DS3231S-C15/T&R [MAXIM]

Real Time Clock, 1 Timer(s), CMOS, PDSO16, 0.300 INCH, SOIC-16;
DS3231S-C15/T&R
型号: DS3231S-C15/T&R
厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
描述:

Real Time Clock, 1 Timer(s), CMOS, PDSO16, 0.300 INCH, SOIC-16

时钟 光电二极管 外围集成电路
文件: 总20页 (文件大小:353K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Rev 6; 10/08  
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
DS231  
General Description  
Features  
2
Accuracy 2ppm from 0°C to +40°C  
The DS3231 is a low-cost, extremely accurate I C real-  
time clock (RTC) with an integrated temperature-  
compensated crystal oscillator (TCXO) and crystal. The  
device incorporates a battery input, and maintains accu-  
rate timekeeping when main power to the device is inter-  
rupted. The integration of the crystal resonator enhances  
the long-term accuracy of the device as well as reduces  
the piece-part count in a manufacturing line. The DS3231  
is available in commercial and industrial temperature  
ranges, and is offered in a 16-pin, 300-mil SO package.  
Accuracy 3.5ppm from -40°C to +85°C  
Battery Backup Input for Continuous  
Timekeeping  
Operating Temperature Ranges  
Commercial: 0°C to +70°C  
Industrial: -40°C to +85°C  
Low-Power Consumption  
Real-Time Clock Counts Seconds, Minutes,  
Hours, Day, Date, Month, and Year with Leap Year  
Compensation Valid Up to 2100  
The RTC maintains seconds, minutes, hours, day, date,  
month, and year information. The date at the end of the  
month is automatically adjusted for months with fewer  
than 31 days, including corrections for leap year. The  
clock operates in either the 24-hour or 12-hour format  
with an AM/PM indicator. Two programmable time-of-  
day alarms and a programmable square-wave output  
are provided. Address and data are transferred serially  
Two Time-of-Day Alarms  
Programmable Square-Wave Output  
2
Fast (400kHz) I C Interface  
3.3V Operation  
Digital Temp Sensor Output: 3°C Accuracy  
Register for Aging Trim  
RST Output/Pushbutton Reset Debounce Input  
2
through an I C bidirectional bus.  
®
Underwriters Laboratories (UL ) Recognized  
A precision temperature-compensated voltage refer-  
ence and comparator circuit monitors the status of V  
CC  
to detect power failures, to provide a reset output, and  
to automatically switch to the backup supply when nec-  
essary. Additionally, the RST pin is monitored as a  
pushbutton input for generating a µP reset.  
Ordering Information  
TOP  
PART  
TEMP RANGE PIN-PACKAGE  
MARK  
DS3231S  
DS3231SN  
DS3231S#  
0°C to +70°C 16 SO  
DS3231SN# -40°C to +85°C 16 SO  
Applications  
Utility Power Meters  
# Denotes a RoHS-compliant device that may include lead that  
is exempt under RoHS requirements. The lead finish is JESD97  
category e3, and is compatible with both lead-based and lead-  
free soldering processes. A "#" anywhere on the top mark  
denotes a RoHS-compliant device.  
Servers  
Telematics  
GPS  
Pin Configuration appears at end of data sheet.  
Typical Operating Circuit  
V
CC  
V
CC  
R
PU  
= t /C  
R B  
V
CC  
R
R
PU  
PU  
V
CC  
SCL  
SDA  
INT/SQW  
32kHz  
SCL  
SDA  
μP  
V
BAT  
RST  
RST  
DS3231  
PUSHBUTTON  
RESET  
N.C.  
N.C.  
N.C.  
N.C.  
N.C.  
N.C.  
N.C.  
N.C.  
GND  
UL is a registered trademark of Underwriters Laboratories, Inc.  
______________________________________________ Maxim Integrated Products  
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,  
or visit Maxim’s website at www.maxim-ic.com.  
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
ABSOLUTE MAXIMUM RATINGS  
Storage Temperature Range...............................-40°C to +85°C  
Lead Temperature  
Voltage Range on V , V  
, 32kHz, SCL, SDA, RST,  
CC BAT  
INT/SQW Relative to Ground.............................-0.3V to +6.0V  
(Soldering, 10s).....................................................+260°C/10s  
Soldering Temperature....................................See the Handling,  
PC Board Layout, and Assembly section.  
Operating Temperature Range  
(noncondensing) .............................................-40°C to +85°C  
Junction Temperature......................................................+125°C  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional  
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
DS231  
RECOMMENDED DC OPERATING CONDITIONS  
(T = T  
A
to T  
, unless otherwise noted.) (Notes 1, 2)  
MAX  
MIN  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
2.3  
2.3  
TYP  
3.3  
MAX  
5.5  
UNITS  
V
CC  
V
V
Supply Voltage  
V
BAT  
3.0  
5.5  
0.7 x  
V
+
0.3  
CC  
Logic 1 Input SDA, SCL  
Logic 0 Input SDA, SCL  
V
V
V
IH  
V
CC  
+0.3 x  
V
V
-0.3  
IL  
CC  
ELECTRICAL CHARACTERISTICS  
(V  
CC  
= 2.3V to 5.5V, V  
= Active Supply (see Table 1), T = T  
to T  
, unless otherwise noted.) (Typical values are at V  
=
CC  
MIN  
MAX  
CC  
A
3.3V, V  
= 3.0V, and T = +25°C, unless otherwise noted.) (Notes 1, 2)  
A
BAT  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
200  
UNITS  
V
= 3.63V  
= 5.5V  
CC  
Active Supply Current  
I
(Notes 3, 4)  
μA  
CCA  
V
300  
CC  
2
I C bus inactive, 32kHz  
V
= 3.63V  
= 5.5V  
110  
170  
CC  
CC  
Standby Supply Current  
I
output on, SQW output off  
(Note 4)  
μA  
CCS  
V
2
V
V
= 3.63V  
= 5.5V  
575  
650  
2.70  
I C bus inactive, 32kHz  
CC  
Temperature Conversion Current  
Power-Fail Voltage  
I
μA  
V
CCSCONV  
output on, SQW output off  
CC  
V
2.45  
-1  
2.575  
PF  
OL  
OL  
LO  
Logic 0 Output, 32kHz,  
INT/SQW, SDA  
V
V
I
I
= 3mA  
= 1mA  
0.4  
0.4  
+1  
V
OL  
OL  
Logic 0 Output, RST  
V
Output Leakage Current 32kHz,  
INT/SQW, SDA  
I
Output high impedance  
0
μA  
Input Leakage SCL  
I
-1  
+1  
μA  
μA  
LI  
RST Pin I/O Leakage  
I
RST high impedance (Note 5)  
-200  
+10  
OL  
V
Leakage Current  
BAT  
I
25  
100  
nA  
BATLKG  
(V Active)  
CC  
2
_____________________________________________________________________  
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
DS231  
ELECTRICAL CHARACTERISTICS (continued)  
(V  
CC  
= 2.3V to 5.5V, V  
= Active Supply (see Table 1), T = T  
to T  
, unless otherwise noted.) (Typical values are at V  
MAX  
=
MIN  
CC  
A
CC  
3.3V, V  
= 3.0V, and T = +25°C, unless otherwise noted.) (Notes 1, 2)  
A
BAT  
PARAMETER  
SYMBOL  
CONDITIONS  
= 3.3V  
MIN  
TYP  
MAX  
UNITS  
Output Frequency  
f
V
CC  
= 3.3V or V  
BAT  
32.768  
kHz  
OUT  
V
V
= 3.3V or  
= 3.3V,  
0°C to +40°C  
2
CC  
Frequency Stability vs.  
