MM1-1467HCH-1 [MARKIMICROWAVE]
GaAs MMIC mmWave Tuner Mixer;型号: | MM1-1467HCH-1 |
厂家: | Marki |
描述: | GaAs MMIC mmWave Tuner Mixer |
文件: | 总15页 (文件大小:1101K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
GaAs MMIC mmWave Tuner Mixer
1. Device Overview
MM1-1467H
1.1 General Description
Die
MM1-1467H is a GaAs MMIC double balanced mixer with a
broad IF bandwidth and low conversion loss. This mixer is ideal for
applications which require broad IF bandwidths with operation at
mmWave frequencies. The MM1-1467H is available as both wire
bondable die and as connectorized modules. The -1 option for die
is available for this mixer. Both the -1 and -2 mixers are
electrically identically but with mirrored footprints. For a list of
recommended LO driver amps for all mixers and IQ mixers, see
here.
Module
▪ High linearity
1.2 Features
▪ High LO to RF isolation
▪ Broad IF bands covering critical
Ku & K band
1.3 Applications
▪ Test and measurement equipment
▪ Fixed RF up converters
▪ Electronic warfare equipment
▪ Flat IF response through K band
1.4 Functional Block Diagram
1.5 Part Ordering Options1
Part
Green
Status
Product
Lifecycle
Export
Classification
Description
Number
Package
CH
(option -2)
MM1-1467HCH-2
MM1-1467HCH-1
MM1-1467HUB
Wire bondable die
Wire bondable die
Active
Active
Active
EAR99
EAR99
EAR99
CH
(option -1)
RoHS
Connectorized
module
UB
1
Refer to our website for a list of definitions for terminology presented in this table.
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MM1-1467H
3.6.2 Typical Performance Plots: LO
Harmonic Isolation............................. 9
Table of Contents
3.6.3 Typical Performance Plots: Tuner
Mixer............................................. 10
1. Device Overview ............................... 1
1.1 General Description........................ 1
1.2 Features ....................................... 1
1.3 Applications................................... 1
1.4 Functional Block Diagram ................ 1
1.5 Part Ordering Options..................... 1
2. Port Configurations and Functions ...... 3
2.1 Port Diagram................................. 3
2.2 Port Functions............................... 3
3. Specifications ................................... 4
3.1 Absolute Maximum Ratings.............. 4
3.2 Package Information ....................... 4
3.3 Recommended Operating Conditions . 4
3.4 Sequencing Requirements ............... 4
3.5 Electrical Specifications .................. 5
3.6 Typical Performance Plots ............... 6
3.6.1 Typical Performance Plots: IP3 .. 8
3.6.4 Typical Spurious Performance:
Down-Conversion............................ 11
3.6.5 Typical Spurious Performance: Up-
Conversion..................................... 11
4. Die Mounting Recommendations ....... 12
4.1 Mounting and Bonding
Recommendations .............................. 12
4.2 Handling Precautions .................... 12
4.3 Bonding Diagram.......................... 13
5. Mechanical Data............................. 14
5.1 CH Package Outline Drawing (Option -
2)..................................................... 14
5.2 CH Package Outline Drawing (Option -
1)..................................................... 14
5.3 UB Package Outline Drawing ......... 15
Revision History
Revision Code
Comment
Datasheet Initial Release
Revision Date
-
May 2019
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MM1-1467H
2. Port Configurations and Functions
2.1 Port Diagram
A top-down view of the MM1-1467HCH-2 outline drawing is shown below to the left. The
MM1-1467HCH-1 is shown below to the right. Both mixers are electrically identical and
have mirrored footprints. The MM1-1467H has the input and output ports given in Port
Functions. The MM1-1467H can be used in either an up or down conversion.
MM1-1467HCH-2
MM1-1467HCH-1
2.2 Port Functions
Equivalent Circuit
Port
Function
Description
for Package
LO
(Configuration A)
RF
Port 1 is DC open for the CH and UB
packages.
Port 1
(Configuration B)
Port 2 is diode connected for the CH
and UB package.
Port 2
Port 3
IF
RF
(Configuration A)
LO
Port 3 is DC open for the CH and UB
packages.
