MAX1489EESD [MAXIM]
【15kV ESD-Protected, Quad, Low-Power RS-232 Line Receiver; ± 15kV ESD保护,四路,低功耗RS - 232线路驱动器型号: | MAX1489EESD |
厂家: | MAXIM INTEGRATED PRODUCTS |
描述: | 【15kV ESD-Protected, Quad, Low-Power RS-232 Line Receiver |
文件: | 总8页 (文件大小:82K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
19-0426; Rev 0; 8/95
±1 5 k V ES D-P ro t e c t e d , Qu a d ,
Lo w -P o w e r RS -2 3 2 Lin e Re c e ive r
MAX1489E
_______________Ge n e ra l De s c rip t io n
____________________________Fe a t u re s
The MAX1489E q ua d , low-p owe r line re c e ive r is
designed for EIA/TIA-232, EIA/TIA-562, and CCITT V.28
communications in harsh environments. Each receiver
inp ut is p rote c te d a g a ins t ± 15kV e le c tros ta tic d is -
charge (ESD) shocks. These inputs have a ±25V range
and feature hysteresis and time-domain filtering. The
outputs are TTL and CMOS compatible. The MAX1489E
has a 120kbps guaranteed data rate. Supply current is
typically 350µA.
♦ Enhanced ESD Protection:
±15kV—Human Body Model
±8kV—IEC1000-4-2, Contact Discharge
±15kV—IEC1000-4-2, Air-Gap Discharge
♦ Latchup Free During an ESD Event
♦ Low 350µA Supply Current
♦ Input Hysteresis and Time-Domain Filtering
Eliminate the Need for External Filtering
The MAX1489E is pin compatible with the MC1489,
MC14C89, SN75189, SN75C189, DS1489, a nd
DS14C89. It is available in 14-pin plastic DIP and SO
packages.
♦ Stable Input Thresholds
♦ Pin Compatible with MC1489, MC14C89, SN75189,
SN75C189, DS1489, and DS14C89
________________________Ap p lic a t io n s
PC Motherboards
Modems
______________Ord e rin g In fo rm a t io n
Interfacing Data Terminal Equipment (DTE) with
Data Circuit-Terminating Equipment (DCE)
PART
TEMP. RANGE
0°C to +70°C
0°C to +70°C
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
14 Plastic DIP
14 SO
MAX1489ECPD
MAX1489ECSD
MAX1489EC/D
MAX1489EEPD
MAX1489EESD
Equipment Meeting IEC1000-4-2 (formerly
IEC801-2) or ±15kV ESD Protection
Dice*
14 Plastic DIP
14 SO
* Dice are specified at T = +25°C.
A
__________Typ ic a l Op e ra t in g Circ u it
__________________P in Co n fig u ra t io n
TOP VIEW
1
1
⁄ MAX1489E
⁄ MAX1488E
4
4
INPUT A
N.C.
V
1
2
3
4
5
6
7
CC
14
13
12
11
10
9
MAX1489E
INPUT D
N.C.
TTL/CMOS
LOGIC
TTL/CMOS
LOGIC
INTERCONNECTING
CABLE
OUTPUT A
INPUT B
N.C.
OUTPUT D
INPUT C
N.C.
1
1
OUTPUT B
GND
⁄ MAX1488E
⁄ MAX1489E
4
4
SIGNAL GROUND
8
OUTPUT C
PC
MODEM
(DCE)
DIP/SO
MOTHERBOARD
(DTE)
________________________________________________________________ Maxim Integrated Products
1
Ca ll t o ll fre e 1 -8 0 0 -9 9 8 -8 8 0 0 fo r fre e s a m p le s o r lit e ra t u re .
