LTM4653 [Linear]
EN55022B Compliant 58V, 4A Step-Down DC/DC μModule Regulator;型号: | LTM4653 |
厂家: | Linear |
描述: | EN55022B Compliant 58V, 4A Step-Down DC/DC μModule Regulator |
文件: | 总32页 (文件大小:1422K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTM4653
EN55022B Compliant 58V, 4A
Step-Down DC/DC μModule Regulator
FEATURES
DESCRIPTION
The LTM®4653 is an ultralow noise 58V, 4A DC/DC step-
down μModule® regulator designed to meet the radiated
emissions requirements of EN55022. Conducted emis-
sion requirements can be met by adding standard filter
components. Included in the package are the switching
controller, power MOSFETs, inductor, filters and support
components.
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Complete Low EMI Switch Mode Power Supply
EN55022 Class B Compliant
Wide Input Voltage Range: 3.1V to 58V
Up to 4A Output Current
Output Voltage Range: 0.5V ≤ V
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≤ 0.94 • V
OUT
IN
1.ꢀ67 Total DC Output Voltage Error Over Line,
Load and Temperature (–40°C to 125°C)
Parallel and Current Share with Multiple LTM4ꢀ53s
Analog Output Current Indicator
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Operating over an input voltage range of 3.1V to 58V, the
LTM4653 supports an output voltage range of 0.5V to
Programmable Input Voltage Limiting
94% of V , and a switching frequency range of 250kHz
IN
Constant-Frequency Current Mode Control
Power Good Indicator and Programmable Soft-Start
Overcurrent/Overvoltage/Overtemperature Protection
15mm × 9mm × 5.01mm BGA Package
to 3MHz (400kHz default), each set by a single resistor.
For high load currents, the LTM4653 can be paralleled in
PolyPhase® operation and synchronized to an external
clock. Only the bulk input and output filter capacitors are
needed to finish the design.
APPLICATIONS
The LTM4653 is offered in a 15mm × 9mm × 5.01mm
BGApackagewithSnPborRoHScompliantterminalfinish.
All registered trademarks and trademarks are the property of their respective owners. Protected
by U.S. Patents, including 5481178, 5705919, 5847554, 6580258.
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Avionics, Industrial Control and Test Equipment
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Video, Imaging and Instrumentation
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48V Telecom and Network Power Supplies
RF Systems
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TYPICAL APPLICATION
4A, 24V Output Low EMI DC/DC μModule Regulator
with Analog Output Current Indicator
Radiated Emission Scan in a 10m Chamber
LTM4ꢀ53 Delivering 24VOUT at 3.5A, from 48VIN
I
ꢓ0
OUT
V
24V
,
IN
ꢁꢈꢀꢨ ꢇꢄꢨꢅ ꢗ0ꢏ
ꢨꢂꢈꢜ ꢇꢄꢨꢅ ꢗ0ꢏ
OUT
V
V
OUT
IN
28V TO 58V
UP TO 4A
10µF
×2
ꢒ0
ꢑ0
ꢔ0
ꢕ0
ꢖ0
ꢗ0
0
4.7μF
4.7μF
V
OSNS
SV
IN
LOAD
V
D
SGND
PGND
RUN
INTV
CC
LTM4653
VINREG
COMPa
ANALOG OUTPUT
ꢣꢗꢤ ꢞꢥRꢄꢦꢥꢛꢅꢀꢃ
ꢣꢖꢤ ꢍꢈRꢅꢄꢜꢀꢃ
ꢚꢂꢧ ꢃꢄꢁꢄꢅ
IMONa
IMONb
CURRENT INDICATOR
10nF
V
= 0.25Ω • I
IMON
OUT
ꢩ
499Ω
ꢙꢥRꢁꢀꢃ
f
ꢘꢗ0
SET
PINS NOT USED IN
THIS CIRCUIT:
ꢕ0
ꢗꢕ0
ꢖꢕ0
ꢕꢕ0
ꢔꢕ0
ꢑꢕ0
ꢒꢕ0
ꢓꢕ0
ꢠꢕ0
ꢡꢕ0 ꢗ000
124k
GND
ISETa ISETb
ꢔꢒꢑꢕ ꢅꢀ0ꢗꢢ
ꢙRꢈꢚꢆꢈꢛꢜꢝ ꢉꢁꢞꢟꢐ
CLKIN, PGOOD, COMPb
PGDFB, SW, EXTV
4653 TA01a
CC
+
–
TEMP , TEMP , NC
481k
Rev 0
1
Document Feedback
For more information www.analog.com
LTM4653
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
(Note 1) (All Voltages Relative to VOUT– Unless Otherwise Indicated)
ꢏꢐꢑ ꢒꢓꢅꢔ
Terminal Voltages
ꢀ
ꢌ
ꢍ
ꢎ
ꢙ
ꢞ
ꢕ
V , V , SV , SW, V , V , ISETa....–0.3V to 60V
ꢒ
IN
D
IN
OUT OSNS
ꢓꢗ
ꢁ
ꢂ
GND, ISETb, EXTV ............................ –0.3V to 28V
CC
ꢒ
ꢃꢋꢊꢓꢗ
ꢗꢃ
ꢄ
RUN.................................... GND–0.3V to PGND+60V
ꢑꢇꢗꢄ
INTV , PGDFB, VINREG, COMPa, COMPb,
ꢓꢠꢐꢗꢦ ꢓꢠꢐꢗꢢ ꢣꢒ
CC
ꢓꢗ
ꢃ
ꢄ
ꢅ
IMONa, IMONb ........................................ –0.3V to 4V
ꢑꢇꢐꢐꢄ ꢑꢇꢄꢆꢂ ꢒꢓꢗRꢅꢇ ꢇꢗꢄ
f
...................................................–0.3V to INTV
SET
CC
CLKIN, PGOOD (Relative to GND) ........... –0.3V to 6V
ꢗꢃ
ꢃꢐꢠꢑꢦ ꢃꢐꢠꢑꢢ
ꢤ
ꢣꢇꢗꢄ
Rꢟꢗ
ꢣꢅꢏ
Terminal Currents
ꢓꢣꢅꢏꢦ ꢓꢣꢅꢏꢢ ꢅꢥꢏꢒ
ꢃꢃ
INTV Peak Output Current (Note 8)................30mA
CC
ꢆ
+
TEMP ..................................................–1mA to 10mA
ꢓꢗꢏꢒ
ꢃꢃ
–
ꢇ
TEMP .................................................–10mA to 1mA
ꢒ
ꢣꢇꢗꢄ
ꢐꢣꢗꢣ
ꢣꢔ
Temperatures
ꢈ
ꢡ
ꢧ
ꢡ
ꢧ
Internal Operating Temperature Range
(Note 2) ............................................. –40°C to 125°C
Storage Temperature Range .............. –55°C to 125°C
Peak Solder Reflow Package
ꢏꢅꢠꢑ
ꢏꢅꢠꢑ
ꢏꢅꢠꢑ
ꢏꢅꢠꢑ
ꢉ
ꢑꢇꢗꢄ
ꢊ
ꢒ
ꢗꢃ
ꢐꢟꢏ
ꢋ
Body Temperature ............................................ 245°C
ꢂꢇꢁ ꢑꢁꢃꢊꢁꢇꢅ
ꢕꢕꢖꢑꢓꢗ ꢘꢀꢙꢚꢚ × ꢛꢚꢚ × ꢙꢜ0ꢀꢚꢚꢝ
= 125°C
T
JMAX
θ
= 20.6°C/W, θ
= 5.1°C/W, θ = 6.0°C/W, θ = 15.5°C/W
JCtop
JCbottom
JB
JA
θ VALUES DETERMINED PER JESD51-12
WEIGHT = 1.8 GRAMS
http://www.linear.com/product/LTM4ꢀ53#orderinfo
ORDER INFORMATION
PART MARKING*
PACKAGE
MSL
TEMPERATURE RANGE
(SEE NOTE 2)
PART NUMBER
LTM4653EY#PBF
LTM4653IY#PBF
LTM4653IY
PAD OR BALL FINISH
SAC305 (RoHS)
SAC305 (RoHS)
SnPb (63/37)
DEVICE
FINISH CODE
TYPE
RATING
e1
e1
e0
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
LTM4653Y
BGA
3
• Device temperature grade is indicated by a label on the shipping container. • Recommended BGA PCB Assembly and Manufacturing Procedures:
www.linear.com/BGA-assy
• Pad or ball finish code is per IPC/JEDEC J-STD-609.
• BGA Package and Tray Drawings: www.linear.com/packaging
• Terminal Finish Part Marking: www.linear.com/leadfree
• This product is moisture sensitive. For more information, go to:
• This product is not recommended for second side reflow. For more
www.linear.com/BGA-assy
information, go to www.linear.com/BGA-assy
Rev 0
2
For more information www.analog.com
LTM4653
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the specified internal
operating temperature range (Note 2). TA = 25°C, Test Circuit, VIN = SVIN = 48V, EXTVCC = 24V, RUN = 3.3V, RISET = 480k,
RfSET = 56.ꢀkΩ, fSW = 1.5MHz (CLKIN driven with 1.2MHz clock signal) unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
3.1
TYP MAX UNITS
l
l
l
SV
, V
Input DC Voltage
58
0.94V
V
V
V
IN(DC) IN(DC)
V
V
Range of Output Voltage Regulation
0.5V ≤ ISETa - SGND ≤ 0.94V , I
= 0A (See Note 6)
0.5
OUT(RANGE)
OUT(24VDC)
IN OUT
IN
Output Voltage Total Variation with
Line and Load at V
28V ≤ V ≤ 58V, 0A ≤ I
≤ 4A, C = 4.7μF,
23.6
24
0
24.4
IN
OUT
INH
= 24V
C = 4.7μF, C = 2 × 47μF, CLKIN driven with
OUTH
OUT
D
1.5MHz Clock
l
V
Output Voltage Total Variation with
Line and Load at V = 0.5V
Measuring V
- ISETa
OSNS
–15
15
mV
OUT(0.5VDC)
3.1V ≤ V ≤ 13.2V, 0A ≤ I
≤ 4A, C = 4.7μF,
INH
= 2 × 47μF, ISETa = 500mV,
OUT
IN
OUT
C = 4.7μF, C
D
fSET
OUTH
R
= N/U (Note 5)
Input Specifications
l
l
l
V
SV Undervoltage Lockout Threshold SV Rising
2.85
2.6
250
3.1
2.9
V
V
mV
IN(UVLO)
IN
IN
SV Falling
2.4
150
IN
Hysteresis
V
V
SV Overvoltage Lockout Rising
(Note 4)
64
68
2
V
V
IN(OVLO)
IN(HYS)
IN
SV Overvoltage Lockout Hysteresis (Note 4)
IN
4
I
Input Inrush Current at Start-Up
C
= 4.7μF, C = 4.7μF, C
= 2 × 47μF; I = 0A,
OUT
300
mA
INRUSH(VIN)
INH
D
OUTH
ISETa Electrically Connected to ISETb
I
Input Supply Bias Current
Shutdown, RUN = GND
16
450
30
μA
μA
Q(SVIN)
RUN = V
IN
I
I
Input Supply Current
CLKIN Open Circuit, I
= 4A
OUT
2.1
4
A
S(VIN, FCM)
Input Supply Current in Shutdown
Shutdown, RUN = GND
µA
S(VIN, SHUTDOWN)
Output Specifications
I
V
Output Continuous Current
OUT
(Note 3)
0
4
A
OUT
Range
l
l
∆V
∆V
/V
Line Regulation Accuracy
Load Regulation Accuracy
I
= 0A, 28V ≤ V ≤58V
0.05
0.1
%
%
OUT(LINE) OUT
OUT
IN
/V
V
V
= 48V, 0A ≤ I
≤ 4A
0.05 0.75
2
OUT(LOAD) OUT
IN
OUT
V
Output Voltage Ripple, V
= 12V, ISETa = 5V
= 57.6k, CLKIN Open Circuit
mV
P–P
OUT(AC)
OUT
IN
l
l
f
V
Ripple Frequency
ISETa = 5V, R
fSET
1.7
1.95
8
2.2
MHz
mV
ms
s
OUT
∆V
Turn-On Overshoot
OUT(START)
t
Turn-On Start-Up Time
Delay Measured from V Toggling from 0V to 48V to
4
9
START
IN
PGOOD Exceeding 3V; PGOOD Having a 100k Pull-Up
to 3.3V, VPGFB Resistor-Divider Network as Shown in
Test Circuit, R
to ISETb and CLKIN Driven with 1.5MHz Clock
= 480k, ISETa Electrically Connected
ISETa
∆V
Peak Output Voltage Deviation for
Dynamic Load Step
I
: 0A to 2A and 2A to 0A Load Steps in 1μs,
OUTH
400
50
mV
µs
A
OUT(LS)
OUT
C
= 47µF × 2
t
I
Settling Time for Dynamic Load Step
I
C
: 0A to 2A and 2A to 0A Load Steps in 1μs,
OUTH
SETTLE
OUT
= 47µF × 2
–
I
Output Current Limit
5.5
OUT(OCL)
OUT
Control Section
l
l
I
Reference Current of ISETa Pin
Leakage Current
V
V
= 0.5V, 3.1V ≤ V ≤ 13.2V
49.3
49
50
50
50.7
51
µA
µA
ISETa
ISETa
ISETa
IN
= 24V, 28V ≤ V ≤ 58V
IN
I
t
V
V
= SV = RUN = ISETa = 58V
600
60
µA
ns
VOSNS
OSNS
IN
IN
Minimum On-Time
(Note 4 )
ON(MIN)
Rev 0
3
For more information www.analog.com
LTM4653
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the specified internal
operating temperature range (Note 2). TA = 25°C, Test Circuit, VIN = SVIN = 48V, EXTVCC = 24V, RUN = 3.3V, RISET = 480k,
RfSET = 56.ꢀkΩ, fSW = 1.5MHz (CLKIN driven with 1.2MHz clock signal) unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP MAX UNITS
l
l
V
RUN Turn-On/-Off Thresholds
RUN Input Turn-On Threshold, RUN Rising
RUN Hysteresis
1.08
1.2
1.32
V
RUN
130
mV
I
RUN Leakage Current
RUN = 3.3V
0.1
50
nA
RUN
Oscillator and Phase-Locked Loop (PLL)
f
Oscillator Frequency Accuracy
V
= 12V, ISETa = 5V, and:
OSC
IN
f
Open Circuit
l
360
400
1.95
440
kHz
MHz
SET
R
= 57.6kΩ (See f Specification)
fSET
s
f
PLL Synchronization Capture Range
V
= 12V, ISETa = 5V, CLKIN Driven with a GND-
SYNC
IN
Referred Clock Toggling from 0.4V to 1.2V and Having
a Clock Duty Cycle:
From 10% to 90%; f Open Circuit
250
1.3
550
3
kHz
MHz
SET
fSET
From 40% to 60%; R
= 57.6kΩ
V
CLKIN Input Threshold
CLKIN Input Current
V
V
Rising
Falling
1.2
V
V
CLKIN
CLKIN
CLKIN
0.4
I
V
V
= 5V
= 0V
230
–5
500
μA
μA
CLKIN
CLKIN
CLKIN
–20
Power Good Feedback Input and Power Good Output
l
l
OV
UV
∆V
Output Overvoltage PGOOD Upper
Threshold
PGDFB Rising
PGDFB Falling
PGDFB Returning
620
525
645
555
8
675
580
mV
mV
PGDFB
Output Undervoltage PGOOD Lower
Threshold
PGDFB
PGOOD Hysteresis
mV
kΩ
Ω
PGDFB
PGDFB
R
R
Resistor Between PGDFB and SGND
PGOOD Pull-Down Resistance
4.94 4.99 5.04
700 1500
V
V
= 0.1V, V
< UV
or
PGOOD
PGOOD
PGDFB
PGDFB
PGDFB
PGDFB
> OV
I
t
PGOOD Leakage Current
PGOOD Delay
V
= 3.3V, UV
< V
< OV
PGDFB
0.1
1
μA
PGOOD(LEAK)
PGOOD(DELAY)
PGOOD
PGDFB
PGDFB
PGOOD Low to High (Note 4)
PGOOD High to Low (Note 4)
16/f
s
s
SW(HZ)
SW(HZ)
64/f
Current Monitor and Input Voltage Regulation Pins
l
h
I
I
/I
Ratio of V
Output Current to I
= 0A
Current, I = 4A
OUT
36
–5
40
10
44
5
k
µA
kΩ
V
IMONa
OUT IMONa
OUT
IMONa
I
I
Offset Current
I
at I
IMONa OUT
OS(IMON)
MONa
Resistor
Resistor Between I
and SGND
9.8
1.9
1.8
10.2
2.1
2.2
MONb
MONb
l
l
V
V
I
Servo Voltage
MONa
IMONa Voltage During Output Current Regulation
VINREG Voltage During Output Current Regulation
VINREG = 2V
2.0
2.0
1
IMONa
VINREG
VINREG
VINREG Servo Voltage
V
I
VINREG Leakage Current
nA
INTV Regulator
CC
V
Channel Internal V Voltage, No
3.6V ≤ SV ≤ 58V, EXTV = Open Circuit
3.15
2.85
3.4
3.0
3.65
3.15
V
V
INTVCC
CC
IN
CC
INTV Loading (I
= 0mA)
5V ≤ SV ≤ 58V, 3.2V ≤ EXTV ≤ 26.5V
CC
INTVCC
IN CC
V
EXTV Switchover Voltage
(Note 4)
0mA ≤ I ≤ 30mA
INTVCC
3.15
0.5
V
EXTVCC(TH)
CC
∆V
V
/
INTV Load Regulation
–2
2
%
INTVCC(LOAD)
INTVCC
CC
Rev 0
4
For more information www.analog.com
LTM4653
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the specified internal
operating temperature range (Note 2). TA = 25°C, Test Circuit, VIN = SVIN = 48V, EXTVCC = 24V, RUN = 3.3V, RISET = 480k,
RfSET = 56.ꢀkΩ, fSW = 1.5MHz (CLKIN driven with 1.2MHz clock signal) unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP MAX UNITS
Temperature Sensor
+
–
∆V
Temperature Sensor Forward Voltage,
TEMP
I
= 100µA and I
= –100μA at T = 25°C
0.6
V
TEMP
TEMP
TEMP
A
+
–
V
– V
TEMP
TC
∆V(TEMP)
∆V
TEMP
Temperature Coefficient
–2.0
mV/°C
Note 1: Stresses beyond those listing under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating conditions for extended periods may affect device
reliability and lifetime.