(Configuration B)
CH package ground path is provided
through the substrate and ground bond
pads. UB package ground provided
through metal housing and outer coax
conductor.
GND
Ground
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MM1-1467H
3. Specifications
3.1 Absolute Maximum Ratings
The Absolute Maximum Ratings indicate limits beyond which damage may occur to the
device. If these limits are exceeded, the device may be inoperable or have a reduced
lifetime.
Parameter
Maximum Rating
Units
Port 1 DC Current
Port 2 DC Current
N/A
TBD
mA
mA
dBm
°C
Power Handling, at any Port
Operating Temperature
Storage Temperature
+27
-55 to +100
-65 to +125
ºC
3.2 Package Information
Parameter
Details
Rating
ESD
Human Body Model (HBM), per MIL-STD-750, Method 1020
UB Package
1A
Weight
16 g
3.3 Recommended Operating Conditions
The Recommended Operating Conditions indicate the limits, inside which the device should
be operated, to guarantee the performance given in Electrical Specifications Operating
outside these limits may not necessarily cause damage to the device, but the
performance may degrade outside the limits of the electrical specifications. For limits,
above which damage may occur, see Absolute Maximum Ratings.
Min Nominal Max Units
TA, Ambient Temperature
LO Input Power
-55
+25
+100
+20
°C
+11
dBm
3.4 Sequencing Requirements
There is no requirement to apply power to the ports in a specific order. However, it is
recommended to provide a 50Ω termination to each port before applying power. This is a
passive diode mixer that requires no DC bias.
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MM1-1467H
3.5 Electrical Specifications
The electrical specifications apply at TA=+25°C in a 50Ω system. Typical data shown is
for the connectorized UB package mixer used with a +15 dBm sine wave LO.
Specifications shown for configuration A (B).
Min and Max limits apply only to our connectorized units and are guaranteed at TA=+25°C. All bare die are 100% DC tested and visually
inspected.
Parameter
Test Conditions
Min Typical
Max
Units
RF (Port 3) Frequency Range
14
67
LO (Port 1) Frequency Range
I (Port 2) Frequency Range
14
0
67
21
GHz
RF/LO = 14 - 67 GHz
I = 0.091 GHz
RF/LO = 14 - 67 GHz
I = 0.091- 21 GHz
RF/LO = 14 - 67 GHz
I = 0.091- 21 GHz
7
(8)
9
12
(13)
Conversion Loss (CL)2
dB
dB
(10.5)
Noise Figure (NF)3
LO to RF
8.5
RF/LO = 14 - 67 GHz
IF/LO = 14 - 67 GHz
RF/IF = 14 - 67 GHz
53
33
48
Isolation
LO to IF
RF to IF
dB
RF/LO = 14 - 67 GHz
I = 0.091 GHz
+17.5
(+19.5)
+9
Input IP3 (IIP3)
dBm
dBm
Input 1 dB Gain Compression
Point (P1dB)
(+9)
2
Measured as a down converter to a fixed 91 MHz IF. Unless otherwise stated, frequency
conversion done using a highside LO.
3
Mixer Noise Figure typically measures within 0.5 dB of conversion loss for IF frequencies greater
than 5 MHz.
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MM1-1467H
3.6 Typical Performance Plots
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MM1-1467H
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3.6.1 Typical Performance Plots: IP3
MM1-1467H
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MM1-1467H
3.6.2 Typical Performance Plots: LO Harmonic Isolation
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MM1-1467H
3.6.3 Typical Performance Plots: Tuner Mixer
Tuner mixer performance plots are taken with the following test conditions and frequency plan:
Parameter
IF Input Frequency
Start
Nominal
Stop
Units
0
24
GHz
dBm
IF Input Power
-10
LO Input Frequency
24
48
GHz
dBm
GHz
LO Input Power
+15
24
RF Output Frequency
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3.6.4 Typical Spurious Performance: Down-Conversion
MM1-1467H
Typical spurious data is provided by selecting RF and LO frequencies (± m*LO ± n*RF) within the
RF/LO bands, to create a spurious output within the IF band. The mixer is swept across the full
spurious band and the mean is calculated. The numbers shown in the table below are for a -10
dBm RF input. Spurious suppression is scaled for different RF power levels by (n-1), where “n” is
the RF spur order. For example, the 2RF x 2LO spur is 67 dBc for a -10 dBm input, so a -20
dBm RF input creates a spur that is (2-1) x (-10 dB) lower, or 77 dBc.
