MAX1887 [MAXIM]

Quick-PWM Slave Controllers for Multiphase, Step-Down; 的Quick-PWM从控制器,用于多相,降压型
MAX1887
型号: MAX1887
厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
描述:

Quick-PWM Slave Controllers for Multiphase, Step-Down
的Quick-PWM从控制器,用于多相,降压型

控制器
文件: 总33页 (文件大小:1015K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
19-2188; Rev 1; 9/02  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
General Description  
Features  
The MAX1887/MAX1897 step-down slave controllers are  
intended for low-voltage, high-current, multiphase DC-to-  
DC applications. The MAX1887/MAX1897 slave con-  
trollers can be combined with any of Maxim’s  
Quick-PWM™ step-down controllers to form a multiphase  
DC-to-DC converter. Existing Quick-PWM controllers,  
such as the MAX1718, function as the master controller,  
providing accurate output voltage regulation, fast tran-  
sient response, and fault protection features.  
Synchronized to the master’s low-side gate driver, the  
MAX1887/MAX1897 include the Quick-PWM constant on-  
time controller, gate drivers for a synchronous rectifier,  
active current balancing, and precision current-limit cir-  
cuitry.  
o Quick-PWM Slave Controller  
o Precise, Active Current Balance (±±1.25m ꢀ  
o Accurate, Adjustable Current-Li5it Threshold  
o Opti5ized for Low-Output moltages (.mꢀ  
o 4m to .8m Battery Input Range  
o Fixed 300kHz (MAX±887ꢀ or Selectable  
.00kHz/300kHz/220kHz (MAX±897ꢀ Switching  
Frequency  
o Drive Large Synchronous-Rectifier MOSFETs  
o 2.2µA (typꢀ I  
Supply Current  
CC  
o .0µA Standby Supply Current  
The MAX1887/MAX1897 provide the same high effi-  
ciency, ultra-low duty factor capability, and excellent  
transient response as other Quick-PWM controllers. The  
MAX1887/MAX1897 differentially sense the inductor  
currents of both the master and the slave across cur-  
rent-sense resistors. These differential inputs and the  
adjustable current-limit threshold derived from an exter-  
nal reference allow the slave controller to accurately  
balance the inductor currents and provide precise cur-  
rent-limit protection. The MAX1887/MAX1897’s dual-  
purpose current-limit input also allows the slave  
controller to automatically enter a low-power standby  
mode when the master controller shuts down.  
o <±µA Shutdown (MAX±897ꢀ Supply Current  
o S5all ±6-Pin QSOP (MAX±887ꢀ, Co5pact  
.0-Pin 255 x 255 QFN (MAX±897ꢀ, or  
.0-Pin 255 x 255 Thin QFN (MAX±897ꢀ  
Ordering Information  
PART  
TEMP RANGE  
PIN-PACKAGE  
MAX±887EEE -40°C to +85°C 16 QSOP  
MAX±897EGP*  
-40°C to +85°C 20 QFN 5mm 5mm  
MAX1897ETP -40°C to +85°C 20 Thin QFN 5mm 5mm  
The MAX1887 triggers on the rising edge of the mas-  
ter’s low-side gate driver, which staggers the on-times  
of both master and slave, providing out-of-phase oper-  
ation that can reduce the input ripple current and con-  
sequently the number of input capacitors. The  
MAX1897 features a selectable trigger polarity, allowing  
out-of-phase or simultaneous in-phase operation.  
*Contact factory for availability.  
Pin Configuration  
TOP VIEW  
20  
19 18  
17 16  
Applications  
CM+  
CM-  
TON  
LX  
1
2
3
4
5
15  
14  
13  
12  
11  
Notebook Computers  
CPU Core Supply  
DH  
Single-Stage (BATT to V  
) Converters  
CORE  
SHDN  
MAX1897  
Two-Stage (5V to V  
) Converters  
CORE  
CS-  
CS+  
V
V
CC  
DD  
Servers/Desktop Computers  
Telecom  
6
7
8
9
10  
Typical Operating Circuit appears at end of data sheet.  
THIN QFN 255 x 255  
Pin Configurations continued at end of data sheet.  
Quick-PWM is a registered trademark of Maxim Integrated  
Products, Inc.  
________________________________________________________________ Maxim Integrated Products  
±
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at  
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
ABSOLUTE MAXIMUM RATINGS  
V+ to GND..............................................................-0.3V to +30V  
, V to GND (Note 3) .......................................-0.3V to +6V  
PGND to GND..................................................................... 0.3V  
TRIG, LIMIT to GND .................................................-0.3V to +6V  
SHDN to GND (MAX1897)........................................-0.3V to +6V  
ILIM, CM+, CM-, CS+, CS-, COMP  
DH to LX....................................................-0.3V to (V  
LX to BST..................................................................-6V to +0.3V  
+ 0.3V)  
BST  
V
CC DD  
Continuous Power Dissipation (T = +70°C)  
A
16-Pin QSOP (derate 8.3mW/°C above +70°C)...........667mW  
20-Pin 5mm x 5mm QFN (derate 20.0mW/°C  
above +70°C)..............................................................1.60W  
Operating Temperature Range ...........................-40°C to +85°C  
Junction Temperature......................................................+150°C  
Storage Temperature Range.............................-65°C to +150°C  
Lead Temperature (soldering, 10s) .................................+300°C  
to GND....................................................-0.3V to (V  
TON, POL to GND (MAX1897) ...................-0.3V to (V  
DL to PGND................................................-0.3V to (V  
+ 0.3V)  
+ 0.3V)  
+ 0.3V)  
CC  
CC  
DD  
BST to GND............................................................-0.3V to +36V  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional  
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
ELECTRICAL CHARACTERISTICS  
(Circuit of Figure 1, V+ = 15V, V  
= V  
= 5V, V  
= V  
= 1.2V, V  
= V  
= V  
= V  
= 1.2V, SHDN = V  
CS- CC  
CC  
DD  
OUT  
COMP  
CM+  
CM-  
CS+  
(MAX1897), T = 0°C to +82°C, unless otherwise noted. Typical values are at T = +25°C.)  
A
A
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
PWM CONTROLLER  
Battery voltage, V+  
, V  
4.0  
4.5  
28.0  
5.5  
Input Voltage Range  
On-Time (Note 1)  
V
V
CC DD  
MAX1887 (300kHz), V+ = 12V, V  
= 1.2V  
320  
171  
320  
464  
355  
390  
209  
390  
566  
COMP  
TON = GND  
TON = open  
190  
355  
515  
75  
MAX1897,  
V+ = 12V,  
t
ns  
ns  
ON  
V
= 1.2V  
COMP  
TON = V  
CC  
Trigger Delay (Note 2)  
t
TRIG  
I+  
SUPPLY CURRENTS  
Quiescent Supply Current (V+)  
Measured at V+; V  
> 0.35V  
25  
525  
<1  
40  
800  
5
µA  
µA  
ILIM  
MAX1887  
MAX1897  
Quiescent Supply Current (V  
(Note 3)  
)
)
Measured at V ; V  
DD ILIM  
> 0.35V  
DD  
I
DD  
Quiescent Supply Current (V  
(MAX1897, Note 3)  
CC  
I
Measured at V ; V > 0.35V  
CC ILIM  
525  
800  
µA  
µA  
µA  
CC  
Standby Supply Current (V+)  
Measured at V+; ILIM = GND  
<1  
20  
<1  
5
40  
5
MAX1887  
MAX1897  
Standby Supply Current (V  
(Note 3)  
)
)
Measured at V ; ILIM  
DD  
= GND  
DD  
Standby Supply Current (V  
(MAX1897, Note 3)  
CC  
Measured at V ; ILIM = GND  
20  
<1  
<1  
<1  
40  
5
µA  
µA  
µA  
µA  
CC  
Shutdown Supply Current (V+)  
(MAX1897)  
Measured at V+; V  
= V  
= 0 or 5V,  
DD  
CC  
SHDN = GND  
Shutdown Supply Current (V  
(MAX1897, Note 3)  
)
DD  
Measured at V ; SHDN = GND  
5
DD  
Shutdown Supply Current (V  
(MAX1897, Note 3)  
)
CC  
Measured at V ; SHDN = GND  
5
CC  
.
_______________________________________________________________________________________  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
ELECTRICAL CHARACTERISTICS (continued)  
(Circuit of Figure 1, V+ = 15V, V  
= V  
= 5V, V  
= V  
= 1.2V, V  
= V  
= V  
= V  
= 1.2V, SHDN = V  
CS- CC  
CC  
DD  
OUT  
COMP  
CM+  
CM-  
CS+  
(MAX1897), T = 0°C to +85°C, unless otherwise noted. Typical values are at T = +25°C.)  
A
A
PARAMETER  
CURRENT SENSING  
On-Time Adjustment Range  
COMP Output Current  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
0.42 < V  
< 2.8V, V  
0.7V  
-40  
30  
+40  
%
COMP  
OUT  
I
Sink and source  
µA  
COMP  
(V  
(V  
- V  
) -  
CM+  
CM-  
MAX1887  
MAX1897  
-1.25  
-1.25  
+1.25  
+1.25  
- V ), I  
CS- COMP  
=
CS+  
Current-Balance Offset  
mV  
mS  
0, -100mV (V  
-
CM+  
V
) +100mV  
CM-  
Current-Balance  
Transconductance  
(V  
CM+  
- V  
CM-  
) - (V  
- V ) = 25mV  
CS-  
1.2  
CS+  
Current-Sense, Common-Mode  
Range  
CM+, CM-, CS+, CS-  
CM+, CM-, CS+, CS-  
-0.2  
+2.0  
V
Current-Sense Input Current  
-1  
+1  
52.5  
102.5  
-70  
µA  
mV  
V
V
V
V
= 0.5V  
= 1V  
47.5  
97.5  
-80  
50.0  
100.0  
-75  
ILIM  
ILIM  
ILIM  
ILIM  
V
V
- V  
and  
CM+  
CS+  
CM-  
Positive Current-Limit Threshold  
V
C_LIM  
- V  
CS-  
= 0.5V  
= 1V  
Negative Current-Limit  
Threshold  
V
- V  
CS-  
mV  
CS+  
-160  
0.2  
-150  
-140  
0.3  
ILIM Standby Threshold Voltage  
ILIM Input Current  
V
-100  
+100  
nA  
µs  
V
LIMIT Propagation Delay  
LIMIT Output Low Voltage  
LIMIT Leakage Current  
FAULT PROTECTION  
t
Falling edge, 3mV over trip threshold  
= 1mA  
1.5  
LIMIT  
V
I
0.1  
OL(LIMIT)  
SINK  
I
LIMIT forced to 5.5V  
< 0.01  
1.00  
µA  
LIMIT  
V
/V  
Undervoltage Lockout  
Rising edge, hysteresis = 20mV, switching  
disabled below this level  
CC DD  
3.45  
3.85  
V
Threshold (Note 3)  
Thermal Shutdown Threshold  
GATE DRIVERS  
Rising, hysteresis = 15°C (typ)  
160  
°C  
MAX1887  
1.0  
1.0  
1.0  
1.0  
0.4  
0.4  
3.5  
4.5  
3.5  
4.5  
1.0  
2.0  
DH Gate-Driver On-Resistance  
(Note 4)  
R
V
- V forced to 5V  
A
ON(DH)  
BST  
LX  
MAX1897  
MAX1887  
MAX1897  
MAX1887  
MAX1897  
High state (pullup)  
DL Gate-Driver On-Resistance  
(Note 4)  
R
ON(DL)  
Low state (pulldown)  
DH Gate-Driver Source/Sink  
Current  
I
DH forced to 2.5V, V  
- V forced to 5V  
LX  
1.3  
DH  
BST  
DL Gate-Driver Sink Current  
I
I
DL forced to 2.5V  
DL forced to 2.5V  
DL rising  
4.0  
1.3  
35  
A
A
DL  
DL  
DL Gate-Driver Source Current  
Dead Time  
ns  
DH rising  
26  
_______________________________________________________________________________________  
3
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
ELECTRICAL CHARACTERISTICS (continued)  
(Circuit of Figure 1, V+ = 15V, V  
= V  
= 5V, V  
= V  
= 1.2V, V  
= V  
= V  
= V  
= 1.2V, SHDN = V  
CS- CC  
CC  
DD  
OUT  
COMP  
CM+  
CM-  
CS+  
(MAX1897), T = 0°C to +85°C, unless otherwise noted. Typical values are at T = +25°C.)  