Note 5: To ensure minimum on time criteria is met, V
high-line
OUT(0.5VDC)
regulation is tested at 13.2V , with f and CLKIN open circuit. See the
IN
SET
Applications Information section.
Note ꢀ. See Applications Information Section for Dropout Criteria.
Note 2: The LTM4653 is tested under pulsed load conditions such that
Note 6. This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may impair device reliability.
T ≈ T . The LTM4653E is guaranteed to meet performance specifications
J
A
over the 0°C to 125°C internal operating temperature range. Specifications
over the full –40°C to 125°C internal operating temperature range are
assured by design, characterization and correlation with statistical process
controls.The LTM4653I is guaranteed to meet specifications over the full
internal operating temperature range. Note that the maximum ambient
temperature consistent with these specifications is determined by specific
operating conditions in conjunction with board layout, the rated package
thermal resistance and other environmental factors.
Note 8. The INTV Abs Max peak output current is specified as the sum
CC
of current drawn by circuits internal to the module biased off of INTV
CC
and current drawn by external circuits biased off of INTV . See the
CC
Applications Information section.
Note 3: See output current derating curves for different V , V , and T ,
IN OUT
A
located in the Applications Information section.
Note 4: Minimum on-time, V Overvoltage Lockout and Overvoltage
IN
Lockout Hysteresis, and EXTV Switchover Threshold are tested at wafer
CC
sort.
Rev 0
5
For more information www.analog.com
LTM4653
TA = 25°C, unless otherwise noted.
TYPICAL PERFORMANCE CHARACTERISTICS
Efficiency vs Load Current at
5VIN, Forced Continuous Mode
Efficiency vs Load Current at
12VIN, Forced Continuous Mode
Efficiency vs Load Current at
15VIN, Forced Continuous Mode
ꢑꢌ
ꢑ0
ꢍꢌ
ꢍ0
ꢐꢌ
ꢐ0
ꢏꢌ
ꢑꢂ
ꢑ0
ꢌꢂ
ꢌ0
ꢐꢂ
ꢐ0
ꢏꢂ
ꢀ00
ꢑꢍ
ꢑ0
ꢂꢍ
ꢂ0
ꢐꢍ
ꢐ0
ꢏꢍ
ꢏ0
ꢎꢁꢎꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢀꢌꢃ ꢇ ꢍ00ꢉꢊꢋ
ꢄꢅꢆ
ꢂꢁꢌꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢍꢁ0ꢃ ꢇ ꢈꢍ0ꢉꢊꢋ
ꢄꢅꢆ
ꢂꢁ0ꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢀꢁꢍꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢎꢁꢎꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢎꢁꢎꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢀꢁꢌꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢌꢁꢍꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢍꢁꢂꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢀꢁꢌꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢀꢁ0ꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢀꢁꢂꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢀꢁꢂꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢀꢁꢍꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢀꢁ0ꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢀꢁꢌꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢀꢁꢍꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢀꢁ0ꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢀꢁꢂꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
0ꢁꢌ ꢀꢁ0 ꢀꢁꢌ ꢂꢁ0 ꢂꢁꢌ ꢎꢁ0 ꢎꢁꢌ ꢈꢁ0
0ꢁꢂ ꢀꢁ0 ꢀꢁꢂ ꢍꢁ0 ꢍꢁꢂ ꢎꢁ0 ꢎꢁꢂ ꢈꢁ0
0ꢁꢍ ꢀꢁ0 ꢀꢁꢍ ꢌꢁ0 ꢌꢁꢍ ꢎꢁ0 ꢎꢁꢍ ꢈꢁ0
ꢛꢄꢜꢝ ꢕꢅRRꢒꢖꢆ ꢘꢜꢚ
ꢛꢄꢜꢝ ꢕꢅRRꢒꢖꢆ ꢘꢜꢚ
ꢛꢄꢜꢝ ꢕꢅRRꢒꢖꢆ ꢘꢜꢚ
ꢈꢏꢌꢎ ꢞ0ꢀ
ꢈꢏꢍꢎ ꢞ0ꢎ
ꢈꢏꢂꢎ ꢞ0ꢍ
Efficiency vs Load Current at
24VIN, Forced Continuous Mode
Efficiency vs Load Current at
3ꢀVIN, Forced Continuous Mode
Efficiency vs Load Current at
48VIN, Forced Continuous Mode
ꢒꢋ
ꢒ0
ꢑꢋ
ꢑ0
ꢐꢋ
ꢐ0
ꢌꢋ
ꢌ0
ꢍ00
ꢑꢂ
ꢑ0
ꢎꢂ
ꢎ0
ꢏꢂ
ꢏ0
ꢐꢂ
ꢐ0
ꢂꢂ
ꢊ00
ꢑꢀ
ꢑ0
ꢏꢀ
ꢏ0
ꢆꢀ
ꢆ0
ꢐꢀ
ꢐ0
ꢀꢀ
ꢎꢇꢂ ꢆ ꢍꢁꢋꢏꢉꢊ
ꢃꢄꢅ
ꢍꢂꢃ ꢇ ꢏꢂ0ꢉꢊꢋ
ꢄꢅꢆ
ꢍꢋꢂ ꢆ ꢍꢁꢇꢏꢉꢊ
ꢃꢄꢅ
ꢋꢎꢁ ꢅ ꢊꢌꢋꢍꢈꢉ
ꢂꢃꢄ
ꢒꢌꢒꢁ ꢅ ꢎ00ꢇꢈꢉ
ꢂꢃꢄ
ꢍꢀꢃ ꢇ ꢎ00ꢉꢊꢋ
ꢄꢅꢆ
ꢍꢁꢎꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢍꢎꢂ ꢆ ꢍꢁꢎꢏꢉꢊ
ꢃꢄꢅ
ꢊꢀꢁ ꢅ ꢊꢌꢋꢍꢈꢉ
ꢂꢃꢄ
ꢋꢌꢀꢁ ꢅ ꢎ00ꢇꢈꢉ
ꢂꢃꢄ
ꢂꢁ0ꢃ ꢇ ꢂꢂ0ꢉꢊꢋ
ꢄꢅꢆ
ꢍꢁꢂꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢋꢁ0ꢂ ꢆ ꢌ00ꢈꢉꢊ
ꢃꢄꢅ
ꢊꢋꢁ ꢅ ꢊꢌꢊꢍꢈꢉ
ꢂꢃꢄ
ꢀꢁ ꢅ ꢀꢆꢀꢇꢈꢉ
ꢂꢃꢄ
ꢊꢌꢏꢁ ꢅ ꢎ00ꢇꢈꢉ
ꢂꢃꢄ
ꢊꢌꢀꢁ ꢅ ꢎ00ꢇꢈꢉ
ꢂꢃꢄ
ꢌꢁꢌꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢍꢁꢀꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢍꢁ0ꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢀꢁꢀꢂ ꢆ ꢇ00ꢈꢉꢊ
ꢃꢄꢅ
ꢀꢁꢂꢃ ꢇ ꢈ00ꢉꢊꢋ
ꢄꢅꢆ
ꢎꢁꢋꢂ ꢆ ꢇ00ꢈꢉꢊ
ꢃꢄꢅ
0ꢁꢂ ꢍꢁ0 ꢍꢁꢂ ꢀꢁ0 ꢀꢁꢂ ꢌꢁ0 ꢌꢁꢂ ꢈꢁ0
0ꢌꢀ ꢊꢌ0 ꢊꢌꢀ ꢋꢌ0 ꢋꢌꢀ ꢒꢌ0 ꢒꢌꢀ ꢎꢌ0
0ꢁꢋ ꢍꢁ0 ꢍꢁꢋ ꢎꢁ0 ꢎꢁꢋ ꢀꢁ0 ꢀꢁꢋ ꢇꢁ0
ꢛꢄꢜꢝ ꢕꢅRRꢒꢖꢆ ꢘꢜꢚ
ꢜꢂꢝꢞ ꢖꢃRRꢓꢗꢄ ꢙꢝꢛ
ꢜꢃꢝꢞ ꢖꢄRRꢓꢗꢅ ꢙꢝꢛ
ꢇꢌꢋꢀ ꢟ0ꢌ
ꢈꢐꢂꢌ ꢞ0ꢈ
ꢎꢐꢀꢒ ꢟ0ꢀ
3.3V Transient Response, 48VIN
12V Transient Response, 48VIN
1V Transient Response, 24VIN
V
V
V
OUT
OUT
OUT
50mV/DIV
100mV/DIV
50mV/DIV
AC-COUPLED
AC-COUPLED
AC-COUPLED
I
I
I
OUT
2A/DIV
OUT
OUT
2A/DIV
2A/DIV
4653 G07
4653 G08
4653 G09
40µs/DIV
FIGURE 30 CIRCUIT, 48V
40µs/DIV
FIGURE 30 CIRCUIT, 48V
40µs/DIV
FIGURE 30 CIRCUIT, 24V
,
,
,
IN
IN
IN
C
= C = 4.7µF, C
= 2 x 100µF,
C
= C = 4.7µF, C
= 2 x 22µF,
C
= C = 4.7µF, C
= 3 x 100µF,
INH
fSET
D
OUT
INH
fSET
D
OUT
INH
fSET
D
OUT
R
C
= N/A, R
= 66.5kΩ,
R
C
= 124k, R
= 240kΩ,
R
C
= N/A, R
= 20kΩ,
ISET
ISET
ISET
= 10nF, R = 604Ω,
= 10nF, R = 562Ω,
= 6.8nF, R = 681Ω,
TH TH
TH
R
TH
TH
R
TH
= N/A, C
= N/A,
= 49.9Ω, C
= 1µF,
R
= N/A, C
= N/A,
EXTVCC
EXTVCC
EXTVCC
EXTVCC
EXTVCC
EXTVCC
2A to 4A LOAD STEP AT 2A/µs
2A to 4A LOAD STEP AT 2A/µs
2A to 4A LOAD STEP AT 2A/µs
Rev 0
6
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LTM4653
TA = 25°C, unless otherwise noted.
