MQS-0418 [MARKIMICROWAVE]
MMIC 4-18GHz 90° Splitter / Combiner;型号: | MQS-0418 |
厂家: | Marki |
描述: | MMIC 4-18GHz 90° Splitter / Combiner |
文件: | 总14页 (文件大小:724K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MMIC 4-18GHz 90° Splitter / Combiner
1 Device Overview
MQS-0418
Bare Die
1.1 General Description
The MQS-0418 is a MMIC 4GHz – 18GHz 90° splitter/combiner.
Wire bondable 50Ω terminations are available on-chip. Passive GaAs
MMIC technology allows production of smaller constructions that
replace larger form factor circuit board constructions. Tight
fabrication tolerances allow for less unit to unit variation than
traditional splitter/combiner technologies. The MQS-0418 is
available as a wire bondable chip and connectorized module. Low
variation allows for accurate simulations using the provided S4P file
taken from measured production units. Applications include single
sideband upconverters, image rejection downconverters, IQ
modulators, balanced amplifiers, and microwave correlators. The
MQS-0418 is not recommended for applications involving reflected
signals.
Module
1.2 Features
▪ Designed for C to Ku-band applications
▪ High amplitude and phase balance
▪ High isolation
▪ Low insertion loss
▪ On-chip 50Ω load terminations
▪ S4P data MQS-0418CH.zip MQS-0418UA.zip
1.3 Functional Block Diagram
90° Output
0° Output
Input
Isolated
1.4 Part Ordering Options1
Part
Number
Green
Status
Product
Lifecycle
Export
Classification
Description
Package
MQS-0418CH
MQS-0418UA
Wire bondable die
Connectorized
CH
UA
RoHS
RoHS
Active
Active
EAR99
EAR99
1
Refer to our website for a list of definitions for terminology presented in this table.
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MQS-0418
3.4
Typical Performance Plots ........... 6
Bare Die............................. 6
Table of Contents
3.4.1
3.4.2
Connectorized Module .......... 7
1
Device Overview ............................... 1
4
5
Application Information ...................... 9
Die Mounting Recommendations ....... 12
1.1
General Description.................... 1
Features ................................... 1
Functional Block Diagram ............ 1
Part Ordering Options................. 1
1.2
1.3
1.4
5.1
Mounting and Bonding
Recommendations .............................. 12
5.2
5.3
Handling Precautions ................ 12
Bonding Diagram ...................... 13
2
3
Port Configurations and Functions ...... 3
2.1
2.2
Port Diagram............................. 3
Port Functions ........................... 3
5.3.1
5.3.2
Four Port Device ............... 13
Isolated Port Terminated..... 13
Specifications ................................... 4
6
Mechanical Data............................. 14
3.1
Absolute Maximum Ratings.......... 4
Package Information.................... 4
Electrical Specifications .............. 4
6.1
6.2
CH Package Outline Drawing ..... 14
UA Package Outline Drawing...... 14
3.2
3.3
3.3.1
3.3.2
Bare Die............................. 4
Connectorized Module .......... 5
Revision History
Revision Code
Comment
Revision Date
-
August 2018
Datasheet Initial Release
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MQS-0418
2 Port Configurations and Functions
2.1 Port Diagram
A top-down view of the MQS-0418CH package outline drawing is shown below. Only
ports 1 and 2 may be used as an input. Ports 3 and 4 are not recommended as inputs.
Device is not recommended for applications requiring reflected signals. Ports 1 – 4
correspond to the UA package designation.
50Ω
Termination
4 pc
2.2 Port Functions2
Configuration Configuration
Port
Description
Equivalent Circuit
A
B
Port 1 is DC short to port
3 and open to ground.
Port 1
Input
90° Output
Port 2 is DC short to port
4 and open to ground.
Port 2
Port 3
Port 4
Pad
90° Output
0° Output
Isolated
Input
Isolated
0° Output
Ground
Port 3 is DC short to port
1 and open to ground.
Port 4 is DC short to port
2 and open to ground.
