5962-89616042C [MAXIM]

ADC, Successive Approximation, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CQCC20, QCC-20;
5962-89616042C
元器件型号: 5962-89616042C
生产厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
描述和应用:

ADC, Successive Approximation, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, CQCC20, QCC-20

转换器
PDF文件: 总5页 (文件大小:26K)
下载文档:  下载PDF数据表文档文件
型号参数:5962-89616042C参数
是否无铅含铅
是否Rohs认证不符合
生命周期Obsolete
IHS 制造商MAXIM INTEGRATED PRODUCTS INC
零件包装代码QLCC
包装说明QCCN, LCC20,.35SQ
针数20
Reach Compliance Codenot_compliant
ECCN代码3A001.A.2.C
HTS代码8542.39.00.01
风险等级5.23
Is SamacsysN
最大模拟输入电压10 V
最长转换时间15 µs
转换器类型ADC, SUCCESSIVE APPROXIMATION
JESD-30 代码S-CQCC-N20
最大线性误差 (EL)0.293%
湿度敏感等级1
模拟输入通道数量1
位数8
功能数量1
端子数量20
最高工作温度125 °C
最低工作温度-55 °C
输出位码BINARY, OFFSET BINARY, COMPLEMENTARY OFFSET BINARY
输出格式PARALLEL, 8 BITS
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码QCCN
封装等效代码LCC20,.35SQ
封装形状SQUARE
封装形式CHIP CARRIER
峰值回流温度(摄氏度)240
电源5 V
认证状态Not Qualified
筛选级别MIL-STD-883
子类别Analog to Digital Converters
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子形式NO LEAD
端子节距1.27 mm
端子位置QUAD
处于峰值回流温度下的最长时间20
Base Number Matches1
MAX34334CSE前5页PDF页面详情预览
SCOPE:
CMOS, MICROPROCESSOR-COMPATIBLE, 8-BIT A/D CONVERTER
Generic Number
MX7574S(x)/883B
MX7574T(x)/883B
Device Type
01
02
Case Outline(s).
The case outlines shall be designated in Mil-Std-1835 and as follows:
Outline Letter
MAXIM SMD
Q
V
E
2
Mil-Std-1835
GDIP1-T18 or CDIP2-T18
CQCC1-N20
Case Outline
Package Code
J18
L20
18 LEAD CERDIP
20 LCC
Absolute Maximum Ratings:
V
DD
to AGND ..................................................................................................…... 0V to 7V
V
DD
to DGND ..................................................................................................…... 0V to 7V
AGND to DGND ........................................................................................….. -0.3V, +0.3V
Clock Input Voltage to DGND ......................................................................... -0.3V to V
DD
Digital Input Voltage to DGND ...................................................................…. -0.3V to V
DD
Digital Output Voltage to DGND ..................................................................... -0.3V to V
DD
AIN to AGND ............................................................................................….. -20V to +20V
Digital Input Voltage to DGND ............................................................... -0.3V, (V
DD
+0.3V)
Digital Output Voltage to DGND ............................................................ -0.3V, (V
DD
+0.3V)
VREF .............................................................................................................….. -20V, +20V
VBOFS ...........................................................................................................…. -20V, +20V
VAIN ..............................................................................................................…. -20V, +20V
Lead Temperature (soldering, 10 seconds) ..................................................................... +300°C
Storage Temperature ........................................................................................ -65°C to +150°C
Continuous Power Dissipation ..........................................................................….... T
A
=+70°C
18 pin CERDIP(derate 10.5mW/°C above +70°C) .................................................…... 842mW
20 pin LCC(derate 9.1mW/°C above +70°C) .........................................................….... 727mW