TYPICAL PERFORMANCE CHARACTERISTICS
Start-Up, No Load
Start-Up, 4A Load
Start-Up, Pre-Bias
RUN
2V/DIV
RUN
2V/DIV
RUN
2V/DIV
V
OUT
5V/DIV
V
V
OUT
5V/DIV
OUT
5V/DIV
I
DIODE
1mA/DIV
PGOOD
2V/DIV
PGOOD
2V/DIV
PGOOD
2V/DIV
4653 G10
4653 G11
4653 G12
2ms/DIV
2ms/DIV
2ms/DIV
FIGURE 30 CIRCUIT, 48V
,
FIGURE 30 CIRCUIT, 48V ,
IN
FIGURE 30 CIRCUIT, 48V
,
IN
IN
C
= C = 4.7µF, C
= 2 x 22µF,
C
= C = 4.7µF, C
= 2 x 22µF,
OUT
C
= C = 4.7µF, C
= 2 x 22µF,
OUT
INH
D
OUT
INH
D
INH
D
R
R
C
= 124k, R
= 240kΩ,
R
R
C
= 124k, R
= 240kΩ,
R
R
C
= 124k, R
= 240kΩ,
fSET
PGDFB
= 10nF, R = 562Ω,
ISET
fSET
ISET
fSET
PGDFB
ISET
= 95.3kΩ,
= 95.3kΩ,
PGDFB
= 95.3kΩ,
= 10nF, R = 562Ω,
TH TH
= 10nF, R = 562Ω,
TH
TH
R
TH
TH
= 49.9Ω, C
= 1µF,
R
= 49.9Ω, C
= 1µF,
EXTVCC
R
= 49.9Ω, C
PRE-BIASED TO 5V
= 1µF,
EXTVCC
EXTVCC
NO LOAD
EXTVCC
EXTVCC
EXTVCC
3Ω RESISTIVE LOAD
V
OUT
THROUGH 1N4148 DIODE
Short Circuit, No Load
Short Circuit, 4A Load
V
OUT
V
OUT
5V/DIV
5V/DIV
I
IN
I
IN
1A/DIV
1A/DIV
4653 G13
4653 G14
10µs/DIV
10µs/DIV
FIGURE 30 CIRCUIT, 48V
,
FIGURE 30 CIRCUIT, 48V ,
IN
IN
C
= C = 4.7µF, C
= 2 x 22µF,
C
= C = 4.7µF, C
= 2 x 22µF,
INH
fSET
D
OUT
INH
fSET
D
OUT
R
R
= 124k, R
= 240kΩ,
R
R
= 124k, R
= 240kΩ,
ISET
ISET
= 95.3kΩ,
= 95.3kΩ,
PGDFB
TH
EXTVCC
PGDFB
TH TH
EXTVCC
C
R
= 10nF, R = 562Ω,
C
R
= 10nF, R = 562Ω,
TH
= 49.9Ω, C
= 1µF,
= 49.9Ω, C
= 1µF,
EXTVCC
EXTVCC
NO LOAD PRIOR TO APPLICATION
OF OUTPUT SHORT-CIRCUIT
3Ω RESISTIVE LOAD PRIOR TO
APPLICATION OF OUTPUT
SHORT-CIRCUIT
Rev 0
7
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LTM4653
PIN FUNCTIONS
PACKAGE ROW AND COLUMN LABELING MAY VARY
RUN (F4): Run Control Pin. A voltage above 1.2V com-
mands the Module to regulate its output voltage. Under-
voltagelockout(UVLO)canbeimplementedbyconnecting
RUN to the midpoint node formed by a resistor-divider
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY.
V
(A1-A3, B3): Power Input Pins. Apply input voltage
IN
and input decoupling capacitance directly between VIN
betweenV andGND. RUNfeatures130mVofhysteresis.
IN
and a ground (PGND) plane.
See the Applications Information section.
V (A4, B4, C4): Drain of the Converter’s Primary Switch-
D
INTV (G3): Internal Regulator, 3.3V Nominal Output.
CC
ing MOSFET. Apply at minimum one 4.7µF high frequency
Internal control circuits and MOSFET-drivers derive pow-
ceramic decoupling capacitor directly from V to PGND.
D
er from INTV bias. When operating 3.1V < SV ≤ 58V,
CC
IN
Give this capacitor higher layout priority (closer proximity
an LDO generates INTV from SV when RUN is logic
CC
IN
to the module) than any V decoupling capacitors.
IN
high (RUN > 1.2V). No external decoupling is required.
When RUN is logic low (RUN - GND < 1.2V), the INTV
CC
SV (C3): Input Voltage Supply for Small-Signal Circuits.
IN
LDO is off, i.e., INTV is unregulated. (Also see EXTV .)
CC
CC
SV is the input to the INTV LDO. Connect SV directly
IN
CC
IN
to V . No decoupling capacitor is needed on this pin.
IN
EXTV (F3): External Bias, Auxiliary Input to the INTV
CC
CC
Regulator. When EXTV exceeds 3.2V and SV exceeds
CC
IN
PGND (A5, B5, C5, D5, E5, F5, G4-5, H3, H5, J3-5, K4-
5, L4-5): Power Ground Pins of the LTM4653. Connect
all pins to the application’s PGND plane.
5V, the INTV LDO derives power from EXTV bias
CC
CC
instead of the SV path. This technique can reduce LDO
IN
losses considerably, resulting in a corresponding reduc-
V
(K1-3, L1-3): Power Output Pins of the LTM4653.
OUT
tion in module junction temperature. For applications in
Connectallpinstotheapplication’spowerV plane.Apply
OUT
which4V≤V ≤26.5V,connectEXTV toV through
OUT
OUT
CC
the output filter capacitors and the output load between
a power V
a resistor. (See the Applications Information section for
plane and the application’s PGND plane.
OUT
resistor value.) When taking advantage of this EXTV
CC
feature, locally decouple EXTV to PGND with a 1µF ce-
GND (D4): Ground Pin of the LTM4653. Electrically con-
nect to the application’s PGND plane.
CC
ramic—otherwise, leave EXTV open circuit.
CC
ISETb (F1): 1.5nF Soft-Start Capacitor. Connect ISETb
to ISETa to achieve default soft-start characteristics, if
desired. See ISETa.
V
(G1,H1):OutputVoltageSenseandFeedbackSignal.
OSNS
Connect V
to V
at the point of load (POL). Pins G1
OSNS
OUT
and H1 are electrically connected to each other internal to
the module, and thus it is only necessary to connect one
V
can be used for redundant connectivity or routed to an ICT
test point for design-for-test considerations, as desired.
ISETa (F2): Accurate 50μA Current Source. Positive input
pin to V
at the POL. The remaining V
pin
OSNS
OUT
OSNS
to the error amplifier. Connect a resistor (R ) from this
ISET
pintoSGNDtoprogramthedesiredLTM4653outputvolt-
age, V
= R
• 50μA. A capacitor can be connected
OUT
ISET
from ISETa to SGND to soft-start the output voltage and
reduce start-up inrush current. Connect ISETa to ISETb in
order to achieve default soft-start, if desired. (See ISETb.)
SGND (E4, G2, H2): Signal Ground Pins of the LTM4653.
Connect Pin H2 to PGND directly under the LTM4653. The
SGND pins at locations E4 and G2 are electrically con-
nected to each other internal to the module, and thus it is
only necessary to connect one SGND pin to PGND under
the module. The remaining SGND pins can be used for
redundant connectivity or routed to an ICT test point for
design-for-test considerations, as desired.
In addition, the output of the LTM4653 can track a voltage
applied between the ISETa pin and the SGND pins. (See
the Applications Information section.)
Rev 0
8
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LTM4653
PIN FUNCTIONS
PGOOD (D1): Power Good Indicator, Open-Drain Output
Pin. PGOOD is high impedance when PGDFB is within
approximately 7.5% of 0.6V. PGOOD is pulled to GND
when PGDFB is outside this range.
default loop compensation. Loop compensation (a series
resistor-capacitor) can be applied externally to COMPa if
desired or needed, instead. (See COMPb.)
COMPb (E1): Internal Loop Compensation Network. For
mostapplications,theinternal,defaultloopcompensation
of the LTM4653 is suitable to apply “as is”, and yields very
satisfactoryresults:applythedefaultloopcompensationto
the control loop by simply connecting COMPa to COMPb.
When more specialized applications require a personal
touch to the optimization of control loop response, this
can be accomplished by connecting a series resistor-
capacitor network from COMPa to SGND—and leaving
COMPb open circuit.
PGDFB (D2): Power Good Feedback Programming Pin.
Connect PGDFB to V
PGDFB
through a resistor, R
.
OSNS
PGDFB
forwhich
R
configuresthevoltagethresholdofV
OUT
PGOOD toggles its state. If the PGOOD feature is used,
set R
to:
PGDFB
⎛
⎞
V
OUT
R
=
– 1 • 4.99k
⎟
⎜
PGDFB
⎝
⎠
0.6V
otherwise, leave PGDFB open circuit.
A small filter capacitor (220pF) internal to the LTM4653
on this pin provides high frequency noise immunity for
the PGOOD output indicator.
VINREG (D3): Input Voltage Regulation Programming
Pin. Optionally connect this pin to the midpoint node
formed by a resistor-divider between V and SGND. When
D
the voltage on VINREG falls below approximately 2V, a
f
(E3): Oscillator Frequency Programming Pin. The
SET
VINREG control loop servos V
to decrease the power
OUT
default switching frequency of the LTM4653 is 400kHz.
inductor current and thus regulate VINREG at 2V. (See
the Applications Information section.)
Often, it is necessary to increase the programmed fre-
quency by connecting a resistor between f and SGND.
SET
(See the Applications Information section.) Note that the
If this input voltage regulation feature is not desired, con-
synchronization range of CLKIN is approximately 40%
nect VINREG to INTV .
CC
of the oscillator frequency programmed by the f pin.
SET
IMONa (C2): Power InductorCurrentAnalog IndicatorPin
and Current Limit Programming Pin. The current flowing
out of this pin is equal to 1/40,000 of the average power
CLKIN (B1): Mode Select and Oscillator Synchronization
Input. Leave CLKIN open circuit for forced continuous
mode operation. Alternatively, this pin can be driven to
synchronize the switching frequency of the LTM4653 to
a clock signal. In this condition, the LTM4653 operates
in forced continuous mode and the cycle-by-cycle turn-
inductor current. To construct a voltage (V
) that is
IMONa
proportional to the power inductor current, optionally
apply a parallel resistor-capacitor network to this pin and
terminate it to SGND.
on of the primary power MOSFET M is coincident with
T
IMONa can be connected to IMONb if the default resis-
tor-capacitor termination network provided by IMONb is
desired: 1V at full scale (4A) load current. (See IMONb.)
If this analog indicator feature is not desired, connect
IMONa to SGND.
the rising edge of the clock applied to CLKIN. Note the
synchronization range of CLKIN is approximately 40%
of the oscillator frequency programmed by the f
(See the Applications Information section.)
pin.
SET
COMPa (E2): Current Control Threshold and Error Ampli-
fier Compensation Node. The trip threshold of LTM4653’s
current comparator increases with a corresponding rise
in COMPa voltage. A small filter cap (10pF) internal to the
LTM4653 on this pin introduces a high-frequency roll-
off of the error-amplifier response, yielding good noise
rejection in the control-loop. COMPa is often electrically
connected to COMPb in one’s application, thus applying
If IMONa ever exceeds a trip threshold of approximately
2V, an IMON control loop servos V
to decrease power
OUT
inductor current and thus regulate IMONa at 2V. In this
manner, the average current limit inception threshold of
the LTM4653 can be configured. (See the Applications
Information section.)
Rev 0
9
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LTM4653
PIN FUNCTIONS
IMONb(C1):PowerInductorAnalogIndicatorCurrentDe-
fault Termination R-C Network. A 10kΩ resistor in parallel
with a 10nF capacitor and terminating to SGND connect
to this pin. Connect IMONb to IMONa to achieve default
power inductor analog indicator current characteristics:
1V at full scale (4A) load current. (See IMONa.)
TEMP– (J2, J6): Temperature Sensor, Negative Input.
Collector and base of a 2N3906-genre PNP bipolar junc-
tion transistor (BJT). Optionally interface to temperature
monitoringcircuitrysuchasLTC2997,LTC2990,LTC2974
or LTC2975. Otherwise leave electrically open. Pins J2
and J7 are electrically connected together internal to the
LTM4653, and thus it is only necessary to connect one
TEMP– pin to monitoring circuitry. The remaining TEMP–
pin can be used for redundant connectivity or routed to an
ICTtestpointfordesign-for-testconsiderations,asdesired.
TEMP+ (J1, Jꢀ): Temperature Sensor, Positive Input.
Emitter of a 2N3906-genre PNP bipolar junction transis-
tor (BJT). Optionally interface to temperature monitor-
ing circuitry such as LTC®2997, LTC2990, LTC2974 or
LTC2975.Otherwiseleaveelectricallyopen.PinsJ1andJ6
areelectricallyconnectedtogetherinternaltotheLTM4653,
and thus it is only necessary to connect one TEMP+ pin
to monitoring circuitry. The remaining TEMP+ pin can be
used for redundant connectivity or routed to an ICT test
point for design-for-test considerations, as desired.
SW (H4): Switching Node of Switching Converter Stage.
Used for test purposes. May be routed a short distance
with a thin trace to a local test point to monitor switching
actionoftheconverter, ifdesired, butdonotroutenearany
sensitivesignals;otherwise,leaveelectricallyopencircuit.
NC (Aꢀ-6, B2, Bꢀ-6, Cꢀ-6, Dꢀ-6, Eꢀ-6, Fꢀ-6, Gꢀ-6, Hꢀ-6,
Kꢀ-6, Lꢀ-6): No connect pins, i.e., pins with no internal
connection. The NC pins predominantly serve to provide
improved mounting of the module to the board. In one’s
layout, NC pinsare permitted to remain electricallyuncon-
nected or can be connected as desired, e.g., connected
to a GND plane for heat-spreading purposes and/or to
facilitate routing.
Rev 0
10
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LTM4653
SIMPLIFIED BLOCK DIAGRAM
Rev 0
11
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LTM4653
TEST CIRCUIT
V
24V
UP TO 4A
,
IN
OUT
NC
SW
V
V
OSNS
IN
OUT
28V TO 58V
C
4.7μF
INH
V
SV
+
IN
C
68µF
C
27µF
OUTL
OUTH
LOAD
RUN
GND
SGND
PGND
CLKIN
LTM4653
V
R
PGDFB
196k
D
C
D
4.7μF
x2
INTV
CC
PGDFB
PGOOD
CC
TEMP+
TEMP–
IMONa
IMONb
VINREG
COMPa
EXTV
C
TH
0.1μF
COMPb
R
TH
f
SET
499Ω
ISETa ISETb
4653 TC01
R
57.6k
R
ISET
480k
fSET
TA = 25°C. Refer to Test Circuit
CONDITIONS
DECOUPLING REQUIREMENTS
APPLICATION SYMBOL PARAMETER
MIN
TYP
MAX
UNITS
Test Circuit
C , C
INH
External High Frequency Input Capacitor Requirement,
28V ≤ V ≤ 58V, V = 24V
I
= 4A
9.4
µF
D
OUT
IN
OUT
C
External High Frequency Output Capacitor Requirement
28V ≤ V ≤ 58V, V = 24V
I
= 4A
22
µF
OUTH
OUT
IN
OUT
Rev 0
12
For more information www.analog.com
LTM4653
OPERATION
Power Module Description
IMONaisananalogoutputcurrentindicatorpin.Itsources
a current proportional to the LTM4653’s load current.
