- On-Leakage Current
Propagation Delay
I
V
, V
= V or 0V; V = 0V
EN
+2.2
200
40
µA
ps
ps
HVD_ON
HVD+ HVD-
IN
t
, t
R = R = 50Ω, Figure 7
L S
PLH PHL
Output Skew Between Switches
t
Skew between D+ and D- switch, Figure 7
SKB
Skew between opposite transitions in
same switch, Figure 7
Output Skew Same Switch
t
40
ps
SKS
FAULT OUTPUT
FAULT Output Low Voltage
V
I
= 500µA
0.5
1
V
OL
SINK
FAULT Output High-Leakage
Current
µA
ms
FAULT-Recovery Time
EN INPUT
t
V
= V , Figure 3 (Note 3)
4.5
10
40
22
FPR
FAULT
IN
Input Logic-High
V
1.65
V
V
IH
Input Logic-Low
V
0.5
1
IL
Input Leakage Current
Enable Delay Time
I
V
= 0V or V
IN
µA
µs
EN
EN
t
D_EN
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MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors
Electrical Characteristics (continued)
(V
= 5.0V V = +3.3V, T = T = -40°C to +105°C. R = ∞, unless otherwise noted. Typical values are at V
= 0V or V
= 3.3V
BUS
IN
J
A
L
EN
EN
and T = +25°C, unless otherwise noted.) (Note 2)
A
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
ESD PROTECTION HVD+, HVD-, HVBUS
ISO 10605 Air Gap (330pF, 2kΩ)
±25
±8
ISO 10605 Contact (330pF, 2kΩ)
IEC 61000-4-2 Air Gap (150pF, 330Ω)
IEC 61000-4-2 Contact (150pF, 330Ω)
IEC 61000-4-2 Air Gap (330pF, 330Ω)
IEC 61000-4-2 Contact (330pF, 330Ω)
±15
±8
ESD Protection Level (Note 5)
V
ESD
kV
±15
±8
Note 2: Specifications with minimum and maximum limits are 100% production tested at T = +25°C and are guaranteed over the
A
operating temperature range by design and characterization. Actual typical values may vary and are not guaranteed.
Note 3: Forward current is defined as current into BUS and out of HVBUS. See the Functional Diagram.
Note 4: Guaranteed by design. Limits are not production tested.
Note 5: Tested in the Typical Application Circuit, as shown on the MAX20044 evaluation kit.
Timing Diagrams/Test Circuits
V
UVLO
V
BUS
GND
ON
OFF
ON
DEVICE
t
FPR_BUS
FAULT
GND
Figure 1. Timing Diagram for Undervoltage Lockout on BUS
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MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors
Timing Diagrams/Test Circuits (continued)
V
OV_D
OR
V
OV_BUS
DEVICE
FAULT
GND
ON
OFF
ON
t
t
FP_D
FP_BUS
t
FPR_D
t
FPR_BUS
GND
Figure 2. Timing Diagram for Overvoltage Protection on HVBUS, HVD+, and HVD-
HARD SHORT
HARD SHORT REMOVED
V
HVBUS
V
SHRT
GND
ON
OFF
ON
DEVICE
t
t
FPR
FAULT
FPS
GND
Figure 3. Timing Diagram for Short-to-Ground Protection
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MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors
Timing Diagrams/Test Circuits (continued)
I
THR
CURRENT
GND
t
t
BLANK_RETRY
BLANK
t
BLANK
t
RETRY
ON
OFF
ON
OFF
DEVICE
FAULT
GND
Figure 4. Timing Diagram for Overcurrent Protection
NETWORK
ANALYZER
V
V
OUT
ON-LOSS = 20log
IN
V
50
50
V
V
IN
D+
(D-)
OUT
CROSSTALK = 20log
V
IN
MAX20042F
MAX20043F
MAX20044F
HVD+
D+
HVD-
D-
ON-LOSS1 = 20log
ON-LOSS2 = 20log
MEAS
50
REF
OUT
HVD+
(HVD-)
HVD+
D-
50
CROSSTALK1 = 20log
CROSSTALK2 = 20log
EN
GND
HVD-
D+
ON-LOSS IS MEASURED BETWEEN D+ AND HVD+, OR D- AND HVD-.