A
A
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
LOGIC  
Logic Input High Voltage  
(MAX1897)  
V
SHDN, POL; V  
SHDN, POL; V  
= 4.5V to 5.5V  
= 4.5V to 5.5V  
2.4  
3.0  
V
V
V
IH  
CC  
Logic Input Low Voltage  
(MAX1897)  
V
0.8  
1.2  
IL  
CC  
High  
Low  
TRIG Logic Levels  
V
350mV hysteresis  
TRIG  
Logic high (V ; 200kHz operation)  
CC  
V
- 0.4  
CC  
TON Logic Levels (MAX1897)  
V
Open (300kHz operation)  
Logic low (GND; 550kHz operation)  
TRIG  
1.5  
3.1  
0.5  
+1  
+1  
+1  
+3  
V
TON  
-1  
-1  
-2  
-2  
SHDN (MAX1897)  
Logic Input Current  
µA  
POL (MAX1897)  
TON = GND or V  
(MAX1897)  
DD  
ELECTRICAL CHARACTERISTICS  
(Circuit of Figure 1, V+ = 15V, V  
= V  
= 5V, V  
= V  
= 1.2V, V  
= V  
= V  
= V  
= 1.2V, SHDN = V  
CS- CC  
CC  
DD  
OUT  
COMP  
CM+  
CM-  
CS+  
(MAX1897), T = -40°C to +85°C, unless otherwise noted.) (Note 5)  
A
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
PWM CONTROLLER  
MAX1887 (300kHz), V+ = 12V, V  
= 1.2V  
320  
171  
320  
464  
390  
209  
390  
566  
COMP  
TON = GND (550kHz)  
TON = open (300kHz)  
MAX1897,  
V+ = 12V,  
On Time (Note 3)  
t
ns  
ON  
V
= 1.2V  
COMP  
TON = V  
(200kHz)  
CC  
SUPPLY CURRENTS  
Quiescent Supply Current (V+)  
I+  
Measured at V+; V  
> 0.35V  
40  
800  
5
µA  
µA  
ILIM  
MAX1887  
MAX1897  
Quiescent Supply Current (V  
(Note 3)  
)
)
Measured at V  
;
DD  
DD  
I
DD  
V
> 0.35V  
ILIM  
Quiescent Supply Current (V  
(MAX1897, Note 3)  
CC  
I
Measured at V ; V  
> 0.35V  
800  
µA  
µA  
µA  
CC  
CC ILIM  
Standby Supply Current (V+)  
Measured at V+; ILIM = GND  
5
40  
5
MAX1887  
MAX1897  
Standby Supply Current (V  
(Note 3)  
)
)
Measured at V  
;
DD  
DD  
ILIM = GND  
Standby Supply Current (V  
(MAX1897, Note 3)  
CC  
Measured at V ; ILIM = GND  
40  
5
µA  
µA  
µA  
CC  
Shutdown Supply Current (V+)  
(MAX1897)  
Measured at V+; V  
= V  
= 0 or 5V,  
DD  
CC  
SHDN = GND  
Shutdown Supply Current (V  
(MAX1897, Note 3)  
)
DD  
Measured at V ; SHDN = GND  
5
DD  
4
_______________________________________________________________________________________  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
ELECTRICAL CHARACTERISTICS (continued)  
(Circuit of Figure 1, V+ = 15V, V  
= V  
= 5V, V  
= V  
= 1.2V, V  
= V  
= V  
= V  
= 1.2V, SHDN = V  
CS- CC  
CC  
DD  
OUT  
COMP  
CM+  
CM-  
CS+  
(MAX1897), T = -40°C to +85°C, unless otherwise noted.) (Note 5)  
A
PARAMETER  
SYMBOL  
CONDITIONS  
Measured at V ; SHDN = GND  
MIN  
TYP  
MAX UNITS  
Shutdown Supply Current (V  
(MAX1897, Note 3)  
)
CC  
5
µA  
CC  
CURRENT SENSING  
On-Time Adjustment Range  
COMP Output Current  
0.42 < V  
< 2.8V, V  
0.7V  
-40  
30  
+40  
%
COMP  
OUT  
I
Sink and source  
µA  
COMP  
(V  
(V  
- V  
) -  
CM+  
CS+  
CM-  
MAX1887  
MAX1897  
-2.0  
-2.0  
-0.2  
+2.0  
+2.0  
+2.0  
- V ), I  
CS- COMP  
= 0,  
Current-Balance Offset  
mV  
-100mV (V  
+100mV  
- V  
)
CM+  
CM-  
Current-Sense, Common-Mode  
Range  
CM+, CM-, CS+, CS-  
V
V
V
V
V
= 0.5V  
= 1V  
47.5  
97.5  
-80  
52.5  
102.5  
-70  
ILIM  
ILIM  
ILIM  
ILIM  
V
V
- V  
and  
CM+  
CS+  
CM-  
Positive Current-Limit Threshold  
V
mV  
C_LIM  
- V  
CS-  
= 0.5V  
= 1V  
Negative Current-Limit  
Threshold  
V
- V  
CS-  
mV  
V
CS+  
-160  
0.2  
-140  
0.3  
ILIM Standby Threshold Voltage  
FAULT PROTECTION  
V
/V  
Undervoltage Lockout  
Rising edge, hysteresis = 20mV, switching  
disabled below this level  
CC DD  
3.45  
3.85  
V
Threshold (Note 3)  
GATE DRIVERS  
MAX1887  
MAX1897  
MAX1887  
MAX1897  
MAX1887  
MAX1897  
3.5  
4.5  
3.5  
4.5  
1.0  
2.0  
DH Gate-Driver On-Resistance  
(Note 4)  
V
5V  
- V forced to  
BST LX  
R
R
ON(DH)  
High state (pullup)  
DL Gate-Driver On-Resistance  
(Note 4)  
ON(DL)  
Low state (pulldown)  
LOGIC  
High  
Low  
3.0  
TRIG Logic Levels  
V
350mV hysteresis  
V
V
TRIG  
1.2  
Logic high (V ; 200kHz operation)  
CC  
V
- 0.4  
CC  
TON Logic Levels (MAX1897)  
V
TON  
Open (300kHz operation)  
1.5  
3.1  
0.5  
Logic low (GND; 550kHz operation)  
Note 1: On-time and off-time specifications are measured from 50% point to 50% point at the DH pin with LX = PGND, V  
= 5V, and a  
BST  
500pF capacitor from DH to LX to simulate external MOSFET gate capacitance. Actual in-circuit times may be different due to  
MOSFET switching speeds.  
Note 2: The trigger delay time, t  
, is measured from the time the TRIG pin transitions to time when the DL pin goes low.  
TRIG  
Note 3: The 20-pin MAX1897 has a separate analog PWM supply voltage input (V ) and gate-driver supply input (V ). For the 16-pin  
CC  
DD  
MAX1887 device, the analog PWM supply voltage input and the gate-driver supply voltage input are internally connected and  
named V  
.
DD  
Note 4: Production testing limitations due to package handling require relaxed maximum on-resistance specifications for the MAX1897s  
QFN package. The MAX1887 and MAX1897 contain the same die, and the QFN package imposes no additional resistance in-  
circuit.  
Note 5: Specifications to -40°C are guaranteed by design and not production tested.  
_______________________________________________________________________________________  
5
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
Typical Operating Characteristics  
(Circuit of Figure 1, V+ = 12V, V  
= V  
= 5V, V  
= 1.3V (ZMODE = GND) and 1V (ZMODE = V ), SHDN = V  
(MAX1897))  
CC  
DD  
OUT  
CC  
CC  
TWO-PHASE  
EFFICIENCY vs. LOAD CURRENT  
TWO-PHASE  
EFFICIENCY vs. LOAD CURRENT  
TWO-PHASE  
OUTPUT VOLTAGE vs. LOAD CURRENT  
(V  
= 1.3V)  
(V  
= 1V)  
(V  
= 1.3V, V  
= -10mV)  
OUT  
OUT  
OUT  
OFFSET  
1.30  
100  
90  
100  
90  
V
= 12.0V  
IN  
1.29  
1.28  
1.27  
1.26  
1.25  
1.24  
1.23  
1.22  
1.21  
1.20  
V
= 8V  
V = 8V  
IN  
IN  
V
= 5V  
V = 5V  
IN  
IN  
80  
80  
70  
60  
70  
60  
V
= 12V  
V
= 12V  
IN  
IN  
50  
40  
30  
20  
50  
40  
30  
20  
V
= 20V  
V
= 20V  
IN  
IN  
0.1  
1
10  
100  
0
10  
20  
30  
40  
50  
0.1  
1
10  
100  
LOAD CURRENT (A)  
LOAD CURRENT (A)  
LOAD CURRENT (A)  
INDUCTOR CURRENT BALANCE  
vs. LOAD CURRENT  
NO-LOAD INPUT CURRENT  
vs. INPUT VOLTAGE  
TWO-PHASE  
OUTPUT VOLTAGE vs. LOAD CURRENT  
(V = 1.0V, V = -10mV)  
1.0  
80  
70  
60  
50  
40  
30  
20  
10  
0
OUT  
OFFSET  
1.00  
0.99  
0.98  
0.97  
0.96  
0.95  
0.94  
0.93  
0.92  
V
= 12.0V  
IN  
0.8  
0.6  
0.4  
I
= I + I  
BIAS DD CC  
I
IN  
0.2  
0
MASTER AND SLAVE  
0
5
10  
15  
20  
25  
30  
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
INPUT VOLTAGE (V)  
LOAD CURRENT (A)  
OFFSET VOLTAGE DEVIATION vs.  
CURRENT-SENSE COMMON-MODE VOLTAGE  
INDUCTOR CURRENT BALANCE  
vs. INPUT VOLTAGE  
OFFSET VOLTAGE DEVIATION  
vs. COMPENSATION VOLTAGE  
50  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.3  
OUT = CM+ = CM- = CS+ = CS-  
OUT = CM+ = CM- = CS+ = CS-  
0.2  
0.1  
0
I
= 40A  
OUT  
25  
0
-0.1  
-0.2  
-0.3  
I
= NO LOAD  
OUT  
-25  
-50  
0
5
10  
15  
20  
25  
-0.5  
0
0.5  
V
1.0  
(V)  
1.5  
2.0  
0
0.5  
1.0  
1.5  
2.0  
INPUT VOLTAGE (V)  
V
(V)  
OUT  
COMP  
6
_______________________________________________________________________________________  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
Typical Operating Characteristics (continued)  
(Circuit of Figure 1, V+ = 12V, V  
= V  
= 5V, V  
= 1.3V (ZMODE = GND) and 1V (ZMODE = V ), SHDN = V  
(MAX1897))  
CC  
DD  
OUT  
CC  
CC  
MINIMUM TRIGGER PULSE WIDTH  
COMPENSATION OUTPUT CURRENT vs.  
