DS1250W-100IND+ [MAXIM]
3.3V 4096k Nonvolatile SRAM;型号: | DS1250W-100IND+ |
厂家: | MAXIM INTEGRATED PRODUCTS |
描述: | 3.3V 4096k Nonvolatile SRAM 静态存储器 内存集成电路 |
文件: | 总9页 (文件大小:226K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
19-5648; Rev 12/10
DS1250W
3.3V 4096k Nonvolatile SRAM
www.maxim-ic.com
FEATURES
PIN ASSIGNMENT
. 10 years minimum data retention in the
absence of external power
A18
A16
A14
A12
A7
1
32
31
VCC
A15
A17
WE
A13
A8
2
3
4
30
29
. Data is automatically protected during power
loss
. Replaces 512k x 8 volatile static RAM,
EEPROM or Flash memory
. Unlimited write cycles
. Low-power CMOS
5
6
28
27
A6
A5
A4
A9
7
8
26
25
A11
OE
A10
CE
A3
9
24
23
A2
10
. Read and write access times of 100ns
. Lithium energy source is electrically
disconnected to retain freshness until power is
applied for the first time
. Optional industrial temperature range of -
40°C to +85°C, designated IND
. JEDEC standard 32-pin DIP package
. PowerCap Module (PCM) package
– Directly surface-mountable module
– Replaceable snap-on PowerCap provides
lithium backup battery
A1
11
12
22
21
DQ7
DQ6
A0
13
14
15
16
20
19
18
17
DQ0
DQ1
DQ2
DQ5
DQ4
DQ3
GND
32-Pin Encapsulated Package
740-Mil Extended
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
A18
A17
A14
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
NC
A15
A16
A13
A12
A11
A10
A9
NC
– Standardized pinout for all nonvolatile
SRAM products
– Detachment feature on PCM allows easy
removal using a regular screwdriver
VCC
WE
OE
CE
A8
DQ7
DQ6
DQ5
DQ4
DQ3
A7
A6
A5
A4
A3
A2
A1
A0
VBAT
GND
DQ2
DQ1
DQ0
GND
34-Pin PowerCap Module (PCM)
(Uses DS9034PC+ or DS9034PCI+ PowerCap)
PIN DESCRIPTION
A0 - A18
DQ0 - DQ7
CE
- Address Inputs
- Data In/Data Out
- Chip Enable
- Write Enable
- Output Enable
- Power (+3.3V)
- Ground
WE
OE
VCC
GND
NC
- No Connect
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DS1250W
DESCRIPTION
The DS1250W 3.3V 4096k Nonvolatile SRAM is a 4,194,304-bit, fully static, nonvolatile SRAM
organized as 524,288 words by 8 bits. Each NV SRAM has a self-contained lithium energy source and
control circuitry, which constantly monitors VCC for an out-of-tolerance condition. When such a condition
occurs, the lithium energy source is automatically switched on and write protection is unconditionally
enabled to prevent data corruption. DIP-package DS1250W devices can be used in place of existing 512k
x 8 static RAMs directly conforming to the popular bytewide 32-pin DIP standard. DS1250W devices in
the PowerCap Module package are directly surface mountable and are normally paired with a DS9034PC
PowerCap to form a complete Nonvolatile SRAM module. There is no limit on the number of write
cycles that can be executed and no additional support circuitry is required for microprocessor interfacing.
READ MODE
The DS1250W executes a read cycle whenever
(Write Enable) is inactive (high) and
(Chip
CE
WE
Enable) and
(Output Enable) are active (low). The unique address specified by the 19 address inputs
OE
(A0 - A18) defines which of the 524,288 bytes of data is to be accessed. Valid data will be available to the
eight data output drivers within tACC (Access Time) after the last address input signal is stable, providing
that
and
(Output Enable) access times are also satisfied. If
and
access times are not
CE
CE
OE
OE
satisfied, then data access must be measured from the later-occurring signal (
or
) and the limiting
OE
CE
parameter is either tCO for
or tOE for
rather than address access.
OE
CE
WRITE MODE
The DS1250W executes a write cycle whenever the
and
signals are active (low) after address
CE
WE
inputs are stable. The later-occurring falling edge of
or
will determine the start of the write cycle.