±1 5 k V ES D-P ro t e c t e d , Qu a d ,
Lo w -P o w e r RS -2 3 2 Lin e Re c e ive r
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (V ).............................................................+7V
Operating Temperature Ranges
CC
Input Voltage (V )...............................................................±30V
Output Short-Circuit Current
MAX1489EC_D ...................................................0°C to +70°C
MAX1489EE_D ................................................-40°C to +85°C
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (soldering, 10sec) .............................+300°C
IN
(Shorted to GND or V ) (Note 1) ............................Self Limiting
CC
Continuous Power Dissipation (T = +70°C)
A
Plastic DIP (derate 10.00mW/°C above +70°C) ..........800mW
SO (derate 8.7mW/°C above +70°C)...........................695mW
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
MAX1489E
ELECTRICAL CHARACTERISTICS
(V = 5V ±10%, T = T
to T , unless otherwise noted. Typical values are at V = 5V, T = +25°C.)
MAX CC A
CC
A
MIN
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Output Voltage High
Output Voltage Low
I
= -3.2mA
= -20µA
3.5
2.5
4.99
4.41
0.17
OUT
V
V
≤ 0.4V
V
V
OH
IN
I
OUT
V
OL
V
IN
≥ 2.4V, I = 3.2mA
OUT
0.4
Shorted to GND
Shorted to V
-35
Output Short-Circuit Current
(Note 1)
I
mA
OS
60
600
25
CC
Supply Current
I
CC
260
µA
V
Input Voltage Range
Input Voltage High
Input Voltage Low
Input Hysteresis
V
-25
IN
V
1.60
0.75
2.17
1.06
1.11
5.0
2.60
1.30
V
IH
V
V
IL
V
HYST
V
Input Resistance
R
3.0
7.0
kΩ
IN
TIMING CHARACTERISTICS
Output Propagation Delay,
Low to High
t
Figure 1
Figure 1
Figure 1
1.38
1.45
4.0
4.0
µs
µs
ns
PLH
PHL
Output Propagation Delay,
High to Low
t
Output Propagation Delay Skew,
t
70
SKEW
t
- t
PLH PHL
I
I
Output Transition Time
Input Noise Rejection
Guaranteed Data Rate
ESD CHARACTERISTICS
t
V
OUT
= 10% to 90%
35
1.0
240
120
ns
µs
TR
t
N
Pulse amplitude = 5V (Note 2)
DR
120
kbps
Human Body Model
±15
±8
ESD Protection
IEC1000-4-2 (Contact Discharge)
IEC1000-4-2 (Air-Gap Discharge)
kV
±15
Note 1: Only one output may be shorted at a time.
Note 2: See Noise Pulse Rejection graph in Typical Operating Characteristics section.
2
_______________________________________________________________________________________
±1 5 k V ES D-P ro t e c t e d , Qu a d ,
Lo w -P o w e r RS -2 3 2 Lin e Re c e ive r
MAX1489E
__________________________________________Typ ic a l Op e ra t in g Ch a ra c t e ris t ic s
(V = 5V, T = +25°C, unless otherwise noted.)
CC
A
PROPAGATION DELAY SKEW
vs. TEMPERATURE
PROPAGATION DELAY vs. TEMPERATURE
NOISE PULSE REJECTION
2.2
800
600
400
200
0
8
6
4
2
0
V
(V + V
)
IH
PULSE AMP,
2
IN = IL
±
2
f = 300kHz
1.8
1.4
1.0
0.6
t
PHL
V
= 5.25V
CC
t
PLH
V
= 5V
CC
V
CC
= 4.75V
60
-40
-15
10
35
60
85
-40
-15
10
35
85
0.7
1.1
1.5
1.9
2.3
2.7
TEMPERATURE (°C)
TEMPERATURE (°C)
INPUT PULSE WIDTH (µs)
_____________________P in De s c rip t io n
3.0V
PIN
NAME
FUNCTION
S.G.
0V
1.5V
1, 4, 10,
13
INPUT_
Receiver Inputs
t
t
PLH
PHL
V
OH
90%
2, 5, 9,
12
No Connect—not internally
connected
N.C.
OUTPUT_
GND
3, 6, 8,
11
Receiver Outputs
Ground
V
OUT
50%
50%
7
10%
V
OL
14
V
CC
Supply Voltage
t
TR
t
TR
V
CC
50pF
V
OUT
SIGNAL
GENERATOR
(S.G.)