CURRENT-SENSE VOLTAGE DIFFERENTIAL  
TRIGGER PROPAGATION DELAY  
vs. OVERDRIVE VOLTAGE  
vs. OVERDRIVE VOLTAGE  
500  
100  
80  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
OUT = CM+ = CM- = CS-  
450  
400  
350  
300  
250  
200  
150  
100  
50  
I
= G (V - V  
)
COMP  
M
CS+  
CS-  
ON-TIME TRIGGERED  
ABOVE THE LINE  
60  
40  
20  
RISING (OUT-OF-PHASE)  
0
RISING (OUT-OF-PHASE)  
FALLING (IN-PHASE)  
-20  
-40  
-60  
-80  
-100  
FALLING (IN-PHASE)  
0
0
0
0.5  
1.0  
1.5  
2.0  
-150 -100  
-50  
V
0
50  
100  
150  
0
0.5  
1.0  
1.5  
2.0  
OVERDRIVE VOLTAGE (V)  
- V (V)  
OVERDRIVE VOLTAGE (V)  
CS+  
CS-  
POSITIVE CURRENT-LIMIT THRESHOLD  
vs. ILIM VOLTAGE  
160  
140  
120  
100  
80  
60  
MASTER OR SLAVE  
40  
20  
0
0
0.5  
1.0  
1.5  
V
(V)  
ILIM  
_______________________________________________________________________________________  
7
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
Typical Operating Characteristics (continued)  
(Circuit of Figure 1, V+ = 12V, V  
= V  
= 5V, V  
= 1.3V (ZMODE = GND) and 1V (ZMODE = V ), SHDN = V  
(MAX1897))  
CC  
DD  
OUT  
CC  
CC  
SWITCHING WAVEFORMS  
(OUT-OF-PHASE)  
SWITCHING WAVEFORMS  
(IN-PHASE)  
MAX1887 toc14  
MAX1887 toc15  
A
A
20mV/div  
20mV/div  
B
20A  
20A  
B
5A/div  
5A/div  
10V  
0
10V  
0
C
C
10V/div  
10V/div  
1µs/div  
1µs/div  
A. OUTPUT VOLTAGE, V = 1.290V (NO LOAD),  
A. OUTPUT VOLTAGE, V  
= 1.290V (NO LOAD),  
OUT  
OUT  
B. MASTER/SLAVE INDUCTOR CURRENTS  
B. MASTER/SLAVE INDUCTOR CURRENTS  
C. MASTER/SLAVE LX WAVEFORMS,  
C. MASTER/SLAVE LX WAVEFORMS,  
V
IN  
= 12.0V, I  
= 40A, POL = V (MAX1897)  
V
IN  
= 12.0V, I  
= 40A, POL = GND (MAX1897)  
OUT  
OUT  
CC  
LOAD TRANSIENT  
(OUT-OF-PHASE)  
LOAD TRANSIENT  
(IN-PHASE)  
MAX1887 toc16  
MAX1887 toc17  
40A  
5A  
40A  
5A  
A
A
40A/div  
40A/div  
B
B
1.282V  
1.282V  
50mV/div  
50mV/div  
C
C
0
0
10A/div  
0
10A/div  
D
D
0
10A/div  
10A/div  
20µs/div  
20µs/div  
A. LOAD CURRENT, I  
= 5A TO 40A  
OUT  
A. LOAD CURRENT, I  
= 5A TO 40A  
OUT  
OUT  
OUT  
B. OUTPUT VOLTAGE, V  
= 1.290V (NO LOAD)  
B. OUTPUT VOLTAGE, V  
= 1.290V (NO LOAD)  
C. SLAVE INDUCTOR CURRENT  
C. SLAVE INDUCTOR CURRENT  
D. MASTER INDUCTOR CURRENT  
V = 12.0V, POL = GND (MAX1897)  
IN  
D. MASTER INDUCTOR CURRENT  
V
IN  
= 12.0V, POL = V (MAX1897)  
CC  
8
_______________________________________________________________________________________  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
Typical Operating Characteristics (continued)  
(Circuit of Figure 1, V+ = 12V, V  
= V  
= 5V, V  
= 1.3V (ZMODE = GND) and 1V (ZMODE = V ), SHDN = V  
(MAX1897))  
CC  
DD  
OUT  
CC  
CC  
STARTUP WAVEFORM  
(NO LOAD)  
DYNAMIC OUTPUT VOLTAGE TRANSITION  
MAX1887 toc19  
MAX1887 toc18  
5.0V  
0
A
A
5V  
5V/div  
5V/div  
0
B
B
1.3V  
1.1V  
200mV/div  
1V  
1.0V/div  
0
0
C
C
0
0
10A/div  
10A/div  
D
D
10A/div  
0
10A/div  
100µs/div  
40µs/div  
A. MASTER SHUTDOWN, V  
= 0 TO 5V  
A. ZMODE = 0 TO 5V  
SHDN  
= 1.290V (NO LOAD)  
B. OUTPUT VOLTAGE, V  
B. OUTPUT VOLTAGE, V  
= 1.30V (ZMODE = GND)  
OUT  
OUT  
C. SLAVE INDUCTOR CURRENT  
D. MASTER INDUCTOR CURRENT  
OR 1.10V (ZMODE = V  
C. SLAVE INDUCTOR CURRENT  
D. MASTER INDUCTOR CURRENT  
)
CC  
STARTUP WAVEFORM  
(20A LOAD)  
SHUTDOWN WAVEFORM  
MAX1887 toc21  
MAX1887 toc20  
A
5V  
0
5V  
0
A
5V/div  
5V/div  
B
B
1V  
0
1.0V/div  
1.0V/div  
0
C
10A/div  
C
0
0
0
0
D
10A/div  
D
10A/div  
10A/div  
100µs/div  
100µs/div  
A. MASTER SHUTDOWN, V  
A. MASTER SHUTDOWN, V  
= 0 TO 5V  
= 5V TO 0  
SHDN  
= 1.290V (NO LOAD)  
OUT  
SHDN  
= 1.290V (NO LOAD)  
B. OUTPUT VOLTAGE, V  
B. OUTPUT VOLTAGE, V  
OUT  
C. SLAVE INDUCTOR CURRENT  
D. MASTER INDUCTOR CURRENT  
C. SLAVE INDUCTOR CURRENT  
D. MASTER INDUCTOR CURRENT  
R
OUT  
= 65m(I  
= 20A)  
OUT  
_______________________________________________________________________________________  
9
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
Pin Description  
PIN  
NAME  
DESCRIPTION  
MAX1887  
MAX1897  
Dual-Mode Current-Limit Adjustment and Standby Input. The current-limit threshold  
voltage is 1/10 the voltage seen at ILIM (V  
drops below 250mV, the slave controller enters a low-power standby mode, forcing  
DL high and DH low.  
) over a 400mV to 1.5V range. If V  
ILIM  
ILIM  
1
19  
ILIM  
Trigger Input. Connect to the master controllers low-side gate driver. For the  
MAX1887, a rising edge triggers a single cycle. For the MAX1897, the trigger inputs  
2
20  
TRIG  
polarity is pin selectable. POL = V  
or floating triggers on the rising edge (out-of-  
CC  
phase operation), and POL = GND triggers on the falling edge (in-phase operation).  
3
4
1
2
CM+  
CM-  
Master Controllers Positive Current-Sense Input  
Master Controllers Negative Current-Sense Input  
On-Time Selection Control Input. This is a three-level input used to determine the DH  
on time (see On-Time Control and Active Current Balancing). For the MAX1897,  
connect TON as follows for the indicated switching frequencies:  
GND = 550kHz  
3
TON  
floating = 300kHz  
V
= 200kHz.  
CC  
For the MAX1887, the switching frequency is internally configured for 300kHz  
operation. The slave controllers switching frequency should be selected to closely  
match the frequency of the master PWM controller.  
5
6
4
5
CS-  
Slave Controllers Negative Current-Sense Input  
Slave Controllers Positive Current-Sense Input  
CS+  
Current Balance Compensation. Connect a series resistor and capacitor between  
COMP and OUT. See the Current Balance Compensation section.  
7
6
7
COMP  
POL  
TRIG Polarity Select Input. Connect POL to V or float to trigger on the rising edge of  
CC  
TRIG (out-of-phase operation). Connect POL to GND to trigger on the falling edge of TRIG  
(in-phase operation). For the MAX1887, POL is internally connected to V  
.
CC  
8
9
8
9
GND  
Analog Ground. Connect the MAX1897s exposed pad to analog ground.  
PGND  
Power Ground  
Low-Side Gate-Driver Output. DL swings from PGND to V . DL is forced high  
DD  
when the MAX1897 enters standby or shutdown mode.  
10  
10  
DL  
Supply Voltage Input for the DL Gate Driver. For the MAX1887, V also serves as  
DD  
the analog supply voltage input that powers the PWM core. Connect to the system  
supply voltage (4.5V to 5.5V). Bypass to PGND with a 1µF or greater ceramic  
capacitor, as close to the IC as possible.  
11  
11  
V
V
DD  
CC  
Analog Supply Voltage Input for PWM Core. Connect V  
to the system supply  
CC  
12  
13  
voltage (4.5V to 5.5V) through a series 10resistor. Bypass to GND with a 0.22µF  
or greater ceramic capacitor, as close to the MAX1897 as possible.  
Active-Low Shutdown Input. A logic low shuts down the MAX1897 slave controller,  
SHDN  
immediately pulling DL high and DH low. Connect to V for normal operation.  
CC  
10 ______________________________________________________________________________________  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
Pin Description (continued)  
PIN  
NAME  
DESCRIPTION  
MAX1887  
MAX1897  
12  
14  
DH  
LX  
High-Side Gate-Driver Output. DH swings from LX to BST.  
Inductor Connection. Connect LX to the switched side of the inductor. LX serves as  
the lower supply rail for the DH high-side gate driver.  
13  
14  
15  
16  
Boost Flying-Capacitor Connection. Connect to an external capacitor and diode  
according to the Standard Application Circuit (Figure 1). An optional resistor in  
series with BST allows DH pullup current to be adjusted.  
BST  
V+  
Battery Voltage Sense Connection. Connect V+ to the input power source. V+ is  
used only for PWM one-shot timing (see the On-Time Control and Active Current  
Balancing section).  
15  
16  
17  
18  
Open-Drain Current-Limit Output. Connect to the master controllers adjustable current-  
limit input (ILIM) according to the Standard Application Circuit (Figure 1). When the  
voltage across the master controllers current-sense resistor (V  
LIMIT  
- V ) exceeds the  
CM-  
CM+  
current-limit threshold (V /10), the MAX1887/MAX1897 pulls LIMIT low.  
ILIM  
Detailed Description  
Table 1. Component Selection for Standard  
Applications  
The MAX1887/MAX1897 step-down slave controllers  
are intended for low-voltage, high-current, multiphase  
DC-to-DC applications. The MAX1887/MAX1897 slave  
controllers can be combined with any of Maxims  
Quick-PWM step-down controllers to form a multiphase  
DC-to-DC converter. When compared to single-phase  
operation, multiphase conversion lowers the peak  
inductor current by distributing the load current  
between parallel power paths. This simplifies compo-  
nent selection, power distribution to the load, and ther-  
mal layout. Existing Quick-PWM controllers, such as the  
MAX1718, function as the master controller, providing  
accurate output voltage regulation, fast transient  
response, and multiple fault protection features.  
Synchronized to the masters low-side gate driver, the  
MAX1887/MAX1897 include a constant on-time con-  
troller, synchronous rectifier gate drive, active current  
balancing, and precision current-limit circuitry.  
COMPONENT  
Output Voltage  
CIRCUIT OF FIGURE 1  
0.6V to 1.75V  
7V to 24V  
Input Voltage Range  
Maximum Load Current  
40A  
0.6µH  
Sumida CDEP134H-0R6 or  
Panasonic ETQP6F0R6BFA  
Inductor (each phase)  
Frequency  
300kHz (TON = float)  
High-Side MOSFET  
(N , each phase)  
H
International Rectifier  
(2) IRF7811W  
International Rectifier  
(2) IRF7822 or  
Fairchild (3) FDS7764A or  
Low-Side MOSFET  
(N , each phase)  
L
On-Time Control and Active  
Current Balancing  
(6) 10µF 25V  
Taiyo Yuden  
TMK432BJ106KM or  
TDK C4532X5R1E106M  
Input Capacitor (C  
)
IN  
The MAX1887/MAX1897 slave controller uses a con-  
stant on-time, voltage feed-forward architecture similar  
to Maxims Quick-PWM controllers (Figure 2). The con-  
trol algorithm is simple: the high-side switch on-time is  
determined solely by a one-shot whose period is  
inversely proportional to input voltage and directly pro-  
(8) 270µF 2V  
Panasonic EEFUE0E271R  
Output Capacitor (C  
)
OUT  
Current-Sense Resistors  
(R and R  
1.5mΩ  
portional to the compensation voltage (V  
).  
COMP  
)
CM  
CS  
Another one-shot sets a minimum off-time (130ns typi-  
cal). The on-time one-shot is triggered when the follow-  
ing conditions are satisfied: The slave detects a  
Voltage Positioning Gain  
(A  
2
)
VPS  
______________________________________________________________________________________ 11  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
Table 2. Component Suppliers  
PHONE  
MANUFACTURER  
WEBSITE  
[COUNTRY CODE]  
MOSFETS  
Fairchild Semiconductor  
International Rectifier  
Siliconix  
[1] 888-522-5372  
[1] 310-322-3331  
[1] 203-268-6261  
www.fairchildsemi.com  
www.irf.com  
www.vishay.com  
CAPACITORS  
Kemet  
[1] 408-986-0424  
[1] 847-468-5624  
www.kemet.com  
Panasonic  
www.panasonic.com  
[65] 281-3226 (Singapore)  
[1] 408-749-9714  
Sanyo  
www.secc.co.jp  
[03] 3667-3408 (Japan)  
[1] 408-573-4150  
Taiyo Yuden  
www.t-yuden.com  
INDUCTORS  
Coilcraft  
[1] 800-322-2645  
[1] 561-752-5000  
[1] 408-982-9660  
www.coilcraft.com  
www.coiltronics.com  
www.sumida.com  
Coiltronics  
Sumida  
transition on the TRIG input, the slave controllers  
inductor current is below its current-limit threshold, and  
the minimum off time has expired. For the MAX1887, a  
rising edge on the trigger input (TRIG) initiates a new  
cycle. For the MAX1897, the trigger inputs polarity is  
to CS-) become unbalanced, the transconductance  
amplifiers adjust the slave controllers on time, allowing  
the slave inductor current to increase or decrease until  
the current-sense signals are properly balanced.  
V
selected by connecting POL to V  
GND (falling edge).  
(rising edge) or to  
CC  
COMP  
t
= K  
= K  
ON  
V
IN  
At the slave controllers core is the one-shot that sets  
the high-side switchs on-time. This fast, low-jitter one-  
shot adjusts the on-time in response to the input volt-  
age and the difference between the inductor currents in  
the master and the slave. Two identical transconduc-  
V
I
Z
OUT  
COMP C  
+K  
V
V
IN  
IN  
= (Masters on time) + (Slaves on-time  
correction due to current imbalance)  
tance amplifiers (G  
= G ) integrate the difference  
MS  
MM  
between the master and slave current-sense signals.  