Temperature (Commercial)  
f/f  
f/f  
ppm  
BAT  
OUT  
OUT  
>40°C to +70°C  
3.5  
aging offset = 00h  
-40°C to <0°C  
0°C to +40°C  
>40°C to +85°C  
3.5  
2
V
V
= 3.3V or  
= 3.3V,  
CC  
Frequency Stability vs.  
Temperature (Industrial)  
ppm  
BAT  
aging offset = 00h  
3.5  
Frequency Stability vs. Voltage  
f/V  
1
ppm/V  
-40°C  
0.7  
0.1  
0.4  
0.8  
+25°C  
+70°C  
+85°C  
Trim Register Frequency  
Sensitivity per LSB  
f/LSB  
Specified at:  
ppm  
Temperature Accuracy  
Crystal Aging  
Temp  
V
= 3.3V or V  
= 3.3V  
BAT  
-3  
+3  
°C  
CC  
First year  
1.0  
5.0  
After reflow,  
not production tested  
f/f  
ppm  
O
0–10 years  
ELECTRICAL CHARACTERISTICS  
(V  
CC  
= 0V, V  
= 2.3V to 5.5V, T = T  
to T  
, unless otherwise noted.) (Note 1)  
MAX  
MIN  
BAT  
A
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
70  
UNITS  
V
V
= 3.63V  
= 5.5V  
EOSC = 0, BBSQW = 0,  
SCL = 400kHz (Note 4)  
BAT  
Active Battery Current  
I
μA  
BATA  
150  
BAT  
EOSC = 0, BBSQW = 0,  
EN32kHz = 1,  
SCL = SDA = 0V or  
V
V
= 3.63V  
= 5.5V  
0.84  
1.0  
3.0  
BAT  
Timekeeping Battery Current  
I
μA  
BATT  
3.5  
BAT  
SCL = SDA = V  
(Note 4)  
BAT  
EOSC = 0, BBSQW = 0,  
SCL = SDA = 0V or  
V
V
= 3.63V  
= 5.5V  
575  
BAT  
Temperature Conversion Current  
Data-Retention Current  
I
μA  
nA  
BATTC  
SCL = SDA = V  
650  
100  
BAT  
BAT  
I
EOSC = 1, SCL = SDA = 0V, +25°C  
BATTDR  
_____________________________________________________________________  
3
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
AC ELECTRICAL CHARACTERISTICS  
(V  
CC  
= V  
to V  
or V  
= V  
to V  
, V  
> V , T = T  
to T  
, unless otherwise noted.) (Note 1)  
MAX  
MIN  
CC(MIN)  
CC(MAX)  
BAT  
BAT(MIN)  
BAT(MAX) BAT  
CC  
A
PARAMETER  
SCL Clock Frequency  
SYMBOL  
CONDITIONS  
MIN  
100  
0
TYP  
MAX  
400  
UNITS  
Fast mode  
f
kHz  
SCL  
BUF  
Standard mode  
Fast mode  
100  
1.3  
4.7  
0.6  
4.0  
1.3  
4.7  
0.6  
4.0  
0
DS231  
Bus Free Time Between STOP  
and START Conditions  
t
μs  
μs  
μs  
μs  
μs  
ns  
μs  
ns  
ns  
μs  
Standard mode  
Fast mode  
Hold Time (Repeated) START  
Condition (Note 6)  
t
HD:STA  
Standard mode  
Fast mode  
Low Period of SCL Clock  
High Period of SCL Clock  
Data Hold Time (Notes 7, 8)  
Data Setup Time (Note 9)  
START Setup Time  
t
LOW  
Standard mode  
Fast mode  
t
HIGH  
Standard mode  
Fast mode  
0.9  
0.9  
t
t
t
HD:DAT  
SU:DAT  
SU:STA  
Standard mode  
Fast mode  
0
100  
250  
0.6  
4.7  
20 +  
Standard mode  
Fast mode  
Standard mode  
Fast mode  
300  
1000  
300  
Rise Time of Both SDA and SCL  
Signals (Note 10)  
t
R
0.1C  
B
Standard mode  
Fast mode  
Fall Time of Both SDA and SCL  
Signals (Note 10)  
20 +  
t
F
0.1C  
B
Standard mode  
Fast mode  
300  
0.6  
4.7  
Setup Time for STOP Condition  
t
SU:STO  
Standard mode  
Capacitive Load for Each Bus  
Line (Note 10)  
C
400  
pF  
pF  
ns  
B
Capacitance for SDA, SCL  
C
10  
30  
I/O  
SP  
Pulse Width of Spikes That Must  
Be Suppressed by the Input Filter  
t
Pushbutton Debounce  
PB  
250  
250  
100  
125  
ms  
ms  
ms  
ms  
DB  
RST  
OSF  
Reset Active Time  
t
Oscillator Stop Flag (OSF) Delay  
Temperature Conversion Time  
t
(Note 11)  
t
200  
CONV  
POWER-SWITCH CHARACTERISTICS  
(T = T  
A
to T  
)
MAX  
MIN  
PARAMETER  
Fall Time; V  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
V
to  
to  
CC  
PF(MAX)  
t
300  
μs  
VCCF  
PF(MIN)  
V
CC  
V
Rise Time; V  
PF(MIN)  
PF(MAX)  
t
0
μs  
VCCR  
Recovery at Power-Up  
t
(Note 12)  
250  
300  
ms  
REC  
4
_____________________________________________________________________  
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
DS231  
Pushbutton Reset Timing  
RST  
PB  
DB  
t
RST  
Power-Switch Timing  
V
CC  
V
PF(MAX)  
V
PF  
V
PF  
V
PF(MIN)  
t
VCCF  
t
VCCR  
t
REC  
RST  
_____________________________________________________________________  
5
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
2
Data Transfer on I C Serial Bus  
SDA  
SCL  
DS231  
t
BUF  
t
t
F
SP  
t
HD:STA  
t
LOW  
t
HIGH  
t
SU:STA  
t
t
R
t
HD:STA  
SU:STO  
t
t
SU:DAT  
HD:DAT  
STOP  
START  
REPEATED  
START  
NOTE: TIMING IS REFERENCED TO V  
AND V  
.
IH(MIN)  
IL(MAX)  
WARNING: Negative undershoots below -0.3V while the part is in battery-backed mode may cause loss of data.  
Note 1: Limits at -40°C are guaranteed by design and not production tested.  
Note 2: All voltages are referenced to ground.  
Note 3:  
I
—SCL clocking at max frequency = 400kHz.  
CCA  
Note 4: Current is the averaged input current, which includes the temperature conversion current.  
Note 5: The RST pin has an internal 50kΩ (nominal) pullup resistor to V  
Note 6: After this period, the first clock pulse is generated.  
.
CC  
Note 7: A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the V  
of the SCL signal)  
IH(MIN)  
to bridge the undefined region of the falling edge of SCL.  
Note 8: The maximum t  
needs only to be met if the device does not stretch the low period (t  
) of the SCL signal.  