NOTE: S.G. SET TO f = 20kHz;
DUTY CYCLE = 50%;
t , t < 5.0ns
R
F
Figure 1. Timing Diagram
_______________________________________________________________________________________
3
±1 5 k V ES D-P ro t e c t e d , Qu a d ,
Lo w -P o w e r RS -2 3 2 Lin e Re c e ive r
R
1M
R 1500Ω
D
C
I 100%
P
90%
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
I
r
DISCHARGE
RESISTANCE
CHARGE-CURRENT
LIMIT RESISTOR
AMPERES
HIGH-
VOLTAGE
DC
DEVICE
UNDER
TEST
36.8%
C
STORAGE
CAPACITOR
s
100pF
10%
0
SOURCE
TIME
0
t
RL
t
MAX1489E
DL
CURRENT WAVEFORM
Figure 2a. Human Body ESD Test Model
Figure 2b. Human Body Model Current Waveform
Human Body Model
_______________De t a ile d De s c rip t io n
Figure 2a shows the Human Body Model, and Figure
2b shows the current waveform it generates when dis-
charged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of inter-
e s t, whic h is the n d is c ha rg e d into the te s t d e vic e
through a 1.5kΩ resistor.
±1 5 k V ES D P ro t e c t io n
As with all Maxim devices, ESD protection structures
are incorporated on all pins to protect against electro-
static discharges encountered during handling and
assembly. The MAX1489E receiver inputs have extra
protection against static electricity found in normal
operation. Maxim’s engineers developed state-of-the-
a rt struc ture s to prote c t the se pins a g a inst ESD of
± 15kV without d a ma g e . Afte r a n ESD e ve nt, the
MAX1489E keeps working without latchup.
IEC1000-4-2
The IEC100-4-2 standard covers ESD testing and per-
formance of finished equipment; it does not specifically
refer to integrated circuits. The MAX1489E helps you
design equipment that meets Level 4 (the highest level)
of IEC1000-4-2, without additional ESD protection com-
ponents.
ESD p rote c tion c a n b e te s te d in va rious wa ys ; the
receiver inputs are characterized for protection to the
following:
The major difference between tests done using the
Human Body Model and IEC1000-4-2 is higher peak cur-
rent in IEC1000-4-2. Because series resistance is lower
in the IEC1000-4-2 ESD test model (Figure 3a), the ESD
withstand voltage measured to this standard is generally
lower than that measured using the Human Body Model.
Figure 3b shows the current waveform for the ±8kV
IEC1000-4-2 Level 4 ESD Contact Discharge test.
1) ±15kV using the Human Body Model
2) ±8kV using the Contact Discharge method speci-
fied in IEC1000-4-2 (formerly IEC801-2)
3) ±15kV using the Air-Gap Discharge method speci-
fied in IEC1000-4-2 (formerly IEC801-2).
ESD Test Conditions
Contact Maxim for a reliability report that documents
test setup, methodology, and results.
The Air-Gap test involves approaching the device with a
charged probe. The Contact Discharge method connects
the probe to the device before the probe is energized.
4
_______________________________________________________________________________________
±1 5 k V ES D-P ro t e c t e d , Qu a d ,
Lo w -P o w e r RS -2 3 2 Lin e Re c e ive r
MAX1489E
I
R
C
50M to 100M
R 330Ω
D
100%
90%
DISCHARGE
RESISTANCE
CHARGE-CURRENT
LIMIT RESISTOR
HIGH-
VOLTAGE
DC
DEVICE
UNDER
TEST
C
STORAGE
CAPACITOR
s
150pF
SOURCE
10%
t = 0.7ns to 1ns
r
t
30ns
60ns
Figure 3a. IEC1000-4-2 ESD Test Model
Figure 3b. IEC1000-4-2 ESD Generator Current Waveform
Machine Model
__________ Ap p lic a t io n s In fo rm a t io n
The Machine Model for ESD testing uses a 200pF stor-
age capacitor and zero-discharge resistance. Its objec-
tive is to mimic the s tre s s c a us e d b y c onta c t tha t
occurs with handling and assembly during manufactur-
ing. Of course, all pins (not just RS-232 inputs and out-
puts) re quire this p rote c tion during ma nufa c turing .
Therefore, the Machine Model is less relevant to the I/O
ports than the Human Body Model and IEC1000-4-2.