When IMONa is electrically connected to IMONb, the
voltage on the IMONa/IMONb node is proportional to load
current—with 1V corresponding to 4A load. IMONa can
be interfaced to an external parallel-RC network instead
of the one provided by IMONb. If IMONa ever exceeds 2V,
a servo loop reduces the LTM4653’s output current in
order to keep IMONa at or below 2V. Through this servo
mechanism, a parallel RC network can be connected to
IMONa to implement an average current limit function—if
desired. When the feature is not needed, connect IMONa
to SGND.
The LTM4653 is a non-isolated switch mode DC/DC step-
down power supply. It can provide up to 4A output current
with a few external input and output capacitors. Set by a
single resistor, R , the LTM4653 regulates a positive
ISET
output voltage, V . V
can be set to as low as 0.5V to
OUT OUT
ashighas0.94V . TheLTM4653operatesfromapositive
IN
input supply rail, V , between 3.1V and 58V. The typical
IN
application schematic is shown in Figure 30.
The LTM4653 contains an integrated constant-frequency
current mode regulator, power MOSFETs, power inductor,
EMI filter and other supporting discrete components. The
nominal switching frequency range is from 400kHz to
3MHz, and the default operating frequency is 400kHz. It
can be externally synchronized to a clock, from 250kHz
to 3MHz. See the Applications Information section. The
LTM4653 supports internal and external control loop
compensation. Internal loop compensation is selected by
connecting the COMPa and COMPb pins. Using internal
loop compensation, the LTM4653 has sufficient stability
margins and good transient performance with a wide
range of output capacitors—even ceramic-only output
capacitors. For external loop compensation, see the
ApplicationsInformationsection.LTpowerCAD® isavailable
for transient load step and stability analysis. Input filter
and noise cancellation circuitry reduces noise-coupling to
the module’s inputs and outputs, ensuring the module’s
electromagnetic interference (EMI) meets the limits of
EN55022 Class B (see Figures 4 to 6).
The LTM4653 also features a spare control pin called
VINREG, with a 2V servo threshold, which can be used
to reduce the input current draw during input line sag
(“brownout”)conditions.ConnectVINREGtoINTV when
CC
this feature is not needed.
TEMP+ and TEMP– pins give access to a diode-con-
nected PNP transistor, making it possible to monitor the
LTM4653’s internal temperature—if desired.
External component selection is primarily determined by
the maximum load current and output voltage. Refer to
Table 7 and the Test Circuit for recommended external
component values.
V to V
Step-Down Ratios
IN
OUT
There are restrictions on the V to V
step-down ratio
IN
OUT
that the LTM4653 can achieve. The maximum duty cycle
of the LTM4653 is 96% typical. The V to V mini-
Pulling the RUN pin below 1.2V forces the LTM4653 into
a shutdown state. A capacitor can be applied from ISETa
to SGND to program the output voltage ramp-rate; or,
the default LTM4653 ramp-rate can be set by connecting
ISETa to ISETb; or, voltage tracking can be implemented
by interfacing rail voltages to the ISETa pin. See the
Applications Information section.
IN
OUT
mum dropout voltage is a function of load current when
operating in high duty cycle applications. As an example,
V
from the Electrical Characteristics table high-
OUT(24VDC)
lights the LTM4653’s ability to regulate 24V
at up to
OUT
4A from 28V , when running at a switching frequency,
IN
f
SW
, of 1.5MHz.
Multiphase operation can be employed by applying an
external clock source to the LTM4653’s synchronization
input, the CLKIN pin. See the Typical Applications section.
At very low duty cycles, the LTM4653’s on-time of M
T
each switching cycle should be designed to exceed the
LTM4653 control loop’s specified minimum on-time of
60ns, t
D
, (guardband to 90ns), i.e.:
LDO losses within the module are reduced by connecting
ON(MIN)
EXTV to V
through an RC-filter or by connecting
CC
OUT
> T
ON(MIN)
EXTV to a suitable voltage source.
CC
f
SW
Rev 0
13
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LTM4653
OPERATION
where D (unitless) is the duty-cycle of M , given by:
effectsduringoutputloadchanges.Thebulkcapacitorcan
be a switcher-rated aluminum electrolytic capacitor or a
T
V
OUT
D =
Polymer capacitor. Suggested values for C and C are
D
INH
V
IN
found in Table 7.
A final precaution regarding ceramic capacitors concerns
the maximum input voltage rating of the LTM4653’s V ,
In rare cases where the minimum on-time restriction is
violated, the frequency of the LTM4653 automatically and
graduallyfoldsbackdowntoapproximatelyone-fifthofits
IN
SV ,andV pins.Aceramicinputcapacitorcombinedwith
IN
D
programmed switching frequency to allow V
to remain
OUT
trace or cable inductance forms a high Q (underdamped)
tank circuit. If the LTM4653 circuit is plugged into a live
supply, the input voltage can ring to twice its nominal
value, possibly exceeding the device’s rating. This situa-
tioniseasilyavoided;seetheHot-PluggingSafelysection.
in regulation. See the Frequency Adjustment section. Be
remindedofNotes2,3and5intheElectricalCharacteristics
section regarding output current guidelines.
Input Capacitors
TheLTM4653achieveslowinputconductedEMInoisedue
to tight layout and high-frequency bypassing of MOSFETs
Output Capacitors
Output capacitors C
theLTM4653.SufficientcapacitanceandlowESRarecalled
for, to meet the output voltage ripple, loop stability, and
transient requirements. C
or polymer capacitor. C
typical output capacitance is 22μF (type X5R material, or
better), if ceramic-only output capacitors are used.
and C
are applied to V
of
OUTH
OUTL
OUT
M and M within the module itself. A small filter inductor
T
B
(400nH) is integrated in the input line (from V to V ),
IN
D
providing further noise attenuation—again, local to the
switching MOSFETs. The V and V pins are available
can be a low ESR tantalum
OUTL
D
IN
is a ceramic capacitor. The
OUTH
for external input capacitors—C and C —to form a
D
INH
high-frequency π filter. As shown in the Simplified Block
Diagram, the ceramic capacitor C on the LTM4653’s V
D
D
pins handles the majority of the RMS current into the DC/
DC converter power stage and requires careful selection,
for that reason.
Table 7 shows a matrix of suggested output capacitors
optimized for 2A transient step-loads applied at 2A/μs.
Additional output filtering may be required by the system
designer, if further reduction of output ripple or dynamic
transientspikeisrequired. TheLTpowerCADdesigntoolis
availablefortransientandstabilityanalysis.Stabilitycriteria
are considered in the Table 7 matrix, and LTpowerCAD is
available for stability analysis. Multiphase operation will
reduce effective output ripple as a function of the num-
ber of phases. Application Note 77 discusses this noise
reduction versus output ripple current cancellation, but
the output capacitance should be considered carefully as
afunctionofstabilityandtransientresponse.LTpowerCAD
can be used to calculate the output ripple reduction as the
number of implemented phases increases by N times.
External loop compensation can be applied to COMPa if
needed, for transient response optimization.
See Figures 4 to 6 for demonstration of LTM4653’s EMI
performance,meetingtheradiatedemissionsrequirements
of EN55022B.
The input capacitance, C , is needed to filter the pulsed
D
current drawn by M . To prevent excessive voltage sag
T
on V , a low-effective series resistance (low-ESR, such
D
as an X7R ceramic) input capacitor should be used, sized
appropriately for the maximum C RMS ripple current:
D
I
OUT(MAX)
I
=
• D • (1–D)
CD(RMS)
η%
whereη%istheestimatedefficiencyofthepowermodule.
(See Typical Performance Characteristics graphs.)
Forced Continuous Operation
Several capacitors may be paralleled to meet the applica-
LeavetheCLKINpinopencircuittocommandtheLTM4653
for forced continuous operation. In this mode, the control
loop is allowed to command the inductor peak current to
Rev 0
tion’stargetsize,height,andC RMSripplecurrentrating.
D
For lower input voltage applications, sufficient bulk input
capacitance is needed to counteract line sag and transient
14
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LTM4653
OPERATION
approximately –1A, allowing for significant negative aver-
age current. Clocking the CLKIN pin at a frequency within
40% of the target switching frequency commanded by
Frequency Adjustment
The default switching frequency (f ) of the LTM4653
SW
is 400kHz. This is suitable for low-V (V ≤ 5V) ap-
IN
IN
the f pin synchronizes M ’s turn-on to the rising edge
SET
T
plications and low-V
(V ≤3.3V) applications. For a
OUT OUT
of the CLKIN pin.
practical design, the LTM4653’s inductor ripple current
(∆I ) is suggested to be less than ~2A . Choose
PK-PK
PK-PK
Output Voltage Programming, Tracking and Soft-Start
f
according to:
SW
The LTM4653 regulates its output voltage, V , accord-
OUT
V
• 1− D
(
)
OUT
ing to the differential voltage present across ISETa and
f
=
SW
L • ∆I
PK-PK
SGND. In most applications, the output voltage is set by
simply connecting a resistor, R , from ISETa to SGND,
ISET
where the value of LTM4653’s power inductor, L, is 4μH.
according to:
To avoid cycle-skipping, impose restrictions on f , to
SW
V
OUT
R
=
ensure minimum on time criteria is met:
ISET
50µA
D
f
<
SW
Since the LTM4653 control loop servos its output volt-
age according to the voltage between ISETa and SGND:
T
ON(MIN)
placing a capacitor, C , parallel to R
configures the
SS
SET
The LTM4653’s minimum on-time, t
, is specified
ON(MIN)
ramp-up rate of ISETa and thus V . In the time domain,
OUT
as 60ns. For a practical design, it is recommended to
guardband to 90ns.
the output voltage ramp-up after the RUN pin is toggled
from low to high (t = 0s) is given by:
ToconfiguretheLTM4653forahigherswitchingfrequency
t
⎛
⎞
⎟
–
than its default of 400kHz, apply a resistor, R , between
fSET
⎜
RISET • CSS
V
(t)=I
•R
• 1– e
the f pin and SGND. R
is given (in MΩ) by:
OUT
ISETa
ISET
⎜
⎜
⎟
SET
fSET
⎟
⎝
⎠
1
R
(MΩ)=
fSET
10pF •[f (MHz)– 0.4(MHz)]
The soft-start time, t , is defined as the time it takes for
SS
SW
V
to ramp from 0V to 90% of its final value:
OUT
The relationship of R
to programmed f is shown
SW
fSET
t
t
= –R
•C •In (1– 0.9)
SS
ISET
SS
in Figure 1. See Table 7 for recommended f and cor-
SW
or
responding R
values for various combinations of V
fSET
IN
= 2.3 • R
•C
SS
ISET
SS
and V
.
OUT
ꢀ0
A default value of C = 1.5nF can be implemented by
SS
connecting ISETa to ISETb. For other ramp-up rates,
connect an external C capacitor parallel to R . When
SS
ISET
starting up into a pre-biased V , the LTM4653 stays in
OUT
a sleep mode, keeping M and M off until V equals
T
B
ISETa
Rꢀ
ꢄꢅꢃ ꢆꢁꢂꢇ
ꢀ
ꢁꢂꢃ
V
—after which, the DC/DC converter commences
OSNS
switching action and V
is ramped according to the
OUT
voltage commanded by ISETa.
Since the LTM4653 control loop servos its V
voltage
OSNS
0ꢀꢁ
to match that of ISETa’s, the LTM4653’s output can be
configured to track any voltage applied to ISETa, refer-
enced to SGND.
ꢀ0
ꢀ00
ꢀꢁ
(kΩ)
ꢀ0ꢁ
Rf
SET
ꢀꢁꢂꢃ ꢄ0ꢅ
Figure 1. Relationship Between RfSET and Target fSW
Rev 0
15
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LTM4653
APPLICATIONS INFORMATION
Power Module Protection
ꢆ
ꢇꢀꢂꢂꢈꢉ
R
R
ꢄ
TheLTM4653’scurrentmodecontrolarchitectureprovides
fastcycle-by-cyclecurrentlimitinanovercurrentcondition,
as shown in the Typical Performance Characteristics sec-
tion. If the output voltage collapses sufficiently due to an
overload or short-circuit condition, minimum on-time will
be violated and the internal oscillator will then fold-back
automatically to one-fifth of the LTM4653’s programmed
switchingfrequency—therebyreducingtheoutputcurrent
and affording the load a chance to recover.
Rꢀꢁ ꢂꢃꢁ
ꢅ
ꢊꢋꢌꢍ ꢎ0ꢏ
Figure 2. Undervoltage Lockout Resistive Divider
from falsely tripping UVLO. Resistors are chosen by first
selecting R (refer to Figure 2). Then:
B
TheLTM4653featuresinputovervoltageshutdownprotec-
tion: when V > 68V, switching action ceases (with 4V of
IN
⎛
⎜
⎝
⎞
V
IN(ON)
hysteresis)—however, be advised that this protection is
onlyactiveoutsidetheLTM4653’ssafeoperatingarea(see
Note 1 and Note 4 of the Electrical Characteristics table).
R =R •
– 1
⎟
⎠
A
B
1.2V
where V
is the input voltage at which the undervolt-
IN(ON)
The LTM4653 ceases switching action if internal tempera-
tures exceed 165°C. The control IC resumes operation
after a 10°C cool-down hysteresis. Note that these typical
parameters are based on measurements in a lab oven and
arenotproductiontested.Thisovertemperatureprotection
is intended to protect the device during momentary over-
loadconditions.Themaximumratedjunctiontemperature
will be exceeded when this overtemperature protection is
active. Continuous operation above the specified absolute
maximum operating junction temperature may impair
device reliability or permanently damage the device.
age lockout is overcome and the supply turns on. R may
A
be replaced with a hardwired connection from V to RUN.
D
The V turn-off voltage, V
is given by:
IN
IN(OFF)
⎛
⎜
⎝
⎞
R
R
A
B
V
= 1.07V •
+1
⎟
IN(OFF)
⎠
IfUVLOisnotneeded,RUNcanbeconnectedtoLTM4653’s
V or V pins.
