1982738-2 [MACOM]
High Speed Backplane Interconnect Solutions; 高速背板互连解决方案
| 型号： | 1982738-2 |
| 厂家： | 
Tyco Electronics |
| 描述： | High Speed Backplane Interconnect Solutions |
| 文件： | 总6页 (文件大小：494K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Qꢀick Reference Gꢀide
High Speed Backplane Interconnect Solutions
The emergence of faster data rates, and decreasing signal rise times, requires better
performing, high speed connectors. TE Connectivity’s broad portfolio of high speed
backplane connectors provides system designers the flexibility they require to solve their
specific performance challenges.
INDuSTRy APPLICATIONS
• Servers- blade, rack mount and
mainframe stackable, carrier grade, core,
edge and Metro Ethernet
• Optical- Transport: carrier grade optical,
metro WDM, optical multi-service
provisioning, long haul optical and
enterprise LAN optical Ethernet
• Switches- Stackable, carrier grade, core,
edge and Metro Ethernet
• Routers- edge, core, enterprise class,
carrier Ethernet, BRAS and
Multi Service Edge
www.te.com/prodꢀcts/2Piece-High-Speed
TE Connectivity
High Speed Backplane Connectors
Signal Integritꢁ at TE
TE Connectivity gets the best performance out of connectors by applying system-level signal integrity design expertise to each high-speed product.
Our modeling and simulation skills are second to none with global expertise in the U.S., Europe, and Asia. Our global presence places simulation,
modeling, and system layout experts next to the customer.
Modeling and Simꢀlation
At TE the design process starts with signal integrity. Signal integrity engineers use sophisticated 3D tools to provide accurate connector and footprint
via pattern performance prior to production. TE has the tools and expertise to get the right answer.
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Ansys HFSS and CST
Microwave Studio Full-wave
3D tools
Both connector and footprint
via pattern(s) analyzed
before production
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S-parameter and SPICE
analysis
Sophisticated ADS and
MATLAB system analysis
Test Capabilitꢁ
With measurement capabilities beyond 12.5 Gbps and 50 GHz, TE can characterize and provide detailed measurements for its products. Cutting-edge
measurement calibration techniques and board design enable accurate de-embedding of test fixtures. TE has also teamed with numerous silicon com-
panies to provide active device measurements that can be invaluable to assure the successful implementation of a design.
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Advanced calibration techniques de-embed fixture
Frequency domain to 50 GHz
Time domain eye pattern/BERT to 12.5 Gbps
Active silicon testing – multiple vendors 2 – 10+ Gbps
Both system and “connector only” boards
Cꢀstomer Sꢀpport and Tools
From test boards to simulation models, TE provides a library of tools that help you successfully implement your system.
Requests can be easily made through our signal integrity website: www.te.com/documentation/electrical-models
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Ansys HFSS and CST Microwave Studio Full-wave 3D tools
Both connector and footprint via pattern(s) analyzed before
production
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S-parameter and SPICE analysis
Sophisticated ADS and MATLAB system analysis
Measurement based S-parameter connector models (64+ ports)
Modeling based S-parameter connector models (64+ ports)
Footprint via pattern S-parameter and SPICE models
SPICE connector models
Connector evaluation test boards
System test boards
www.te.com/products/2Piece-High-Speed
TE Connectivity
High Speed Backplane Connectors
STRADA Whisper Connectors
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Up to 40Gb/s performance
Density up to 20 differential pairs per cm (52 DP per in)
Available in 4, 6, and 8 pairs/column, supporting cardpitch
of 16.4 mm (.64"), 20.4 mm (.8"), and 25.4 mm (1")
respectively
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See back panel for representative part numbers
Website: www.te.com/products/stradawhisper
DATA RATE
3-6 GB/s
15-20 GB/s
6-10 GB/s
20-25 GB/s
25+ GB/s
10-15 GB/s
STRADA Whisper
Connector
52 DP/in
20 DP/cm
IMPACT
Connector
80 DP/in
32 DP/cm
Z-PACK TinMan100 Ohm and 85 Ohm
Connector
80 DP/in
32 DP/cm
Z-PACK Slim UHD
Common Speed
Connector
Z-PACK Slim UHD
High Speed
Connector
36 DP/in
14 DP/cm
36 DP/in
14 DP/cm
Z-PACK HM-Zd
Connector
Z-PACK HM-Zd Plus
Connector
40 DP/in
16 DP/cm
40 DP/in
16 DP/cm
MULTIGIG RT
Connector
57 DP/in
23 DP/cm
Z-PACK HS3
Connector
50 DP/in
24 DP/cm
www.te.com/products/2Piece-High-Speed
TE Connectivity
High Speed Backplane Connectors
Z-PACK HM-Zd and Hm-Zd Plꢀs Connectors
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Up to 12.5 Gb/s performance
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Density up to 16 differential pairs per cm (40 DP per inch), in 25.4 mm (1")
slot-pitch
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Available in 2, 3 and 4 pairs/column, fitting 20.32 mm (0.8") slot-pitch for
2 and 3 pair version and 25.4 mm (1") slot-pitch for the 4 pair version
HM-Zd Plus provides enhanced signal integrity in a design backwards
compatible with standard HM-Zd
Advanced Differential Fabric (ADF) Connector specified in the PICMG 3.X
Advanced TCA specifications
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See back panel for representative part numbers
Order catalog 1773095, "High Speed Backplane Connector"
Website: http://hmzd.te.com
Z-PACK HS3 Connectors
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Up to 6.25 Gb/s performance
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Density up to 40 high speed signal lines (20 DP) per cm board space, in
25.4 mm (1") slot-pitch
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Available in 2 versions: six row and ten row, respectively fitting 20.32 mm
(0.8") and 25.40 mm (1") slot-pitches
High-speed connector designed for both single ended and differential
signals
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See back panel for representative part numbers
Order catalog 1773095, "High Speed Backplane Connector"
Website: http://hs3.te.com
MuLTIGIG RT Connectors
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Up to 6.25 Gb/s performance
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Density available in 2 versions per tier: 0.8" and 1", respectively fitting
20.32 mm (0.8") and 25.4 mm (1") slot-pitches
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Backplane connector system specified in VME standards: VXS (VITA 41) &
VPX (VITA 46)
Pinless backplane connector utilizes a PCB construction which allows the
connector system to have extreme flexibility. 100 Ohm differential, 50 Ohm
single ended, open pin field, and power wafers can be mixed within one
connector module.
