LTM4630EY#PBF [Linear]
LTM4630 - Dual 18A or Single 36A DC/DC µModule (Power Module) Regulator; Package: BGA; Pins: 144; Temperature Range: -40°C to 85°C;型号: | LTM4630EY#PBF |
厂家: | Linear |
描述: | LTM4630 - Dual 18A or Single 36A DC/DC µModule (Power Module) Regulator; Package: BGA; Pins: 144; Temperature Range: -40°C to 85°C 开关 |
文件: | 总34页 (文件大小:630K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTM4630
Dual 18A or Single 36A
DC/DC µModule Regulator
FEATURES
DESCRIPTION
n
Dual 18A or Single 36A Output
TheLTM®4630isadual18Aorsingle36Aoutputswitching
modestep-downDC/DCµModule® (micromodule)regula-
tor. Included in the package are the switching controllers,
power FETs, inductors, and all supporting components.
Operating from an input voltage range of 4.5V to 15V, the
LTM4630supportstwooutputseachwithanoutputvoltage
range of 0.6V to 1.8V, each set by a single external resistor.
Its high efficiency design delivers up to 18A continuous
current for each output. Only a few input and output ca-
pacitors are needed. The LTM4630 is pin compatible with
the LTM4620 and LTM4620A (dual 13A, single 26A) and
the LTM4628 (dual 8A, single 16A).
n
Wide Input Voltage Range: 4.5V to 15V
n
Output Voltage Range: 0.6V to 1.8V
n
1.5ꢀ ꢁaꢂiꢃuꢃ ꢄotal DC Output Error Over Line,
Load and ꢄeꢃperature
Differential Reꢃote Sense Aꢃplifier
n
n
Current ꢁode Control/Fast ꢄransient Response
n
Adjustable Switching Frequency
Overcurrent Foldback Protection
n
n
ꢁultiphase Parallel Current Sharing with ꢁultiple
Lꢄꢁ4630s Up to 144A
n
Frequency Synchronization
n
Internal ꢄeꢃperature ꢁonitor
The device supports frequency synchronization, multi-
phaseoperation,BurstModeoperationandoutputvoltage
tracking for supply rail sequencing and has an onboard
temperaturediodefordevicetemperaturemonitoring.High
switchingfrequencyandacurrentmodearchitectureenable
a very fast transient response to line and load changes
without sacrificing stability.
n
Pin Compatible with the LTM4620 and LTM4620A (Dual
13A, Single 26A) and LTM4628 (Dual 8A, Single 16A)
Selectable Burst Mode® Operation
n
n
Soft-Start/Voltage Tracking
Output Overvoltage Protection
16mm × 16mm × 4.41mm LGA and 16mm × 16mm ×
5.01mm BGA Packages
n
n
Fault protection features include overvoltage and
overcurrent protection. The LTM4630 is offered in 16mm
× 16mm × 4.41mm LGA and 16mm × 16mm × 5.01mm
BGA packages. The LTM4630 is ROHS compliant.
L, LT, LTC, LTM, Linear Technology, the Linear logo, µModule, Burst Mode and PolyPhase are
registered trademarks of Linear Technology Corporation. All other trademarks are the property
of their respective owners. Protected by U.S. Patents, including 5481178, 5705919, 5929620,
6100678, 6144194, 6177787, 6304066 and 6580258. Other patents pending.