Typical Down-conversion spurious suppression (dBc): Config A (B)
-10 dBm
0xLO
1xLO
2xLO
3xLO
4xLO
5xLO
RF Input
1xRF
40 (25)
86 (93)
98 (90)
124 (122)
N/A
Reference
50 (66)
40 (35)
67 (74)
21 (16)
61 (69)
45 (35)
68 (72)
N/A
2xRF
64 (73)
3xRF
58 (61)
84 (84)
66 (74)
86 (85)
63 (69)
4xRF
89 (111)
117 (130)
102 (110)
124 (118)
98 (115)
107 (120)
111 (119)
124 (127)
101 (114)
109 (121)
5xRF
3.6.5 Typical Spurious Performance: Up-Conversion
Typical spurious data is taken by mixing an input within the IF band, with LO frequencies
(± m*LO ± n*IF), to create a spurious output within the RF output band. The mixer is swept
across the full spurious output band and the mean is calculated. The numbers shown in the table
below are for a -10 dBm IF input. Spurious suppression is scaled for different IF input power levels
by (n-1), where “n” is the IF spur order. For example, the 2IFx1LO spur is typically 79 dBc for a -
10 dBm input with a sine-wave LO, so a -20 dBm IF input creates a spur that is (2-1) x (-10 dB)
lower, or 89 dBc.
Typical Up-conversion spurious suppression (dBc): Config A (B)
-10 dBm
0xLO
1xLO
2xLO
3xLO
4xLO
5xLO
RF Input
1xIF
40 (25)
70 (70)
Reference
79 (79)
40 (34)
68 (71)
17 (14)
74 (76)
42 (34)
57 (67)
N/A
2xIF
77 (74)
54 (58)
102 (105)
98 (104)
3xIF
89 (80)
61 (69)
82 (79)
65 (64)
77 (72)
4xIF
109 (111)
121 (119)
106 (109)
105 (110)
106 (108)
120 (121)
105 (104)
103 (107)
89 (99)
5xIF
114 (112)
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MM1-1467H
4. Die Mounting Recommendations
4.1 Mounting and Bonding Recommendations
Marki MMICs should be attached directly to a ground plane with conductive epoxy. The
ground plane electrical impedance should be as low as practically possible. This will
prevent resonances and permit the best possible electrical performance. Datasheet
performance is only guaranteed in an environment with a low electrical impedance ground.
Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the
mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip.
Cure epoxy according to manufacturer instructions.
Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire.
Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding
force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use
the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be
started on the chip and terminated on the package or substrate. All bonds should be as
short as possible <0.31 mm (12 mils).
Circuit Considerations – 50 Ω transmission lines should be used for all high frequency
connections in and out of the chip. Wirebonds should be kept as short as possible, with
multiple wirebonds recommended for higher frequency connections to reduce parasitic
inductance. In circumstances where the chip more than .001” thinner than the
substrate, a heat spreading spacer tab is optional to further reduce bondwire length and
parasitic inductance.
4.2 Handling Precautions
General Handling
Chips should be handled with care using tweezers or a vacuum collet. Users should take
precautions to protect chips from direct human contact that can deposit contaminants,
like perspiration and skin oils on any of the chip's surfaces.
Static Sensitivity
GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and
transported only in static protected environments.
Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or
expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are
opened, chips should be stored in a dry nitrogen atmosphere.
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MM1-1467H
4.3 Bonding Diagram
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MM1-1467H
5. Mechanical Data
5.1 CH Package Outline Drawing (Option -2)
1. CH Substrate material is 0.004 in thick GaAs.
2. I/O trace finish is 4.2 microns Au. Ground plane finish is 5 microns Au.
5.2 CH Package Outline Drawing (Option -1)
3. CH Substrate material is 0.004 in thick GaAs.
4. I/O trace finish is 4.2 microns Au. Ground plane finish is 5 microns Au.
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MM1-1467H
5.3 UB Package Outline Drawing
Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice.
Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any
particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any
product.
© Marki Microwave, Inc.
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