CROSSTALK IS MEASURED FROM ONE CHANNEL TO THE OTHER CHANNEL.
SIGNAL DIRECTION THROUGH SWITCH IS REVERSED; WORST VALUES ARE RECORDED.
Figure 5. On-Channel -3dB Bandwidth and Crosstalk
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MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors
Timing Diagrams/Test Circuits (continued)
MAX20042F
MAX20043F
MAX20044F
D_ OR
HVD_
CAPACITANCE
METER
EN
GND
Figure 6. On-Capacitance
MAX20042F
MAX20043F
MAX20044F
R
R
S
S
D+
D-
HVD+
HVD-
INPUT+
INPUT-
OUT+
OUT-
RISE-TIME PROPAGATION DELAY = t
FALL-TIME PROPAGATION DELAY = t
OR t
OR t
PLHX
PLHY
PHLX
|
|
PHLY
R
R
L
t
t
= |t
= |t
- t
| OR |t
- t
SKB
SKS
PLHX PLHY
PHLX PHLY
- t
| OR |t - t
PLHY PHLY
PLHX PHLX
L
EN
V
IL
TO V
IH
t
t
INFALL
INRISE
10%
V+
90%
90%
V
INPUT+
50%
50%
50%
10%
0V
V+
V
50%
INPUT-
0V
V+
t
t
OUTRISE
10%
OUTFALL
10%
t
t
PLHX
PHLX
90%
90%
V
OUT+
50%
50%
0V
V+
50%
50%
V
OUT-
0V
t
t
PHLY
PLHY
Figure 7. Propagation Delay and Output Skew
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MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors
Typical Operating Characteristics
(T = +25°C, unless otherwise noted.)
A
BUS SUPPLY CURRENT
vs. TEMPERATURE (EN = GND)
BUS SUPPLY CURRENT
vs. TEMPERATURE (EN = VIN)
HVD+/HVD- LEAKAGE CURRENT
vs. TEMPERATURE
toc2
toc3
toc1
400
350
300
250
200
150
100
50
4.0
3.5
3.0
2.5
2.0
1.5
1.0
300
280
260
240
220
200
VEN = VIN
VEN = 0V
VBUS = 5.25V
VBUS = 5.25V
VBUS = 5.0V
VIN = 3.3V
VHVD = 3.3V
VBUS = 5.00V
VBUS = 4.75V
VBUS = 5.00V
VEN = 0V
VBUS = 4.75V
0
-40
-15
10
35
60
85
-40
-15
10
35
60
85
105
-40
-15
10
35
60
85
105
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
HVD+/HVD- LEAKAGE CURRENT
vs. TEMPERATURE
HVD+/HVD- LEAKAGE CURRENT
vs. TEMPERATURE
DATA SWITCH RON vs. APPLIED DATA VOLTAGE
toc6
toc4
toc5
3.45
3.44
3.43
3.42
3.41
3.40
14
13
12
11
10
9
6
14
13
12
11
10
9
6
VBUS =5.0V, VIN =3.3V
VBUS = 5.0V, VIN = 3.3V
IL = 40mA
VBUS = 0V, VIN = 0V
VIN = 3.6V
VN = 0V
5
4
3
5
4
3
HVD+/HVD- SHORTED TO +18V
HVD+/HVD- SHORTED TO +18V
HVD+/HVD- SHORTED TO +5V
VIN = 3.0V
HVD+/HVD- SHORTED TO +5V
VIN = 3.3V
8
8
-40
-15
10
35
60
85
105
-40
-15
10
35
60
85
105
0.0
0.6
1.2
1.8
2.4
3.0
3.6
TEMPERATURE (°C)
TEMPERATURE (°C)
APPLIED DATA VOLTAGE (V)
HVD+/HVD-SHORT-TO-BATTERY
TURN-OFF RESPONSE
HVD+/HVD-SHORT-TO-BATTERY
TURN-OFF RESPONSE
DATA SWITCH RON vs. APPLIED DATA VOLTAGE
toc8
toc9
toc7
8
6
4
2
0
VBUS = 5.0V
IL = 40mA
UNPOWERED
POWERED
VD_
5V/div
5V/div
5V/div
5V/div
VD_
TA = +105°C
VHVD_
VHVD_
2V/div
5V/div
VFAULT
VFAULT
2V/div
5V/div
TA = +25°C
2.4
TA = -40°C
VIN
VIN
0.0
0.6
1.2
1.8
3.0
3.6
40µs/div
40µs/div
APPLIED DATA VOLTAGE (V)
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MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors
Typical Operating Characteristics (continued)
(T = +25°C, unless otherwise noted.)