CH package ground path is
provided through the
substrate and ground bond
pads.
Ground
2
Each configuration describes a different application of the same product.
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MQS-0418
3 Specifications
3.1 Absolute Maximum Ratings
The Absolute Maximum Ratings indicate limits beyond which damage may occur to the
device. If these limits are exceeded, the device may be inoperable or have a reduced
lifetime.
Parameter
Maximum Rating
Units
DC Current at any port
TBD
mA
dBm
°C
Power Handling, at any Port
Operating Temperature
Storage Temperature
TBD
-55 to +100
-65 to +125
°C
3.2 Package Information
Parameter
Details
Human Body Model (HBM), per MIL-STD-750, Method 1020
Rating
ESD
N/A
3.3 Electrical Specifications3
The electrical specifications apply at TA=+25°C in a 50Ω system.
Min and Max limits are guaranteed at TA=+25°C.
3.3.1 Bare Die
Frequency
Parameter
Coupling
Min
Typ.
Max
Units
(GHz)
3
dB
Nominal Phase Shift
Amplitude Balance
Phase Balance
90
Degrees
dB
±0.4
±0.5
±2
±8
Degrees
4-18
Excess Through Line
Insertion Loss
1.5
3.2
dB
dB
Isolation
VSWR
11
16
1.1
50
Impedance
Ω
3
Device is non-reciprocal. Operation not guaranteed when ports 3 or 4 are used as an input.
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MQS-0418
3.3.2 Connectorized Module
Parameter
Frequency
Min
Typ.
Max
Units
(GHz)
Coupling
3
dB
Nominal Phase Shift
Amplitude Balance
Phase Balance
90
Degrees
dB
±0.4
±1.5
±2
±9
Degrees
4-18
Excess Through Line
Insertion Loss
1.9
3.8
dB
dB
Isolation
VSWR
10
20
1.13
50
Impedance
Ω
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MQS-0418
3.4 Typical Performance Plots4
3.4.1 Bare Die
4 All measurements taken in a 50Ω environment. On-chip load was not used when taking
measurements.
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MQS-0418
3.4.2 Connectorized Module
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MQS-0418
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MQS-0418
4 Application Information
Quadrature signal generation is useful for many applications in analog signal processing. Marki
MQH/S MMIC quadrature hybrids and 90˚ Splitter/Combiners offer this functionality in a small
factor with high repeatability. Below are applications and how they can be realized with the MQH
and MQS product lines.
Quadrature Hybrids vs 90˚ Splitter/Combiners
Some products are ‘true’ quadrature hybrids, while others are 90˚ Splitter/Combiners. A
quadrature hybrid is symmetric about all four ports, meaning that in a splitting application any port
can be used as an input, with the isolated and output ports following from this selection. Likewise,
for a combining application, any port can be used as an output.
A 90˚ Splitter/Combiner is not symmetric. When splitting, only ports 1 and 2 can be used as an
input. If ports 3 or 4 were used, there would be significant phase walk-off between the output
ports. As a combiner, only ports 1 and 2 are suitable as output ports. The phase walk-off
introduced when using ports 3 or 4 as an output means that reflected signals recombine and
cancel poorly inside a 90° Splitter/Combiner.
Single Sideband and Image Reject Mixers
The primary application for the MQH and MQS series is as IF or LO quadrature signal
splitter/combiners. They can be used in combination with the MMIQ series of IQ mixers to create
broadband single sideband and image reject mixers. Either 90˚ Splitter/Combiners or quadrature
hybrids can be used as the IF hybrid, but if a 90˚ Splitter/Combiner is used only one sideband (or
image) is accessible, whereas if a quadrature hybrid is used than both sidebands are accessible.
If 90˚ Splitter/Combiner is used for a single sideband upconverter or image reject mixer, port 1
(or 2) should be used as the IF input/output and ports 2 and 3 (or 1 and 4) should be connected to
the I and Q ports. Selecting port 1 or 2 to terminate will select which sideband of the mixer to
reject.