The summed output is connected to COMP, allowing  
adjustment of the integration time constant with a com-  
pensation capacitor connected at COMP. The resulting  
compensation current and voltage may be determined  
by the following equations:  
This control algorithm results in balanced inductor cur-  
rents with the slave switching frequency synchronized  
to the master. Since the master operates at nearly con-  
stant frequency, the slave will as well. The benefits of a  
constant switching frequency are twofold: first, the fre-  
quency can be selected to avoid noise-sensitive  
regions of the spectrum; second, the inductor ripple-  
current operating point remains relatively constant,  
resulting in easy design methodology and predictable  
output voltage ripple.  
I
= G  
V
V  
G  
V
V  
(
)
(
)
COMP  
MM CM+ CM−  
MS CS+ CS−  
V
= V  
+I  
Z
COMP  
OUT COMP COMP  
where Z  
is the impedance at the COMP output.  
Multiple phase switching effectively distributes the load  
among the external components, thereby improving the  
overall efficiency. Distributing the load current between  
multiple phases lowers the peak inductor current by the  
COMP  
The PWM controller uses this integrated signal (V  
)
COMP  
to set the slave controllers on time. When the master  
and slave current-sense signals (CM+ to CM- and CS+  
12 ______________________________________________________________________________________  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
R6  
10Ω  
C2  
0.22µF  
5V BIAS  
SUPPLY  
C1  
1µF  
V
CC  
VGATE  
D0  
V
DD  
TO LOGIC  
INPUT  
8V TO 24V  
C
IN  
D1  
D2  
D3  
D4  
V+  
DAC  
INPUTS  
(6) 10µF 25V CERAMIC  
DM  
BST  
C
BST(M)  
0.1µF  
DH  
LX  
DL  
N
N
H(M)  
L(M)  
L
R
CM  
S0  
S1  
SUSPEND  
INPUTS  
M
0.6µF  
1.5mΩ  
ZMODE  
SUS  
MUX CONTROL  
C
CC  
47pF  
R5  
GND  
OVP  
CC  
5V BIAS  
SUPPLY  
510Ω  
R13  
0Ω  
C
REF  
0.22µF  
REF  
R8  
53.6kΩ  
R
FB  
100Ω  
MAX1718  
FLOAT  
(300kHz)  
FB  
TON  
C
FB  
1000pF  
SKP/SDN  
ON  
OFF  
NEG  
POS  
R9  
100kΩ  
R3  
1kΩ  
R4  
1kΩ  
R
TIME  
62kΩ  
ILIM  
C5  
470pF  
TIME  
R2  
2.8kΩ  
R10  
34.8kΩ  
DS  
R1  
301kΩ  
TRIG  
V+  
BST  
5V BIAS  
SUPPLY  
V
DD  
C
BST(S)  
0.1µF  
C3  
SHDN  
R7  
10Ω  
1µF  
MAX1897  
LIMIT  
N
N
DH  
LX  
DL  
H(S)  
V
CC  
C4  
OUTPUT  
L
S
0.22µF  
POL  
R
CS  
1.5mΩ  
0.6µH  
C
OUT  
L(S)  
(8) 270µF  
FLOAT  
(300kHz)  
TON  
C
COMP  
470pF  
R
COMP  
10kΩ  
PGND  
CS+  
FB  
COMP  
R13  
200Ω  
(MASTER)  
REF  
(MAX1718)  
R14  
200Ω  
C7  
R11  
113kΩ  
4700pF  
CS-  
POWER GROUND  
I
LIM  
C6  
100pF  
ANALOG GROUND  
(MASTER)  
CM+  
R12  
R15  
200Ω  
C8  
4700pF  
30.1kΩ  
ANALOG GROUND  
(SLAVE)  
CM-  
GND  
R16  
200Ω  
Figure 1. Standard Application Circuit  
______________________________________________________________________________________ 13  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
Q
TRIG  
MAX1887  
(MAX1897)*  
TOFF  
ONE-SHOT  
BST  
DH  
LX  
R
S
Q
Q
(V )*  
CC  
TRIG  
TON  
Q
CONTROLLER  
BIAS  
V
DD  
(SHDN)*  
ONE-SHOT  
DL  
(TON)*  
ON-TIME  
COMPUTE  
PGND  
V+  
COMP  
TRIG  
CS-  
Q
TRIG  
(POL)*  
EDGE  
DETECTOR  
GMS  
NEGATIVE  
CS LIMIT  
POSITIVE  
CS LIMIT  
CS+  
CM+  
GMM  
ILIM  
CM-  
17R  
R
LIMIT  
2R  
GND  
POSITIVE  
CM LIMIT  
Figure 2. Functional Diagram  
number of phases (1/η) when compared to a single-  
phase converter. This significantly reduces the I2R loss-  
es across the inductors series resistance, the  
MOSFETs on-resistance, and the board resistance.  
In-Phase and Out-of-Phase Operation  
Multiphase systems can stagger the on times of each  
phase (out-of-phase operation) or simultaneously turn on  
all phases at the beginning of a new cycle (in-phase  
operation). When configured for out-of-phase operation,  
high input-to-output differential voltages (V > ηV  
)
IN  
OUT  
14 ______________________________________________________________________________________  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
prevent the on times from overlapping. Therefore, the  
put voltage. Another benefit of forced-PWM operation,  
the switching frequency remains relatively constant  
over the full load and input voltage ranges.  
instantaneous input current peaks of each phase do  
not overlap, resulting in reduced input and output volt-  
age ripple and RMS ripple current. This lowers the  
input and output capacitor requirements, which allows  
fewer or less expensive capacitors, and decreases  
shielding requirements for EMI. When the on-times  
5V Bias Supply (V  
and V  
)
CC  
DD  
The MAX1887/MAX1897 require an external 5V bias  
supply in addition to the battery. Typically this 5V bias  
supply is the notebooks 95% efficient 5V system sup-  
ply. Keeping the bias supply external to the IC  
improves efficiency, eliminates power dissipation limita-  
tions, and removes the cost associated with the inter-  
nal, 5V linear regulator that would otherwise be needed  
to supply the PWM circuit and gate drivers. If stand-  
alone capability is needed, the 5V supply can be gen-  
erated with an external linear regulator.  
overlap at low input-to-output differential voltages (V  
IN  
< ηV  
OUT  
), the input currents of the overlapping phases  
may sum together, increasing the total input and output  
ripple voltage and RMS ripple current.  
During in-phase operation, the input capacitors must  
support large, instantaneous input currents when the  
high-side MOSFETs turn on simultaneously, resulting in  
increased ripple voltage and current when compared  
to out-of-phase operation. The higher RMS ripple cur-  
rent degrades efficiency due to power loss associated  
with the input capacitors effective series resistance  
(ESR). This typically requires a large number of low-  
ESR input capacitors in parallel to meet input ripple  
current ratings or minimize ESR-related losses.  
The 20-pin MAX1897 has a separate analog PWM sup-  
ply voltage input (V ) and gate-driver supply input  
CC  
(V ). For the 16-pin MAX1887 device, the analog  
DD  
PWM supply voltage input and the gate-driver supply  
voltage input are internally connected and named V  
.
DD  
and  
The battery input (V+) and 5V bias inputs (V  
CC  
V
) can be tied together if the input source is a fixed  
DD  
For the MAX1897, the polarity select input (POL) deter-  
mines whether rising edges (POL = V ) or falling  
CC  
4.5V to 5.5V supply.  
The maximum current required from the 5V bias supply  
edges (POL = GND) trigger a new cycle. For low duty-  
cycle applications (duty factor < 50%), triggering on  
the rising edge of the masters low-side gate driver pre-  
vents both high-side MOSFETs from turning on at the  
same time. Staggering the phases in this way lowers  
the input ripple current, thereby reducing the input  
capacitor requirements. For applications operating with  
approximately a 50% duty factor, out-of-phase opera-  
to power V  
power) is:  
(PWM controller) and V  
(gate-drive  
DD  
CC  
I
= I + f (Q + Q ) = 10mA to 45mA (typ)  
CC SW G1 G2  
BIAS  
where I  
is 525µA typical, f  
is the switching  
SW  
CC  
frequency, and Q  
and Q  
are the MOSFET data  
G2  
G1  
sheetstotal gate charge specification limits at  
= 5V.  
tion (POL = V ) causes the slave controller to com-  
CC  
V
GS  
plete an on-pulse coincident to the master controller  
determining when to initiate its next on-time. The noise  
generated when the slave controller turns off its high-  
side MOSFET could compromise the master controllers  
feedback voltage and current-sense inputs, causing  
inaccurate decisions that lead to more jitter in the  
switching waveforms. Under these conditions, trigger-  
ing off of the falling edge (POL = GND) of the masters  
low-side gate driver forces the controllers to operate in-  
phase, improving the systems noise immunity.  
Shutdown (MAX1897 only)  
When SHDN is driven low, the MAX1897 enters the  
micropower shutdown mode (Table 3). Shutdown  
immediately forces DL high, pulls DH low, and shuts  
down the PWM controller so the total supply current  
(I  
+ I  
+ I+) drops below 1µA. When SHDN is dri-  
ven high, the MAX1897 operates normally with the  
PWM controller enabled.  
CC  
DD  
Table 3. Approximate K-Factor Errors  
Forced-PWM Mode  
The MAX1887/MAX1897 controllers do not allow light-  
load pulse skipping. Therefore, the master controller  
must be configured for forced-PWM operation. This  
PWM control scheme forces the low-side gate drive  
waveform to be the complement of the high-side gate  
drive waveform, allowing the inductor current to  
reverse. During negative load and downward output  
voltage transitions, forced-PWM operation allows the  
converter to sink current, rapidly pulling down the out-  
MAX  
TON  
CONNECTION  
(MAX1897)*  
FREQUENCY  
SETTING  
(kHz)  
K-FACTOR  
(µs)  
K-FACTOR  
ERROR  
(%)  
V
200  
300  
550  
5
10  
10  
10  
CC  
Float  
GND  
3.3  
1.8  
*The MAX1887 is internally preset for 300kHz operation.  
______________________________________________________________________________________ 15  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
Table 4. Operating Mode Truth Table  
SHDN  
ILIM  
DL  
MODE  
COMMENTS  
Micropower, shutdown mode (I +I < 1µA typ). DL forced high,  
CC DD  
GND  
X
High  
Shutdown  
DH forced low, and the PWM controller disabled.  
Low-power, standby mode (I + I = 20µA typ). DL forced high,  
CC  
DD  
GND  
(< 0.25V)  
DH forced low, and the PWM controller disabled. However, the bias  
and fault protection circuitry remain active so the MAX1887/MAX1897  
can continuously monitor the ILIM input.  
V
V
High  
Standby  
CC  
High  
(> 0.25V)  
Normal  
Operation  
Low-noise, fixed-frequency, PWM operation. The inductor current  
reverses with light loads.  
Switching  
CC  
X = Dont Care  
Several Quick-PWM converters that may be used as the  
master controller ramp down the output voltage at a  
controlled slew rate when shut down. When combined  
with these master controllers, the MAX1897 must not be  
deactivated until the output voltage is fully discharged.  
Otherwise the slaves low side switch will turn on while  
the master is still attempting to regulate the output. In  
these applications, delay the shutdown input signal to  
side gate driver, the slave cannot initiate a new on-time  
pulse so the slaves inductor current ramps down as  
well, maintaining the current balance. Therefore, the  
slaves valley current limit only needs to protect the  
slave controller if the current-balance circuitry or the  
master current limit fails. The slaves ILIM input voltage  
should be selected to properly adjust the masters cur-  
rent-limit threshold.  
the MAX1897 or permanently connect SHDN to V  
and use standby mode to conserve power (see the  
Standby Mode section).  
CC  
Dual-Mode ILIM Input  
The current-limit input (ILIM) features dual-mode opera-  
tion, serving as both the standby mode control input  
and the current-limit threshold adjustment. The slave  
controller enters a low-power standby mode when the  
Standby Mode  
The MAX1887/MAX1897 slave controllers enter a low-  
power standby mode when the ILIM voltage (V  
)
ILIM voltage (V  
) is pulled below 250mV. For ILIM  
ILIM  
ILIM  
drops below 250mV (Table 4). Similar to shutdown  
mode, standby forces DL high, pulls DH low, and dis-  
ables the PWM controller to inhibit switching; however,  
the bias and fault protection circuitry remain active so  
the MAX1887/MAX1897 can continuously monitor the  
voltages from 400mV to 1.5V, the current-limit threshold  
voltage is precisely 0.1 V . The current-limit volt-  
age may be accurately set with a resistive voltage-  
divider between the master controllers reference and  
GND, allowing the MAX1887/MAX1897 to automatically  
enter the low-power standby mode.  
