1410188-3_技术文档

108-2072

10 Sep 12 Rev E

Product

Specification

MULTIGIG RT* Signal Connectors, Tiers 1 and 2, RT2 Mezzanine,

and RT2 Ruggedized

1.

SCOPE

1.1.

Content

This specification covers performance, tests and quality requirements for the TE Connectivity (TE)

MULTIGIG RT* Signal connector system which uses a modular concept and interconnects two printed

circuit boards. Both receptacle and plug connectors are connected to the printed circuit boards with

plated thru-hole compliant press-fit leads. The connector system is designed to perform at two different

signal transmission performance levels which are identified by the “Tier” designator. Although signal

transmission performance levels vary between the “Tiers” of product, the mechanical and

environmental requirements contained in this specification apply to all.

1.2.

1.3.

Qualification

When tests are performed on the subject product line, procedures specified in Figure 1 shall be used.

All inspections shall be performed using the applicable inspection plan and product drawing.

Qualification Test Results

Successful qualification testing on Tier 1 product was completed on 14Aug02. Successful qualification

testing on Tier 2 product was completed on 31Jan04. Successful qualification testing on RT2

Mezzanine product was completed on 11Nov07. Successful qualification testing on the RT2

Ruggedized product was completed 20Aug2012. The Qualification Test Report number for this testing

is 501-544. This documentation is on file at and available from Engineering Practices and Standards

(EPS).

2.

APPLICABLE DOCUMENTS

The following documents form a part of this specification to the extent specified herein. Unless

otherwise specified, the latest edition of the document applies. In the event of conflict between the

requirements of this specification and the product drawing, the product drawing shall take precedence.

In the event of conflict between the requirements of this specification and the referenced documents,

this specification shall take precedence.

2.1.

2.2.

Tyco Electronics Documents

●

109 Series: Test Specifications as indicated in Figure 1

109-197: Test Specification (AMP Test Specifications vs EIA and IEC Test Methods)

501-544: Qualification Test Report (MULTIGIG RT* Signal Connectors, Tiers 1 and 2, RT2

Mezzanine, and RT2 Ruggedized.)

Commercial Documents

●

Bellcore GR-1217: Generic Requirements for Separable Electrical Connectors Used in

Telecommunications Hardware

EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications

| Indicates Change

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*Trademark. TE Connectivity, TE connectivity (logo), and TE (logo) are trademarks. Other logos, product and/or company names may be trademarks of their respective owners.

108-2072

3.

REQUIREMENTS

3.1.

Design and Construction

Product shall be of the design, construction and physical dimensions specified on the applicable

product drawing.

3.2.

3.3.

Materials

Materials used in the construction of this product shall be as specified on the applicable product

drawing.

Ratings

●

Operating Voltage:

Current: 1 ampere at <30°C (single circuit, free air)

Temperature: -55 to 105°C

50 volts AC peak or DC

3.4.

3.5.

Performance and Test Description

Product is designed to meet the electrical, mechanical and environmental performance requirements

specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental

conditions.

Test Requirements and Procedures Summary

Test Description

Requirement

Procedure

Initial examination of product.

Meets requirements of product

drawing.

EIA-364-18.

Visual and dimensional (C of C)

inspection per product drawing.

Final examination of product.

Meets visual requirements.

ELECTRICAL

EIA-364-18.

Visual inspection.

Low level contact resistance, circuit. 80 milliohms maximum initial.

EIA-364-23.

5 milliohms maximum average

increase.

10 milliohms maximum individual

increase.

Subject specimens to 100

milliamperes maximum and 20

millivolts maximum open circuit

voltage.

See Figure 3.

Low level contact resistance,

compliant pin.

1 milliohm maximum initial.

1 milliohm maximum change.

EIA-364-23.

Subject specimens to 100

milliamperes maximum and 20

millivolts maximum open circuit

voltage.

See Figure 4.

Insulation resistance.

1000 megohms minimum.