Junction Temperature T
J
....................................................................................…….. +150°C
Thermal Resistance, Junction to Case,
ΘJC
18 pin CERDIP................................................................................................……. 45°C/W
20 pin LCC .....................................................................................................…….. 20°C/W
Thermal Resistance, Junction to Ambient,
ΘJA:
18 pin CERDIP................................................................................................……. 95°C/W
20 pin LCC ...................................................................................................…….. 110°C/W
Recommended Operating Conditions
Ambient Operating Range (T
A
) .........................................................…….. -55°C to
+125°C
Supply Voltage Range (V
DD
) ..................................................................................……...+5V
Reference Voltage (VREF) ...................................................................................……... -10V
Ground ...........................................................................................…….. AGND=DGND=0V
Clock Resistance ...................................................................................................…….. 150k
Clock Capacitance (C
CLK
) ....................................................................................……. 100pF
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
----------------------------
Electrical Characteristics of MX7574/883B
for /883B and SMD 5962-89616
19-0356
Page 2 of
Rev. C
7
TABLE 1. ELECTRICAL TESTS:
CONDITIONS
-55
°C ≤T
A
+125°C 1/
Unless otherwise specified
TEST
Resolution
NOTE 5
Symbol
RES
RA
DNL
AE
Group A
Subgroup
Device
type
All
Limits
Min
8
Limits
Max
Units
Bits
±0.75
±0.50
±0.875
±0.75
±5.0
±6.5
±3.0
±4.5
±60
±80
±30
±50
±1.5
LSB
LSB
Relative Accuracy
Differential Nonlinearity
Gain Error
External clock frequency 500kHz.
External clock frequency 500kHz.
Gain Error is measured after calibrating
out offset error.
External clock frequency 500kHz.
1,2,3
1,2,3
1
2,3
1
2,3
01
02
01
02
01
LSB
02
01
Offset Error
VOS
External clock frequency 500kHz.
1
2,3
1
2,3
LSB
02
All
Resistance mismatch
between BOFS and AIN
Input Resistance
RM
RIN
At VREF
AT BOFS
At AIN
___ __
RD, CS
___ __
RD, CS
V
IN
=0V or V
DD
NOTE 2
NOTE 3
NOTE 3
1,2,3
%
kΩ
5
1,2,3
All
15
30
30
10
10
2.4
Digital Input High Level
Voltage
Digital Input Low Level
Voltage
Digital Input Current
Digital Input Capacitance
Clock Input High
Clock Input Low
Clock Input High
Current
Clock Input Low Current
Digital Output High
Voltage
Digital Output Low Level
Voltage
Floating State Leakage
Current (DB7-DB0)
Floating State Output
Capacitance (DB7-DB0)
V
IH
V
IL
I
IN
CID
V
IH
V
IL
I
IH
I
IL
V
OH
V
OL
I
LKG
C
OUT
1,2,3
NOTE 3
1,2,3
NOTE 3
1
2,3
1,2,3
1,2,3
1,2,3
1,2,3
1
2,3
1,2,3
1,2,3
1
2,3
1,2,3
All
All
All
All
All
All
All
All
All
All
All
All
V
0.8
±1.0
±10
5.0
V
µA
pF
V
V
mA
µA
V
0.4
±1.0
±10
7.0
V
µA
pF
3.0
0.4
±2.0
±1.0
±10
4.0
I
SOURCE
=40µA
I
SINK
=1.6mA
V
OUT
=0V or V
DD
NOTE 2
----------------------------
Electrical Characteristics of MX7574/883B
for /883B and SMD 5962-89616
19-0356
Page 3 of
Rev. C
7
TEST
Supply Current
__
CS Pulse Width
__
__
RD to CS Setup Time
__
_____
CS to BUSY Propagation
Delay
Symbol
I
CC
t
CS
t
WSCS
t
CBPD
CONDITIONS
-55
°C ≤T
A
+125°C 1/
Unless otherwise specified
_____
___
BUSY and RD= HIGH, AIN=0V
NOTE 4
NOTE 5
_____
BUSY Load=20pF
_____
BUSY Load=100pF
Group A
Subgroup
Device
type