HD:DAT  
LOW  
Note 9: A fast-mode device can be used in a standard-mode system, but the requirement t  
250ns must then be met. This  
SU:DAT  
is automatically the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the  
low period of the SCL signal, it must output the next data bit to the SDA line t  
before the SCL line is released.  
t
= 1000 + 250 = 1250ns  
R(MAX)  
SU:DAT  
+
Note 10: C —total capacitance of one bus line in pF.  
B
Note 11: The parameter t  
is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage range of  
OSF  
0.0V V  
V  
and 2.3V V  
3.4V.  
CC  
CC(MAX)  
BAT  
Note 12: This delay applies only if the oscillator is enabled and running. If the EOSC bit is a 1, t  
is bypassed and RST immediate-  
REC  
2
ly goes high. The state of RST does not affect the I C interface, RTC, or TCXO.  
6
_____________________________________________________________________  
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
DS231  
Typical Operating Characteristics  
(V  
CC  
= +3.3V, T = +25°C, unless otherwise noted.)  
A
STANDBY SUPPLY CURRENT  
vs. SUPPLY VOLTAGE  
SUPPLY CURRENT  
vs. SUPPLY VOLTAGE  
150  
125  
100  
75  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
BSY = 0, SCL = SDA = V  
V
CC  
= 0V, BSY = 0,  
CC  
SDA = SCL = V OR V  
BAT  
CC  
RST ACTIVE  
EN32kHz = 1  
EN32kHz = 0  
50  
25  
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
2.3  
3.3  
4.3  
5.3  
V
(V)  
V
BAT  
(V)  
CC  
SUPPLY CURRENT  
vs. TEMPERATURE  
FREQUENCY DEVIATION  
vs. TEMPERATURE vs. AGING VALUE  
1.0  
0.9  
0.8  
0.7  
0.6  
60  
50  
V
CC  
= 0, EN32kHz = 1, BSY = 0,  
SDA = SCL = V OR GND  
BAT  
8
40  
-33  
30  
20  
0
10  
0
-10  
-20  
-30  
-40  
32  
127  
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
DELTA TIME AND FREQUENCY  
vs. TEMPERATURE  
DS3231 toc05  
20  
0
0
CRYSTAL  
+20ppm  
-20  
-40  
-20  
-40  
-60  
-80  
-100  
TYPICAL CRYSTAL,  
UNCOMPENSATED  
-60  
-80  
-100  
-120  
-140  
-160  
-180  
-200  
DS3231  
ACCURACY  
BAND  
CRYSTAL  
-20ppm  
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80  
TEMPERATURE (°C)  
_____________________________________________________________________  
7
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
Block Diagram  
32kHz  
OSCILLATOR AND  
X1  
DS231  
CAPACITOR ARRAY  
N
CONTROL LOGIC/  
DIVIDER  
SQUARE-WAVE BUFFER;  
INT/SQW CONTROL  
INT/SQW  
X2  
1Hz  
N
V
CC  
TEMPERATURE  
SENSOR  
ALARM, STATUS, AND  
CONTROL REGISTERS  
V
BAT  
POWER CONTROL  
GND  
1Hz  
CLOCK AND CALENDAR  
REGISTERS  
SCL  
SDA  
2
I C INTERFACE AND  
ADDRESS REGISTER  
DECODE  
USER BUFFER  
(7 BYTES)  
V
CC  
VOLTAGE REFERENCE;  
DEBOUNCE CIRCUIT;  
PUSHBUTTON RESET  
RST  
N
DS3231  
8
_____________________________________________________________________  
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
DS231  
Pin Description  
PIN  
NAME  
FUNCTION  
32kHz Output. This open-drain pin requires an external pullup resistor. When enabled, the output operates  
on either power supply. It may be left open if not used.  
1
32kHz  
DC Power Pin for Primary Power Supply. This pin should be decoupled using a 0.1μF to 1.0μF capacitor.  
If not used, connect to ground.  
2
3
V
CC  
Active-Low Interrupt or Square-Wave Output. This open-drain pin requires an external pullup resistor  
connected to a supply at 5.5V or less. This multifunction pin is determined by the state of the INTCN bit in  
the Control Register (0Eh). When INTCN is set to logic 0, this pin outputs a square wave and its frequency is  
determined by RS2 and RS1 bits. When INTCN is set to logic 1, then a match between the timekeeping  
registers and either of the alarm registers activates the INT/SQW pin (if the alarm is enabled). Because the  
INTCN bit is set to logic 1 when power is first applied, the pin defaults to an interrupt output with alarms  
INT/SQW  
disabled. The pullup voltage can be up to 5.5V, regardless of the voltage on V . If not used, this pin can be  
CC  
left floating.  
Active-Low Reset. This pin is an open-drain input/output. It indicates the status of V relative to the  
CC  
V
specification. As V falls below V , the RST pin is driven low. When V exceeds V , for t  
, the RST  
PF  
CC  
PF  
CC  
PF  
RST  
pin is pulled high by the internal pullup resistor. The active-low, open-drain output is combined with a  
debounced pushbutton input function. This pin can be activated by a pushbutton reset request. It has an  
4
RST  
internal 50knominal value pullup resistor to V . No external pullup resistors should be connected. If the  
CC  
oscillator is disabled, t  
is bypassed and RST immediately goes high.  
REC  
5–12  
13  
N.C.  
GND  
No Connection. Must be connected to ground.  
Ground  
Backup Power-Supply Input. This pin should be decoupled using a 0.1μF to 1.0μF low-leakage capacitor.  
2
If the I C interface is inactive whenever the device is powered by the V  
input, the decoupling capacitor  
BAT  
14  
V
BAT  
is not required. If V  
is not used, connect to ground. UL recognized to ensure against reverse charging  
BAT  
when used with a lithium battery. Go to www.maxim-ic.com/qa/info/ul.  
2
Serial Data Input/Output. This pin is the data input/output for the I C serial interface. This open-drain pin  
15  
16  
SDA  
SCL  
requires an external pullup resistor. The pullup voltage can be up to 5.5V, regardless of the voltage on V  
.
CC  
2
Serial Clock Input. This pin is the clock input for the I C serial interface and is used to synchronize data  
movement on the serial interface. Up to 5.5V can be used for this pin, regardless of the voltage on V  
.
CC  
clock operates in either the 24-hour or 12-hour format  
Detailed Description  
with an AM/PM indicator. The internal registers are  
The DS3231 is a serial RTC driven by a temperature-  
compensated 32kHz crystal oscillator. The TCXO pro-  
vides a stable and accurate reference clock, and  
maintains the RTC to within 2 minutes per year accu-  
racy from -40°C to +85°C. The TCXO frequency output  
is available at the 32kHz pin. The RTC is a low-power  
clock/calendar with two programmable time-of-day  
alarms and a programmable square-wave output. The  
INT/SQW provides either an interrupt signal due to  
alarm conditions or a square-wave output. The clock/cal-  
endar provides seconds, minutes, hours, day, date,  
month, and year information. The date at the end of the  
month is automatically adjusted for months with fewer  
than 31 days, including corrections for leap year. The  
2
accessible though an I C bus interface.  
A temperature-compensated voltage reference and  
comparator circuit monitors the level of V  
to detect  
CC  
power failures and to automatically switch to the back-  
up supply when necessary. The RST pin provides an  
external pushbutton function and acts as an indicator  
of a power-fail event.  
Operation  
The block diagram shows the main elements of the  
DS3231. The eight blocks can be grouped into four  
functional groups: TCXO, power control, pushbutton  
function, and RTC. Their operations are described sep-  
arately in the following sections.  
