73S8023C-IM/F1 [MAXIM]

Analog Circuit, 1 Func, 5 X 5 MM, LEAD FREE, QFN-32;
73S8023C-IM/F1
元器件型号: 73S8023C-IM/F1
生产厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
描述和应用:

Analog Circuit, 1 Func, 5 X 5 MM, LEAD FREE, QFN-32

PDF文件: 总27页 (文件大小:389K)
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型号参数:73S8023C-IM/F1参数
是否Rohs认证 不符合
生命周期Obsolete
包装说明HVQCCN,
Reach Compliance Codeunknown
HTS代码8542.39.00.01
风险等级5.63
模拟集成电路 - 其他类型ANALOG CIRCUIT
JESD-30 代码S-XQCC-N32
长度5 mm
功能数量1
端子数量32
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料UNSPECIFIED
封装代码HVQCCN
封装形状SQUARE
封装形式CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)NOT SPECIFIED
座面最大高度0.9 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
温度等级INDUSTRIAL
端子形式NO LEAD
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度5 mm
Base Number Matches1
MAX34334CSE前5页PDF页面详情预览
73S8023C
Smart Card Interface
Simplifying System Integration™
DATA SHEET
April 2009
DESCRIPTION
The Teridian 73S8023C is a low-power, high efficiency,
single smart card interface IC suitable for 3V and 5V
cards. It provides full electrical compliance with ISO-
7816-3 and EMV 4.0 (EMV2000) specifications.
Hardware support for any type of synchronous cards
(memory cards) is provided.
Interfacing with the system controller is done through the
control bus; composed of digital inputs to control the
interface, and one interrupt output to inform the system
controller of the card presence and faults. Data exchange
with the card is managed from the system controller using
the I/O line (and eventually the auxiliary I/O lines).
A chip select input allows multiple 73S8023C ICs to share
the same control bus. When chip select is set low, the
host microcontroller inputs are latched and outputs are
taken to a high impedance state.
The card clock signal can be generated by an on-chip
oscillator using an external crystal or by connecting an
external clock signal.
The 73S8023C device incorporates an ISO-7816-3
activation/deactivation sequencer that controls the card
signals. Emergency card deactivation is initiated upon
card extraction or upon any fault generated by the
protection circuitry.
The 73S8023C requires only a single 2.7 V to 3.6 V power
supply, and features a high-efficiency embedded DC-DC
converter. This architecture, plus a Power Down digital
input that allow placing the IC in a very low-power mode
making the 73S8023C particularly suitable for low-power
applications (cell-phones, PDAs, payphones, hand-held
POS terminals…).
FEATURES
Card Interface:
Complies with ISO-7816-3, EMV 4.0
A DC-DC Converter provides 3V / 5V to the card
from an external power supply input
High-efficiency converter: > 80% @ V
DD
=3.3 V,
V
CC
=5 V and I
CC
= 65 mA
Up to 100 mA supplied to the card
ISO-7816-3 Activation / Deactivation sequencer
with emergency automated deactivation
Protection includes 2 voltage supervisors which
detect voltage drops on card V
CC
and on V
DD
power supply
The V
DD
voltage supervisor threshold value can be
externally adjusted
True over-current detection (150 mA max.)
2 card detection inputs, 1 for either possible switch
configuration
Full support of synchronous cards
System Controller Interface:
3 Digital inputs control the card activation /
deactivation, card reset and card voltage
3 Digital inputs control the card clock (division rate
and card clock source selection)
1 Digital output, interrupt to the system controller,
allows the system controller to monitor the card
presence and faults
1 Power down digital input (places the 73S8023C
in a very low-power mode (card deactivated)
1 Chip select digital input for parallel operation of
several 73S8023C ICs.