D
IN
When RUN is below its threshold, UVLO is engaged, M
T
and M are turned off, INTV ceases to be regulated, and
B
CC
ISETa is discharged to SGND by internal circuitry.
The LTM4653 does not feature any specialized output
overvoltage protection beyond what is inherent to the
control loop’s servo mechanism.
Loop Compensation
External loop compensation may be preferred for some
applications and can be implemented easily, as follows:
RUN Pin Enable
leave COMPb open circuit; connect a series-R network
C
The RUN pin is used to enable the power module or se-
quencethepowermodule. Thethresholdis1.2V. TheRUN
pincanbeusedtoprovideanundervoltagelockout(UVLO)
function by connecting a resistor divider from the input
supply to the RUN pin, as shown in Figure 2. Undervoltage
lockout keeps the LTM4653 in shutdown until the supply
input voltage is above a certain voltage programmed by
the user. The RUN pin hysteresis voltage prevents noise
(R and C ) from COMPa to SGND; in some instances,
TH
TH
connect a capacitor (C ) from COMPa to SGND (paral-
THP
leling the R
series-RC network). See Table 7 for
TH-CTH
suggested input and output capacitances for a variety of
operatingconditions.Additionally,theLTpowerCADdesign
tool is available for transient and stability analysis.
Rev 0
16
For more information www.analog.com
LTM4653
APPLICATIONS INFORMATION
Hot-Plugging Safely
The recommended value of the resistor between V
and
OUT
EXTV is roughly V
• 4Ω/V. This resistor, R
,
.
The small size, robustness and low impedance of ceramic
capacitors make them an attractive option for the input
CC
OUT
EXTVCC
EXTVCC
²
must be rated to continually dissipate (0.02A) • R
The primary purpose of this resistor is to prevent EXTV
bypasscapacitors(C andC )oftheLTM4653.However,
CC
D
INH
overstress under a fault condition. For example, when an
these capacitors can cause problems if the LTM4653 is
plugged into a live supply (see Linear Technology Ap-
plication Note 88 for a complete discussion). The low
loss ceramic capacitor combined with stray inductance
in series with the power source forms an under damped
inductive short-circuit is applied to the module’s output,
V
OUT
may be briefly dragged below PGND—forward bias-
ing the PGND-to-EXTV body diode. This resistor limits
CC
the magnitude of current flow in EXTV . Bypass EXTV
CC
CC
with 1μF of X5R (or better) MLCC.
tank circuit, and the voltage at the V pin of the LTM4653
IN
can ring to twice the nominal input voltage, possibly ex-
ceeding the LTM4653’s rating and damaging the part. If
the input supply is poorly controlled or the user will be
plugging the LTM4653 into an energized supply, the input
network should be designed to prevent this overshoot by
introducing a damping element into the path of current
flow. This is often done by adding an inexpensive elec-
Multiphase Operation
Multiple LTM4653 devices can be paralleled for higher
output current applications. For lowest input and output
voltage and current ripples, it is advisable to synchronize
paralleled LTM4653s to an external clock (within 40%
of the target switching frequency set by f —see Test
SET
trolytic bulk capacitor (C ) across the input terminals
Circuit 1). See Figure 32 for an example of a synchroniz-
INL
of the LTM4653. The selection criteria for C calls for:
ing circuit.
INL
an ESR high enough to damp the ringing; a capacitance
LTM4653modulescanbeparalleledwithoutsynchronizing
circuits:justbeawarethatsomebeat-frequencyripplewill
bepresentintheoutputvoltageandreflectedinputcurrent
by virtue of the fact that such modules are not operating
at identical, synchronized switching frequencies.
value several times larger than C . C does not need
INH INL
to be located physically close to the LTM4653; it should
be located close to the application board’s input connec-
tor, instead.
INTV and EXTV Connection
The LTM4653 device is an inherently current mode con-
trolled device, so parallel modules will have good current
sharing’s shown in Figure 33. This helps balance the
thermals on the design.
CC
CC
When RUN is logic high, an internal low dropout regula-
tor regulates an internal supply, INTV , that powers the
CC
controlcircuitryfordrivingLTM4653’sinternalMOSFETs.
INTV isregulatedat3.3V.Inthismanner,theLTM4653’s
To parallel LTM4653s, connect the respective COMPa,
CC
INTV is directly powered from SV , by default. The gate
ISETa, and V
pins of each LTM4653 together to share
CC
IN
OSNS
driver current through the LDO is about 20mA for a typical
1MHz application. The internal LDO power dissipation can
be calculated as:
the current evenly. In addition, tie the respective RUN
pins of paralleled LTM4653 devices together, to ensure
proper start-up and shutdown behavior. Figure 32 shows
a schematic of LTM4653 devices operating in parallel.
PLDO _ LOSS(INTVCC) = 20mA •(SVIN – 3V)
Note that for parallel applications, V
can be set by a
OUT
The LDO draws current off of EXTV instead of SV
CC
IN
single, common resistor on the ISETa net:
when EXTV is higher than 3.2V and SV is above 5V.
CC
IN
For output voltages of 4V and higher, EXTV can be con-
CC
V
OUT
R
=
ISET
nectedtoV
throughanRC-filter.WhentheinternalLDO
OUT
50µA •N
derives power from EXTV instead of SV , the internal
CC
IN
where N is the number of LTM4653 modules in parallel
configuration.
LDO power dissipation is:
PLDO _ LOSS(EXTVCC) = 20mA •(VOUT −3V)
Rev 0
17
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LTM4653
APPLICATIONS INFORMATION
Manydesignersmayopttouselaboratoryequipmentanda
testvehiclesuchasthedemoboardtopredicttheµModule
regulator’s thermal performance in their application at
various electrical and environmental operating conditions
to compliment any FEA activities. Without FEA software,
the thermal resistances reported in the Pin Configuration
sectionare, inandofthemselves, notrelevanttoproviding
guidance of thermal performance; instead, the derating
curves provided in this data sheet can be used in a man-
ner that yields insight and guidance pertaining to one’s
application-usage,andcanbeadaptedtocorrelatethermal
performance to one’s own application.
Depending on the duty cycle of operation, the output volt-
age ripple achieved by paralleled, synchronized LTM4653
modulesmaybeconsiderablysmallerthanwhatisyielded
by a single-phase solution. Application Note 77 provides
a detailed explanation of multiphase operation (relevant
to parallel LTM4653 applications) pertaining to noise
reduction and output and input ripple current cancella-
tion. Regardless of ripple current cancellation, it remains
importantfortheoutputcapacitanceofparalleledLTM4653
applications to be designed for loop stability and transient
response. LTpowerCAD is available for such analysis.
Figure 3 illustrates the RMS ripple current reduction as
a function of the number of interleaved (paralleled and
synchronized) LTM4653 modules—derived from Ap-
plication Note 77.
The Pin Configuration section gives four thermal coeffi-
cients explicitly defined in JESD51-12; these coefficients
are quoted or paraphrased below:
1. θ , the thermal resistance from junction to ambient, is
JA
Radiated EMI Noise
the natural convection junction-to-ambient air thermal
resistance measured in a one cubic foot sealed enclo-
sure. This environment is sometimes referred to as
“still air” although natural convection causes the air to
move. This value is determined with the part mounted
toaJESD51-9definedtestboard,whichdoesnotreflect
an actual application or viable operating condition.
The generation of radiated EMI noise is an inherent disad-
vantageofswitchingregulators.Fastswitchingturn-onand
turn-off of the power MOSFETs—necessary for achieving
high efficiency—create high-frequency (~30MHz+) ∆l/∆t
changes within DC/DC converters. This activity tends to
be the dominant source of high-frequency EMI radiation
in such systems. The high level of device integration
within LTM4653—including optimized gate-driver and
critical front-end � filter inductor—delivers low radiated
EMI noise performance. Figures 4 to 6 show typical ex-
amples of LTM4653 meeting the radiated emission limits
established by EN55022 Class B.
2. θ
, the thermal resistance from junction to the
JCbottom
bottom of the product case, is determined with all of
the component power dissipation flowing through the
bottomofthepackage.InthetypicalµModuleregulator,
the bulk of the heat flows out the bottom of the pack-
age, but there is always heat flow out into the ambient
environment. As a result, this thermal resistance value
may be useful for comparing packages but the test
conditionsdon’tgenerallymatchtheuser’sapplication.
Thermal Considerations and Output Current Derating
The thermal resistances reported in the Pin Configuration
section of this data sheet are consistent with those pa-
rameters defined by JESD51-12 and are intended for use
with finite element analysis (FEA) software modeling tools
that leverage the outcome of thermal modeling, simula-
tion, and correlation to hardware evaluation performed on
a µModule package mounted to a hardware test board.
The motivation for providing these thermal coefficients is
found in JESD51-12 (“Guidelines for Reporting and Using
Electronic Package Thermal Information”).
3. θ
, the thermal resistance from junction to top of
JCtop
the product case, is determined with nearly all of the
componentpowerdissipationflowingthroughthetopof
the package. As the electrical connections of the typical
µModule regulator are on the bottom of the package, it
is rare for an application to operate such that most of
the heat flows from the junction to the top of the part.
As in the case of θ
, this value may be useful
JCbottom
for comparing packages but the test conditions don’t
generally match the user’s application.
Rev 0
18
For more information www.analog.com
LTM4653
APPLICATIONS INFORMATION
0ꢀꢅ0
ꢉꢙꢘꢚꢓꢖꢑ
ꢈꢙꢘꢚꢓꢖꢑ
0ꢀꢂꢂ
ꢆꢙꢘꢚꢓꢖꢑ
ꢄꢙꢘꢚꢓꢖꢑ
ꢅꢙꢘꢚꢓꢖꢑ
0ꢀꢂ0
0ꢀꢄꢂ
0ꢀꢄ0
0ꢀꢆꢂ
0ꢀꢆ0
0ꢀꢈꢂ
0ꢀꢈ0
0ꢀꢉꢂ
0ꢀꢉ0
0ꢀ0ꢂ
0
0ꢀꢉ 0ꢀꢉꢂ 0ꢀꢈ 0ꢀꢈꢂ 0ꢀꢆ 0ꢀꢆꢂ 0ꢀꢄ 0ꢀꢄꢂ 0ꢀꢂ 0ꢀꢂꢂ 0ꢀꢅ 0ꢀꢅꢂ 0ꢀꢁ 0ꢀꢁꢂ 0ꢀꢃ 0ꢀꢃꢂ 0ꢀꢊ
ꢋꢌꢍꢎ ꢏꢎꢏꢐꢑ
ꢄꢅꢂꢆ ꢇ0ꢆ
Figure 3. Normalized Input RMS Ripple Current vs Duty Cycle for One to Six LTM4ꢀ53s (Phases)
ꢓ0
ꢒ0
ꢑ0
ꢔ0
ꢕ0
ꢖ0
ꢗ0
0
ꢓ0
ꢁꢈꢀꢧ ꢇꢄꢧꢅ ꢗ0ꢏ
ꢧꢂꢈꢜ ꢇꢄꢧꢅ ꢗ0ꢏ
ꢁꢈꢀꢧ ꢇꢄꢧꢅ ꢗ0ꢏ
ꢧꢂꢈꢜ ꢇꢄꢧꢅ ꢗ0ꢏ
ꢒ0
ꢑ0
ꢔ0
ꢕ0
ꢖ0
ꢗ0
0
ꢢꢗꢣ ꢞꢤRꢄꢥꢤꢛꢅꢀꢃ
ꢢꢖꢣ ꢍꢈRꢅꢄꢜꢀꢃ
ꢚꢂꢦ ꢃꢄꢁꢄꢅ
ꢢꢗꢣ ꢞꢤRꢄꢥꢤꢛꢅꢀꢃ
ꢢꢖꢣ ꢍꢈRꢅꢄꢜꢀꢃ
ꢚꢂꢦ ꢃꢄꢁꢄꢅ
ꢨ
ꢨ
ꢙꢤRꢁꢀꢃ
ꢙꢤRꢁꢀꢃ
ꢘꢗ0
ꢘꢗ0
ꢕ0
ꢗꢕ0
ꢖꢕ0
ꢕꢕ0
ꢔꢕ0
ꢑꢕ0
ꢒꢕ0
ꢓꢕ0
ꢠꢕ0
ꢡꢕ0 ꢗ000
ꢕ0
ꢗꢕ0
ꢖꢕ0
ꢕꢕ0
ꢔꢕ0
ꢑꢕ0
ꢒꢕ0
ꢓꢕ0
ꢠꢕ0
ꢡꢕ0 ꢗ000
ꢔꢒꢑꢕ ꢙ0ꢔ
ꢔꢒꢑꢕ ꢙ0ꢑ
ꢙRꢈꢚꢆꢈꢛꢜꢝ ꢉꢁꢞꢟꢐ
ꢙRꢈꢚꢆꢈꢛꢜꢝ ꢉꢁꢞꢟꢐ
Figure 4. Radiated Emissions Scan of the LTM4ꢀ53. Producing
24VOUT at 4A, from 29.5VIN. DC2326A Hardware. fSW = 1.2MHz.
Measured in a 10m Chamber. Peak Detect Method
Figure 5. Radiated Emissions Scan of the LTM4ꢀ53 Producing
24VOUT at 3.5A, from 48VIN. DC2326A Hardware. fSW = 1.2MHz.
Measured in a 10m Chamber. Peak Detect Method
ꢓ0
ꢁꢈꢀꢧ ꢇꢄꢧꢅ ꢗ0ꢏ
ꢧꢂꢈꢜ ꢇꢄꢧꢅ ꢗ0ꢏ
ꢒ0
ꢑ0
ꢔ0
ꢕ0
ꢖ0
ꢗ0
0
ꢢꢗꢣ ꢞꢤRꢄꢥꢤꢛꢅꢀꢃ
ꢢꢖꢣ ꢍꢈRꢅꢄꢜꢀꢃ
ꢚꢂꢦ ꢃꢄꢁꢄꢅ
ꢨ
ꢙꢤRꢁꢀꢃ
ꢘꢗ0
ꢕ0
ꢗꢕ0
ꢖꢕ0
ꢕꢕ0
ꢔꢕ0
ꢑꢕ0
ꢒꢕ0
ꢓꢕ0
ꢠꢕ0
ꢡꢕ0 ꢗ000
ꢔꢒꢑꢕ ꢙ0ꢒ
ꢙRꢈꢚꢆꢈꢛꢜꢝ ꢉꢁꢞꢟꢐ
Figure ꢀ. Radiated Emissions Scan of the LTM4ꢀ53. Producing
12VOUT at 3A, from 58VIN. DC2326A Hardware. fSW = 1.2MHz.