WE
CE
The write cycle is terminated by the earlier rising edge of
or
. All address inputs must be kept
WE
CE
valid throughout the write cycle.
must return to the high state for a minimum recovery time (tWR)
WE
before another cycle can be initiated. The
control signal should be kept inactive (high) during write
OE
cycles to avoid bus contention. However, if the output drivers are enabled (
will disable the outputs in tODW from its falling edge.
and
active) then
OE WE
CE
DATA RETENTION MODE
The DS1250W provides full functional capability for VCC greater than 3.0 volts and write protects by 2.8
volts. Data is maintained in the absence of VCC without any additional support circuitry. The nonvolatile
static RAMs constantly monitor VCC. Should the supply voltage decay, the NV SRAMs automatically
write protect themselves, all inputs become “don’t care,” and all outputs become high-impedance. As VCC
falls below approximately 2.5 volts, a power switching circuit connects the lithium energy source to
RAM to retain data. During power-up, when VCC rises above approximately 2.5 volts, the power
switching circuit connects external VCC to RAM and disconnects the lithium energy source. Normal
RAM operation can resume after VCC exceeds 3.0 volts.
FRESHNESS SEAL
Each DS1250W device is shipped from Maxim with its lithium energy source disconnected, guaranteeing
full energy capacity. When VCC is first applied at a level greater than 3.0 volts, the lithium energy source
is enabled for battery back-up operation.
PACKAGES
The DS1250W is available in two packages: 32-pin DIP and 34-pin PowerCap Module (PCM). The 32-
pin DIP integrates a lithium battery, an SRAM memory and a nonvolatile control function into a single
package with a JEDEC-standard 600-mil DIP pinout. The 34-pin PowerCap Module integrates SRAM
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DS1250W
memory and nonvolatile control into a module base along with contacts for connection to the lithium
battery in the DS9034PC PowerCap. The PowerCap Module package design allows a DS1250W PCM
device to be surface mounted without subjecting its lithium backup battery to destructive high-
temperature reflow soldering. After a DS1250W module base is reflow soldered, a DS9034PC PowerCap
is snapped on top of the base to form a complete Nonvolatile SRAM module. The DS9034PC is keyed to
prevent improper attachment. DS1250W module bases and DS9034PC PowerCaps are ordered separately
and shipped in separate containers. See the DS9034PC data sheet for further information.
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DS1250W
ABSOLUTE MAXIMUM RATINGS
Voltage on Any Pin Relative to Ground
Operating Temperature Range
Commercial:
-0.3V to +4.6V
0°C to +70°C
Industrial:
-40°C to +85°C
Storage Temperature
EDIP
PowerCap
-40°C to +85°C
-55°C to +125°C
+260°C
Lead Temperature (soldering, 10s)
Soldering Temperature (reflow, PowerCap)
Note: EDIP is wave or hand soldered only.
+260°C
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect
reliability.
RECOMMENDED DC OPERATING CONDITIONS
(TA: See Note 10)
PARAMETER
Power Supply Voltage
Logic 1
SYMBOL MIN
TYP
MAX
3.6
UNITS NOTES
VCC
VIH
VIL
3.0
2.2
0.0
3.3
V
V
V
VCC
Logic 0
+0.4
DC ELECTRICAL CHARACTERISTICS
(TA: See Note 10) (VCC = 3.3V ±0.3V)
PARAMETER
SYMBOL MIN
TYP
MAX
UNITS NOTES
Input Leakage Current
IIL
IIO
-1.0
-1.0
-1.0
2.0
+1.0
µA
µA
mA
mA
µA
µA
mA
V
+1.0
I/O Leakage Current
≥ VIH ≤ VCC
CE
Output Current @ 2.2V
Output Current @ 0.4V
IOH
IOL
ICCS1
ICCS2
ICCO1
VTP
50
30
250
150
50
Standby Current
Standby Current
=2.2V
CE
CE
=V -0.2V
CC
Operating Current
Write Protection Voltage
2.8
2.9
3.0
CAPACITANCE
PARAMETER
(TA = +25°C)
UNITS NOTES
SYMBOL MIN
TYP
MAX
10
Input Capacitance
CIN
5
5
pF
pF
Input/Output Capacitance
CI/O
10
4 of 9
DS1250W
(TA: See Note 10) (VCC = 3.3V ±0.3V)
DS1250W-100
AC ELECTRICAL CHARACTERISTICS
PARAMETER
SYMBOL
UNITS
NOTES
MIN
MAX
Read Cycle Time
Access Time
tRC
tACC
tOE
100
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
100
50
to Output Valid
to Output Valid
OE
CE
OE
tCO
100
tCOE
tOD
tOH
tWC
tWP
tAW
5
5
5
or
to Output Active
CE
Output High-Z from Deselection
Output Hold from Address Change
Write Cycle Time
35
5
100
75
0
Write Pulse Width
3
Address Setup Time
tWR1
tWR2
5
12
13
5
Write Recovery Time
20
tODW
tOEW
tDS
35
ns
ns
ns
ns
Output High-Z from
Output Active from
Data Setup Time
WE
WE
5
5
40
0
4
tDH1
tDH2
12
13
Data Hold Time
20
READ CYCLE
SEE NOTE 1
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DS1250W
WRITE CYCLE 1
SEE NOTES 2, 3, 4, 6, 7, 8, AND 12
WRITE CYCLE 2
SEE NOTES 2, 3, 4, 6, 7, 8, AND 12
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DS1250W
POWER-DOWN/POWER-UP CONDITION
POWER-DOWN/POWER-UP TIMING
(TA: See Note 10)
PARAMETER
SYMBOL MIN
tPD
tF
TYP
MAX
UNITS NOTES
1.5
11
µs
µs
µs
ms
ms
VCC Fail Detect to
and
Inactive
WE
CE
VCC slew from VTP to 0V
VCC slew from 0V to VTP
150
150
tR
tPU
tREC
2
VCC Valid to
and
Inactive
WE
CE
VCC Valid to End of Write Protection
125
(TA = +25°C)
UNITS NOTES
PARAMETER
SYMBOL MIN
tDR 10
TYP
MAX
Expected Data Retention Time
years
9
WARNING:
Under no circumstance are negative undershoots, of any amplitude, allowed when device is in battery
backup mode.