1 External clock input (STROBE), used for
synchronous operation
1 Digital output clock, buffered version of signal on
XTALIN
Crystal oscillator or host clock (XTALIN), up to
27 MHz
Power Supply: V
DD
2.7 V to 3.6 V
6 kV ESD Protection on the card interface
ADVANTAGES
Supports both synchronous and asynchronous smart
cards
Replacement for TDA8002, with up to 600 mW in
power savings (@ EMV ICCmax condition) !
The inductor-based DC-DC converter provides higher
current and efficiency
Ideal for battery-powered applications
Suitable for high current cards and SAMs: (100 mA
max)
Single 2.7 V to 3.6 V power supply allows removal
of 5 V from the system
Power down mode: 2
µA
typical
Package: Small Format (5x5mm) 32-QFN
APPLICATIONS
Point of Sales and Transaction Terminals
Payphones
Set-Top-Boxes, DVD / HDD Recorders
Payment card interfaces in portable devices (PDAs,
mobile phones…)
Rev. 1.5
© 2009 Teridian Semiconductor Corporation
1
73S8023C Data Sheet
FUNCTIONAL DIAGRAM
VDD
20
4
NC
21
GND
VDDF_ADJ
17
LIN
6
2
VDD
3
6
DS_8023C_019
VDD VOLTAGE SUPERVISOR
VOLTAGE REFERENCE
I
CC
FAULT
V
DD
FAULT
V
CC
FAULT
1
GND
5
PWRDN
DC-DC
CONVERTER
12
GND
15
VCC
CS
CMDVCC
RSTIN
8
18
19
31
R-C
OSC.
DIGITAL
CIRCUITRY
&
FAULT LOGIC
Int_Clk
ICC RESET
BUFFER
14
RST
5V/3V
22
OFF
29
CLKDIV1
30
CLKDIV2
23
XTALIN
24
XTALOUT
32
CLKOUT
ICC CLOCK
BUFFER
13
CLK
25
STROBE
ISO-7816-3
SEQUENCER
XTAL
OSC
CLOCK
GENERATION
OVER
TEMP
TEMP FAULT
16
CLKSEL
7
PRES
6
PRES
9
26
IOUC
27
AUX1UC
28
AUX2UC
I/O
ICC I/O BUFFERS
11
AUX1
10
AUX2
Figure 1: 73S8023C Block Diagram
2
Rev. 1.5
DS_8023C_019
73S8023C Data Sheet
Table of Contents
1
Pin Description .................................................................................................................................... 5
1.1 Card Interface ............................................................................................................................... 5
1.2 Miscellaneous Inputs and Outputs................................................................................................ 5
1.3 Power Supply and Ground............................................................................................................ 5
1.4 Microcontroller Interface ............................................................................................................... 6
System Controller Interface ............................................................................................................... 7
Oscillator.............................................................................................................................................. 8
DC-DC Converter – Card Power Supply .......................................................................................... 8
Voltage Supervision ........................................................................................................................... 9
Power Down....................................................................................................................................... 10
Over-Temperature Monitor............................................................................................................... 10
Activation and Deactivation ............................................................................................................. 11
8.1 Activation Sequence (Synchronous Mode) ................................................................................ 11
8.2 Deactivation Sequence (Synchronous Mode) ............................................................................ 11
8.3 Activation Sequence (Asynchronous Mode) ............................................................................... 12
8.4 Deactivation Sequence (Asynchronous Mode) .......................................................................... 14
OFF
and Fault Detection .................................................................................................................. 14
I/O Circuitry and Timing ................................................................................................................... 15
Typical Application Schematic ........................................................................................................ 17
Electrical Specification..................................................................................................................... 18
12.1 Absolute Maximum Ratings ........................................................................................................ 18
12.2 Recommended Operating Conditions......................................................................................... 18
12.3 Package Thermal Parameters .................................................................................................... 18
12.4 Card Interface Characteristics .................................................................................................... 19
12.5 Digital Signals ............................................................................................................................. 22