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See back panel for representative part numbers
Order catalog 1773095, "High Speed Backplane Connector"
Website: http://www.multigigrt.com
www.te.com/products/2Piece-High-Speed
TE Connectivity
High Speed Backplane Connectors
IMPACT Connectors
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Up to 25 Gb/s performance
Density up to 32 high speed differential pairs per cm (80 DP per inch)
100 Ohm
Modular system: 2, 3, 4, 5, 6 pair/ column available. 6 through 20 columns
offered in increments of 2 columns
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See back panel for representative part numbers
Order catalog 7-1773458-1, "IMPACT Backplane Connector System"
Website: www.te.com/products/Impact
Z-PACK TinMan 100 Ohm and 85 Ohm Connectors
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Up to 12.5 Gb/s performance
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Density up to 14 high speed differential pairs per cm (80 DP per inch);
6-16 columns available
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Modular system: 3, 4, 5, and 6 pair/column, respectively fitting 16.25mm
(.625"), 20.32 mm (0.8") and 25.4 mm (1") slot-pitch
85 ohm impedance version for QPCle and Intel QPI standards, and other
85 ohm system applications
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See back panel for representative part numbers
Order catalog 1773095, "High Speed Backplane Connector"
Website: http://www.te.com/ZPackTinMan
Z-PACK Slim uHD Connectors
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2 versions
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CS (Common Speed) 8 Gb/s
HS (High Speed) 12.5 Gb/s, scalable to 20 Gb/s
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Density (in a 2 DP/Column assignment): 55 lines per cm, 141 lines per inch
(in a SE assignment)
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Low profile — 12.5 mm wide
Flexible pin assignments
See back panel for representative part numbers
Order catalog 1773095, "High Speed Backplane Connector"
Website: http://www.te.com/products/zpackuhd
www.te.com/products/2Piece-High-Speed
High Speed Backplane Interconnects
Once you have determined which connector description best suits your needs, use the
chart below to find a part number to search the TE website.
Representative Part Nꢀmbers
Connector Description
Plꢀg
Receptacle
2149968-3
6469001-1
5120790-1
1410142-1
STRADA Whisper Connectors
2149967-3
6469002-1
5120658-1
1410187-3
2007777-1
1934269-1
2042088-2
Z-Pack HM-Zd Connectors and Z-Pack Hm-Zd Plus Connectors
Z-Pack HS3 Connectors
MULTIGIG RT Connectors
IMPACT Connectors
2007703-1
1934218-1
1982738-2
Z-Pack TinMan 100 Ohm and 85 Ohm Connectors
Z-Pack Slim UHD Connectors
FOR MORE INFORMATION
TE Technical Sꢀpport Center
USA:
+1 (800) 522-6752
Canada:
Mexico
+1 (905) 475-6222
+52 (0) 55-1106-0800
+54 (0) 11-4733-2200
+49 (0) 6251-133-1999
+44 (0) 800-267666
+33 (0) 1-3420-8686
+31 (0) 73-6246-999
+86 (0) 400-820-6015
Latin/S. America:
Germany:
UK:
France:
Netherlands:
China:
Part numbers in this brochure are RoHS Compliant*, unless marked otherwise.
*as defined www.te.com/leadfree
te.com
© 2011 Tyco Electronics Corporation, a TE Connectivity Ltd. Company. All Rights Reserved.
1654263-1 CIS LUG FP 3M 08/2011
MULTIGIG RT, TE Connectivity, the TE connectivity (logo), Z-PACK and Z-PACK TinMan are trademarks. Other
logos, product and/or company names might be trademarks of their respective owners.
Advanced TCA is a trademark of PICMG-PCI Industrial Computer Mfg’s Group.
Ansys HFSS is a trademark of Ansoft Corporation.
CST Microwave Studio is a trademark of CST Computer Simulation Technology AG.
IMPACT is a trademark of Molex Inc.
MATLAB is a trademark of The MathWorks, Inc.
VITA is a trademark of VMEbus International Trade Association.
While TE has made every reasonable effort to ensure the accuracy of the information in this brochure, TE does not guarantee that it is
error-free, nor does TE make any other representation, warranty or guarantee that the information is accurate, correct, reliable or current.
TE reserves the right to make any adjustments to the information contained herein at any time without notice. TE expressly disclaims all
implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or
fitness for a particular purpose. The dimensions in this catalog are for reference purposes only and are subject to change without notice.
Specifications are subject to change without notice. Consult TE for the latest dimensions and design specifications.
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