All
All
All
Limits
Min
Limits
Max
5.0
Units
1,2,3
9,10,11
mA
ns
ns
150
0
180
NOTE 5
All
ns
200
____
__
BUSY to RD Setup Time
_____ ___
BUSY to CS Setup Time
Data Valid Access Time
Data Valid Hold Time
__
CS to RD Hold Time
Reset Time Requirement
___ _____
RD to BUSY
Conversion Time
NOTE 1:
NOTE 2:
NOTE 3:
NOTE 4:
NOTE 5:
t
BSR
t
BSCS
t
RAD
t
RHD
t
RHS
t
RESET
t
WBPD
t
CONVERT
Load=20pF
Load=100pF
NOTE 5
NOTE 4
NOTE 4
NOTE 4
NOTE 5
NOTE 4
NOTE 4
NOTE 4
NOTE 4
NOTE 5
9,10,11
9,10,11
All
All
All
0
0
200
400
180
500
ns
ns
ns
ns
ns
µs
µs
9,10,11
9,10,11
9,10,11
9,10,11
All
All
All
All
All
80
3
2
15
_____
BUSY Load=20pF
Ext CLK 500kHz
V
DD
=+5.0V, VREF=-10V. Unipolar Configuration, R
CLK
=180kΩ. C
CLK
=100pF.
Guaranteed at 25°C if not tested to the limits specified in Table 1.
Guaranteed by functional pattern testing in external clock RAM, ROM, and SLOW modes.
Static RAM interface mode.
Guaranteed at 25°C, +125°C, -55°C, if not tested to the limits specified in Table 1.
ORDERING INFORMATION:
Package
Pkg. Code
01
18 pin CERDIP
J18
01
20 pin LCC
L20
02
18 pin CERDIP
J18
02
20 pin LCC
L20
MAXIM PART #
MX7574SQ/883B
MX7574SE/883B
MX7574TQ/883B
MX7574TE/883B
SMD Number
5962-8961604VA
5962-89616042C
5962-8961603VA
5962-89616032C
----------------------------
Electrical Characteristics of MX7574/883B
for /883B and 5962-89616
19-0356
Page 4 of
Rev. C
7
TERMINAL CONNECTIONS:
J18
L20
Pin
1
V
DD
NC
2
VREF
V
DD
3
BOFS
VREF
4
AIN
BOFS
5
AGND
AIN
6
D7(MSB)
AGND
7
D6
D7(MSB)
8
D5
D6
9
D4
D5
10
D3
D4
11
D2
NC
12
D1
D3
13
D0(LSB)
D2
14
_____
D1
BUSY
15
___
D0(LSB)
RD
16
___
_____
CS
BUSY
17
CLK
___
RD
18
DGND
___
CS
19
CLK
20
DGND
----------------------------
Electrical Characteristics of MX7574/883B
for /883B and SMD 5962-89616
19-0356
Page 5 of
Rev. C
7
QUALITY ASSURANCE
Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in Mil-
Std-883.
Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015:
1. Test Condition, A, B, C, or D.
2. TA = +125°C minimum.
3. Interim and final electrical test requirements shall be specified in Table 2.
Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B,
C, and D inspection.
Group A inspection:
1. Tests as specified in Table 2.
2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted.
Group C and D inspections:
a. End-point electrical parameters shall be specified in Table 1.
b. Steady-state life test, Method 1005 of Mil-Std-883:
1. Test condition A, B, C, D.
2. TA = +125°C, minimum.
3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883.
TABLE 2.
ELECTRICAL TEST REQUIREMENTS
Mil-Std-883 Test Requirements
Subgroups
per Method 5005, Table 1
1
1*, 2, 3, 4**, 9, 10, 11***
1, 2, 3, 4** , 9, 10, 11***
1
Interim Electric Parameters
Method 5004
Final Electrical Parameters
Method 5005
Group A Test Requirements
Method 5005
Group C and D End-Point Electrical Parameters
Method 5005
* PDA applies to Subgroup 1 only.
** Subgroups 4, capacitance tests shall be tested at initial qualification and upon redesign.
*** Subgroups 10 and 11 if not tested, are guaranteed to the limits in Table 1.
----------------------------
Electrical Characteristics of MX7574/883B
for /883B and SMD 5962-89616
19-0356
Page 6 of
Rev. C
7
相关元器件产品Datasheet PDF文档

5962-89616042X

Analog-to-Digital Converter, 8-Bit
6 ETC

5962-8961604VX

Analog-to-Digital Converter, 8-Bit
4 ETC

5962-8961701LX

12-Bit Digital-to-Analog Converter
21 ETC

5962-89620012A

Current-Feedback Operational Amplifier
10 ETC

5962-89620012X

Current-Feedback Operational Amplifier
5 ETC

5962-8962001PA

Current-Feedback Operational Amplifier
38 ETC