ILIM  
ILIM input. When V  
is driven above 250mV, the  
ILIM  
PWM controller is enabled.  
Slave Current Limit  
The slave current-limit circuit employs a unique valley”  
current-sensing algorithm. If the current-sense signal is  
above the current-limit threshold, the MAX1887/ MAX1897  
will not initiate a new cycle (Figure 3). The actual peak  
inductor current is greater than the current-limit threshold  
by an amount equal to the inductor ripple current.  
Therefore, the exact current-limit characteristic and maxi-  
mum load capability are a function of the current-limit  
threshold, inductor value, and input voltage. The reward  
for this uncertainty is robust, overcurrent sensing. When  
combined with master controllers that contain output  
undervoltage protection circuits, this current-limit method  
is effective in almost every circumstance.  
When the slave controllers current-limit voltage (V  
)
ILIM  
is set through a resistive divider between the master  
controllers reference and GND (see the Current-Limit  
Circuitry section), the MAX1887/MAX1897 automatically  
enters low-power standby mode when the master con-  
troller shuts down. As the masters reference powers  
down, the resistive divider pulls ILIM below 250mV,  
automatically activating the MAX1887/MAX1897s low-  
power standby mode.  
Current-Limit Circuitry  
When the masters inductor current exceeds its valley  
current limit, the master extends its off time by forcing  
DL high until the inductor current falls below the current-  
limit threshold. Without a transition on the masters low-  
16 ______________________________________________________________________________________  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
The slave includes a precision current-limit comparator  
that supplements the masters current-limit circuitry.  
The MAX1887/MAX1897 uses CM+ and CM- to differ-  
I
I
I
PEAK  
LOAD  
LIMIT  
entially sense the masters inductor current across a  
current-sense resistor, providing a more accurate cur-  
rent limit. When the masters current-sense voltage  
exceeds the current limit set by ILIM in the slave (see  
the Dual-Mode ILIM Input section), the open-drain cur-  
rent-limit comparator pulls LIMIT low (Figure 2). Once  
the master triggers the current limit, a pulse-width mod-  
ulated output signal appears at LIMIT. This signal is fil-  
tered and used to adjust the masters current-limit  
threshold.  
2 - LIR  
2η  
I
= I  
LIMIT(VALLEY) LOAD(MAX)  
( )  
High-Side, Gate Driver Supply (BST)  
The gate drive voltage for the high-side, N-channel  
MOSFET is generated by the flying capacitor boost cir-  
cuit (Figure 4). The capacitor between BST and LX is  
alternately charged from the external 5V bias supply  
0
TIME  
Figure 3. ValleyCurrent-Limit Threshold Point  
(V ) and placed in parallel with the high-side MOSFETs  
DD  
There also is a negative current limit that prevents  
excessive reverse inductor currents when V  
ing current. The negative current-limit threshold is set to  
approximately 150% of the positive current-limit thresh-  
old, and tracks the positive current limit when ILIM is  
adjusted.  
gate-source terminals.  
is sink-  
OUT  
On startup, the synchronous rectifier (low-side MOSFET)  
forces LX to ground and charges the boost capacitor to  
5V. On the second half of each cycle, the switch-mode  
power supply turns on the high-side MOSFET by closing  
an internal switch between BST and DH. This provides  
the necessary gate-to-source voltage to turn on the high-  
side switch, an action that boosts the 5V gate drive signal  
above the systems main supply voltage (V+).  
The MAX1887/MAX1897 uses CS+ and CS- to differen-  
tially measure the current across an external sense  
resistor (R ) connected between the inductor and out-  
CS  
put capacitors. This configuration provides precise cur-  
rent balancing, current limiting, and voltage positioning  
with a 1% current-sense resistor. Reducing the sense  
voltage decreases power dissipation but increases the  
relative measurement error.  
INPUT  
(V  
)
IN  
C
BYP  
Carefully observe the PC board layout guidelines to  
ensure that noise and DC errors dont corrupt the current-  
sense signals measured at CS+ and CS-. The IC should  
be mounted relatively close to the current-sense resistor  
with short, direct traces making a Kelvin sense connec-  
tion.  
V+  
D
BST  
(R )*  
BST  
BST  
DH  
LX  
C
BST  
N
H
Master Current-Limit Adjustment (LIMIT)  
The Quick-PWM controllers that may be used as the  
master controller typically use the low-side MOSFETs  
on-resistance as its current-sense element. This depen-  
dence on a loosely specified resistance with a large  
temperature coefficient causes inaccurate current limit-  
ing. As a result, high current-limit thresholds are need-  
ed to guarantee full-load operation under worst-case  
conditions. Furthermore, the inaccurate current limit  
mandates the use of MOSFETs and inductors with  
excessively high current and power dissipation ratings.  
L
MAX1887  
MAX1897  
( )* OPTIONAL–THE RESISTOR REDUCES  
THE SWITCHING-NODE RISE TIME.  
Figure 4. High-Side Gate Driver Boost Circuitry  
______________________________________________________________________________________ 17  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
MOSFET Gate Drivers (DH, DL)  
Thermal-Fault Protection  
The DH and DL drivers are optimized for driving moder-  
ately sized, high-side and larger, low-side power  
MOSFETs. This is consistent with the low duty factor  
seen in the notebook CPU environment, where a large  
The MAX1887/MAX1897 feature a thermal fault-protec-  
tion circuit. When the junction temperature rises above  
+160°C, a thermal sensor activates the standby logic,  
forces the DL low-side gate driver high, and pulls the  
DH high-side gate driver low. This quickly discharges  
the output capacitors, tripping the master controllers  
undervoltage lockout protection. The thermal sensor  
reactivates the slave controller after the junction tem-  
perature cools by 15°C.  
V
- V  
differential exists. An adaptive dead-time  
OUT  
IN  
circuit monitors the DL output and prevents the high-  
side FET from turning on until DL is fully off. There must  
be a low resistance, low inductance path from the DL  
driver to the MOSFET gate in order for the adaptive  
dead-time circuit to work properly. Otherwise, the sense  
circuitry in the MAX1887/MAX1897 will interpret the  
MOSFET gate as offwhile there is actually charge still  
left on the gate. Use very short, wide traces (50mils to  
100mils wide if the MOSFET is 1 inch from the device).  
The dead time at the other edge (DH turning off) is  
determined by a fixed 35ns internal delay.  
Design Procedure  
Firmly establish the input voltage range and maximum  
load current before choosing a switching frequency  
and inductor operating point (ripple-current ratio). The  
primary design trade-off lies in choosing a good switch-  
ing frequency and inductor operating point, and the fol-  
lowing four factors dictate the rest of the design:  
The internal pulldown transistor that drives DL low is  
robust, with a 0.4(typ) on-resistance. This helps pre-  
vent DL from being pulled up during the fast rise-time of  
the LX node, due to capacitive coupling from the drain  
to the gate of the low-side synchronous-rectifier MOS-  
FET. However, for high-current applications, some com-  
binations of high- and low-side FETs may cause  
excessive gate-drain coupling, leading to poor efficien-  
cy, EMI, and shoot-through currents. This is often reme-  
died by adding a resistor less than 5in series with  
BST, which increases the turn-on time of the high-side  
FET without degrading the turn-off time (Figure 4).  
Input Voltage Range: The maximum value (V  
)
IN(MAX)  
must accommodate the worst-case high AC adapter  
voltage. The minimum value (V ) must account for  
IN(MIN)  
the lowest input voltage after drops due to connectors,  
fuses, and battery selector switches. If there is a choice  
at all, lower input voltages result in better efficiency.  
Maximum Load Current: There are two values to con-  
sider. The peak load current (I  
) determines  
LOAD(MAX)  
the instantaneous component stresses and filtering  
requirements, and thus drives output capacitor selec-  
tion, inductor saturation rating, and the design of the  
current-limit circuit. The continuous load current (I  
)
LOAD  
Undervoltage Lockout  
undervoltage lockout (UVLO)  
determines the thermal stresses and thus drives the  
selection of input capacitors, MOSFETs, and other criti-  
cal heat-contributing components. Modern notebook  
During startup, the V  
CC  
circuitry forces the DL gate driver high and the DH gate  
driver low, inhibiting switching until an adequate supply  
CPUs generally exhibit I  
= I  
80%.  
LOAD  
LOAD(MAX)  
voltage is reached. Once V  
rises above 3.75V, valid  
CC  
For multiphase systems, each phase supports a frac-  
tion of the load, depending on the current balancing.  
The highly accurate current sensing and balancing  
implemented by the MAX1887/MAX1897 slave con-  
troller evenly distributes the load among each phase:  
transitions detected at the trigger input initiate a corre-  
sponding on-time pulse (see the On-Time Control and  
Active Current Balancing section). To ensure correct  
startup, the MAX1887/MAX1897 slave controllers  
undervoltage lockout voltage must be lower than the  
master controllers undervoltage lockout voltage.  
If the V  
voltage drops below 3.75V, it is assumed that  
I
CC  
LOAD  
η
I
= I  
=
LOAD(SLAVE)  
LOAD(MASTER)  
there is not enough supply voltage to make valid deci-  
sions. To protect the output from overvoltage faults, DL  
is forced high in this mode to force the output to  
ground. This results in large negative inductor current  
where η is the number of phases.  
Switching Frequency: This choice determines the  
basic trade-off between size and efficiency. The opti-  
mal frequency is largely a function of maximum input  
voltage, due to MOSFET switching losses that are pro-  
and possibly small negative output voltages. If V  
is  
CC  
likely to drop in this fashion, the output can be clamped  
with a Schottky diode to PGND to reduce the negative  
excursion.  
portional to frequency and V 2. The optimum frequen-  
IN  
cy also is a moving target, due to rapid improvements  
18 ______________________________________________________________________________________  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
in MOSFET technology that are making higher frequen-  
Find a low-loss inductor having the lowest possible DC  
resistance that fits in the allotted dimensions. Ferrite  
cores are often the best choice, although powdered  
iron is inexpensive and can work well at 200kHz. The  
core must be large enough not to saturate at the peak  
cies more practical.  
Setting Switch On Time: The constant on-time control  
algorithm in the master results in a nearly constant  
switching frequency despite the lack of a fixed-frequen-  
cy clock generator. In the slave, the high-side switch on  
time is inversely proportional to V+ and directly propor-  
inductor current (I  
):  
PEAK  
2 + LIR  
2η  
tional to the compensation voltage (V  
):  
COMP  
I
= I  
LOAD(MAX)  
PEAK  
V
COMP  
t
=K  
ON  
where η is the number of phases.  
V
IN  
Transient Response  
where K is internally preset to 3.3µs for the MAX1887 or  
externally set by the TON pin-strap connection for the  
MAX1897 (Table 3)  
The inductor ripple current affects transient-response  
performance, especially at low V - V  
differentials.  
OUT  
IN  
Low inductor values allow the inductor current to slew  
faster, replenishing charge removed from the output fil-  
ter capacitors by a sudden load step. The amount of  
output sag also is a function of the maximum duty fac-  
tor, which can be calculated from the on time and mini-  
mum off time:  
Set the nominal on time in the slave to match the on  
time in the master. An exact match is not necessary  
because the MAX1887/MAX1897 have wide t  
adjust-  
ON  
ment ranges ( 40%). For example, if t  
in the master  
ON  
is set to 250kHz, the slave can be set to either 200kHz  
or 300kHz and still achieve good performance. Care  
should be taken to ensure that the COMP voltage  
remains within its output voltage range (0.42V to  
2.80V).  
V
K
2
OUT  
L I  
+ t  
(
)
(
LOAD(MAX)  
OFF(MIN)  
V
IN  
V
=
SAG  
Inductor Operating Point: This choice provides trade-  
offs between size vs. efficiency and transient response  
vs. output noise. Low inductor values provide better  
transient response and smaller physical size, but also  
result in lower efficiency and higher output noise due to  
increased ripple current. The minimum practical induc-  
tor value is one that causes the circuit to operate at the  
edge of critical conduction (where the inductor current  
just touches zero with every cycle at maximum load).  
Inductor values lower than this grant no further size-  
reduction benefit. The optimum operating point is usu-  
ally found between 20% and 50% ripple current.  
V
V  
OUT  
K
)
IN  
2ηC  
V
OUT OUT  
OFF(MIN)  
t  
V
IN  
where t  
is the minimum off time (see the  
OFF(MIN)  
Electrical Characteristics section), η is the number of  
phases, and K is from Table 3.  