_____________________________________________________________________  
9
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
active battery current, I  
, is drawn. When the serial  
32kHz TCXO  
The temperature sensor, oscillator, and control logic  
form the TCXO. The controller reads the output of the  
on-chip temperature sensor and uses a lookup table to  
determine the capacitance required, adds the aging  
correction in AGE register, and then sets the capaci-  
tance selection registers. New values, including  
changes to the AGE register, are loaded only when a  
change in the temperature value occurs, or when a  
user-initiated temperature conversion is completed.  
Temperature conversion occurs on initial application of  
BATA  
interface is inactive, timekeeping current (I  
), which  
BATT  
includes the averaged temperature conversion current,  
, is used (refer to Application Note 3644: Power  
I
BATTC  
Considerations for Accurate Real-Time Clocks for  
details). Temperature conversion current, I , is  
BATTC  
specified since the system must be able to support the  
periodic higher current pulse and still maintain a valid  
voltage level. Data retention current, I  
current drawn by the part when the oscillator is  
stopped (EOSC = 1). This mode can be used to mini-  
mize battery requirements for times when maintaining  
time and date information is not necessary, e.g., while  
the end system is waiting to be shipped to a customer.  
DS231  
, is the  
BATTDR  
V
and once every 64 seconds afterwards.  
CC  
Power Control  
This function is provided by a temperature-compensat-  
ed voltage reference and a comparator circuit that  
Pushbutton Reset Function  
The DS3231 provides for a pushbutton switch to be  
connected to the RST output pin. When the DS3231 is  
not in a reset cycle, it continuously monitors the RST  
signal for a low going edge. If an edge transition is  
detected, the DS3231 debounces the switch by pulling  
the RST low. After the internal timer has expired  
monitors the V  
level. When V  
is greater than V  
CC  
,
PF  
.
CC  
CC  
PF  
the part is powered by V . When V  
is less than V  
CC  
but greater than V  
, the DS3231 is powered by V  
BAT  
CC  
, the  
BAT  
If V  
is less than V  
and is less than V  
CC  
PF  
device is powered by V  
. See Table 1.  
BAT  
(PB ), the DS3231 continues to monitor the RST line.  
DB  
Table 1. Power Control  
If the line is still low, the DS3231 continuously monitors  
the line looking for a rising edge. Upon detecting  
release, the DS3231 forces the RST pin low and holds it  
SUPPLY CONDITION  
ACTIVE SUPPLY  
V
CC  
V
CC  
V
CC  
V
CC  
< V , V < V  
V
BAT  
PF CC  
BAT  
BAT  
BAT  
BAT  
low for t  
.
RST  
< V , V > V  
V
PF CC  
CC  
CC  
CC  
RST is also used to indicate a power-fail condition.  
When V is lower than V , an internal power-fail sig-  
> V , V < V  
V
PF CC  
CC  
PF  
> V , V > V  
V
PF CC  
nal is generated, which forces the RST pin low. When  
returns to a level above V , the RST pin is held  
V
CC  
PF  
REC  
low for approximately 250ms (t  
) to allow the power  
To preserve the battery, the first time V  
is applied to  
BAT  
supply to stabilize. If the oscillator is not running (see  
the device, the oscillator will not start up until V  
CC  
2
the Power Control section) when V is applied, t is  
exceeds V , or until a valid I C address is written to  
CC  
REC  
PF  
bypassed and RST immediately goes high. Assertion of  
the RST output, whether by pushbutton or power-fail  
detection, does not affect the internal operation of the  
DS3231.  
the part. Typical oscillator startup time is less than one  
second. Approximately 2 seconds after V  
or a valid I C address is written, the device makes a  
temperature measurement and applies the calculated  
correction to the oscillator. Once the oscillator is run-  
ning, it continues to run as long as a valid power  
is applied,  
CC  
2
Real-Time Clock  
With the clock source from the TCXO, the RTC provides  
seconds, minutes, hours, day, date, month, and year  
information. The date at the end of the month is auto-  
matically adjusted for months with fewer than 31 days,  
including corrections for leap year. The clock operates  
in either the 24-hour or 12-hour format with an AM/PM  
indicator.  
source is available (V  
or V  
), and the device con-  
CC  
BAT  
tinues to measure the temperature and correct the  
oscillator frequency every 64 seconds.  
On the first application of power (V ) or when a valid  
CC  
2
I C address is written to the part (V  
), the time and  
BAT  
date registers are reset to 01/01/00 01 00:00:00  
(MM/DD/YY DOW HH:MM:SS).  
The clock provides two programmable time-of-day  
alarms and a programmable square-wave output. The  
INT/SQW pin either generates an interrupt due to alarm  
condition or outputs a square-wave signal and the  
selection is controlled by the bit INTCN.  
V
BAT  
Operation  
There are several modes of operation that affect the  
amount of V current that is drawn. While the device  
BAT  
is powered by V  
and the serial interface is active,  
BAT  
10  
____________________________________________________________________  
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
DS231  
Figure 1. Timekeeping Registers  
BIT 7  
MSB  
BIT 0  
LSB  
ADDRESS  
BIT 6  
BIT 5  
BIT 4  
BIT 3  
BIT 2  
BIT 1  
FUNCTION  
RANGE  
00h  
01h  
0
0
10 Seconds  
10 Minutes  
AM/PM  
10 Hour  
0
Seconds  
Seconds  
Minutes  
00–59  
00–59  
Minutes  
Hour  
1–12 + AM/PM  
02h  
0
12/24  
10 Hour  
0
Hours  
00–23  
03h  
04h  
0
0
0
0
0
Day  
Day  
1–7  
10 Date  
Date  
Month  
Year  
Date  
01–31  
Month/  
Century  
01–12 +  
Century  
05h  
Century  
0
0
10 Month  
10 Hour  
10 Hour  
06h  
07h  
08h  
10 Year  
Year  
00–99  
00–59  
00–59  
A1M1  
A1M2  
10 Seconds  
10 Minutes  
AM/PM  
Seconds  
Minutes  
Alarm 1 Seconds  
Alarm 1 Minutes  
1–12 + AM/PM  
09h  
A1M3  
12/24  
Hour  
Alarm 1 Hours  
00–23  
10 Hour  
Day  
Date  
Alarm 1 Day  
Alarm 1 Date  
1–7  
0Ah  
0Bh  
0Ch  
A1M4  
A2M2  
A2M3  
DY/DT  
10 Date  
1–31  
00–59  
10 Minutes  
AM/PM  
Minutes  
Alarm 2 Minutes  
1–12 + AM/PM  
12/24  
Hour  
Alarm 2 Hours  
00–23  
10 Hour  
Day  
Alarm 2 Day  
Alarm 2 Date  
Control  
1–7  
1–31  
0Dh  
A2M4  
DY/DT  
10 Date  
Date  
0Eh  
0Fh  
10h  
11h  
12h  
EOSC  
OSF  
BBSQW  
0
CONV  
0
RS2  
0
RS1  
EN32kHz  
DATA  
DATA  
0
INTCN  
BSY  
A2IE  
A2F  
A1IE  
A1F  
Control/Status  
Aging Offset  
MSB of Temp  
LSB of Temp  
SIGN  
SIGN  
DATA  
DATA  
DATA  
DATA  
DATA  
DATA  
0
DATA  
DATA  
0
DATA DATA  
DATA DATA  
DATA  
DATA  
0
0
0
Note: Unless otherwise specified, the registers’ state is not defined when power is first applied.  
event, it is possible that the microcontroller and  
Address Map  
2
DS3231 I C communications could become unsyn-  
Figure 1 shows the address map for the DS3231 time-  
keeping registers. During a multibyte access, when the  
address pointer reaches the end of the register space  
chronized, e.g., the microcontroller resets while read-  
ing data from the DS3231. When the microcontroller  
2
resets, the DS3231 I C interface may be placed into a  
2
(12h), it wraps around to location 00h. On an I C  
known state by toggling SCL until SDA is observed to  
be at a high level. At that point the microcontroller  
should pull SDA low while SCL is high, generating a  
START condition.  