Figure 1 (continued)

EIA-364-21.

Test between any adjacent pair of

signal contacts, or from any signal

contact to an adjacent ground pin

of mated specimens at 100 volts

DC.

Rev E

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108-2072

Test Description

Requirement

1 minute hold with no breakdown or EIA-364-20, Condition I.

flashover. 500 volts AC peak or DC at sea

Procedure

Withstanding voltage.

level.

Test between any adjacent pair of

signal contacts, or from any signal

contact to an adjacent ground pin of

mated specimens.

Temperature rise vs current.

Vibration, sinusoidal.

30°C maximum temperature rise at EIA-364-70, Method 1.

1 ampere load, single circuit in free Stabilize at a single current level

air using thermography.

until 3 readings at 5 minute intervals

are within 1°C.

MECHANICAL

No discontinuities of 1 microsecond EIA-364-28, Test Condition II.

or longer duration.

See Note.

Subject mated specimens to 10-

500-10 Hz traversed in 15 minutes

with 1.5 mm [.06 in] maximum total

excursion. Two hours in each of 3

mutually perpendicular planes.

Mechanical shock.

No discontinuities of 1 microsecond EIA-364-27, Method H.

or longer duration.

See Note.

Subject mated specimens to 30 G's

half-sine shock pulses of 11

milliseconds duration. Three shocks

in each direction applied along 3

mutually perpendicular planes, 18

total shocks.

Durability.

See Note.

EIA-364-9.

Mate and unmate specimens for

200 cycles at a maximum rate of

500 cycles per hour.

Mating force.

0.75 N [2.7 ozf] maximum per

contact. Average for entire

connector.

EIA-364-13.

Measure force necessary to mate

specimens at a maximum rate of

12.7 mm [.5 in] per minute.

Unmating force.

Compliant pin insertion.

0.15 N [.54 ozf] minimum per

contact. Average for entire

connector.

EIA-364-13.

Measure force necessary to unmate

specimens at a maximum rate of

12.7 mm [.5 in] per minute.

31 N [7 lbf] maximum per pin

average.

AMP Spec 109-41.

Measure force necessary to

correctly apply a connector

assembly to a printed circuit board

at a maximum rate of 12.7 mm [.5

in] per minute.

Compliant pin retention.

13.35 N [3 lbf] minimum.

AMP Spec 109-30.

Measure force necessary to unseat

a single pin in a correctly applied

connector assembly from its printed

circuit board hole at a maximum

rate of 12.7 mm [.5 in] per minute.

Figure 1 (continued)

Rev E

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108-2072

Test Description

Requirement

See Note.

Procedure

Minute disturbance.

Unmate and mate specimens a

distance of approximately 0.1 mm

[.004 in].

ENVIRONMENTAL

Thermal shock.

See Note.

EIA-364-32, Test Condition VII.

Subject mated specimens to 5

cycles between -55 and 105°C.

Humidity/temperature cycling.

See Note.

EIA-364-31, Method III.

Subject mated specimens to 10

cycles (10 days) between 25 and

65°C at 80 to 100% RH.

Temperature life.

Mixed flowing gas.

Dust contamination.

See Note.

EIA-364-17, Method A, Test

Condition 4, Test Time Condition C.

Subject mated specimens to 105°C

for 500 hours.

EIA-364-65, Class IIA (4 gas).

Subject mated and unmated

specimens to environmental Class

IIA for 20 days.

EIA-364-91.

Subject unmated specimens to dust

contamination for 1 hour.

NOTE Shall meet visual requirements, show no physical damage, and meet requirements of additional tests

as specified in the Product Qualification and Requalification Test Sequence shown in Figure 2.

Figure 1 (end)

Rev E

4 of 11

108-2072

3.6.