The amount of overshoot due to stored inductor energy  
can be calculated as:  
2
I  
L
(
)
LOAD(MAX)  
V
SOAR  
2ηC  
V
OUT OUT  
Inductor Selection  
The switching frequency and operating point (% ripple  
or LIR) determine the inductor value as follows:  
Setting the Current Limits  
The master and slave current-limit thresholds must be  
great enough to support the maximum load current,  
even under worst-case operating conditions. Since the  
masters current limit determines the maximum load  
(see the Current-Limit Circuitry section), the procedure  
for setting the current limit is sequential. First, the mas-  
ters current limit is set based on the operating condi-  
tions and the characteristics of the low-side MOSFETs.  
Then the slave controller is configured to adjust the  
masters current-limit threshold based on the precise  
current-sense resistor value and variation in the MOS-  
FET characteristics. Finally, the resulting valley current  
limit for the slaves inductor occurs above the masters  
V
x V V  
xη  
xLIR  
(
)
OUT  
IN  
OUT  
L =  
V xf xI  
IN SW LOAD(MAX)  
where η is the number of phases. Example: η = 2,  
= 40A, V = 12V, V = 1.3V, f = 300kHz,  
I
LOAD  
IN  
OUT  
SW  
30% ripple current or LIR = 0.3:  
1.3Vx 12V 1.3V x2  
(
)
L =  
= 0.64µH  
12Vx300kHzx40Ax0.3  
______________________________________________________________________________________ 19  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
SLAVE  
CONTROLLER  
MASTER  
CONTROLLER  
R
C
1
R
B
V
=
=
V
REF  
ILIM  
REF  
ITHM(HIGH)  
10 R +R  
A
B
C
REF  
R
D
1
R //R  
B LIMIT  
MAX1887  
MAX1897  
MAX1718  
V
V
REF  
ITHM(HIGH)  
10 R + R //R  
(
)
A
B
LIMIT  
R
R
A
B
R
LIMIT  
LIMIT  
ILIM  
1
R
D
10 R +R  
V
=
V
REF  
ITHS  
C
LIMIT  
C
D
Figure 5. Setting the Adjustable Current Limits  
current-limit threshold. This is acceptable since the  
slaves inductor current limit only serves as a fail-safe in  
case the master and slave inductor currents become  
significantly unbalanced during a transient.  
to support the maximum load current for the maximum  
and minimum current-limit tolerance value:  
R
DS(ON)  
V
(I  
)R  
ITHM(HIGH)  
LIMIT(VALLEY) DS(ON)(MAX)  
where V  
, the masters current-limit threshold, is typ-  
ITHM  
The basic operating conditions are determined using  
the same calculations provided in any Quick-PWM reg-  
ulator data sheet. The valley of the inductor current  
ically 1/10th the voltage seen at the masters ILIM input  
(V = 0.1 x V , see the master con-  
ITHM  
LIM(MASTER)  
trollers data sheet). Connect a resistive voltage-divider  
from the master controllers internal reference to GND,  
with the masters ILIM input connected to the center tap  
(Figure 5). Use 1% tolerance resistors in the divider with  
10µA to 20µA DC bias current to prevent significant  
errors due to the ILIM pins input current:  
(I  
) occurs at I  
divided by the  
LOAD(MAX)  
LIMIT(VALLEY)  
number of phases minus half of the peak-to-peak  
inductor current:  
I
I  
LOAD(MAX)  
INDUCTOR  
I
LIMIT(VALLEY)  
−  
η
2
V
V
ILIM(MASTER)  
ILIM(MASTER)  
R ≤  
B
where the peak-to-peak inductor current may be deter-  
mined by the following equation:  
20µA  
10µA  
V
REF(MASTER)  
1 R  
B
R
=
A
V
V
V  
(
)
V
OUT IN OUT  
ILIM(MASTER)   
I  
=
INDUCTOR  
V f  
L
IN SW  
Configure the slave controller so its LIMIT output begins  
to roll off after the master current-limit threshold occurs:  
The masters high current-limit threshold must be set  
high enough to support the maximum load current,  
even when the masters current-limit threshold is at its  
minimum tolerance value, as described in the master  
controllers data sheet. Most Quick-PWM controllers  
that may be chosen as the master controller use the  
low-side MOSFETs on-resistance to sense the inductor  
current. In these applications, the worst-case maximum  
V
ITHM(HIGH)  
V
R  
+ ∆I  
INDUCTOR  
ITHS  
CM  
R
DS(ON)(MAX)  
where V  
, the slaves current-limit threshold, is pre-  
ITHS  
cisely one-tenth the voltage seen at the slaves ILIM  
input (V = 0.1 V ). Connect a second  
ITHS  
ILIM(SLAVE)  
value for R  
DS(ON)  
plus some margin for the rise in  
DS(ON)  
resistive voltage-divider from the master controllers  
internal reference to GND, with the slaves ILIM input  
connected to the center tap (Figure 5). The external  
adjustment range of 400mV to 1.5V corresponds to a  
R
over temperature must be used to determine  
the masters current-limit threshold. A good general rule  
is to allow 0.5% additional resistance for each °C of  
temperature rise. Set the master current-limit threshold  
20 ______________________________________________________________________________________  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
current-limit threshold of 40mV to 150mV. Use 1% toler-  
2) Determine the masters current-limit threshold from  
the valley current limit and low-side MOSFETsmax-  
imum on-resistance over temperature:  
ance resistors in the divider with 10µA to 20µA DC bias  
current to prevent significant errors due to the ILIM  
pins input current. Reducing the current-limit threshold  
voltage lowers the sense resistors power dissipation,  
but this also increases the relative measurement error:  
V
21.8A 6m= 130mV  
ITH(MASTER)  
Now select the resistive-divider values (R and R  
A
B
V
V
ILIM(SLAVE)  
in Figure 5) to set the appropriate voltage at the  
ILIM(SLAVE)  
R  
D
masters ILIM input:  
20µA  
10µA  
V
10x130mV  
10x130mV  
REF(MASTER)  
1 R  
D
R
=
R =  
to  
= 65kto130kΩ  
C
B
V
20µA  
10µA  
ILIM(SLAVE)   
Selecting R = 100k1% provides the following  
Now, set the current-limit adjustment ratio (A  
=
B
ADJ  
value for R :  
V
/V  
) greater than the maximum to  
A
ITHM(HIGH) ITHM(LOW)  
minimum on-resistance ratio (A  
= R  
/
DS(ON)(MAX)  
RDS  
R
):  
2V  
DS(ON)(MIN)  
R
=
1 x100k54kΩ  
A
10x130mV  
A
A  
ADJ  
ROS  
R
R //R  
DS(ON)(MAX)  
A
B
3) Determine the slaves current-limit threshold:  
1+  
R
R
DS(ON)(MIN)  
LIMIT  
130mV  
6mΩ  
V
1.5mx  
+ 6.4A 42mV  
Increasing A  
improves the masters current-limit  
ADJ  
ITHS  
accuracy but also increases the current limits noise  
sensitivity. Therefore, R  
following equation:  
may be selected using the  
LIMIT  
Select the resistive-divider values (R and R in  
Figure 5) to set the appropriate voltage at the  
C
D
slaves ILIM input:  
R //R R  
(
)
A
B
DS(ON)(MIN)  
R  
R
LIMIT  
R
DS(ON)(MAX)  
DS(ON)(MIN)  
10x42mV  
10x42mV  
R
=
to  
= 21kto42kΩ  
D
20µA  
10µA  
Finally, verify that the total load on the masters refer-  
ence does not exceed 50µA:  
Selecting R = 30.1k1% provides the following  
D
A
value for R :  
V
V
REF  
REF  
I
=
+
50µA  
BIAS(TOTAL)  
R
+ R  
D
R
+ R //R  
(
)
C
A
B
LIMIT  
2V  
R
=
1 x30.1k113kΩ  
C
10x42mV  
Current Limit Design Example  
For the typical application circuit shown in Figure 1: V  
IN  
LOAD(MAX)  
= 6m, R  
DS(ON)(MIN )  
4) Determine R  
(Figure 5) from the above equation:  
LIMIT  
= 12V, V  
= 1.3V, f  
= 300kHz, η = 2, I  
OUT  
SW  
= 50A, L = 0.6µH, R  
= 3mΩ  
DS(ON)(MAX)  
53.6k//100kx3mΩ  
(
)
R
35kΩ  
LIMIT  
6mΩ − 3mΩ  
1) Determine the peak-to-peak inductor current and  
the valley current limit:  
5) Finally, verify that that the total bias currents do not  
exceed the 50µA maximum load of the masters ref-  
erence:  
1.3Vx 12V 1.3V  
(
)
I  
=
= 6.4A  
INDUCTOR  
12Vx300kHzx0.6µH  
2V  
50A  
2
1
2
  
I
=
+
BIAS(TOTAL)  
I
=
x6.4A = 21.8A  
LIMIT(VALLEY)  
54kΩ + 100k//34.8kΩ  
(
)
2V  
30.1kΩ +113kΩ  
= 36µA  
______________________________________________________________________________________ 21  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
SLAVE CURRENT-LIMIT VOLTAGES  
vs. AVERAGE INDUCTOR CURRENT  
160  
V
ITHS  
I
= I  
=
ADJ(MIN) PEAK  
R
140  
120  
100  
80  
CM  
V
ITHM(HIGH)  
MASTER  
CONTROLLER  
V
ITHM(LOW)  
R
R
V
I
= R  
I
CS LS(PEAK)  
60  
CM LM(PEAK)  
SLAVE  
CONTROLLER  
I
= R  
I
CS LS(VALLEY)  
CM LM(VALLEY)  
40  
ITHS  
20  
V
(V - V  
IN SW  
)
OUT  
OUT IN  
I - I  
ADJ  
=
INDUCTOR  
[
]
V
f
L
0
0
10  
20  
30  
40  
50  
AVERAGE INDUCTOR CURRENT (A)  
MASTER CURRENT-LIMIT VOLTAGES  
vs. AVERAGE INDUCTOR CURRENT  
160  
140  
120  
100  
80  
A
- 1  
RDS  
UNADJUSTED I  
≤ ∆I  
= V  
LIMIT ITHM(HIGH)  
LIMIT  
(
R
)
DS(ON)(MAX)  
V
ITHM(HIGH)  
ADJUSTED I  
≤ ∆I  
INDUCTOR  
LIMIT  
V
R
ITHM(LOW)  
60  
= L  
= L  
DS(ON)(MIN)  
LM(VALLEY)  
LM(VALLEY)  
40  
R
DS(ON)(MIN)  
20  
0
0
10  
20  
30  
40  
50  
AVERAGE INDUCTOR CURRENT (A)  
Figure 6. Master/Slave Current-Limit Thresholds  
When unadjusted, the on-resistance variation of the  
low-side MOSFETs results in a maximum current-limit  
rent-limit variation from 21.7A (unadjusted) to less than  
6.4A (adjusted).  
variation (I  
) determined by the following equation:  
LIMIT  
Output Capacitor Selection  
The output filter capacitor must have low enough effec-  
tive series resistance (ESR) to meet output ripple and  
load-transient requirements, yet have high enough ESR  
to satisfy stability requirements.  
A
1  
RDS  
UnadjustedI  
= V  
LIMIT  
ITHM(HIGH)  
R
DS(ON)(MAX)   
where A  
= R  
/R  
. Using the  
RDS  
DS(ON)(MAX) DS(ON)(MIN)  
In CPU V  
converters and other applications where  
CORE  
MAX1887/MAX1897 to adjust the masters current-limit  
threshold results in a maximum current-limit variation  
less than the peak-to-peak inductor current:  
the output is subject to large load transients, the output  
capacitor selection typically depends on how much  
ESR is needed to prevent the output from dipping too  
low under a load transient. Ignoring the sag due to  
finite capacitance:  
Adjusted I  
≤ ∆I  
INDUCTOR  
LIMIT  
As shown in Figure 6, the resulting current-limit varia-  
tion of the master is dramatically reduced. For the  
above example, this control scheme reduces the cur-  
V
STEP  
LOAD(MAX)  
R
ESR  
I  
22 ______________________________________________________________________________________  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
In non-CPU applications, the output capacitor selection  
Output Capacitor Stability Considerations  
For Quick-PWM controllers, stability is determined by  
the value of the ESR zero relative to the switching fre-  
quency. The boundary of instability is given by the fol-  
lowing equation:  
often depends on how much ESR is needed to maintain  
an acceptable level of output ripple voltage. The output  
ripple voltage of a step-down controller equals the total  
inductor ripple current multiplied by the output capaci-  
tors ESR. When operating multiphase systems out-of-  
phase, the peak inductor currents of each phase are  
staggered, resulting in lower output ripple voltage by  
reducing the total inductor ripple current. For out-of-  
phase operation, the maximum ESR to meet ripple  
requirements is:  
fSW  
π
fESR  
1
where:  
fESR  
=
2πRESRCOUT  
V
RIPPLE  
R
ESR  
For a standard 300kHz application, the ESR zero fre-  
quency must be well below 95kHz, preferably below  
50kHz. Tantalum, Sanyo POSCAP, and Panasonic SP  
capacitors in wide-spread use at the time of publication  
have typical ESR zero frequencies below 30kHz. In the  
standard application used for inductor selection, the  
  
η
L
V
ηV  
V
IN  
OUT  
OUT  
η1 V  
OUT TRIG  
t
(
)
  
  
f
V
IN  
SW  
This equation may be rewritten as the single phase rip-  
ple current minus a correction due to the additional  
phases:  
ESR needed to support a 30mV  
ripple is 30mV/(40A  
P-P  
x 0.3) = 2.5m. Eight 270µF/2V Panasonic SP capaci-  
tors in parallel provide 1.9m(max) ESR. Their typical  
combined ESR results in a zero at 39kHz.  