START or address pointer incrementing to location 00h,  
the current time is transferred to a second set of regis-  
ters. The time information is read from these secondary  
registers, while the clock may continue to run. This  
eliminates the need to reread the registers in case the  
main registers update during a read.  
Clock and Calendar  
The time and calendar information is obtained by read-  
ing the appropriate register bytes. Figure 1 illustrates  
the RTC registers. The time and calendar data are set  
or initialized by writing the appropriate register bytes.  
The contents of the time and calendar registers are in  
2
I C Interface  
2
The I C interface is accessible whenever either V  
or  
CC  
V
is at a valid level. If a microcontroller connected  
BAT  
to the DS3231 resets because of a loss of V  
or other  
CC  
____________________________________________________________________ 11  
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
the binary-coded decimal (BCD) format. The DS3231  
can be run in either 12-hour or 24-hour mode. Bit 6 of  
Alarms  
The DS3231 contains two time-of-day/date alarms.  
Alarm 1 can be set by writing to registers 07h to 0Ah.  
Alarm 2 can be set by writing to registers 0Bh to 0Dh.  
The alarms can be programmed (by the alarm enable  
and INTCN bits of the control register) to activate the  
INT/SQW output on an alarm match condition. Bit 7 of  
each of the time-of-day/date alarm registers are mask  
bits (Table 2). When all the mask bits for each alarm  
are logic 0, an alarm only occurs when the values in the  
timekeeping registers match the corresponding values  
stored in the time-of-day/date alarm registers. The  
alarms can also be programmed to repeat every sec-  
ond, minute, hour, day, or date. Table 2 shows the pos-  
sible settings. Configurations not listed in the table will  
result in illogical operation.  
the hours register is defined as the 12- or 24-hour  
mode select bit. When high, the 12-hour mode is  
selected. In the 12-hour mode, bit 5 is the AM/PM bit  
with logic-high being PM. In the 24-hour mode, bit 5 is  
the second 10-hour bit (20–23 hours). The century bit  
(bit 7 of the month register) is toggled when the years  
register overflows from 99 to 00.  
DS231  
The day-of-week register increments at midnight.  
Values that correspond to the day of week are user-  
defined but must be sequential (i.e., if 1 equals  
Sunday, then 2 equals Monday, and so on). Illogical  
time and date entries result in undefined operation.  
When reading or writing the time and date registers, sec-  
ondary (user) buffers are used to prevent errors when  
the internal registers update. When reading the time and  
date registers, the user buffers are synchronized to the  
internal registers on any START and when the register  
pointer rolls over to zero. The time information is read  
from these secondary registers, while the clock contin-  
ues to run. This eliminates the need to reread the regis-  
ters in case the main registers update during a read.  
The DY/DT bits (bit 6 of the alarm day/date registers)  
control whether the alarm value stored in bits 0 to 5 of  
that register reflects the day of the week or the date of  
the month. If DY/DT is written to logic 0, the alarm will  
be the result of a match with date of the month. If  
DY/DT is written to logic 1, the alarm will be the result of  
a match with day of the week.  
The countdown chain is reset whenever the seconds regis-  
ter is written. Write transfers occur on the acknowledge  
from the DS3231. Once the countdown chain is reset, to  
avoid rollover issues the remaining time and date registers  
must be written within 1 second. The 1Hz square-wave out-  
put, if enabled, transitions high 500ms after the seconds  
data transfer, provided the oscillator is already running.  
When the RTC register values match alarm register set-  
tings, the corresponding Alarm Flag ‘A1F’ or ‘A2F’ bit is  
set to logic 1. If the corresponding Alarm Interrupt  
Enable ‘A1IE’ or ‘A2IE’ is also set to logic 1 and the  
INTCN bit is set to logic 1, the alarm condition will acti-  
vate the INT/SQW signal. The match is tested on the  
once-per-second update of the time and date registers.  
Table 2. Alarm Mask Bits  
ALARM 1 REGISTER MASK BITS (BIT 7)  
DY/DT  
ALARM RATE  
A1M4  
A1M3  
A1M2  
A1M1  
X
X
X
X
0
1
1
1
1
1
0
0
1
1
1
0
0
0
1
1
0
0
0
0
1
0
0
0
0
0
Alarm once per second  
Alarm when seconds match  
Alarm when minutes and seconds match  
Alarm when hours, minutes, and seconds match  
Alarm when date, hours, minutes, and seconds match  
Alarm when day, hours, minutes, and seconds match  
ALARM 2 REGISTER MASK BITS (BIT 7)  
DY/DT  
ALARM RATE  
A2M4  
A2M3  
A2M2  
X
X
X
0
1
1
1
1
0
0
1
1
0
0
0
1
0
0
0
0
Alarm once per minute (00 seconds of every minute)  
Alarm when minutes match  
Alarm when hours and minutes match  
Alarm when date, hours, and minutes match  
Alarm when day, hours, and minutes match  
12  
____________________________________________________________________  
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
DS231  
Control Register (0Eh)  
BIT 7  
EOSC  
0
BIT 6  
BBSQW  
0
BIT 5  
CONV  
0
BIT 4  
RS2  
1
BIT 3  
RS1  
1
BIT 2  
INTCN  
1
BIT 1  
A2IE  
0
BIT 0  
A1IE  
0
NAME:  
POR:  
Special-Purpose Registers  
SQUARE-WAVE OUTPUT FREQUENCY  
The DS3231 has two additional registers (control and  
status) that control the real-time clock, alarms, and  
square-wave output.  
SQUARE-WAVE OUTPUT  
FREQUENCY  
RS2  
RS1  
0
0
1
1
0
1
0
1
1Hz  
Control Register (0Eh)  
Bit 7: Enable Oscillator (EOSC). When set to logic 0,  
the oscillator is started. When set to logic 1, the oscilla-  
1.024kHz  
4.096kHz  
8.192kHz  
tor is stopped when the DS3231 switches to V  
. This  
BAT  
bit is clear (logic 0) when power is first applied. When  
the DS3231 is powered by V , the oscillator is always  
CC  
the square wave has been enabled. The following table  
shows the square-wave frequencies that can be select-  
ed with the RS bits. These bits are both set to logic 1  
(8.192kHz) when power is first applied.  
on regardless of the status of the EOSC bit. When  
EOSC is disabled, all register data is static.  
Bit 6: Battery-Backed Square-Wave Enable  
(BBSQW). When set to logic 1 and the DS3231 is being  
Bit 2: Interrupt Control (INTCN). This bit controls the  
INT/SQW signal. When the INTCN bit is set to logic 0, a  
square wave is output on the INT/SQW pin. When the  
INTCN bit is set to logic 1, then a match between the  
timekeeping registers and either of the alarm registers  
activates the INT/SQW output (if the alarm is also  
enabled). The corresponding alarm flag is always set  
regardless of the state of the INTCN bit. The INTCN bit  
is set to logic 1 when power is first applied.  
powered by the V  
pin, this bit enables the square-  
BAT  
wave or interrupt output when V  
is absent. When  
CC  
BBSQW is logic 0, the INT/SQW pin goes high imped-  
ance when V  
falls below the power-fail trip point. This  
CC  
bit is disabled (logic 0) when power is first applied.  