Product Qualification and Requalification Test Sequence

A. Tier 1 Product

Test Group (a)

Test or Examination

1

2

3

4

1

5

1

Test Sequence (b)

1

Initial examination of product

1

3,7,10,15

4,16

1

3,7,9,12

4,13

14

Low level contact resistance, circuit

Low level contact resistance, compliant pin (c)

Insulation resistance

Withstanding voltage

Temperature rise vs current

Vibration

2,5,7,10

3,11

2,5,7,9,12,14,16,19

3,10,17

5,13

6,14

15

2

8

9

Mechanical shock

Durability

6

4

4,18(d)

Mating force

2,12

8,11

2,17

5,16

13

12

Unmating force

Compliant pin insertion

Compliant pin retention

Minute disturbance

3

4

18

14

20

15

Thermal shock

10

11

Humidity-temperature cycling

Temperature life

9

Mixed flowing gas

6(e),8(e),11(f),13(f)

21

Dust contamination

8

6

Final examination of product

17

19

15

NOTE

(a) See paragraph 4.1.A.

(b) Numbers indicate sequence in which tests are performed.

(c) Compliant pin design requires special test printed circuit board for low level contact

resistance data collection. Separate, parallel test groups to be supplied where this data

is required.

(d) Perform 100 cycles of durability before, and 100 cycles after mixed flowing gas testing.

(e) Exposure interval of 5 days with specimens unmated.

(f) Exposure interval of 5 days with specimens mated.

Figure 2A

Rev E

5 of 11

108-2072

B. Tier 2 Product

Test Group (a)

Test or Examination

1

2

3

4

1

5

1

Test Sequence (b)

1

Initial examination of product

Low level contact resistance, circuit

Low level contact resistance, compliant pin (c)

Insulation resistance

Withstanding voltage

Temperature rise vs current

Vibration

1

3,9,11,14

4,17

3,9,13

4,10

5,14

6,15

2,5,7,10

3,11

2,5,7,9,12,14,16,18

3,10,19

5,18

6,19

2

8

9

Mechanical shock

Durability

8

4

4,17(d)

Mating force

2,12

7,11

2,16

7,15

13

12

Unmating force

Compliant pin insertion

Compliant pin retention

Minute disturbance

3

4

16

20

14

20

15

Thermal shock

12

13

Humidity-temperature cycling

Temperature life

8

Mixed flowing gas

6(e),8(e),11(f),13(f)

21

Dust contamination

10

21

6

Final examination of product

17

15

5

NOTE

(a) See paragraph 4.1.A.

(b) Numbers indicate sequence in which tests are performed.

(c) Compliant pin design requires special test printed circuit board for low level contact

resistance data collection. Separate, parallel test groups to be supplied where this data

is required.

(d) Perform 100 cycles of durability before, and 100 cycles after mixed flowing gas testing.

(e) Exposure interval of 5 days with specimens unmated.

(f) Exposure interval of 5 days with specimens mated.

Figure 2B

Rev E

6 of 11

108-2072

C. RT2 Mezzanine Product

Test Group (a)

Test or Examination

1

2

Test Sequence (b)

1

Initial examination of product

Low level contact resistance, circuit

Vibration

2,4,6,9

2,4,6,8,10,12,14,16

7

8

Mechanical shock

Durability

3

3,15(c)

Mating force

10

11

Unmating force

Minute disturbance

Mixed flowing gas

Dust contamination

Final examination of product

13

5(d),7(d),9(e),11(e)

5

12

17

NOTE

(a) See paragraph 4.1.A.

(b) Numbers indicate sequence in which tests are performed.

(c) Perform 100 cycles of durability before, and 100 cycles after mixed flowing gas testing.

(d) Exposure interval of 5 days with specimens unmated.

(e) Exposure interval of 5 days with specimens mated.

Figure 2C

Rev E

7 of 11

108-2072

D. RT2 Ruggedized Product

Test Groups (a)

2

Test or Examination

1

3

Test Sequence (b)

Initial examination of product

Low level contact resistance, circuit

Vibration

1

3,6

2,4,6,9 2,4,6,8,10,12,14,16

7

8

Mechanical shock

Durability

3

3,15(c)

Mating force

2,8

4,7

11

10

Unmating force

Minute disturbance

Temperature life

13

5(d),7(d),9(e),11(e)

17

5

9

Mixed flowing gas

Dust contamination

Final examination of product

5

12

NOTE

(a) See Paragraph 4.1.A.