A
HVBUS LEAKAGE CURRENT
vs. TEMPERATURE
HVBUS LEAKAGE CURRENT
vs. TEMPERATURE
CROSSTALK
toc12
toc11
toc10
150
140
130
120
110
100
90
650
600
550
500
450
400
350
300
250
200
300
250
200
150
100
0
-10
-20
-30
-40
-50
-60
500
450
400
350
300
250
200
150
100
VBUS= 0V, VIN = 0V
VBUS = 0V, VIN = 0V
EN = 0V
VEN = 0V
V
HVBUS SHORTED TO +18V
HVBUS SHORTED TO +18V
HVBUS SHORTED TO +6V
HVBUS SHORTED TO +5V
80
70
60
105
105
-40
-15
10
35
60
85
-40
-15
10
35
60
85
10
100
1000
TEMPERATURE (°C)
TEMPERATURE (°C)
FREQUENCY (MHz)
HVBUS SHORT-TO-BATTERY
TURN-OFF RESPONSE
BUS ON RESISTANCE
vs. TEMPERATURE
BUS On Resistance Histogram
toc14
toc15
toc13
80
70
60
50
40
45
IL = 500mA
40
35
5V/div
5V/div
VBUS
VBUS = 5.00V
30
25
20
15
10
5
VHVBUS
VBUS = 4.75V
VBUS = 5.25V
VFAULT
2V/div
0
POWERED
40µs/div
-40
-15
10
35
60
85
105
TEMPERATURE (°C)
ON RESISTANCE (mOhm)
INRUSH CURRENT EN ON RESPONSE
INRUSH CURRENT EN ON RESPONSE
HVBUS SHORT-TO-BATTERY
TURN-OFF RESPONSE
WITH RC LOAD
WITH RC LOAD
toc18
toc17
toc16
VFAULT
VFAULT
2V/div
1V/div
2V/div
1V/div
5V/div
5V/div
VBUS
VBUS
VBUS
VHVBUS
220µF
100µF
VHVBUS
VHVBUS
2V/div
2A/div
2V/div
2A/div
220µF
100µF
2V/div
VFAULT
IHVBUS
IHVBUS
NOT POWERED
40µs/div
1ms/div
1ms/div
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MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors
Typical Operating Characteristics (continued)
(T = +25°C, unless otherwise noted.)
A
HVBUS OVERCURRENT AUTORETRY RESPONSE
HVBUS OVERCURRENT AUTORETRY RESPONSE
SHORT-CIRCUIT CURRENT, DEVICE ENABLED
INTO SHORT-TO-GROUND
(VHVBUS>VSHRT
)
(VHVBUS< VSHRT
)
toc20
toc21
toc19
2V/div
VEN
IHVBUS
1A/div
5V/div
IHVBUS
500mA/div
5V/div
VHVBUS
VBUS
100mA/div
IHVBUS
VHVBUS
VBUS
5V/div
5V/div
5V/div
5V/div
VFAULT
VFAULT
2ms/div
40µs/div
20ms/div
MAX20042F
CURRENT-LIMIT HISTOGRAM
MAX20043F
CURRENT-LIMIT HISTOGRAM
MAX20044F
CURRENT-LIMIT HISTOGRAM
toc24
toc22
toc23
35
30
25
60
50
30
25
40
30
20
15
20
15
20
10
0
10
5
10
0
CURRENT-LIMIT
THRESHOLD (A)
CURRENT-LIMIT
THRESHOLD (A)
CURRENT-LIMIT
THRESHOLD (A)
USB 2.0 HIGH-SPEED DIAGRAM
(NO TUNING COMPONENTS)
HVBUS INRUSH CURRENT FOR
SHORT-TO-GROUND RESPONSE
USB 2.0 HIGH-SPEED EYE DIAGRAM
W/STANDARD EV KIT TUNING COMPONENTS
toc26
toc25
toc27
5V
5V
VBUS
5V/div
0.4
0.2
0.4
VHVBUS
5V/div
0.2
0.0
3.3V
0A
0.0
VFAULT
5V/div
-0.2
-0.4
-0.2
-0.4
IHVBUS
10A/div
0.0
0.5
1.0
TIME (ns)
1.5
2.0
0.0
0.5
1.0
TIME (ns)
1.5
2.0
20µs/div
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MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors
Pin Configuration
TOP VIEW
+
I.C.