Measured in a 10m Chamber. Peak Detect Method
Rev 0
19
For more information www.analog.com
LTM4653
APPLICATIONS INFORMATION
4. θ , the thermal resistance from junction to the printed
Within the LTM4653, be aware there are multiple power
devices and components dissipating power, with a con-
sequence that the thermal resistances relative to different
junctions of components or die are not exactly linear with
respect to total package power loss. To reconcile this
complicationwithoutsacrificingmodelingsimplicity—but
alsonotignoringpracticalrealities—anapproachhasbeen
taken using FEA software modeling along with laboratory
testing in a controlled-environment chamber to reason-
ably define and correlate the thermal resistance values
supplied in this data sheet: (1) Initially, FEA software is
used to accurately build the mechanical geometry of the
LTM4653 and the specified PCB with all of the correct
material coefficients along with accurate power loss
source definitions; (2) this model simulates a software-
definedJEDECenvironmentconsistentwithJESD51-9and
JESD51-12topredictpowerlossheatflowandtemperature
readings at different interfaces that enable the calculation
of the JEDEC-defined thermal resistance values; (3) the
model and FEA software is used to evaluate the LTM4653
with heat sink and airflow; (4) having solved for and
analyzed these thermal resistance values and simulated
various operating conditions in the software model, a
thorough laboratory evaluation replicates the simulated
conditions with thermocouples within a controlled envi-
ronment chamber while operating the device at the same
power loss as that which was simulated. The outcome of
this process and due diligence yields the set of derating
JB
circuit board, is the junction-to-board thermal resis-
tance where almost all of the heat flows through the
bottom of the µModule regulator and into the board,
and is really the sum of the θ
and the thermal
JCbottom
resistance of the bottom of the part through the solder
joints and through a portion of the board. The board
temperature is measured a specified distance from the
package, using a two sided, two layer board. This board
is described in JESD51-9.
A graphical representation of the aforementioned ther-
mal resistances is given in Figure 7; blue resistances are
contained within the µModule regulator, whereas green
resistances are external to the µModule package.
As a practical matter, it should be clear to the reader that
no individual or sub-group of the four thermal resistance
parameters defined by JESD51-12 or provided in the
Pin Configuration section replicates or conveys normal
operating conditions of a µModule regulator. For example,
in normal board-mounted applications, never does 100%
of the device’s total power loss (heat) thermally conduct
exclusively through the top or exclusively through bot-
tom of the µModule package—as the standard defines
for θ
and θ , respectively. In practice, power
JCbottom
JCtop
loss is thermally dissipated in both directions away from
the package—granted, in the absence of a heat sink and
airflow, a majority of the heat flow is into the board.
ꢑꢒꢓꢐꢔꢏꢕꢓꢖꢔꢕꢖꢗꢇꢜꢏꢍꢓꢔ ꢔꢝꢍRꢇꢗꢞ Rꢍꢘꢏꢘꢔꢗꢓꢐꢍ ꢐꢕꢇꢚꢕꢓꢍꢓꢔꢘ
ꢑꢒꢓꢐꢔꢏꢕꢓꢖꢔꢕꢖꢐꢗꢘꢍ ꢙꢔꢕꢚꢛ
Rꢍꢘꢏꢘꢔꢗꢓꢐꢍ
ꢐꢗꢘꢍ ꢙꢔꢕꢚꢛꢖꢔꢕꢖꢗꢇꢜꢏꢍꢓꢔ
Rꢍꢘꢏꢘꢔꢗꢓꢐꢍ
ꢑꢒꢓꢐꢔꢏꢕꢓꢖꢔꢕꢖꢜꢕꢗRꢌ Rꢍꢘꢏꢘꢔꢗꢓꢐꢍ
ꢑꢒꢓꢐꢔꢏꢕꢓ
ꢗꢇꢜꢏꢍꢓꢔ
ꢑꢒꢓꢐꢔꢏꢕꢓꢖꢔꢕꢖꢐꢗꢘꢍ
ꢙꢜꢕꢔꢔꢕꢇꢛ Rꢍꢘꢏꢘꢔꢗꢓꢐꢍ
ꢐꢗꢘꢍ ꢙꢜꢕꢔꢔꢕꢇꢛꢖꢔꢕꢖꢜꢕꢗRꢌ
Rꢍꢘꢏꢘꢔꢗꢓꢐꢍ
ꢜꢕꢗRꢌꢖꢔꢕꢖꢗꢇꢜꢏꢍꢓꢔ
Rꢍꢘꢏꢘꢔꢗꢓꢐꢍ
ꢀꢁꢂꢃ ꢄ0ꢅ
ꢆꢇꢈꢉꢊꢋe ꢌꢍꢎꢏꢐꢍ
Figure 6. Graphical Representaion of JESD51-12 Thermal Coefficients
Rev 0
20
For more information www.analog.com
LTM4653
APPLICATIONS INFORMATION
curves provided in later sections of this data sheet, along
withwell-correlatedJESD51-12-definedθvaluesprovided
in the Pin Configuration section of this data sheet.
at 2.5A
condition is 3.9W. A 4.5W loss is calculated
OUT
by multiplying the 3.9W room temperature loss from the
48V to 24V
power loss curve at 2.5A (Figure 10),
IN
OUT
with the 1.15 multiplying factor at 70°C ambient (from
Table 1). If the 70°C ambient temperature is subtracted
from the 120°C junction temperature, then the difference
The1V,5V,and15V and24VpowerlosscurvesinFigures8,
9 and 10 respectively can be used in coordination with
the load current derating curves in Figures 11 to 28 for
of 50°C divided by 4.5W yields a thermal resistance, θ ,
JA
calculating an approximate θ thermal resistance for the
JA
of 11.1°C/W—in good agreement with Table 4. Tables 2,
3 and 4 provide equivalent thermal resistances for 1V, 5V
and 15V and 24V outputs with and without air flow and
heat sinking. The derived thermal resistances in Tables 2,
3 and 4 for the various conditions can be multiplied by the
calculatedpowerlossasafunctionofambienttemperature
to derive temperature rise above ambient, thus maximum
junction temperature. Room temperature power loss
can be derived from the efficiency curves in the Typical
Performance Characteristics section and adjusted with
ambient temperature multiplicative factors from Table 1.
LTM4653withvariousheatsinkingandairflowconditions.
These thermal resistances represent demonstrated
performance of the LTM4653 on DC2327A hardware; a
4-layerFR4PCBmeasuring99mm×133mm ×1.6mm using
outerandinnercopperweightsof2ozand1oz,respectively.
The power loss curves are taken at room temperature,
and are increased with multiplicative factors with ambient
temperature.TheseapproximatefactorsarelistedinTable1.
(Compute the factor by interpolation, for intermediate
temperatures.) The derating curves are plotted with the
LTM4653’s output initially sourcing 4A and the ambient
temperature at 20°C. The output voltages are 1V, 5V,
15V and 24V. These are chosen to include the lower and
higher output voltage ranges for correlating the thermal
resistance. In all derating curves, the switching frequency
of operation follows guidance provided by Table 7.
Thermal models are derived from several temperature
measurements in a controlled temperature chamber
along with thermal modeling analysis. The junction
temperatures are monitored while ambient temperature is
increased with and without air flow, and with and without
a heat sink attached with thermally conductive adhesive
tape. The power loss increase with ambient temperature
change is factored into the derating curves. The junctions
are maintained at 120°C maximum while lowering output
current or power while increasing ambient temperature.
The decreased output current decreases the internal
module loss as ambient temperature is increased. The
monitored junction temperature of 120°C minus the
ambientoperatingtemperaturespecifieshowmuchmodule
temperaturerisecanbeallowed.AsanexampleinFigure25,
the load current is derated to 2.5A at 70°C ambient
with 200LFM airflow and no heat sink and the room
Table 1. Power Loss Multiplicative Factors vs Ambient
Temperature
POWER LOSS MULTIPLICATIVE
AMBIENT TEMPERATURE
FACTOR
1.00
1.05
1.10
1.15
1.20
1.25
1.30
1.35
1.40
Up to 40°C
50°C
60°C
70°C
80°C
90°C
100°C
110°C
120°C
temperature (25°C) power loss for this 48V to 24V
IN
OUT
Rev 0
21
For more information www.analog.com
LTM4653
APPLICATIONS INFORMATION
Table 2. 1V Output
DERATING CURVE
Figures 11, 12, 13
Figures 11, 12, 13
Figures 11, 12, 13
Figures 14, 15, 16
Figures 14, 15, 16
Figures 14, 15, 16
V
(V)
POWER LOSS CURVE
Figures 8, 9
AIRFLOW (LFM)
HEAT SINK
None
θ
(°C/W)
JA
IN
5, 12, 24
5, 12, 24
5, 12, 24
5, 12, 24
5, 12, 24
5, 12, 24
0
13.9
11.4
10.7
13.3
11.0
10.3
Figures 8, 9
200
400
0
None
Figures 8, 9
None
Figures 8, 9
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
Figures 8, 9
200
400
Figures 8, 9
Table 3. 5V Output
DERATING CURVE
Figures 17, 18, 19
Figures 17, 18, 19
Figures 17, 18, 19
Figures 20, 21, 22
Figures 20, 21, 22
Figures 20, 21, 22
V
(V)
POWER LOSS CURVE
Figures 8, 9, 10
Figures 8, 9, 10
Figures 8, 9, 10
Figures 8, 9, 10
Figures 8, 9, 10
Figures 8, 9, 10
AIRFLOW (LFM)
HEAT SINK
None
θ
(°C/W)
JA
IN
12, 24, 48
12, 24, 48
12, 24, 48
12, 24, 48
12, 24, 48
12, 24, 48
0
13.9
11.4
10.7
13.3
11.0
10.3
200
400
0
None
None
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
200
400
Table 4. 15V and 24V Output
DERATING CURVE
Figures 23, 24, 25
V
(V)
POWER LOSS CURVE
Figures 9, 10
Figures 9, 10
Figures 9, 10
Figures 9, 10
Figures 9, 10
Figures 9, 10
AIRFLOW (LFM)
HEAT SINK
None
θ
(°C/W)
JA
IN
24, 48
24, 48
24, 48
24, 48
24, 48
24, 48
0
13.9
11.4
10.7
13.3
11.0
10.3
Figures 23, 24, 25
200
400
0
None
Figures 23, 24, 25
None
Figures 26, 27, 28
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
Figures 26, 27, 28
200
400
Figures 26, 27, 28
Table 5. Heat Sink Manufacturer (Thermally Conductive Adhesive Tape Pre-Attached)
HEAT SINK MANUFACTURER
PART NUMBER
WEBSITE
Cool Innovations
3-0504035UT411
www.coolinnovations.com
Table ꢀ. Thermally Conductive Adhesive Tape Vendor
THERMALLY CONDUCTIVE ADHESIVE
TAPE MANUFACTURER
PART NUMBER
WEBSITE
Chomerics
T411
www.chomerics.com
Rev 0
22
For more information www.analog.com
LTM4653
APPLICATIONS INFORMATION
Table 6. LTM4ꢀ53 Output Voltage Response vs Component Matrix. Performance of Figure 30 Circuit with Values Here Indicated.
Load-Stepping from 2A to 4A Load Current, at 2A/μs. Typical Measured Values
C
VENDORS
PART NUMBER
C
OUTH
VENDORS
PART NUMBER
OUTH
AVX
12066D107MAT2A (100μF, 6.3V, 1206 Case Size)
GRM31CR60J107M (100μF, 6.3V, 1206 Case Size)
JMK316BBJ107MLHT (100μF, 6.3V, 1206 Case Size)
C3216X5R0J107M (100μF, 6.3V, 1206 Case Size)
1210YD476MAT2A (47μF, 16V, 1210 Case Size)
GRM32ER61C476M (47μF, 16V, 1210 Case Size)
EMK325BJ476MM (47μF, 16V, 1210 Case Size)
12103D226MAT2A (22μF, 25V, 1210 Case Size)
TMK325BJ226MM (22μF, 25V, 1210 Case Size)
C3225X5R1E226M (22μF, 25V, 1210 Case Size)
AVX
12105D106MAT2A (10μF, 50V, 1210 Case Size)
GRM32ER61H106M (10μF, 50V, 1210 Case Size)
UMK325BJ106M (10μF, 50V, 1210 Case Size)
C3225X5R1H106M (10μF, 50V, 1210 Case Size)
PART NUMBER
Murata
Murata
Taiyo Yuden
TDK
Taiyo Yuden
TDK
AVX
C
/C VENDORS
INH D
Murata
Taiyo Yuden
AVX
Murata
AVX
GRM32ER71K475M (4.7μF, 80V, 1210 Case Size)
12065C475MAT2A (4.7μF, 50V, 1206 Case Size)
GRM31CR71H475M (4.7μF, 50V, 1206 Case Size)
UMK316AB7475ML (4.7μF, 50V, 1206 Case Size)
C3216X5R1H475M (4.7μF, 50V, 1206 Case Size)
Murata
Taiyo Yuden
TDK
Taiyo Yuden
TDK
LOAD STEP LOAD STEP
TRANSIENT
DROOP
(mV)
PK-PK
DEVIATION
(mV)
RECOVERY
TIME
(μs)
V
V
R
C
R
R
f
R
R
OUT
(V)
IN
(V)
TH
TH
ISET
(kΩ)
PGDFB
(kΩ)
SW
fSET
EXTVCC
(Ω)
C
C
C
OUTH
(Ω)
681
681
681
665
665
665
665
665
665
665
665
665
665
665
649
649
649
649
649
604
604
604
604
604
499
499
499
499
499
499
499
499
499
499
499
499
499
(nF)
6.8
6.8
6.8
6.8
6.8
6.8
6.8
6.8
6.8
6.8
8.2
8.2
8.2
8.2
8.2
8.2
8.2
8.2
8.2
10
(kHz)
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
400
550
575
600
500
800
1100
1200
750
1200
1400
1200
1500
(kΩ)
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
665
576
499
1000
249
143
124
287
124
100
124
90.9
INH
D
1
5
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
4.7μF
100μF x 3
100μF x 3
100μF x 3
100μF x 3
100μF x 3
100μF x 3
100μF x 3
100μF x 3
100μF x 3
100μF x 3
100μF x 3
100μF x 3
100μF x 3
100μF x 3
100μF x 3
100μF x 3
100μF x 3
100μF x 3
100μF x 3
100μF x 2
100μF x 2
100μF x 2
100μF x 2
100μF x 2
47μF x 2
47μF x 2
47μF x 2
47μF x 2
22μF x 2
22μF x 2
22μF x 2
22μF x 2
22μF x 2
22μF x 2
22μF x 2
10μF x 2
10μF x 2
20
3.32
3.32
3.32
4.99
4.99
4.99
7.5
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
20
70
70
145
145
145
145
145
145
145
145
145
145
145
145
145
145
145
145
145
145
145
190
190
185
180
180
260
260
260
260
350
350
350
350
350
350
350
430
440
55
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
45
45
45
45
40
40
40
40
40
40
40
35
35
1
12
24
5
20
1
20
70
1.2
1.2
1.2
1.5
1.5
1.5
1.5
1.8
1.8
1.8
1.8
2.5
2.5
2.5
2.5
2.5
3.3
3.3
3.3
3.3
3.3
5
24
70
12
24
5
24
70
24
70
30.1
30.1
30.1
30.1
36
70
12
24
36
5
7.5
70
7.5
70
7.5
70
10
70
12
24
36
5
36
10
70
36
10
70
36
10
70
50
15.8
15.8
15.8
15.8
15.8
22.6
22.6
22.6
22.6
22.6
36.5
36.5
36.5
36.5
95.3
95.3
95.3
95.3
121
121
121
196
196
70
12
24
36
48
5
50
70
50
70
50
70
50
70
66.5
66.5
66.5
66.5
66.5
100
100
100
100
240
240
240
240
301
301
301
481
481
90
12
24
36
48
12
24
36
48
15
24
36
48
24
36
48
36
48
10
90
10
90
10
90
10
90
10
130
130
130
130
170
170
170
170
170
170
170
220
220
5
10
20
5
10
20
5
10
20
12
12
12
12
15
15
15
24
24
10
49.9
49.9
49.9
49.9
60.4
60.4
60.4
100
100
10
10
10
10
10
10
10
10
Rev 0
23
For more information www.analog.com
LTM4653
See Table 1 for fSW and REXTVCC
.