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MQS-0418
Balanced Amplifiers
In a balanced amplifier, the poor return loss of an amplifier is compensated for with a quadrature
hybrid. In this application, the reflections from the input or output are collected at the isolated
port of the quadrature hybrid and terminated.
Since a 90˚ Splitter/Combiner is not completely symmetric, reflected signals will not terminate as
well as with a quadrature hybrid. An MQH option is recommended for this application. If a 90˚
Splitter/Combiner is used for a single sideband upconverter or image reject mixer, port 1 (or 2)
should be used as the IF input/output and ports 2 and 3 (or 1 and 4) should be connected to the I
and Q ports. Selecting port 1 or 2 to terminate will select which sideband of the mixer to reject.
Testing/simulation is recommended when considering if a 90° Splitter/Combiner is suitable.
Reflectionless Filter
Similar to a balanced amplifier, a reflectionless filter will terminate reflections that are out of band
for a filter (but in band for the quadrature hybrid) at the isolated port.
Since a 90˚ Splitter/Combiner is not completely symmetric, reflected signals will not terminate as
well as with a quadrature hybrid. An MQH option is recommended for this application. If a 90˚
Splitter/Combiner is used for a single sideband upconverter or image reject mixer, port 1 (or 2)
should be used as the IF input/output and ports 2 and 3 (or 1 and 4) should be connected to the I
and Q ports. Selecting port 1 or 2 to terminate will select which sideband of the mixer to reject.
Testing/simulation is recommended when considering if a 90° Splitter/Combiner is suitable.
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MQS-0418
Reflective Applications
Unlike in the previous applications, reflective applications only work well with a quadrature hybrid
(not a 90˚ Splitter/Combiner). In these applications a signal is reflected off of two identical
structures (typically a PIN diode) and the output signal is collected at the isolated port. In this
case the desired signal is deliberately reflected.
Since a 90˚ Splitter/Combiner is not completely symmetric, you will have poor results if you use
these for reflective applications.
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MQS-0418
5 Die Mounting Recommendations
5.1 Mounting and Bonding Recommendations
Marki MMICs should be attached directly to a ground plane with conductive epoxy. The
ground plane electrical impedance should be as low as practically possible. This will
prevent resonances and permit the best possible electrical performance. Datasheet
performance is only guaranteed in an environment with a low electrical impedance ground.
Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the
mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip.
Cure epoxy according to manufacturer instructions.
Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire.
Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding
force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use
the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be
started on the chip and terminated on the package or substrate.
Circuit Considerations – 50 Ω transmission lines should be used for all high frequency
connections in and out of the chip. In circumstances where the chip more than .001”
thinner than the substrate, a heat spreading spacer tab is optional to further reduce
bondwire length and parasitic inductance.
Special Considerations for 90° Splitters – Transitions between the chip and
transmission line should be as close to 50 Ω as possible. Small impedance mismatches will
result in poor phase balance mid-band due to reflections. Length and number of wire
bonds should be adjusted to tune inductance for an optimal 50 Ω match. In the modules,
chip transitions are optimized for broadband performance.
5.2 Handling Precautions
General Handling
Chips should be handled with care using tweezers or a vacuum collet. Users should take
precautions to protect chips from direct human contact that can deposit contaminants,
like perspiration and skin oils on any of the chip's surfaces.
Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or
expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are
opened, chips should be stored in a dry nitrogen atmosphere.
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MQS-0418
5.3 Bonding Diagram
The MQS-0418 has 50Ω loads near each I/O port, allowing the user to terminate the isolated port
on-chip.
5.3.1 Four Port Device
5.3.2 Isolated Port Terminated
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MQS-0418
6 Mechanical Data
6.1 CH Outline Drawing
1. CH Substrate material is 0.004 in thick GaAs.
2. I/O trace finish is 5 microns Au. Ground plane finish is 4 microns Au.
6.2 UA Package Outline Drawing
Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice.
Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any
particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any
product.
© Marki Microwave, Inc.
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