HVBUS
HVBUS
GND
1
2
3
4
5
6
7
8
16 I.C.
15 BUS
14 BUS
13 GND
12 GND
11 EN
MAX20042F
MAX20043F
MAX20044F
HVD-
HVD+
D-
10 FAULT
D+
9 IN
QSOP
Pin Description
PIN
NAME
FUNCTION
1, 16
I.C.
Internal Connection. Must be left unconnected.
Protected BUS Output. Connect HVBUS directly to the USB connector. Connect both HVBUS outputs together
for proper operation. Connect a 20V zener diode and a 0.1µF and 10µF capacitor from HVBUS to GND.
2, 3
HVBUS
4, 12, 13
GND
HVD-
HVD+
D-
Ground
5
6
7
8
High-Voltage-Protected USB Differential Data D- Output. Connect HVD- directly to USB connector D-.
High-Voltage-Protected USB Differential Data D+ Output. Connect HVD+ directly to USB connector D+.
USB Differential Data D- Input. Connect D- to low-voltage USB transceiver D-.
USB Differential Data D+ Input. Connect D+ to low-voltage USB transceiver D+.
D+
Logic Power-Supply Input. The supply voltage range is from +3.0V to +3.6V. Connect a 0.1µF and 10µF
9
IN
capacitor from IN to GND. Place these components on the same plane as the IC, close to the IN and GND
pins.
Open-Drain Fault Indicator Output. Used to indicate if an overvoltage condition exists on HVD-, HVD+,
10
FAULT or HVBUS, if an overcurrent condition exists on HVBUS, if a short-to-GND exists on HVBUS, or if an
overtemperature condition occurs.
11
EN
Active-Low Enable Input. Drive EN low to enable the device.
USB Power Supply. Connect BUS to USB +5V supply. Connect both BUS inputs together for proper
operation. Connect a 0.1µF and a 100µF, low-ESR ceramic capacitor from BUS to GND.
14, 15
BUS
Maxim Integrated
│ 11
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MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors
HVBUS Overcurrent Protection
Detailed Description
The devices have a 0.65A/1.0A/1.3A (typ) forward
current threshold ITHR. When the HVBUS forward
current exceeds the ITHR threshold, the device is turned
off. Forward current is defined as current into BUS and
out of HVBUS. See the Functional Diagram.
The MAX20042F, MAX20043F, and MAX20044F
devices provide high ESD and short-circuit
protection for the low-voltage internal USB data and
USB power line in automotive radio, navigation, con-
nectivity, and USB hub applications. The devices
support both USB Hi-Speed (480Mbps) and USB full-
speed (12Mbps) operation.
HVD+ and HVD- Overvoltage Protection
The devices have a 4.1V (typ) overvoltage threshold
(VOV_D). When HVD+, or HVD- is greater than VOV_D,
FAULT is enabled and all the device switches are high
impedance. Note that HVD+ and HVD- do not have short-
to-ground protection. Forward current is limited by the
upstream transceiver.
The short-circuit protection features include short-to-bat-
tery on the protected HVBUS, HVD+, and HVD- outputs,
as well as short-to-HVBUS on the protected HVD+ and
HVD- outputs. These devices are capable of a short-to-
battery condition of up to +18V. Short-to-GND protection
and overcurrent protection are also provided on the pro-
tected HVBUS output to protect the internal BUS power
rail from overcurrent faults.