Bit 5: Convert Temperature (CONV). Setting this bit to  
1 forces the temperature sensor to convert the temper-  
ature into digital code and execute the TCXO algorithm  
to update the capacitance array to the oscillator. This  
can only happen when a conversion is not already in  
progress. The user should check the status bit BSY  
before forcing the controller to start a new TCXO exe-  
cution. A user-initiated temperature conversion does  
not affect the internal 64-second update cycle.  
Bit 1: Alarm 2 Interrupt Enable (A2IE). When set to  
logic 1, this bit permits the alarm 2 flag (A2F) bit in the  
status register to assert INT/SQW (when INTCN = 1).  
When the A2IE bit is set to logic 0 or INTCN is set to  
logic 0, the A2F bit does not initiate an interrupt signal.  
The A2IE bit is disabled (logic 0) when power is first  
applied.  
A user-initiated temperature conversion does not affect  
the BSY bit for approximately 2ms. The CONV bit  
remains at a 1 from the time it is written until the conver-  
sion is finished, at which time both CONV and BSY go  
to 0. The CONV bit should be used when monitoring  
the status of a user-initiated conversion.  
Bit 0: Alarm 1 Interrupt Enable (A1IE). When set to  
logic 1, this bit permits the alarm 1 flag (A1F) bit in the  
status register to assert INT/SQW (when INTCN = 1).  
When the A1IE bit is set to logic 0 or INTCN is set to  
logic 0, the A1F bit does not initiate the INT/SQW sig-  
nal. The A1IE bit is disabled (logic 0) when power is  
first applied.  
Bits 4 and 3: Rate Select (RS2 and RS1). These bits  
control the frequency of the square-wave output when  
____________________________________________________________________ 13  
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
Status Register (0Fh)  
BIT 7  
OSF  
1
BIT 6  
BIT 5  
BIT 4  
BIT 3  
EN32kHz  
1
BIT 2  
BSY  
X
BIT 1  
A2F  
X
BIT 0  
A1F  
X
NAME:  
POR:  
0
0
0
0
0
0
DS231  
ters. If the A1IE bit is logic 1 and the INTCN bit is set to  
logic 1, the INT/SQW pin is also asserted. A1F is  
cleared when written to logic 0. This bit can only be  
written to logic 0. Attempting to write to logic 1 leaves  
the value unchanged.  
Status Register (0Fh)  
Bit 7: Oscillator Stop Flag (OSF). A logic 1 in this bit  
indicates that the oscillator either is stopped or was  
stopped for some period and may be used to judge the  
validity of the timekeeping data. This bit is set to logic 1  
any time that the oscillator stops. The following are exam-  
ples of conditions that can cause the OSF bit to be set:  
Aging Offset  
The aging offset register takes a user-provided value to  
add to or subtract from the codes in the capacitance  
array registers. The code is encoded in two’s comple-  
ment, with bit 7 representing the sign bit. One LSB rep-  
resents one small capacitor to be switched in or out of  
the capacitance array at the crystal pins. The aging off-  
set register capacitance value is added or subtracted  
from the capacitance value that the device calculates  
for each temperature compensation. The offset register  
is added to the capacitance array during a normal tem-  
perature conversion, if the temperature changes from  
the previous conversion, or during a manual user con-  
version (setting the CONV bit). To see the effects of the  
aging register on the 32kHz output frequency immedi-  
ately, a manual conversion should be started after each  
aging register change.  
1) The first time power is applied.  
2) The voltages present on both V  
insufficient to support oscillation.  
and V  
are  
BAT  
CC  
3) The EOSC bit is turned off in battery-backed mode.  
4) External influences on the crystal (i.e., noise, leak-  
age, etc.).  
This bit remains at logic 1 until written to logic 0.  
Bit 3: Enable 32kHz Output (EN32kHz). This bit con-  
trols the status of the 32kHz pin. When set to logic 1, the  
32kHz pin is enabled and outputs a 32.768kHz square-  
wave signal. When set to logic 0, the 32kHz pin goes to  
a high-impedance state. The initial power-up state of  
this bit is logic 1, and a 32.768kHz square-wave signal  
appears at the 32kHz pin after a power source is  
applied to the DS3231 (if the oscillator is running).  
Positive aging values add capacitance to the array,  
slowing the oscillator frequency. Negative values  
remove capacitance from the array, increasing the  
oscillator frequency.  
Bit 2: Busy (BSY). This bit indicates the device is busy  
executing TCXO functions. It goes to logic 1 when the  
conversion signal to the temperature sensor is asserted  
and then is cleared when the device is in the 1-minute  
idle state.  
The change in ppm per LSB is different at different  
temperatures. The frequency vs. temperature curve is  
shifted by the values used in this register. At +25°C,  
one LSB typically provides about 0.1ppm change in  
frequency.  
Bit 1: Alarm 2 Flag (A2F). A logic 1 in the alarm 2 flag  
bit indicates that the time matched the alarm 2 regis-  
ters. If the A2IE bit is logic 1 and the INTCN bit is set to  
logic 1, the INT/SQW pin is also asserted. A2F is  
cleared when written to logic 0. This bit can only be  
written to logic 0. Attempting to write to logic 1 leaves  
the value unchanged.  
Use of the aging register is not needed to achieve the  
accuracy as defined in the EC tables, but could be  
used to help compensate for aging at a given tempera-  
ture. See the Typical Operating Characteristics section  
for a graph showing the effect of the register on accu-  
racy over temperature.  
Bit 0: Alarm 1 Flag (A1F). A logic 1 in the alarm 1 flag  
bit indicates that the time matched the alarm 1 regis-  
Aging Offset (10h)  
BIT 7  
Sign  
0
BIT 6  
Data  
0
BIT 5  
Data  
0
BIT 4  
Data  
0
BIT 3  
Data  
0
BIT 2  
Data  
0
BIT 1  
Data  
0
BIT 0  
Data  
0
NAME:  
POR:  
14  
____________________________________________________________________  
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
DS231  
Temperature Register (Upper Byte) (11h)  
BIT 7  
Sign  
0
BIT 6  
Data  
0
BIT 5  
Data  
0
BIT 4  
Data  
0
BIT 3  
Data  
0
BIT 2  
Data  
0
BIT 1  
Data  
0
BIT 0  
Data  
0
NAME:  
POR:  
Temperature Register (Lower Byte) (12h)  
BIT 7  
Data  
0
BIT 6  
Data  
0
BIT 5  
BIT 4  
BIT 3  
BIT 2  
BIT 1  
BIT 0  
NAME:  
POR:  
0
0
0
0
0
0
0
0
0
0
0
0
line while the clock line is high are interpreted as  
control signals.  
Temperature Registers (11h–12h)  
Temperature is represented as a 10-bit code with a res-  
olution of 0.25°C and is accessible at location 11h and  
12h. The temperature is encoded in two’s complement  
format. The upper 8 bits, the integer portion, are at  
location 11h and the lower 2 bits, the fractional portion,  
are in the upper nibble at location 12h. For example,  
00011001 01b = +25.25°C. Upon power reset, the reg-  
isters are set to a default temperature of 0°C and the  
controller starts a temperature conversion. The temper-  
Accordingly, the following bus conditions have been  
defined:  
Bus not busy: Both data and clock lines remain  
high.  