NOTES:
1.
is high for a Read Cycle.
WE
2.
= VIH or VIL. If
= VIH during write cycle, the output buffers remain in a high-impedance state.
OE
OE
3. tWP is specified as the logical AND of
and
. t is measured from the latter of
or
CE WE
CE
WE
WP
going low to the earlier of
or
going high.
WE
CE
4. tDH, tDS are measured from the earlier of
or
going high.
WE
CE
5. These parameters are sampled with a 5 pF load and are not 100% tested.
6. If the low transition occurs simultaneously with or latter than the
low transition, the output
high transition, the output
CE
WE
WE
buffers remain in a high-impedance state during this period.
7. If the high transition occurs prior to or simultaneously with the
CE
buffers remain in high-impedance state during this period.
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DS1250W
8. If
is low or the
low transition occurs prior to or simultaneously with the low transition,
CE
WE
WE
the output buffers remain in a high-impedance state during this period.
9. Each DS1250W has a built-in switch that disconnects the lithium source until VCC is first applied by
the user. The expected tDR is defined as accumulative time in the absence of VCC starting from the
time power is first applied by the user.
10. All AC and DC electrical characteristics are valid over the full operating temperature range. For
commercial products, this range is 0°C to +70°C. For industrial products (IND), this range is -40°C to
+85°C.
11. In a power-down condition the voltage on any pin may not exceed the voltage on VCC.
12. tWR1 and tDH1 are measured from
13. tWR2 and tDH2 are measured from
going high.
going high.
WE
CE
14. DS1250 modules are recognized by Underwriters Laboratories (UL) under file E99151.
DC TEST CONDITIONS
Outputs Open
Cycle = 200ns for operating current
All voltages are referenced to ground
AC TEST CONDITIONS
Output Load: 100 pF + 1TTL Gate
Input Pulse Levels: 0 to 2.7V
Timing Measurement Reference Levels
Input: 1.5V
Output: 1.5V
Input pulse Rise and Fall Times: 5ns
ORDERING INFORMATION
SUPPLY
TOLERANCE
3.3V ± 0.3V
3.3V ± 0.3V
3.3V ± 0.3V
3.3V ± 0.3V
SPEED
GRADE (ns)
100
PART
TEMP RANGE
PIN-PACKAGE
DS1250W-100+
0°C to +70°C
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
32 740 EDIP
34 PowerCap*
32 740 EDIP
34 PowerCap*
DS1250WP-100+
DS1250W-100IND+
DS1250WP-100IND+
100
100
100
+Denotes a lead(Pb)-free/RoHS-compliant package.
*DS9034PC+ or DS9034PCI+ (PowerCap) required. Must be ordered separately.
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix
character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
OUTLINE NO.
21-0245
LAND PATTERN NO.
—
32 EDIP
MDT32+6
—
34 PCAP
PC2+5
21-0246
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DS1250W
REVISION HISTORY
REVISION
PAGES
CHANGED
DESCRIPTION
DATE
Added the Package Information table; removed the DIP module
package drawing and dimension table
121907
7, 8
Updated the storage information, soldering temperature, and lead
temperature information in the Absolute Maximum Ratings
section; removed the -150 MIN/MAX information from the AC
Electrical Characteristics table; updated the Ordering
Information table (removed -150 parts and leaded -100 parts);
updated the Package Information table
12/10
1, 4, 5, 8
9 of 9
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