FAULT Output
FAULT goes low when a fault is detected on HVD+, HVD-,
or HVBUS. The FAULT output is asserted low when the
device is enabled and the switches are disabled due to
a fault. Fault detection includes short-to-battery, short-
to-GND or overcurrent on HVBUS, and short-to-battery
or short-to-HVBUS on HVD+ or HVD-. Connect a 100kΩ
pullup resistor from FAULT to IN.
The devices feature high ESD protection to ±15kV Air
Gap Discharge and ±8kV Contact Discharge on all pro-
tected HVBUS, HVD+, and HVD- outputs.
The devices feature a low on-resistance (R ) 0.14Ω
ON
(max) USB power switch and two low on-resistance
(R ) of 4Ω (typ) USB 2.0 switches. These devices also
ON
feature an enable input, a fault output, a 10ms fault-re-
covery time, a 1ms overcurrent blanking time, and an
integrated overcurrent autoretry.
EN Input
EN is an active-low enable input. Drive EN low for normal
operation and enable the protection switches. This allows
BUS power, D+, and D- USB signaling to pass through
the device if a fault is not present. Drive EN high to dis-
able the device.
BUS Undervoltage Lockout (Power-On Reset)
The devices have a 4.2V (typ) undervoltage-lockout
threshold (V
). When V
is less than V
,
UVLO
BUS
UVLO
The MAX20042F, MAX20043F, and MAX20044F devices
support USB OTG. With these units, disabling the device
through the EN pin disables the +5V BUS power switch,
but leaves the D+ and D- data switches closed. This
allows for a downstream device to assume the role of
host when negotiated per the USB Host Negotiation
Protocol. In this mode, the HVBUS, HVD+, and HVD-
outputs continue to be protected and FAULT continues to
assert normally in response to overvoltage conditions on
these pins.
FAULT is enabled and all the device switches are high
impedance.
HVBUS Overvoltage Protection
The devices have a fixed 5.57V (typ) HVBUS protection
trip threshold; when HVBUS rises from V
to > 5.57V,
BUS
the device is turned off. Connect a 20V zener diode or
RC snubber network from HVBUS to GND to limit positive
inductive voltage spikes that are caused by the induc-
tance from long wires at turn-off.
HVBUS Short-to-Ground
The devices have a 0.7V (min) HVBUS short-to-ground
threshold (V
). When HVBUS falls below the V
SHRT
SHRT
threshold, the main power switch is turned off. During
continuous short-to-ground conditions, an approximately
250mA autoreset current remains active to detect removal
of the short circuit.
Maxim Integrated
│ 12
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MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors
ESD Test Conditions
Applications Information
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents test
setup, test methodology, and test results.
Power-Supply Bypass Capacitor
Bypass HVBUS to GND with a 10µF and a 0.1µF ceramic
capacitor as close to the device as possible to provide
±15kV (HBM) ESD protection on the pin. If the power
source has significant inductance due to long lead length,
take care to prevent overshoots due to the LC tank circuit
and provide protection if necessary to prevent violation
of the +6V absolute maximum rating on BUS. Connect
a 100µF low-ESR ceramic capacitor from BUS to GND.
Connect a 0.1µF and 10µF ceramic capacitor from both
BUS and IN to GND. Place these components on the
same plane as the IC, close to the IN and GND pins.
Human Body Model
Figure 8 shows the Human Body Model, and Figure 9
shows the current waveform it generates when discharged
into a low impedance. This model consists of a 100pF
capacitor charged to the ESD voltage of interest, which is
then discharged into the device through a 1.5kΩ resistor.
IEC 61000-4-2
The IEC 61000-4-2 standard covers ESD testing and
performance of finished equipment. The MAX20042F,
MAX20043F, and MAX20044F devices help users design
equipment that meets Level 4 of IEC 61000-4-2. The
main difference between tests done using the Human
Body Model and IEC 61000-4-2 is higher peak current
in IEC 61000-4-2. Because series resistance is lower in
the IEC 61000-4-2 ESD test model (Figure 10), the ESD
withstand voltage measured to this standard is generally
lower than that measured using the Human Body Model.
Figure 11 shows the current waveform for the ±8kV, IEC
61000-4-2 Level 4, ESD Contact Discharge test. The
Air-Gap Discharge test involves approaching the device
with a charged probe. The Contact Discharge method
connects the probe to the device before the probe is
energized.