APPLICATIONS
n
Telecom and Networking Equipment
n
Storage and ATCA Cards
n
Industrial Equipment
TYPICAL APPLICATION
36A, 1.2V Output DC/DC µꢁodule Regulator
INTV
CC
1.2VOUꢄ Efficiency vs IOUꢄ
4.7µF
10k
PGOOD
95
90
85
80
75
70
65
MODE_PLLIN CLKOUT INTV
EXTV
PGOOD1
CC
V
= 5V
CC
IN
V
IN
4.5V TO 15V
V
IN
V
OUT1
+
+
22µF
25V
×4
100µF
6.3V
470µF
6.3V
TEMP
V
OUTS1
10k
120k
V
= 12V
IN
RUN1
DIFFOUT
RUN2
SW1
TRACK1
TRACK2
V
V
FB1
FB2
LTM4630
5.1V
60.4k
f
0.1µF
COMP1
COMP2
SET
PHASMD
V
OUTS2
V
1.2V
36A
OUT
V
121k
OUT2
SW2
100µF
6.3V
0
2
4
6
8
10 12 14 16 18
OUTPUT CURRENT (A)
470µF
6.3V
PGOOD2
SGND
GND
DIFFP
DIFFN
4630 TA01b
PGOOD
4630 TA01a
4630fa
1
For more information www.linear.com/LTM4630
LTM4630
ABSOLUTE MAXIMUM RATINGS (Note 1)
V (Note 8) ............................................... –0.3V to 16V
SW1 SW2
DIFFP, DIFFN.......................................... –0.3V to INTV
IN
V
CC
, V
................................................... –1V to 16V
COMP1, COMP2, V , V (Note 6)........ –0.3V to 2.7V
FB1 FB2
PGOOD1, PGOOD2, RUN1, RUN2,
INTV Peak Output Current ................................100mA
Internal Operating Temperature Range
(Note 2) ............................................. –40°C to 125°C
Storage Temperature Range................... –55°C to 125°C
Peak Package Body Temperature .......................... 245°C
CC
INTV , EXTV ........................................... –0.3V to 6V
CC
CC
MODE_PLLIN, f , TRACK1, TRACK2,
SET
DIFFOUT, PHASMD................................ –0.3V to INTV
CC
V
, V
, V
, V
(Note 6)........ –0.3V to 6V
OUT1 OUT2 OUTS1 OUTS2
PIN CONFIGURATION
TOP VIEW
TOP VIEW
TEMP
EXTV
CC
TEMP
EXTV
CC
M
L
M
L
V
IN
K
J
K
J
H
G
F
INTV
SW2
PGOOD1
PGOOD2
RUN2
CC
CLKOUT
SW1
H
G
F
INTV
SW2
PGOOD1
PGOOD2
RUN2
CC
CLKOUT
SW1
PHASMD
RUN1
SGND
PHASMD
RUN1
SGND
MODE_PLLIN
DIFFOUT
MODE_PLLIN
GND
COMP1 COMP2
DIFFOUT
GND
COMP1 COMP2
DIFFP
E
DIFFP
DIFFN
E
TRACK1
V
TRACK2
GND
DIFFN
SGND FB2
TRACK1
V
TRACK2
SGND FB2
GND
V
FB1
D
C
B
A
V
FB1
D
C
B
A
V
f
SGND OUTS2
SET
V
f
SGND OUTS2
SET
V
OUTS1
V
OUTS1
V
V
OUT1
OUT2
GND
V
OUT2
GND
1
2
3
4
5
6
7
8
9
10
11
12
1
2
3
4
5
6
7
8
9
10
11
12
LGA PACKAGE
144-LEAD (16mm × 16mm × 4.41mm)
BGA PACKAGE
144-LEAD (16mm × 16mm × 4.41mm)
T
JMAX
= 125°C, Θ = 7°C/W, Θ
= 1.5°C/W, Θ
= 3.7°C/W, Θ + Θ ≅ 7°C/W
JA
JCbottom
JCtop JB JBA
T
JMAX
= 125°C, Θ = 7°C/W, Θ
= 1.5°C/W, Θ
= 3.7°C/W, Θ + Θ ≅ 7°C/W
JA
JCbottom
JCtop
JB
JBA
Θ VALUES DEFINED PER JESD 51-12
Θ VALUES DEFINED PER JESD 51-12
WEIGHT = 3.2g
WEIGHT = 3.2g
ORDER INFORMATION
PARꢄ ꢁARKING*
PACKAGE
ꢄYPE
ꢁSL
RAꢄING
ꢄEꢁPERAꢄURE RANGE
(Note 2)
PARꢄ NUꢁBER
LTM4630EV#PBF
LTM4630IV#PBF
LTM4630EY#PBF
LTM4630IY#PBF
LTM4630IY
PAD OR BALL FINISH
Au (RoHS)
DEVICE
FINISH CODE
LTM4630V
LTM4630V
LTM4630Y
LTM4630Y
LTM4630Y
e4
e4
e1
e1
e0
LGA
LGA
BGA
BGA
BGA
3
3
3
3
3
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
Au (RoHS)
SAC305 (RoHS)
SAC305 (RoHS)
SnPb (63/37)
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
• LGA and BGA Package and Tray Drawings:
www.linear.com/packaging
• Terminal Finish Part Marking:
www.linear.com/leadfree
4630fa
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For more information www.linear.com/LTM4630
LTM4630
ELECTRICAL CHARACTERISTICS ꢄhe l denotes the specifications which apply over the specified internal
operating teꢃperature range. Specified as each individual output channel. ꢄA = 25°C (Note 2), VIN = 12V and VRUN1, VRUN2 at 5V
unless otherwise noted. Per the typical application in Figure 23.