(b) Numbers indicate sequence in which tests are performed.

(c) Perform 100 cycles of durability before, and 100 cycles after mixed flowing gas testing.

(d) Exposure interval of 5 days with specimens unmated.

(e) Exposure interval of 5 days with specimens mated.

Figure 2D

Rev E

8 of 11

108-2072

4.

QUALITY ASSURANCE PROVISIONS

Qualification Testing

4.1.

A. Specimen Selection

1. Tier 1 Product

Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be

selected at random from current production. Each test group shall consist of 8 male and 8

female connector assemblies. Low level contact resistance circuit data, where tested, shall

be collected and evaluated from a minimum of 100 circuits chosen at random from those

assemblies. Low level contact resistance compliant pin data, where tested, shall be collected

and evaluated from a minimum of 50 pins chosen at random from those assemblies.

2. Tier 2 Product

Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be

selected at random from current production. Test groups 1 and 2 shall each consist of 12

male and 12 female connector assemblies. Test groups 3 and 4 shall each consist of 8 male

and 8 female connector assemblies. Test group 5 shall consist of 7 male and 7 female

connector assemblies. Low level contact resistance circuit data, where tested, shall be

collected and evaluated from a minimum of 96 circuits chosen at random from those

assemblies. Low level contact resistance compliant pin data, where tested, shall be collected

and evaluated from a minimum of 100 pins chosen at random from those assemblies.

3. RT2 Mezzanine Product

Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be

selected at random from current production. Each test group shall consist of 4, 42 mm stack

height Mezzanine connectors and 8, 20.3 mm MULTIGIG RT2 vertical receptacle assembly

backplane connectors. Low level contact resistance circuit data, where tested, shall be

collected and evaluated from a minimum of 100 circuits chosen at random from those

assemblies.

4. RT2 Ruggedized

Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be

selected at random from current production. Each test group shall consist of 5 male and 5

female connector assemblies. Low level contact resistance circuit data, where tested, shall

be collected and evaluated from a minimum of 100 circuits chosen at random from those

assemblies.

B. Test Sequence

Qualification inspection shall be verified by testing specimens as specified in Figures 2A, 2B, 2C,

and 2D.

4.2.

Requalification Testing

If changes significantly affecting form, fit or function are made to the product or manufacturing process,

product assurance shall coordinate requalification testing, consisting of all or part of the original testing

sequence as determined by development/product, quality and reliability engineering.

Rev E

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108-2072

4.3.

4.4.

Acceptance

Acceptance is based on verification that the product meets the requirements of Figure 1. Failures

attributed to equipment, test setup or operator deficiencies shall not disqualify the product. If product

failure occurs, corrective action shall be taken and specimens resubmitted for qualification. Testing to

confirm corrective action is required before resubmittal.

Quality Conformance Inspection

The applicable quality inspection plan shall specify the sampling acceptable quality level to be used.

Power

Supply

A

Termination Resistance

Measurement Points

Dimensional and functional requirements shall be in accordance with the applicable product drawing

and this specification.

Figure 3

Low Level Contact Resistance Measurement Points (Circuit)

Rev E

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108-2072

Termination Resistance

Measurement Points

Power

Supply

Termination Resistance

Measurement Points

Power

Supply

Figure 4

Low Level Contact Resistance Measurement Points (Compliant Pin)

Rev E

11 of 11


型号：	1410188-3
厂家：	Tyco Electronics
描述：	MULTIGIG RT Signal Connectors, Tiers 1 and 2, RT2 Mezzanine,and RT2 Ruggedized MULTIGIG RT信号连接器，方法1和方法2 ， RT2夹层和RT2加固连接器
文件：	总11页 (文件大小：416K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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