APPLICATIONS INFORMATION—DERATING CURVES
ꢄꢀ0
ꢃꢀꢁ
ꢃꢀ0
ꢂꢀꢁ
ꢂꢀ0
0ꢀꢁ
0ꢀ0
ꢅꢀ0
ꢄꢀꢁ
ꢄꢀ0
ꢃꢀꢁ
ꢃꢀ0
ꢂꢀꢁ
ꢂꢀ0
0ꢀꢁ
0ꢀ0
ꢇꢀ0
ꢆꢀ0
ꢃꢀ0
ꢄꢀ0
ꢅꢀ0
ꢂꢀ0
ꢁꢀ0
0ꢀ0
ꢁꢀ0ꢖ ꢗ ꢅ00ꢘꢙꢚ
ꢇꢎꢏ
ꢂꢄꢖ ꢗ ꢁꢀꢃꢛꢙꢚ
ꢉꢐꢑ
ꢂꢁꢖ ꢗ ꢜꢁ0ꢘꢙꢚ
ꢇꢎꢏ
ꢄꢀꢄꢖ ꢗ ꢅ00ꢘꢙꢚ
ꢇꢎꢏ
ꢁꢃꢖ ꢗ ꢁꢀꢄꢛꢙꢚ
ꢉꢐꢑ
ꢂꢃꢖ ꢗ ꢛ00ꢘꢙꢚ
ꢇꢎꢏ
ꢃꢀꢁꢖ ꢗ ꢅ00ꢘꢙꢚ
ꢇꢎꢏ
ꢁꢂꢖ ꢗ ꢁꢀꢂꢛꢙꢚ
ꢉꢐꢑ
ꢁꢀ0ꢖ ꢗ ꢁꢁ0ꢘꢙꢚ
ꢇꢎꢏ
ꢂꢀꢕꢖ ꢗ ꢅ00ꢘꢙꢚ
ꢇꢎꢏ
ꢃꢀ0ꢖ ꢗ ꢆ00ꢘꢙꢚ
ꢉꢐꢑ
ꢄꢀꢄꢖ ꢗ ꢅ00ꢘꢙꢚ
ꢇꢎꢏ
ꢂꢀꢁꢖ ꢗ ꢅ00ꢘꢙꢚ
ꢇꢎꢏ
ꢅꢀꢅꢖ ꢗ ꢄ00ꢘꢙꢚ
ꢉꢐꢑ
ꢃꢀꢁꢖ ꢗ ꢅ00ꢘꢙꢚ
ꢇꢎꢏ
ꢂꢀꢃꢖ ꢗ ꢅ00ꢘꢙꢚ
ꢇꢎꢏ
ꢂꢀꢃꢖ ꢗ ꢄ00ꢘꢙꢚ
ꢉꢐꢑ
ꢂꢀꢛꢖ ꢗ ꢅ00ꢘꢙꢚ
ꢇꢎꢏ
ꢂꢀ0ꢖ ꢗ ꢅ00ꢘꢙꢚ
ꢇꢎꢏ
ꢂꢀꢁꢖ ꢗ ꢅ00ꢘꢙꢚ
ꢇꢎꢏ
ꢂꢀꢃꢖ ꢗ ꢅ00ꢘꢙꢚ
ꢇꢎꢏ
ꢂꢀ0ꢖ ꢗ ꢅ00ꢘꢙꢚ
ꢇꢎꢏ
0ꢀ0 0ꢀꢁ ꢂꢀ0 ꢂꢀꢁ ꢃꢀ0 ꢃꢀꢁ ꢄꢀ0 ꢄꢀꢁ ꢅꢀ0
0ꢀ0 0ꢀꢁ ꢂꢀ0 ꢂꢀꢁ ꢃꢀ0 ꢃꢀꢁ ꢄꢀ0 ꢄꢀꢁ ꢅꢀ0
0ꢀ0 0ꢀꢃ ꢁꢀ0 ꢁꢀꢃ ꢂꢀ0 ꢂꢀꢃ ꢅꢀ0 ꢅꢀꢃ ꢄꢀ0
ꢇꢎꢏꢆꢎꢏ ꢐꢎRRꢉꢑꢏ ꢌꢒꢍ
ꢇꢎꢏꢆꢎꢏ ꢐꢎRRꢉꢑꢏ ꢌꢒꢍ
ꢉꢐꢑꢈꢐꢑ ꢒꢐRRꢋꢓꢑ ꢎꢔꢏ
ꢅꢓꢁꢄ ꢔ0ꢕ
ꢅꢓꢁꢄ ꢔ0ꢕ
ꢄꢆꢃꢅ ꢕꢁ0
Figure 8. 12VIN Power Loss Curve
Figure 9. 24VIN Power Loss Curve
Figure 10. 48VIN Power Loss Curve
ꢁꢕ0
ꢓꢕꢒ
ꢓꢕ0
ꢀꢕꢒ
ꢀꢕ0
ꢄꢕꢒ
ꢄꢕ0
0ꢕꢒ
0ꢕ0
ꢁꢕ0
ꢓꢕꢒ
ꢓꢕ0
ꢀꢕꢒ
ꢀꢕ0
ꢄꢕꢒ
ꢄꢕ0
0ꢕꢒ
0ꢕ0
ꢁꢕ0
ꢓꢕꢒ
ꢓꢕ0
ꢀꢕꢒ
ꢀꢕ0
ꢄꢕꢒ
ꢄꢕ0
0ꢕꢒ
0ꢕ0
ꢘꢗꢔꢆ
ꢘꢗꢔꢆ
ꢘꢗꢔꢆ
ꢀ00ꢗꢔꢆ
ꢁ00ꢗꢔꢆ
ꢀ00ꢗꢔꢆ
ꢁ00ꢗꢔꢆ
ꢀ00ꢗꢔꢆ
ꢁ00ꢗꢔꢆ
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢁꢂꢒꢓ ꢔꢄꢄ
ꢁꢂꢒꢓ ꢔꢄꢀ
ꢁꢂꢒꢓ ꢔꢄꢓ
Figure 11. 5V to 1VOUT Derating
Curve, No Heat Sink
Figure 12. 12V to 1VOUT
Derating Curve, No Heat Sink
Figure 13. 24V to 1VOUT
Derating Curve, No Heat Sink
ꢁꢕ0
ꢓꢕꢒ
ꢓꢕ0
ꢀꢕꢒ
ꢀꢕ0
ꢄꢕꢒ
ꢄꢕ0
0ꢕꢒ
0ꢕ0
ꢁꢕ0
ꢓꢕꢒ
ꢓꢕ0
ꢀꢕꢒ
ꢀꢕ0
ꢄꢕꢒ
ꢄꢕ0
0ꢕꢒ
0ꢕ0
ꢁꢕ0
ꢓꢕꢒ
ꢓꢕ0
ꢀꢕꢒ
ꢀꢕ0
ꢄꢕꢒ
ꢄꢕ0
0ꢕꢒ
0ꢕ0
ꢘꢗꢔꢆ
ꢘꢗꢔꢆ
ꢘꢗꢔꢆ
ꢀ00ꢗꢔꢆ
ꢁ00ꢗꢔꢆ
ꢀ00ꢗꢔꢆ
ꢁ00ꢗꢔꢆ
ꢀ00ꢗꢔꢆ
ꢁ00ꢗꢔꢆ
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢁꢂꢒꢓ ꢔꢄꢁ
ꢁꢂꢒꢓ ꢔꢄꢒ
ꢁꢂꢒꢓ ꢔꢄꢂ
Figure 14. 5V to 1VOUT Derating
Curve, with BGA Heat Sink
Figure 15. 12V to 1VOUT Derating
Curve, with BGA Heat Sink
Figure 1ꢀ. 24V to 1VOUT Derating
Curve, with BGA Heat Sink
Rev 0
24
For more information www.analog.com
LTM4653
See Table 1 for fSW and REXTVCC
.
APPLICATIONS INFORMATION—DERATING CURVES
ꢁꢖ0
ꢓꢖꢒ
ꢓꢖ0
ꢀꢖꢒ
ꢀꢖ0
ꢄꢖꢒ
ꢄꢖ0
0ꢖꢒ
0ꢖ0
ꢁꢕ0
ꢓꢕꢒ
ꢓꢕ0
ꢀꢕꢒ
ꢀꢕ0
ꢄꢕꢒ
ꢄꢕ0
0ꢕꢒ
0ꢕ0
ꢁꢖ0
ꢓꢖꢒ
ꢓꢖ0
ꢀꢖꢒ
ꢀꢖ0
ꢄꢖꢒ
ꢄꢖ0
0ꢖꢒ
0ꢖ0
ꢙꢘꢔꢆ
ꢘꢗꢔꢆ
ꢙꢘꢔꢆ
ꢀ00ꢘꢔꢆ
ꢁ00ꢘꢔꢆ
ꢀ00ꢗꢔꢆ
ꢁ00ꢗꢔꢆ
ꢀ00ꢘꢔꢆ
ꢁ00ꢘꢔꢆ
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢁꢂꢒꢓ ꢔꢄꢕ
ꢁꢂꢒꢓ ꢔꢄꢃ
ꢁꢂꢒꢓ ꢔꢄꢕ
Figure 16. 12V to 5VOUT
Derating Curve, No Heat Sink
Figure 18. 24V to 5VOUT
Derating Curve, No Heat Sink
Figure 19. 48V to 5VOUT
Derating Curve, No Heat Sink
ꢁꢕ0
ꢓꢕꢒ
ꢓꢕ0
ꢀꢕꢒ
ꢀꢕ0
ꢄꢕꢒ
ꢄꢕ0
0ꢕꢒ
0ꢕ0
ꢁꢕ0
ꢓꢕꢒ
ꢓꢕ0
ꢀꢕꢒ
ꢀꢕ0
ꢄꢕꢒ
ꢄꢕ0
0ꢕꢒ
0ꢕ0
ꢁꢕ0
ꢓꢕꢒ
ꢓꢕ0
ꢀꢕꢒ
ꢀꢕ0
ꢄꢕꢒ
ꢄꢕ0
0ꢕꢒ
0ꢕ0
ꢘꢗꢔꢆ
ꢘꢗꢔꢆ
ꢘꢗꢔꢆ
ꢀ00ꢗꢔꢆ
ꢁ00ꢗꢔꢆ
ꢀ00ꢗꢔꢆ
ꢁ00ꢗꢔꢆ
ꢀ00ꢗꢔꢆ
ꢁ00ꢗꢔꢆ
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢁꢂꢒꢓ ꢔꢀꢄ
ꢁꢂꢒꢓ ꢔꢀꢀ
ꢁꢂꢒꢓ ꢔꢀ0
Figure 22. 48V to 5VOUT Derating
Curve, with BGA Heat Sink
Figure 20. 12V to 5VOUT Derating
Curve, with BGA Heat Sink
Figure 21. 24V to 5VOUT Derating
Curve, with BGA Heat Sink
ꢁꢕ0
ꢓꢕꢒ
ꢓꢕ0
ꢀꢕꢒ
ꢀꢕ0
ꢄꢕꢒ
ꢄꢕ0
0ꢕꢒ
0ꢕ0
ꢁꢕ0
ꢓꢕꢒ
ꢓꢕ0
ꢀꢕꢒ
ꢀꢕ0
ꢄꢕꢒ
ꢄꢕ0
0ꢕꢒ
0ꢕ0
ꢁꢕ0
ꢓꢕꢒ
ꢓꢕ0
ꢀꢕꢒ
ꢀꢕ0
ꢄꢕꢒ
ꢄꢕ0
0ꢕꢒ
0ꢕ0
ꢘꢗꢔꢆ
ꢘꢗꢔꢆ
ꢘꢗꢔꢆ
ꢀ00ꢗꢔꢆ
ꢁ00ꢗꢔꢆ
ꢀ00ꢗꢔꢆ
ꢁ00ꢗꢔꢆ
ꢀ00ꢗꢔꢆ
ꢁ00ꢗꢔꢆ
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢁꢂꢒꢓ ꢔꢀꢓ
ꢁꢂꢒꢓ ꢔꢀꢁ
ꢁꢂꢒꢓ ꢔꢀꢒ
Figure 24. 48V to 15VOUT Derating
Curve, No Heat Sink
Figure 25. 48V to 24VOUT Derating
Curve, No Heat Sink
Figure 23. 24V to 15VOUT Derating
Curve, No Heat Sink
Rev 0
25
For more information www.analog.com
LTM4653
See Table 1 for fSW and REXTVCC
.