Layout of USB Data Line Traces
USB Hi-Speed requires careful PCB layout with 90Ω
controlled-impedance matched traces of equal lengths.
Use LC tuning components on the data lines as shown in
the Typical Operating Circuit. The values of these com-
ponents are layout and captive-cable dependent. Contact
Maxim technical support for more detailed information.
±15kV ESD Protection
As with all Maxim devices, ESD-protection structures are
incorporated on all pins to protect against electrostatic
discharges encountered during handling and assembly.
The devices have extra protection against static elec-
tricity. Maxim’s engineers have developed state-of-the-
art structures to protect against ESD of ±15kV at the
HVD+, HVD-, and HVBUS ports without damage. The
ESD structures withstand high ESD in all states: normal
operation, shutdown, and powered down. After an ESD
event, the devices keep working without latchup, whereas
other solutions can latch and must be powered down to
remove latchup. ESD protection can be tested in various
ways; this product is characterized for protection to the
following limits:
●
●
±15kV using the Human Body Model
±15kV using IEC 61000-4-2’s Air-Gap Discharge
method, EN = GND
●
±8kV using the Contact Discharge method specified
in IEC 61000-4-2, EN = GND
Maxim Integrated
│ 13
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MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors
Functional Diagram
FORWARD DIRECTION
BUS
HVBUS
LV ESD
CLAMP
IEC
SCR
CLAMP
SHORT
TO
GROUND
FORWARD
CURRENT
DETECTION
UNDER-
VOLTAGE
LOCKOUT
OVP (SHORT-
TO-BATTERY
AND/OR
CONTROL
SHORT-
FAULT
EN
TO-V
)
HVBUS
IN
LV
ESD
CLAMP
THERMAL
SHUTDOWN
D+
HVD+
HVD-
IEC
SCR
CLAMP
D-
IEC
SCR
CLAMP
MAX20042F
MAX20043F
MAX20044F
GND
R
D
1500Ω
R
C
1MΩ
I
100%
90%
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
I
P
R
DISCHARGE
RESISTANCE
CHARGE-CURRENT-
LIMIT RESISTOR
AMPERES
36.8%
HIGH-
VOLTAGE
DC
DEVICE
UNDER
TEST
C
STORAGE
CAPACITOR
S
100pF
10%
0
SOURCE
TIME
0
t
RL
t
DL
CURRENT WAVEFORM
Figure 9. Human Body Current Waveform
Figure 8. Human Body ESD Test Model
Maxim Integrated
│ 14
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MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors
R
R
D
330Ω
C
50MΩ TO 100MΩ
I
100%
90%
DISCHARGE
RESISTANCE
CHARGE-CURRENT-
LIMIT RESISTOR
HIGH-
VOLTAGE
DC
DEVICE
UNDER
TEST
C
STORAGE
CAPACITOR
S
150pF
10%
SOURCE
30ns
t
t = 0.7ns TO 1ns
r
60ns
Figure 10. IEC 61000-4-2 ESD Test Model
Figure 11. IEC 61000-4-2 ESD Generator Current Waveform
Ordering Information
PART
CURRENT RATING (A) (typ)
OTG SUPPORT
PIN-PACKAGE
16 QSOP
16 QSOP
16 QSOP
16 QSOP
16 QSOP
16 QSOP
MAX20042FGEEA/V+
MAX20042FGEEB/V+
MAX20043FGEEA/V+
MAX20043FGEEB/V+
MAX20044FGEEA/V+
MAX20044FGEEB/V+
0.65
0.65
1.0
No
Yes
No
1.0
Yes
No
1.3
1.3
Yes
Note: All devices are specified over the -40°C to +105°C operating temperature range.
/V denotes an automotive qualified part.
+Denotes a lead(Pb)-free/RoHS-compliant package.
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
16 QSOP
E16+12C
21-0055
90-0167
Maxim Integrated
│ 15
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MAX20042F–MAX20044F
Automotive Hi-Speed USB 2.0 Protectors
Revision History
REVISION REVISION
PAGES
DESCRIPTION
CHANGED
NUMBER
DATE
0
1/17
Initial release
—
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
©
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
2017 Maxim Integrated Products, Inc.
│ 16
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