Use proper layout to ensure other devices on your
board are not damaged in an ESD strike. Currents as
hig h a s 60A c a n ins ta nta ne ous ly p a s s throug h the
ground pin, so it is important to minimize the ground-
lead return path to the power supply. A separate return
p a th to the p owe r s up p ly is re c omme nd e d . Tra c e
widths should be greater than 40 mils. V
must be
CC
bypassed with 0.1µF capacitors as close to the part as
possible to ensure maximum ESD protection.
_______________________________________________________________________________________
5
±1 5 k V ES D-P ro t e c t e d , Qu a d ,
Lo w -P o w e r RS -2 3 2 Lin e Re c e ive r
___________________Ch ip To p o g ra p h y
V
CC
INPUT A
INPUT D
MAX1489E
OUTPUT A
INPUT B
OUTPUT D
INPUT C
0. 096"
(2. 438mm)
OUTPUT B
OUTPUT C
GND
0. 071"
(1. 803mm)
TRANSISTOR COUNT: 144
SUBSTRATE CONNECTED TO GND
6
_______________________________________________________________________________________
±1 5 k V ES D-P ro t e c t e d , Qu a d ,
Lo w -P o w e r RS -2 3 2 Lin e Re c e ive r
MAX1489E
________________________________________________________P a c k a g e In fo rm a t io n
INCHES
MILLIMETERS
DIM
E
MIN
MAX
0.200
–
MIN
–
MAX
5.08
–
A
–
E1
D
A1 0.015
A2 0.125
A3 0.055
0.38
3.18
1.40
0.41
1.14
0.20
0.13
7.62
6.10
2.54
7.62
–
0.175
0.080
0.022
0.065
0.012
0.080
0.325
0.310
–
4.45
2.03
0.56
1.65
0.30
2.03
8.26
7.87
–
A3
A2
A1
A
L
B
0.016
B1 0.045
0.008
D1 0.005
0.300
E1 0.240
0.100
eA 0.300
C
0° - 15°
E
C
e
e
B1
eA
eB
–
–
B
eB
L
–
0.400
0.150
10.16
3.81
0.115
2.92
D1
INCHES
MILLIMETERS
PKG. DIM
PINS
Plastic DIP
PLASTIC
DUAL-IN-LINE
PACKAGE
(0.300 in.)
MIN
MAX MIN
MAX
8
P
P
P
P
P
N
D
D
D
D
D
D
0.348 0.390 8.84
9.91
14
16
18
20
24
0.735 0.765 18.67 19.43
0.745 0.765 18.92 19.43
0.885 0.915 22.48 23.24
1.015 1.045 25.78 26.54
1.14 1.265 28.96 32.13
21-0043A
_______________________________________________________________________________________
7
±1 5 k V ES D-P ro t e c t e d , Qu a d ,
Lo w -P o w e r RS -2 3 2 Lin e Re c e ive r
___________________________________________P a c k a g e In fo rm a t io n (c o n t in u e d )
INCHES
MILLIMETERS
DIM
MIN
0.053
MAX
0.069
0.010
0.019
0.010
0.157
MIN
1.35
0.10
0.35
0.19
3.80
MAX
1.75
0.25
0.49
0.25
4.00
A
D
A1 0.004
B
C
E
e
0.014
0.007
0.150
0°-8°
A
0.101mm
0.004in.
0.050
1.27
MAX1489E
e
H
L
0.228
0.016
0.244
0.050
5.80
0.40
6.20
1.27
A1
C
B
L
INCHES
MILLIMETERS
DIM PINS
Narrow SO
SMALL-OUTLINE
PACKAGE
MIN MAX
MIN
MAX
5.00
8.75
8
0.189 0.197 4.80
D
D
D
E
H
14 0.337 0.344 8.55
16 0.386 0.394 9.80 10.00
21-0041A
(0.150 in.)
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
8
___________________Ma x im In t e g ra t e d P ro d u c t s , 1 2 0 S a n Ga b rie l Drive , S u n n yva le , CA 9 4 0 8 6 (4 0 8 ) 7 3 7 -7 6 0 0
© 1995 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
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