V
RIPPLE  
R
ESR  
V
OUT  
I
LIRη η1  
t
+ t  
ON TRIG  
(
)
(
)
LOAD(MAX)  
L
Dont put high-value ceramic capacitors directly across  
the output without taking precautions to ensure stability.  
Ceramic capacitors have a high ESR zero frequency  
and may cause erratic, unstable operation. However,  
its easy to add enough series resistance by placing  
the capacitors a couple of centimeters downstream  
from the junction of the inductor and FB pin.  
where t  
is the MAX1887/MAX1897s trigger propa-  
TRIG  
gation delay, η is the number of phases, and K is from  
Table 3. When operating the MAX1897 in-phase (POL  
= GND), the high-side MOSFETs turn on together, so  
the output capacitors must simultaneously support the  
combined inductor ripple currents of each phase. For  
in-phase operation, the maximum ESR to meet ripple  
requirements is:  
Unstable operation manifests itself in two related but  
distinctly different ways: double-pulsing and feedback  
loop instability. Double-pulsing occurs due to noise on  
the output or because the ESR is so low that there isnt  
enough voltage ramp in the output voltage signal. This  
foolsthe error comparator into triggering a new cycle  
immediately after the minimum off-time period has  
expired. Double-pulsing is more annoying than harmful,  
resulting in nothing worse than increased output ripple.  
However, it can indicate the possible presence of loop  
instability due to insufficient ESR. Loop instability can  
result in oscillations at the output after line or load  
steps. Such perturbations are usually damped, but can  
cause the output voltage to rise above or fall below the  
tolerance limits.  
V
V
RIPPLE  
RIPPLE  
R
=
ESR  
I
LIR  
  
η
V
LOAD(MAX)  
OUT  
V
IN  
V
V  
OUT  
(
)
IN  
  
  
f
L
SW  
The actual capacitance value required relates to the  
physical size needed to achieve low ESR, as well as to  
the chemistry of the capacitor technology. Thus, the  
capacitor is usually selected by ESR and voltage rating  
rather than by capacitance value (this is true of tanta-  
lums, OS-CONs, and other electrolytics).  
When using low-capacity filter capacitors such as  
ceramic or polymer types, capacitor size is usually  
The easiest method for checking stability is to apply a  
very fast zero-to-max load transient and carefully  
observe the output voltage ripple envelope for over-  
shoot and ringing. It can help to simultaneously monitor  
determined by the capacity needed to prevent V  
SAG  
and V  
from causing problems during load tran-  
SOAR  
sients. Generally, once enough capacitance is added to  
meet the overshoot requirement, undershoot at the ris-  
the switching waveforms (V and/or I  
). Dont  
INDUCTOR  
LX  
ing load edge is no longer a problem (see the V  
and  
allow more than one cycle of ringing after the initial  
step-response under/overshoot.  
SAG  
V
SOAR  
equations in the Transient Response section).  
______________________________________________________________________________________ 23  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
the minimum power dissipation occurs where the resis-  
Input Capacitor Selection  
tive losses equal the switching losses.  
The input capacitor must meet the ripple current  
requirement (I  
) imposed by the switching currents.  
RMS  
Choose a low-side MOSFET that has the lowest possi-  
The MAX1887/MAX1897 multiphase slave controllers  
operate out-of-phase (MAX1897 POL = V or float),  
ble on-resistance (R  
), comes in a moderate-  
DS(ON)  
CC  
sized package (i.e., one or two SO-8s, DPAK or  
D2PAK), and is reasonably priced. Make sure that the  
DL gate driver can supply sufficient current to support  
the gate charge and the current injected into the para-  
sitic gate-to-drain capacitor caused by the high-side  
MOSFET turning on; otherwise, cross-conduction prob-  
lems may occur.  
staggering the turn-on times of each phase. This mini-  
mizes the input ripple current by dividing the load cur-  
rent among independent phases:  
V
V
V  
OUT  
(
)
I
OUT IN  
LOAD  
I
=
RMS  
η
V
IN  
MOSFET Power Dissipation  
Worst-case conduction losses occur at the duty factor  
for out-of-phase operation.  
extremes. For the high-side MOSFET (N ), the worst-  
H
case power dissipation due to resistance occurs at the  
minimum input voltage:  
When operating the MAX1897 in-phase (POL = GND),  
the high-side MOSFETs turn on simultaneously, so  
input capacitors must support the combined input rip-  
ple currents of each phase:  
2
V
V
I
LOAD  
OUT  
PD(N Resistive) =  
R
DS(ON)  
H
η
IN  
V
V
V  
OUT  
(
)
OUT IN  
Generally, a small high-side MOSFET is desired to  
reduce switching losses at high input voltages.  
I
=I  
RMS LOAD  
V
IN  
However, the R  
required to stay within package  
DS(ON)  
power-dissipation often limits how small the MOSFET  
can be. Again, the optimum occurs when the switching  
for in-phase operation.  
losses equal the conduction (R  
) losses. High-  
DS(ON)  
For most applications, nontantalum chemistries (ceram-  
ic, aluminum, or OS-CON) are preferred because of  
their resistance to inrush surge currents typical of sys-  
tems with a mechanical switch or connector in series  
with the input. If the MAX1887/MAX1897 is operated as  
the second stage of a two-stage power-conversion sys-  
tem, tantalum input capacitors are acceptable. In either  
configuration, choose an input capacitor that exhibits  
less than +10°C temperature rise at the RMS input cur-  
rent for optimal circuit longevity.  
side switching losses dont usually become an issue  
until the input is greater than approximately 15V.  
Calculating the power dissipation of the high-side  
MOSFET (N ) due to switching losses is difficult since it  
H
must allow for difficult quantifying factors that influence  
the turn-on and turn-off times. These factors include the  
internal gate resistance, gate charge, threshold volt-  
age, source inductance, and PC board layout charac-  
teristics. The following switching-loss calculation  
provides only a very rough estimate and is no substi-  
tute for breadboard evaluation, preferably including  
Power MOSFET Selection  
Most of the following MOSFET guidelines focus on the  
challenge of obtaining high load-current capability  
when using high-voltage (>20V) AC adapters. Low-cur-  
rent applications usually require less attention.  
verification using a thermocouple mounted on N :  
H
2
V
C
f I  
RSS SW LOAD  
(
)
IN(MAX)  
PD(N Switching) =  
H
I
η
GATE  
The high-side MOSFET (N ) must be able to dissipate  
H
the resistive losses plus the switching losses at both  
where C  
and I  
is the reverse transfer capacitance of N  
H
RSS  
V
and V  
. Calculate both of these sums.  
IN(MAX)  
is the peak gate-drive source/sink current  
IN(MIN)  
Ideally, the losses at V  
GATE  
should be roughly equal  
IN(MIN)  
(1A typ).  
to losses at V  
, with lower losses in between. If  
IN(MIN)  
IN(MAX)  
Switching losses in the high-side MOSFET can become  
an insidious heat problem when maximum AC adapter  
the losses at V  
are significantly higher than the  
losses at V  
, consider increasing the size of N .  
IN(MAX)  
H
voltages are applied, due to the squared term in the C  
2
Conversely, if the losses at V  
are significantly  
IN(MAX)  
V  
f  
switching-loss equation. If the high-side  
SW  
IN  
higher than the losses at V  
, consider reducing  
IN(MIN)  
MOSFET chosen for adequate R  
voltages becomes extraordinarily hot when biased from  
at low battery  
DS(ON)  
the size of N . If V does not vary over a wide range,  
H
IN  
24 ______________________________________________________________________________________  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
V
, consider choosing another MOSFET with  
Balancing section). To reduce noise pick-up in applica-  
tions that have a widely distributed layout, it is some-  
times helpful to connect the compensation network to  
IN(MAX)  
lower parasitic capacitance.  
For the low-side MOSFET (N ), the worst-case power  
L
dissipation always occurs at maximum input voltage:  
quiet analog ground rather than V  
.
OUT  
2
Applications Information  
V
I
LOAD  
OUT  
R
DS(ON)  
L
PD(N Resistive) = 1  
   
Voltage Positioning and  
Effective Efficiency  
V
η
IN(MAX)   
Powering new mobile processors requires careful  
attention to detail to reduce cost, size, and power dissi-  
pation. As CPUs became more power hungry, it was  
recognized that even the fastest DC-DC converters  
were inadequate to handle the transient power require-  
ments. After a load transient, the output instantly  
The worst case for MOSFET power dissipation occurs  
under heavy overloads that are greater than  
LOAD(MAX)  
the current limit and cause the fault latch to trip. To pro-  
tect against this possibility, overdesignthe circuit to  
tolerate:  
I
but are not quite high enough to exceed  
changes by ESR  
I  
. Conventional DC-DC  
LOAD  
COUT  
I
LIR  
converters respond by regulating the output voltage  
back to its nominal state after the load transient occurs  
(Figure 7). However, the CPU only requires that the out-  
put voltage remain above a specified minimum value.  
Dynamically positioning the output voltage to this lower  
limit allows the use of fewer output capacitors and  
reduces power consumption under load.  
LOAD(MAX)  
I
= ηI  
+
LOAD  
VALLEY(MAX)  
2
where I  
is the maximum valley current  
VALLEY(MAX)  
allowed by the current-limit circuit, including threshold  
tolerance and on-resistance variation. The MOSFETs  
must have a good-sized heatsink to handle the over-  
load power dissipation.  
For a conventional (nonvoltage-positioned) circuit, the  
total voltage change is:  
Choose a Schottky diode (D1) with a forward voltage  
low enough to prevent the low-side MOSFET body  
diode from turning on during the dead time. As a gen-  
eral rule, select a diode with a DC current rating equal  
to 1/(3η) of the load current. This diode is optional and  
can be removed if efficiency is not critical.  
V
P-P  
1 = 2 (ESR  
I  
) + V + V  
LOAD SAG SOAR  
COUT  
where V  
and V  
are defined in Figure 8. Setting  
SOAR  
SAG  
the converter to regulate at a lower voltage when under  
load allows a larger voltage step when the output cur-  
rent suddenly decreases (Figure 7). So the total voltage  
change for a voltage-positioned circuit is:  
Current Balance Compensation (COMP)  
The current balance compensation capacitor (C  
)
COMP  
integrates the difference of the master and slave cur-  
rent-sense signals, while the compensation resistor  
improves transient response by increasing the phase  
margin. This allows the user to optimize the dynamics  
of the current balance loop. Excessively large capacitor  
values increase the integration time constant, resulting  
in larger current differences between the phases during  
transients. Excessively small capacitor values allow the  
current loop to respond cycle by cycle but can result in  
small DC current variations between the phases.  
Likewise, excessively large series resistance can also  
cause DC current variations between the phases. Small  
series resistance reduces the phase margin, resulting  
in marginal stability in the current balance loop. For  
most applications, a 470pF capacitor and 10kseries  
resistor from COMP to the converters output voltage  
works well.  
V
2 = (ESR  
I  
) + V  
+ V  
P-P  
COUT  
LOAD  
SAG SOAR  
where V  
and V  
are defined in the Design  
SOAR  
SAG  
Procedure section. Since the amplitudes are the same  
for both circuits (V 1 = V 2), the voltage-positioned  
P-P  
P-P  
circuit tolerates twice the ESR. Since the ESR specifica-  
tion is achieved by paralleling several capacitors, fewer  
units are needed for the voltage-positioned circuit.  
An additional benefit of voltage positioning is reduced  
power consumption at high load currents. Since the  
output voltage is lower under load, the CPU draws less  
current. The result is lower power dissipation in the  
CPU, although some extra power is dissipated in  
R
. For a nominal 1.6V, 22A output (R  
=
LOAD  
SENSE  
72.7m), reducing the output voltage 2.9% gives an  
output voltage of 1.55V and an output current of 21.3A.  