START data transfer: A change in the state of the  
data line from high to low, while the clock line is high,  
defines a START condition.  
ature is read on initial application of V  
or I2C access  
STOP data transfer: A change in the state of the  
data line from low to high, while the clock line is high,  
defines a STOP condition.  
CC  
on V  
and once every 64 seconds afterwards. The  
BAT  
temperature registers are updated after each user-initi-  
ated conversion and on every 64-second conversion.  
The temperature registers are read-only.  
Data valid: The state of the data line represents  
valid data when, after a START condition, the data  
line is stable for the duration of the high period of the  
clock signal. The data on the line must be changed  
during the low period of the clock signal. There is  
one clock pulse per bit of data.  
2
I C Serial Data Bus  
2
The DS3231 supports a bidirectional I C bus and data  
transmission protocol. A device that sends data onto  
the bus is defined as a transmitter and a device receiv-  
ing data is defined as a receiver. The device that con-  
trols the message is called a master. The devices that  
are controlled by the master are slaves. The bus must  
be controlled by a master device that generates the  
serial clock (SCL), controls the bus access, and gener-  
ates the START and STOP conditions. The DS3231  
Each data transfer is initiated with a START condition  
and terminated with a STOP condition. The number  
of data bytes transferred between the START and  
the STOP conditions is not limited, and is determined  
by the master device. The information is transferred  
byte-wise and each receiver acknowledges with a  
ninth bit.  
2
operates as a slave on the I C bus. Connections to the  
Acknowledge: Each receiving device, when  
addressed, is obliged to generate an acknowledge  
after the reception of each byte. The master device  
must generate an extra clock pulse, which is associ-  
ated with this acknowledge bit.  
bus are made through the SCL input and open-drain  
SDA I/O lines. Within the bus specifications, a standard  
mode (100kHz maximum clock rate) and a fast mode  
(400kHz maximum clock rate) are defined. The DS3231  
works in both modes.  
A device that acknowledges must pull down the SDA  
line during the acknowledge clock pulse in such a  
way that the SDA line is stable low during the high  
period of the acknowledge-related clock pulse. Of  
course, setup and hold times must be taken into  
account. A master must signal an end of data to the  
The following bus protocol has been defined (Figure 2):  
• Data transfer may be initiated only when the bus is  
not busy.  
• During data transfer, the data line must remain stable  
whenever the clock line is high. Changes in the data  
____________________________________________________________________ 15  
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
MSB FIRST  
MSB  
LSB  
MSB  
LSB  
SDA  
SLAVE  
ADDRESS  
R/W  
8
ACK  
9
DATA  
ACK  
9
DATA  
ACK/  
NACK  
DS231  
SCL  
1–7  
1–7  
8
1–7  
8
9
IDLE  
START  
CONDITION  
REPEATED IF MORE BYTES  
ARE TRANSFERRED  
STOP CONDITION  
REPEATED START  
2
Figure 2. I C Data Transfer Overview  
slave by not generating an acknowledge bit on the  
last byte that has been clocked out of the slave. In  
this case, the slave must leave the data line high to  
enable the master to generate the STOP condition.  
the slave address. Next follows a number of data  
bytes. The slave returns an acknowledge bit after  
each received byte. Data is transferred with the most  
significant bit (MSB) first.  
Figures 3 and 4 detail how data transfer is accom-  
Data transfer from a slave transmitter to a master  
receiver. The first byte (the slave address) is trans-  
mitted by the master. The slave then returns an  
acknowledge bit. Next follows a number of data  
bytes transmitted by the slave to the master. The  
2
plished on the I C bus. Depending upon the state of  
the R/W bit, two types of data transfer are possible:  
Data transfer from a master transmitter to a slave  
receiver. The first byte transmitted by the master is  
<SLAVE  
ADDRESS> <R/W> <WORD ADDRESS (n)>  
<DATA (n)>  
XXXXXXXX  
<DATA (n + 1)>  
XXXXXXXX  
<DATA (n + X)  
XXXXXXXX  
S
1101000 XXXXXXXX  
0
A
A
A
A
A
P
...  
S - START  
A - ACKNOWLEDGE (ACK)  
P - STOP  
SLAVE TO MASTER  
MASTER TO SLAVE  
DATA TRANSFERRED  
(X + 1 BYTES + ACKNOWLEDGE)  
R/W - READ/WRITE OR DIRECTION BIT ADDRESS  
Figure 3. Data Write—Slave Receiver Mode  
<SLAVE  
ADDRESS> <R/W>  
<DATA (n)>  
XXXXXXXX  
<DATA (n + 1)>  
<DATA (n + 2)>  
XXXXXXXX  
<DATA (n + X)>  
XXXXXXXX  
S
1101000  
1
A
A
XXXXXXXX  
A
A
A
P
...  
S - START  
MASTER TO SLAVE  
SLAVE TO MASTER  
A - ACKNOWLEDGE (ACK)  
P - STOP  
A - NOT ACKNOWLEDGE (NACK)  
DATA TRANSFERRED  
(X + 1 BYTES + ACKNOWLEDGE)  
NOTE: LAST DATA BYTE IS FOLLOWED BY A NACK.  
R/W - READ/WRITE OR DIRECTION BIT ADDRESS  
Figure 4. Data Read—Slave Transmitter Mode  
16  
____________________________________________________________________  
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
DS231  
<SLAVE  
ADDRESS> <R/W>  
<WORD ADDRESS (n)> <SLAVE ADDRESS (n)> <R/W>  
XXXXXXXX Sr 1101000 A  
S
1101000  
0
A
A
1
<DATA (n)>  
XXXXXXXX  
<DATA (n + 1)>  
XXXXXXXX  
<DATA (n + 2)>  
XXXXXXXX  
<DATA (n + X)>  
XXXXXXXX  
A
A
A
A
P
...  
S - START  
Sr - REPEATED START  
A - ACKNOWLEDGE (ACK)  
P - STOP  
MASTER TO SLAVE  
SLAVE TO MASTER  
DATA TRANSFERRED  
(X + 1 BYTES + ACKNOWLEDGE)  
NOTE: LAST DATA BYTE IS FOLLOWED BY A NACK.  
A - NOT ACKNOWLEDGE (NACK)  
R/W - READ/WRITE OR DIRECTION BIT ADDRESS  
Figure 5. Data Write/Read (Write Pointer, Then Read)—Slave Receive and Transmit  
master returns an acknowledge bit after all received  
bytes other than the last byte. At the end of the last  
received byte, a not acknowledge is returned.  
acknowledging the transfer. The master may then  
transmit zero or more bytes of data, with the DS3231  
acknowledging each byte received. The register  
pointer increments after each data byte is trans-  
ferred. The master generates a STOP condition to  
terminate the data write.  
The master device generates all the serial clock puls-  
es and the START and STOP conditions. A transfer is  
ended with a STOP condition or with a repeated  
START condition. Since a repeated START condition  
is also the beginning of the next serial transfer, the  
bus will not be released. Data is transferred with the  
most significant bit (MSB) first.  
Slave transmitter mode (DS3231 read mode): The  
first byte is received and handled as in the slave  
receiver mode. However, in this mode, the direction  
bit indicates that the transfer direction is reversed.  