SYꢁBOL
PARAꢁEꢄER
CONDIꢄIONS
ꢁIN
4.5
ꢄYP
ꢁAX
15
UNIꢄS
l
l
l
V
V
Input DC Voltage
Output Voltage
V
V
V
IN
0.6
1.8
OUT
V
V
,
Output Voltage, Total Variation with
Line and Load
1.477
1.5
1.523
C
= 22µF × 3, C
= 100µF × 1 Ceramic,
OUT1(DC)
OUT2(DC)
IN
OUT
470µF POSCAP
= 12V, V
V
IN
= 1.5V, I
= 0A to 18A
OUT
OUT
Input Specifications
V
V
, V
RUN Pin On/Off Threshold
RUN Pin On Hysteresis
RUN Rising
1.1
1.25
150
1
1.40
V
mV
A
RUN1 RUN2
, V
RUN1HYS RUN2HYS
I
Input Inrush Current at Start-Up
I
= 0A, C = 22µF ×3, C = 0.01µF,
OUT
= 12V
INRUSH(VIN)
OUT
C
V
IN
SS
= 100µF ×3, V
= 1.5V, V
= 1.5V,
OUT2
OUT1
IN
I
Input Supply Bias Current
Input Supply Current
V
V
V
= 12V, V
= 12V, V
= 1.5V, Burst Mode Operation
= 1.5V, Pulse-Skipping Mode
3
mA
mA
mA
µA
Q(VIN)
IN
IN
IN
OUT
OUT
15
65
50
= 12V, V = 1.5V, Switching Continuous
OUT
Shutdown, RUN = 0, V = 12V
IN
I
V
IN
V
IN
= 5V, V
= 1.5V, I = 18A
OUT
6
2.6
A
A
S(VIN)
OUT
= 12V, V
= 1.5V, I
= 18A
OUT
OUT
Output Specifications
, I
I
Output Continuous Current Range
Line Regulation Accuracy
V
V
= 12V, V
= 1.5V (Note 7)
0
18
A
OUT1(DC) OUT2(DC)
IN
OUT
l
l
ΔV
ΔV
/V
= 1.5V, V from 4.5V to 15V
0.01
0.5
15
0.025
%/V
OUT1(LINE) OUT1
OUT
IN
/V
I
= 0A for Each Output,
OUT
OUT2(LINE) OUT2
ΔV
ΔV
/V
Load Regulation Accuracy
Output Ripple Voltage
For Each Output, V
V = 12V (Note 7)
IN
= 1.5V, 0A to 18A
0.75
%
OUT1 OUT1
OUT
/V
OUT2 OUT2
V
, V
For Each Output, I
= 0A, C
= 100µF ×3/
IN
mV
P-P
OUT1(AC) OUT2(AC)
OUT
OUT
X7R/Ceramic, 470µF POSCAP, V = 12V,
V
OUT
= 1.5V, Frequency = 450kHz
f (Each Channel)
Output Ripple Voltage Frequency
SYNC Capture Range
V
IN
= 12V, V
= 1.5V, f = 1.25V (Note 4)
500
kHz
kHz
S
OUT
SET
f
400
780
SYNC
(Each Channel)
ΔV
Turn-On Overshoot
Turn-On Time
C
V
= 100µF/X5R/Ceramic, 470µF POSCAP,
10
5
mV
ms
OUTSTART
OUT
OUT
(Each Channel)
= 1.5V, I
= 0A V = 12V
OUT IN
t
C
OUT
= 100µF/X5R/Ceramic, 470µF POSCAP,
START
(Each Channel)
No Load, TRACK/SS with 0.01µF to GND,
V
= 12V
IN
ΔV
Peak Deviation for Dynamic Load
Load: 0% to 50% to 0% of Full Load
30
mV
OUT(LS)
(Each Channel)
C
= 22µF ×3/X5R/Ceramic, 470µF POSCAP
OUT
V
= 12V, V
= 1.5V
OUT
IN
t
Settling Time for Dynamic Load
Step
Load: 0% to 50% to 0% of Full Load,
20
30
µs
A
SETTLE
(Each Channel)
V
= 12V, C
= 100µF, 470µF POSCAP
IN
OUT
I
Output Current Limit
V
IN
= 12V, V
= 1.5V
OUT(PK)
OUT
(Each Channel)