APPLICATIONS INFORMATION—DERATING CURVES
ꢁꢕ0
ꢓꢕꢒ
ꢓꢕ0
ꢀꢕꢒ
ꢀꢕ0
ꢄꢕꢒ
ꢄꢕ0
0ꢕꢒ
0ꢕ0
ꢁꢖ0
ꢓꢖꢒ
ꢓꢖ0
ꢀꢖꢒ
ꢀꢖ0
ꢄꢖꢒ
ꢄꢖ0
0ꢖꢒ
0ꢖ0
ꢁꢕ0
ꢓꢕꢒ
ꢓꢕ0
ꢀꢕꢒ
ꢀꢕ0
ꢄꢕꢒ
ꢄꢕ0
0ꢕꢒ
0ꢕ0
ꢘꢗꢔꢆ
ꢙꢘꢔꢆ
ꢘꢗꢔꢆ
ꢀ00ꢗꢔꢆ
ꢁ00ꢗꢔꢆ
ꢀ00ꢘꢔꢆ
ꢁ00ꢘꢔꢆ
ꢀ00ꢗꢔꢆ
ꢁ00ꢗꢔꢆ
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢀ0
ꢁ0
ꢂ0
ꢃ0
ꢄ00
ꢄꢀ0
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢅꢆꢇꢈꢉꢊꢋ ꢋꢉꢆꢌꢉRꢅꢋꢍRꢉ ꢎꢏꢐꢑ
ꢁꢂꢒꢓ ꢔꢀꢂ
ꢁꢂꢒꢓ ꢔꢀꢕ
ꢁꢂꢒꢓ ꢔꢀꢃ
Figure 26. 48V to 15VOUT Derating
Curve, with BGA Heat Sink
Figure 28. 48V to 24VOUT Derating
Curve, with BGA Heat Sink
Figure 2ꢀ. 24V to 15VOUT Derating
Curve, with BGA Heat Sink
APPLICATIONS INFORMATION
Safety Considerations
• Place high frequency ceramic input and output ca-
pacitors next to the V , V , PGND and V pins to
IN
D
OUT
TheLTM4653doesnotprovidegalvanicisolationfromV
IN
minimize high frequency noise.
to V . There is no internal fuse. If required, a slow blow
OUT
fuse with a rating twice the maximum input current needs
• Place a dedicated power ground layer underneath the
LTM4653.
tobeprovidedtoprotecttheunitfromcatastrophicfailure.
The fuse or circuit breaker, if used, should be selected to
• Tominimizetheviaconductionlossandreducemodule
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
limit the current to the regulator in case of a M MOSFET
T
fault. If M fails, the system’s input supply will source
T
very large currents to V
through M . This can cause
OUT
T
• Do not put vias directly on pads, unless they are capped
or plated over.
excessive heat and board damage depending on how
much power the input voltage can deliver to this system.
A fuse or circuit breaker can be used as a secondary fault
protector in this situation. The LTM4653 does feature
overcurrent and overtemperature protection.
• Use a separate SGND copper plane for components
connected to signal pins. Connect SGND to PGND
directly under the module.
• For parallel module applications, connect the V
,
OUT
Layout Checklist/Example
V
, RUN, ISETa, COMPa and PGOOD pins together
OSNS
The high integration of LTM4653 makes the PCB board
layout straightforward. However, to optimize its electrical
and thermal performance, some layout considerations
are still necessary.
as shown in Figure 32.
• Bring out test points on the signal pins for monitoring.
Figure 29 gives a good example of the recommended
LTM4653 layout.
• Use large PCB copper areas for high current paths,
including V , PGND and V . Doing so helps to
IN
OUT
minimize the PCB conduction loss and thermal stress.
Rev 0
26
For more information www.analog.com
LTM4653
APPLICATIONS INFORMATION
ꢀꢁꢂ
ꢃ
ꢄꢁ
ꢀꢁꢂ
ꢃ
ꢅꢆꢇ
ꢈꢉꢊꢋ ꢌꢍꢎ
Figure 29. Recommend PCB Layout, Package Top View
TYPICAL APPLICATIONS
V
24V
UP TO 4A
,
IN
OUT
NC
SW
V
V
OSNS
IN
OUT
48V
C
4.7μF
INH
V
SV
IN
C
OUTH
10µF
x2
LOAD
V
D
C
4.7μF
D
SGND
PGND
RUN
GND
INTV
CC
LTM4653
R
196k
R
EXTVCC
PGDFB
CLKIN
R
PGDPUP
100k
100Ω
0.1µF
PGDFB
PGOOD
TEMP+
TEMP–
INTV
INTV
CC
CC
+
–
V
VINREG
COMPa
COMPb
CC
V
D
D
REF
470pF
LTC2997
GND
C
10nF
TH
TH
EXTV
4mV/K
CC
V
PTAT
C
EXTVCC
IMONa
IMONb
4653 F30
R
499Ω
f
SET
1µF
ISETa ISETb
R
90.9k
R
ISET
481k
fSET
OPTIONAL ANALOG OUTPUT
TEMPERATURE INDICATOR
Figure 30. 4A, 24V Output DC/DC μModule Regulator
Rev 0
27
For more information www.analog.com
LTM4653
TYPICAL APPLICATIONS
Rꢀꢁ
ꢂꢃꢄꢅꢆꢃ
ꢆ
ꢇꢈꢉ
ꢀ0ꢆꢃꢄꢅꢆ
ꢊꢋꢇꢇꢄ
ꢌꢆꢃꢄꢅꢆ
ꢀꢁꢂꢃ ꢄꢃꢅ
ꢀꢁꢂꢃꢄꢅꢆ
Figure 31. Start-Up Waveforms at 48VIN, Figure 30 Circuit
I
OUT1
24V
V
48V
OUT
IN
V
NC
SW
IN
V
OUT
UP TO 8A
C
22µF
×2
C
4.7μF
OUT
INH
V
OSNS
SV
IN
LOAD
V
D
C
4.7μF
D
RUN
GND
SGND
PGND
U1
LTM4653
INTV
CC1
R
INTV
PGDFB1
196k
CLKIN
INTV
CC1
R
PGDPUP
100Ω
PGDFB
PGOOD
EXTV
CC
PGOOD
VINREG
CC
R
100Ω
EXTVCC
COMPa
COMPb
TEMP+
TEMP–
IMONa
C
1µF
EXTVCC
LTC6908-1
ANALOG OUTPUT
CURRENT INDICATOR
f
SET
ISETa
ISETb IMONb
+
V
OUT1
OUT2
MOD
V
IMON
= 0.125Ω • (I
+ I
)
OUT1 OUT2
R
fSET1
90.9k
R
66.5k
SET
SET
I
OUT2
0.1µF
GND
V
NC
SW
IN
V
OUT
C
4.7μF
INH
V
OSNS
SV
IN
V
D
SGND
PGND
RUN
GND
C
D
4.7μF
U2
LTM4653
R
CLKIN
INTV
PGDFB2
196k
R
100Ω
EXTVCC
PGDFB
PGOOD
CC
VINREG
EXTV
CC
+
–
COMPa
COMPb
TEMP
TEMP
C
10nF
TH
C
1µF
TH
EXTVCC
R
IMONa
IMONb
499Ω
f
SET
ISETa
ISETb
4653 F32
R
90.9k
R
ISET
240k
fSET
Figure 32. 24V Output at Up to 8A from 48V Input, 2-Phase Paralled with Analog Output Current Indicator
Rev 0
28
For more information www.analog.com
LTM4653
TYPICAL APPLICATIONS
ꢄ
ꢃ
ꢂ
ꢁ
ꢀ
0
ꢌꢀ
ꢌꢁ
ꢔꢀ
0
ꢀ
ꢁ
ꢂ
ꢃ
ꢄ
ꢅ
ꢆ
ꢇ
ꢈꢉꢈꢊꢋ ꢉꢌꢈꢍꢌꢈ ꢎꢌRRꢏꢐꢈ ꢑꢊꢒ
ꢃꢅꢄꢂ ꢓꢂꢂ
Figure 33. Current Sharing Performance of LTM4ꢀ53s in Figure 32 Circuit
Rꢈꢎ
ꢊꢆꢃꢄꢅꢆ
ꢆ
ꢇꢈꢉ
ꢊꢆꢃꢄꢅꢆ
ꢋ
ꢆ
ꢇꢈꢉ
ꢊꢆꢃꢄꢅꢆ
ꢌꢍꢇꢇꢄ
ꢊꢆꢃꢄꢅꢆ
ꢀꢁꢂꢃ ꢄꢃꢀ
ꢀꢁꢂꢃꢄꢅꢆ
Figure 34. Concurrent 12V Supply, Output Voltage Start-Up Waveforms, Figure 35 Circuit
Rev 0
29
For more information www.analog.com
LTM4653
PACKAGE PHOTOGRAPH
PACKAGE DESCRIPTION
Table 9. LTM4ꢀ53 Component BGA Pinout
PIN ID
A1
FUNCTION
PIN ID
B1
FUNCTION
CLKIN
NC
PIN ID
C1
FUNCTION
IMONb
PIN ID
D1
FUNCTION
PGOOD
PGDFB
VINREG
GND
PIN ID
E1
FUNCTION
COMPb
PIN ID
F1
FUNCTION
ISETb
V
IN
V
IN
V
IN
A2
B2
C2
IMONa
D2
E2
COMPa
F2
ISETa
A3
B3
V
C3
SV
D3
E3
f
F3
EXTV
CC
IN
IN
SET
A4
V
D
B4
V
D
C4
V
D
D4
E4
SGND
PGND
NC
F4
RUN
PGND
NC
A5
PGND
NC
B5
PGND
NC
C5
PGND
NC
D5
PGND
NC
E5
F5
A6
B6
C6
D6
E6
F6
A7
NC
B7
NC
C7
NC
D7
NC
E7
NC
F7
NC
PIN ID
G1
FUNCTION
PIN ID
H1
FUNCTION
PIN ID
J1
FUNCTION
PIN ID
K1
FUNCTION
PIN ID
L1
FUNCTION
+
V
V
OSNS
TEMP
V
V
V
V
V
V
OSNS
OUT
OUT
OUT
OUT
OUT
OUT
–
G2
SGND
INTV
H2
SGND
PGND
SW
J2
TEMP
K2
L2
G3
H3
J3
PGND
PGND
PGND
K3
L3
CC
G4
PGND
PGND
NC
H4
J4
K4
PGND
PGND
NC
L4
PGND
PGND
NC
G5
H5
PGND
NC
J5
K5
L5
+
G6
H6
J6
TEMP
K6
L6
–
G7
NC
H7
NC
J7
TEMP
K7
NC
L7
NC
Rev 0
30
For more information www.analog.com
LTM4653
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/product/LTM4ꢀ53#packaging for the most recent package drawings.
ꢓ
ꢓ
ꢷ ꢷ ꢯ ꢯ ꢯ
ꢓ
ꢪ ꢥ ꢞ ꢎ 0
ꢟ ꢥ ꢜ ꢋ 0
ꢎ ꢥ ꢟ ꢰ 0
0 ꢥ ꢪ ꢎ ꢰ ꢜ
0 ꢥ ꢪ ꢎ ꢰ ꢜ
ꢎ ꢥ ꢟ ꢰ 0
0 ꢥ 0 0 0
ꢟ ꢥ ꢜ ꢋ 0
ꢪ ꢥ ꢞ ꢎ 0
Rev 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
31
subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
LTM4653
TYPICAL APPLICATION
I
OUT
V
OUT
12V
V
IN
15V TO 46V
V
NC
SW
V
IN
OUT
C
INH1
4.7μF
UP TO 4A
V
OSNS
SV
IN
C
22µF
×2
OUTH
R
105k
A
LOAD
V
D
C
4.7μF
D1
GND
SGND
PGND
RUN
U1
LTM4653
INTV
CC1
R
PGDFB1
95.3k
CLKIN
R
PGDPUP
100Ω
INTV
INTV
CC
CC1
PGDFB
PGOOD
EXTV
PGOOD
VINREG
CC
R
EXTVCC1
49.9Ω
COMPa
COMPb
TEMP+
C
TH
C
1µF
TEMP–
IMONa
EXTVCC1
10nF
TH
R
499Ω
ANALOG OUTPUT
CURRENT INDICATOR,
f
SET
ISETa
ISETb IMONb
V
IMON
= 0.25Ω • I
OUT
C
R
R
124k
SS
ISET1
fSET1
10nF 240k
V
NC
SW
IN
C
INH2
4.7µF
PGOOD
GND
C
SV
IN
SNS
INOUT
4.7µF
GND
V
D
C
DGND
4.7µF
PGND
C
OUT2
22µF
LOAD
U2
LTM4651
D1*
–
V
OUT
–12V
UP TO 3.25A
–
V
SV
C
D2
4.7µF
OUT
–
OUT
RUN
R
PGDFB2
95.3k
CLKIN
R
B
PGDFB
INTV
CC
10k
R
EXTVCC2
49.9Ω
VINREG
COMPa
EXTV
CC
+
TEMP
COMPb
R
–
TRACK
10k
TEMP
f
SET
ISETa ISETb
C
R
R
EXTVCC2
1µF
fSET2
124k
ISET2
240k||10k
*D1: CENTRAL SEMI
P/N CMMSH1-40L
4653 F35
Figure 35. Concurrent 12V Supply. See Figure 34 for Output Voltage Start-Up Waveforms
RELATED PARTS
PART NUMBER DESCRIPTION
COMMENTS
LTM4651
LTM8045
LTM8049
EN55022B Compliant, 58Vin, 24W Inverting-Output
3.6V ≤ Vin ≤ 58V, -26.5V ≤ Vout ≤ -0.5V, Iout ≤ 4A. 15mm x 9mm x
5.01mm BGA
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SEPIC or Inverting µModule DC/DC Converter
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≤ 700mA. 6.25mm ×
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OUT
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11.25mm × 4.92mm BGA
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LTM8073
LTM8064
LTM4613
60V, 3A Step-Down µModule Regulator
3.4V ≤ V ≤ 60V, 0.8V ≤ V
≤ 15V. 6.25mm × 9mm × 3.32mm BGA
IN
OUT
58V, 6A CVCC Step-Down µModule Regulator
EN55022B Compliant, 36V, 8A µModule Regulator
6V ≤ V ≤ 58V, 1.2V ≤ V
≤ 36V. 11.9mm x 16mm × 4.92mm BGA
≤ 15V. 15mm × 15mm × 4.32mm LGA, and
IN
OUT
5V ≤ V ≤ 36V, 3.3V ≤ V
IN
OUT
15mm × 15mm × 4.92mm BGA
Rev 0
D16803-0-4/18(0)
www.analog.com
32
ANALOG DEVICES, INC. 2018
相关型号:
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LTM4655IY
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LTM4655MPY
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