Serial data is transmitted on SDA by the DS3231  
while the serial clock is input on SCL. START and  
STOP conditions are recognized as the beginning  
and end of a serial transfer. Address recognition is  
performed by hardware after reception of the slave  
address and direction bit. The slave address byte is  
the first byte received after the master generates a  
START condition. The slave address byte contains  
the 7-bit DS3231 address, which is 1101000, fol-  
lowed by the direction bit (R/W), which is 1 for a  
read. After receiving and decoding the slave  
address byte, the DS3231 outputs an acknowledge  
on SDA. The DS3231 then begins to transmit data  
starting with the register address pointed to by the  
register pointer. If the register pointer is not written to  
before the initiation of a read mode, the first address  
that is read is the last one stored in the register point-  
er. The DS3231 must receive a not acknowledge to  
end a read.  
The DS3231 can operate in the following two modes:  
Slave receiver mode (DS3231 write mode): Serial  
data and clock are received through SDA and SCL.  
After each byte is received, an acknowledge bit is  
transmitted. START and STOP conditions are recog-  
nized as the beginning and end of a serial transfer.  
Address recognition is performed by hardware after  
reception of the slave address and direction bit. The  
slave address byte is the first byte received after the  
master generates the START condition. The slave  
address byte contains the 7-bit DS3231 address,  
which is 1101000, followed by the direction bit (R/W),  
which is 0 for a write. After receiving and decoding  
the slave address byte, the DS3231 outputs an  
acknowledge on SDA. After the DS3231 acknowl-  
edges the slave address + write bit, the master  
transmits a word address to the DS3231. This sets  
the register pointer on the DS3231, with the DS3231  
____________________________________________________________________ 17  
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
signal line. All N.C. (no connect) pins must be connect-  
Handling, PC Board Layout,  
and Assembly  
The DS3231 package contains a quartz tuning-fork  
crystal. Pick-and-place equipment can be used, but  
precautions should be taken to ensure that excessive  
shocks are avoided. Ultrasonic cleaning should be  
avoided to prevent damage to the crystal.  
ed to ground.  
Moisture-sensitive packages are shipped from the fac-  
tory dry packed. Handling instructions listed on the  
package label must be followed to prevent damage  
during reflow. Refer to the IPC/JEDEC J-STD-020 stan-  
dard for moisture-sensitive device (MSD) classifications  
and reflow profiles. Exposure to reflow is limited to 2  
times maximum.  
DS231  
Avoid running signal traces under the package, unless  
a ground plane is placed between the package and the  
Pin Configuration  
Chip Information  
TRANSISTOR COUNT: 33,000  
TOP VIEW  
SUBSTRATE CONNECTED TO GROUND  
PROCESS: CMOS  
32kHz  
1
2
3
4
5
6
7
8
16 SCL  
15 SDA  
V
CC  
Thermal Information  
Theta-JA: +73°C/W  
INT/SQW  
RST  
14 V  
BAT  
13 GND  
12 N.C.  
11 N.C.  
10 N.C.  
Theta-JC: +23°C/W  
DS3231S  
N.C.  
N.C.  
Package Information  
For the latest package outline information and land patterns, go  
N.C.  
to www.maxim-ic.com/packages.  
N.C.  
9
N.C.  
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.  
SO  
16 SO  
21-0042  
18  
____________________________________________________________________  
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
DS231  
Revision History  
REVISION REVISION  
PAGES  
DESCRIPTION  
CHANGED  
NUMBER  
DATE  
0
1/05  
Initial release.  
1, 3  
1
Changed Digital Temp Sensor Output from ±2°C to ±3°C.  
Updated Typical Operating Circuit.  
1
2/05  
Changed T = -40°C to +85°C to T = T  
to T .  
MAX  
2, 3, 4  
8
A
A
MIN  
Updated Block Diagram.  
Added “UL Recognized” to Features; added lead-free packages and removed S  
from top mark info in Ordering Information table; added ground connections to  
the N.C. pin in the Typical Operating Circuit.  
1
Added “noncondensing” to operating temperature range; changed V MIN from  
PF  
2.35V to 2.45V.  
2
Added aging offset specification.  
Relabeled TOC4.  
3
7
Added arrow showing input on X1 in the Block Diagram.  
8
Updated pin descriptions for V and V  
CC  
.
9
BAT  
2
6/05  
2
Added the I C Interface section.  
10  
11  
13  
Figure 1: Added sign bit to aging and temperature registers; added MSB and LSB.  
Corrected title for rate select bits frequency table.  
Added note that frequency stability over temperature spec is with aging offset  
register = 00h; changed bit 7 from Data to Sign (Crystal Aging Offset Register).  
14  
15  
17  
Changed bit 7 from Data to Sign (Temperature Register); correct pin definitions  
2
in I C Serial Data Bus section.  
Modified the Handing, PC Board Layout, and Assembly section to refer to  
J-STD-020 for reflow profiles for lead-free and leaded packages.  
3
4
11/05  
10/06  
Changed lead-free packages to RoHS-compliant packages.  
1
1
Changed RST and UL bullets in Features.  
Changed EC condition “V > V  
” to “V = Active Supply (see Table 1).”  
2, 3  
6
CC  
BAT  
CC  
Modified Note 12 to correct t  
operation.  
REC  
Added various conditions text to TOCs 1, 2, and 3.  
7
Added text to pin descriptions for 32kHz, V , and RST.  
CC  
9
Table 1: Changed column heading “Powered By” to “Active Supply”; changed  
10  
13  
14  
“applied” to “exceeds V ” in the Power Control section.  
PF  
Indicated BBSQW applies to both SQW and interrupts; simplified temp convert  
description (bit 5); added “output” to INT\SQW (bit 2).  
Changed the Crystal Aging section to the Aging Offset section; changed “this  
bit indicates” to “this bit controls” for the enable 32kHz output bit.  
Added Warning note to EC table notes; updated Note 12.  
6
7
Updated the Typical Operating Characteristics graphs.  
In the Power Control section, added information about the POR state of the time  
and date registers; in the Real-Time Clock section, added to the description of  
the RST function.  
5
4/08  
10  
11  
In Figure 1, corrected the months date range for 04h from 00–31 to 01–31.  
____________________________________________________________________ 19  
2
Extremely Accurate I C-Integrated  
RTC/TCXO/Crystal  
Revision History (continued)  
REVISION REVISION  
PAGES  
CHANGED  
DESCRIPTION  
Updated the Typical Operating Circuit.  
NUMBER  
DATE  
1
Removed the V parameter from the Recommended DC Operating Conditions  
PU  
table and added verbiage about the pullup to the Pin Description table for  
INT/SQW, SDA, and SCL.  
2, 9  
DS231  
Added the Delta Time and Frequency vs. Temperature graph in the Typical  
Operating Characteristics section.  
7
8
6
10/08  
Updated the Block Diagram.  
Added the V  
Operation section, improved some sections of text for the  
BAT  
10  
32kHz TCXO and Pushbutton Reset Function sections.  
Added the register bit POR values to the register tables.  
13, 14, 15  
14, 15  
Updated the Aging Offset and Temperature Registers (11h–12h) sections.  
2
Updated the I C timing diagrams (Figures 3, 4, and 5).  
16, 17  
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are  
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.  
20 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600  
© 2008 Maxim Integrated Products  
is a registered trademark of Dallas Semiconductor Corporation.  
is a registered trademark of Maxim Integrated Products, Inc.  

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