Given these values, CPU power consumption is  
reduced from 35.2W to 33.03W. The additional power  
The compensation network can be tied to V  
to  
OUT  
consumption of R  
is:  
include the feed-forward term due to the masters on  
time (see the On-time Control and Active Current  
SENSE  
______________________________________________________________________________________ 25  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
CAPACITIVE SOAR  
(dV/dt = I /C  
VOLTAGE POSITIONING THE OUTPUT  
)
OUT OUT  
ESR VOLTAGE STEP  
(I x R  
)
ESR  
STEP  
A
B
1.4V  
1.4V  
V
OUT  
CAPACITIVE SAG  
(dV/dt = I /C  
)
RECOVERY  
OUT OUT  
A. CONVENTIONAL CONVERTER (50mV/div)  
B. VOLTAGE-POSITIONED OUTPUT (50mV/div)  
I
LOAD  
Figure 7. Voltage Positioning the Output  
Figure 8. Transient Response Regions  
50mV x 21.3A = 1.06W,  
current, I  
.
NP  
The effective efficiency of voltage-positioned circuits is  
shown in the Typical Operating Characteristics.  
which results in an overall power savings of:  
35.2W - (33.03W + 1.06W) = 1.10W.  
One-Stage (Battery Input) Versus  
Two-Stage (5V Input) Applications  
The MAX1887/MAX1897 can be used with a direct bat-  
tery connection (one stage) or can obtain power from a  
regulated 5V supply (two-stage). Each approach has  
advantages, and careful consideration should go into  
the selection of the final design.  
In effect, 2.2W of CPU dissipation is saved and the  
power supply dissipates much of the savings, but both  
the net savings and the transfer of dissipation away  
from the hot CPU are beneficial. Effective efficiency is  
defined as the efficiency required of a nonvoltage-posi-  
tioned circuit to equal the total dissipation of a voltage-  
positioned circuit for a given CPU operating condition.  
The one-stage approach offers smaller total inductor  
size and fewer capacitors overall due to the reduced  
demands on the 5V supply. Due to the high input volt-  
age, the one-stage approach requires lower DC input  
currents, reducing input connection/bus requirements  
and power dissipation due to input resistance. The  
transient response of the single stage is better due to  
the ability to ramp the inductor current faster. The total  
efficiency of a single stage is better than the two-stage  
approach.  
Calculate effective efficiency as follows:  
1) Start with the efficiency data for the positioned cir-  
cuit (V , I , V  
, I  
).  
IN IN OUT OUT  
2) Model the load resistance for each data point:  
R
= V / I  
LOAD  
OUT OUT  
3) Calculate the output current that would exist for each  
data point in a nonpositioned application:  
R
LOAD  
The two-stage approach allows flexible placement due  
to smaller circuit size and reduced local power dissipa-  
tion. The power supply can be placed closer to the  
CPU for better regulation and lower I2R losses from PC  
board traces. Although the two-stage design has slow-  
er transient response than the single stage, this can be  
offset by the use of a voltage-positioned converter.  
I
= V / R  
NP LOAD  
NP  
where V = 1.6V (in this example).  
NP  
4) Calculate effective efficiency as:  
Effective efficiency = (V  
culated nonpositioned power output divided by the  
measured voltage-positioned power input.  
I ) / (V I ) = cal-  
NP IN IN  
NP  
5) Plot the efficiency data point at the nonpositioned  
26 ______________________________________________________________________________________  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
the master to the analog ground in the slave to pre-  
vent ground offsets. A low value (10) resistor is  
sufficient to link the two grounds.  
Ceramic Output Capacitor Applications  
Ceramic capacitors have advantages and disadvan-  
tages. They have ultra-low ESR and are noncom-  
bustible, relatively small, and nonpolarized. However,  
they are also expensive and brittle, and their ultra-low  
ESR characteristic can result in excessively high ESR  
zero frequencies. In addition, their relatively low capac-  
itance value can cause output overshoot when step-  
ping from full-load to no-load conditions, unless a small  
inductor value is used (high switching frequency), or  
there are some bulk tantalum or electrolytic capacitors  
in parallel to absorb the stored inductor energy. In  
some cases, there may be no room for electrolytics,  
creating a need for a DC-DC design that uses nothing  
but ceramics.  
4) Keep the power traces and load connections short.  
This is essential for high efficiency. The use of thick  
copper PC boards (2oz vs. 1oz) can enhance full-load  
efficiency by 1% or more. Correctly routing PC board  
traces is a difficult task that must be approached in  
terms of fractions of centimeters, where a single mΩ  
of excess trace resistance causes a measurable effi-  
ciency penalty.  
5) Keep the high-current gate-driver traces (DL, DH,  
LX, and BST) short and wide to minimize trace  
resistance and inductance. This is essential for  
high-power MOSFETs that require low-impedance  
gate drivers to avoid shoot-through currents.  
The MAX1887/MAX1897 can take full advantage of the  
small size and low ESR of ceramic output capacitors in  
a voltage-positioned circuit. The addition of the posi-  
tioning resistor increases the ripple at FB, lowering the  
effective ESR zero frequency of the ceramic output  
capacitor.  
6) CS+, CS-, CM+, and CM- connections for current  
limiting and balancing must be made using Kelvin  
sense connections to guarantee the current-sense  
accuracy.  
7) When trade-offs in trace lengths must be made, its  
preferable to allow the inductor charging path to be  
made longer than the discharge path. For example,  
its better to allow some extra distance between the  
input capacitors and the high-side MOSFET than to  
allow distance between the inductor and the low-side  
MOSFET or between the inductor and the output filter  
capacitor.  
Output overshoot (V  
) determines the minimum  
SOAR  
output capacitance requirement (see the Output  
Capacitor Selection section). Often the switching fre-  
quency is increased to 550kHz, and the inductor value  
is reduced to minimize the energy transferred from  
inductor to capacitor during load-step recovery. The  
efficiency penalty for operating at 550kHz is about 3%  
when compared to the 300kHz circuit, primarily due to  
the high-side MOSFET switching losses.  
8) Route high-speed switching nodes away from sen-  
sitive analog areas (COMP, ILIM). Make all pin-  
strap control input connections (SHDN, ILIM, POL)  
PC Board Layout Guidelines  
Careful PC board layout is critical to achieve low  
switching losses and clean, stable operation. The  
switching power stage requires particular attention  
(Figure 9). If possible, mount all of the power compo-  
nents on the top side of the board with their ground ter-  
minals flush against one another. Follow these  
guidelines for good PC board layout:  
to analog ground or V  
rather than power ground  
CC  
or V  
.
DD  
Layout Procedure  
1) Place the power components first, with ground termi-  
nals adjacent (low-side MOSFET source, C , C  
,
IN OUT  
and D1 anode). If possible, make all these connec-  
tions on the top layer with wide, copper-filled areas.  
1) Keep the high-current paths short, especially at the  
ground terminals. This is essential for stable, jitter-  
free operation  
2) Mount the controller IC adjacent to the low-side  
MOSFET. The DL gate trace must be short and  
wide (50mils to 100mils wide if the MOSFET is 1  
inch from the controller IC).  
2) Connect all analog grounds to a separate solid  
copper plane, which connects to the GND pin of  
3) Group the gate-drive components (BST diode and  
the MAX1887/MAX1897. This includes the V  
bypass capacitor, COMP components, and the  
resistive-divider connected to ILIM.  
CC  
capacitor, V  
bypass capacitor) together near the  
DD  
controller IC.  
4) Make the DC-DC controller ground connections as  
shown in Figure 1. This diagram can be viewed as  
having four separate ground planes: input/output  
ground, where all the high-power components go;  
the power ground plane, where the PGND pin and  
3) The master controller also should have a separate  
analog ground. Return the appropriate noise sensi-  
tive components to this plane. Since the reference  
in the master is sometimes connected to the slave,  
it may be necessary to couple the analog ground in  
______________________________________________________________________________________ 27  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
MAX1718  
(MASTER)  
MAX1897  
(SLAVE)  
CONNECT THE EXPOSED  
PAD TO GND  
VIA TO POWER  
GROUND  
VIA TO POWER  
GROUND  
CONNECT GND AND PGND  
BENEATH THE CONTROLLER AT  
ONE POINT ONLY AS SHOWN  
10Ω  
MASTER  
SLAVE  
LM  
DM  
DS  
LS  
VIA TO CM+  
AND FB  
VIA TO CS+  
C
C
C
C
C
C
C
C
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
VIA TO CM-  
VIA TO CS-  
POWER  
GROUND  
TOP LAYER  
OUTPUT  
MASTER  
SLAVE  
INPUT (V+)  
C
C
C
C
C
C
C
C
IN  
IN  
IN  
IN  
IN  
IN  
IN  
IN  
POWER  
GROUND  
BOTTOM LAYER  
Figure 9. Power-Stage PC Board Layout Example  
28 ______________________________________________________________________________________  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
Typical Operating Circuit  
5V BIAS  
SUPPLY  
V
DD  
INPUT  
V+  
(V )*  
CC  
BST  
(POL)*  
DH  
LX  
OUTPUT  
SHDN  
ILIM  
REF  
(MASTER)  
DL  
MAX1887  
(MAX1897)*  
(TON)*  
FLOAT  
(300kHz)  
PGND  
CS+  
ILIM  
(MASTER)  
LIMIT  
CS-  
FB  
(MASTER)  
CM+  
COMP  
MASTER CURRENT  
SENSE RESISTOR  
CM-  
TRIG  
MASTER LOW-SIDE GATE DRIVER  
GND  
( )* MAX1897 PINS ONLY  
V
bypass capacitor go; the masters analog  
DD  
Pin Configurations (continued)  
ground plane where sensitive analog components,  
the masters GND pin and V bypass capacitor  
CC  
TOP VIEW  
go; and the slaves analog ground plane where the  
slaves GND pin, and V bypass capacitor go.  
CC  
ILIM  
TRIG  
CM+  
CM-  
1
2
3
4
5
6
7
8
16 LIMIT  
15 V+  
The masters GND plane must meet the PGND  
plane only at a single point directly beneath the IC.  
Similarly, the slaves GND plane must meet the  
PGND plane only at a single point directly beneath  
the IC. The respective master and slave ground  
planes should connect to the high-power output  
ground with a short metal trace from PGND to the  
source of the low-side MOSFET (the middle of the  
star ground). This point must also be very close to  
the output capacitor ground terminal.  
14 BST  
13 LX  
MAX1887  
CS-  
12 DH  
CS+  
11  
10 DL  
PGND  
V
DD  
COMP  
GND  
9
5) Connect the output power planes (V  
and sys-  
QSOP  
CORE  
tem ground planes) directly to the output filter  
capacitor positive and negative terminals with multi-  
ple vias. Place the entire DC-DC converter circuit  
as close to the CPU as is practical.  
Chip Information  
TRANSISTOR COUNT: 1422  
PROCESS: BiCMOS  
______________________________________________________________________________________ 29  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
Package Information  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,  
go to www.maxim-ic.com/packages.)  
30 ______________________________________________________________________________________  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
Package Information (continued)  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,  
go to www.maxim-ic.com/packages.)  
______________________________________________________________________________________ 31  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
Package Information (continued)  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,  
go to www.maxim-ic.com/packages.)  
32 ______________________________________________________________________________________  
Quick-PWM Slave Controllers for  
Multiphase, Step-Down Supplies  
Package Information (continued)  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,  
go to www.maxim-ic.com/packages.)  
D2  
0.15  
C A  
D
b
0.10 M  
C A B  
C
L
D2/2  
D/2  
k
PIN # 1  
I.D.  
0.15  
C
B
PIN # 1 I.D.  
0.35x45  
E/2  
E2/2  
C
(NE-1) X  
e
L
E2  
E
k
L
DETAIL A  
e
(ND-1) X  
e
C
C
L
L
L
L
e
e
0.10  
C
A
0.08  
C
C
A3  
A1  
PROPRIETARY INFORMATION  
TITLE:  
PACKAGE OUTLINE  
16, 20, 28, 32L, QFN THIN, 5x5x0.8 mm  
APPROVAL  
DOCUMENT CONTROL NO.  
REV.  
1
21-0140  
C
2
COMMON DIMENSIONS  
EXPOSED PAD VARIATIONS  
NOTES:  
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.  
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.  
3. N IS THE TOTAL NUMBER OF TERMINALS.  
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1  
SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE  
ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.  
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm  
FROM TERMINAL TIP.  
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.  
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.  
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.  
9. DRAWING CONFORMS TO JEDEC MO220.  
PROPRIETARY INFORMATION  
TITLE:  
PACKAGE OUTLINE  
10. WARPAGE SHALL NOT EXCEED 0.10 mm.  
16, 20, 28, 32L, QFN THIN, 5x5x0.8 mm  
APPROVAL  
DOCUMENT CONTROL NO.  
REV.  
2
21-0140  
C
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are  
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.  
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 33  
© 2002 Maxim Integrated Products  
Printed USA  
is a registered trademark of Maxim Integrated Products.  

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