12.6 DC Characteristics ...................................................................................................................... 23
12.7 Voltage / Temperature Fault Detection Circuits.......................................................................... 23
Mechanical Drawing (32-QFN) ......................................................................................................... 24
Package Pin Designation (32-QFN) ................................................................................................. 25
Ordering Information ........................................................................................................................ 26
Related Documentation .................................................................................................................... 26
Contact Information .......................................................................................................................... 26
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
Revision History ........................................................................................................................................ 27
Rev. 1.5
3
73S8023C Data Sheet
DS_8023C_019
Figures
Figure 1: 73S8023C Block Diagram ............................................................................................................. 2
Figure 2: Power Down Mode Operation: CS = high.................................................................................... 10
Figure 3: Activation Sequence – Synchronous Mode ................................................................................. 11
Figure 4: Synchronous Deactivation Operation – CKSEL = High............................................................... 12
Figure 5: Asynchronous Activation Sequence – RSTIN Low When
CMDVCC
Goes Low ......................... 13
Figure 6: Asynchronous Activation Sequence – Timing Diagram #2 ......................................................... 13
Figure 7: Asynchronous Deactivation Sequence ........................................................................................ 14
Figure 8: Timing Diagram – Management of the Interrupt Line
OFF
.......................................................... 15
Figure 9: I/O and I/OUC State Diagram ...................................................................................................... 16
Figure 10: I/O – I/OUC Delays Timing Diagram.......................................................................................... 16
Figure 11: 73S8023C – Typical Application Schematic .............................................................................. 17
Figure 12: DC – DC Converter efficiency (V
CC
= 5 V) ................................................................................ 20
Figure 13: DC – DC Converter Efficiency (V
CC
= 3 V) ................................................................................ 20
Figure 14: 32-QFN Mechanical Drawing..................................................................................................... 24
Figure 15: 32-QFN 73S8023C Pin Out ....................................................................................................... 25
Table
Table 1: Choice of VCC Pin Capacitor .......................................................................................................... 8
4
Rev. 1.5
DS_8023C_019
73S8023C Data Sheet
1 Pin Description
1.1
I/O
AUX1
AUX2
RST
CLK
PRES
PRES
VCC
GND
Card Interface
Pin
9
11
10
14
13
7
6
15
12
Description
Card I/O: Data signal to/from card. Includes a pull-up resistor to V
CC.
AUX1: Auxiliary data signal to/from card. Includes a pull-up resistor to V
CC.
AUX2: Auxiliary data signal to/from card. Includes a pull-up resistor to V
CC.
Card reset: Provides reset (RST) signal to card.
Card clock: Provides clock (CLK) signal to card. The rate of this clock is
determined by crystal oscillator frequency and CLKDIV selections.
Card Presence switch: Active high indicates card is present. Includes a
pull-down current source.
Card Presence switch: Active low indicates card is present. Includes a pull-up
current source.
Card power supply: Logically controlled by sequencer, output of DC-DC
converter. Requires an external filter capacitor to the card GND.
Card ground.
Name
1.2
Miscellaneous Inputs and Outputs
Pin
23
24
17
4
Description
Crystal oscillator input: can either be connected to crystal or driven as a
source for the card clock.
Crystal oscillator output: connected to crystal. Left open if XTALIN is being
used as external clock input.
V
DD
fault threshold adjustment input: this pin can be used to adjust V
DDF
value (that controls deactivation of the card). Must be left open if unused.
Non-connected pin. Must be left open.
Name
XTALIN
XTALOUT
VDDF_ADJ
NC
1.3
Power Supply and Ground
Pin
3, 20
1
21
2
Description
System controller interface supply voltage: Supply voltage for internal power
supply and DC-DC converter power supply source.
DC-DC converter ground.
Digital ground.
External inductor. Connect external inductor from pin 2 to V
DD
. Keep the
inductor close to pin 2.
Name
VDD
GND
GND
LIN
Rev. 1.5
5
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