Control Section
l
l
V
, V
Voltage at V Pins
I
= 0A, V = 1.5V
OUT
0.592
0.600
–5
0.606
–20
V
nA
V
FB1 FB2
FB
OUT
I
FB
(Note 6)
V
OVL
Feedback Overvoltage Lockout
0.64
1
0.66
1.25
0.68
1.5
TRACK1 (I),
TRACK2 (I)
Track Pin Soft-Start Pull-Up Current TRACK1 (I),TRACK2 (I) Start at 0V
µA
4630fa
3
For more information www.linear.com/LTM4630
LTM4630
ELECTRICAL CHARACTERISTICS ꢄhe l denotes the specifications which apply over the specified internal
operating teꢃperature range. Specified as each individual output channel. ꢄA = 25°C (Note 2), VIN = 12V and VRUN1, VRUN2 at 5V
unless otherwise noted. Per the typical application in Figure 23.
SYꢁBOL
PARAꢁEꢄER
CONDIꢄIONS
ꢁIN
ꢄYP
3.3
ꢁAX
UNIꢄS
V
UVLO
Undervoltage Lockout (Falling)
UVLO Hysteresis
0.6
V
t
Minimum On-Time
(Note 6)
90
ns
ON(MIN)
R
, R
Resistor Between V
, V
60.05
60.4
60.75
0.3
5
kΩ
FBHI1 FBHI2
OUTS1 OUTS2
and V , V Pins for Each Output
FB1 FB2
V
, V
PGOOD Voltage Low
I
= 2mA
= 5V
0.1
V
PGOOD1 PGOOD2
PGOOD
Low
I
PGOOD Leakage Current
PGOOD Trip Level
V
µA
PGOOD
PGOOD
V
V
V
V
with Respect to Set Output Voltage
Ramping Negative
Ramping Positive
PGOOD
FB
FB
FB
–10
10
%
%
INꢄV Linear Regulator
CC
V
Internal V Voltage
6V < V < 15V
4.8
4.5
5
5.2
2
V
INTVCC
CC
IN
V
INTV Load Regulation
I
CC
= 0mA to 50mA
0.5
%
INTVCC
CC
Load Regulation
V
V
V
EXTV Switchover Voltage
EXTV Ramping Positive
4.7
50
V
mV
mV
EXTVCC
CC
CC
EXTV Dropout
I
CC
= 20mA, V = 5V
EXTVCC
100
EXTVCC(DROP)
EXTVCC(HYST)
CC
EXTV Hysteresis
220
CC
Oscillator and Phase-Locked Loop
Frequency Nominal Nominal Frequency
f
f
f
= 1.2V
450
210
700
9
500
250
780
10
550
290
860
11
kHz
kHz
kHz
µA
SET
SET
SET
Frequency Low
Frequency High
Lowest Frequency
= 0V (Note 5)
> 2.4V, Up to INTV
Highest Frequency
CC
f
Frequency Set Current
MODE_PLLIN Input Resistance
SET
R
250
kΩ
MODE_PLLIN
CLKOUT
Phase (Relative to V
)
PHASMD = GND
PHASMD = Float
PHASMD = INTV
60
90
120
Deg
Deg
Deg
OUT1
CC
CLK High
CLK Low
Clock High Output Voltage
Clock Low Output Voltage
2
V
V
0.2
Differential Aꢃplifier
A Differential
Gain
1
V/V
V
Amplifier
R
Input Resistance
Measured at DIFFP Input
= V = 1.5V, I = 100µA
DIFFOUT
80
kΩ
mV
dB
IN
V
OS
Input Offset Voltage
V
DIFFP
3
DIFFOUT
PSRR Differential
Amplifier
Power Supply Rejection Ratio
5V < V < 15V
90
3
IN
I
CL
Maximum Output Current
Maximum Output Voltage
Gain Bandwidth Product
Diode Connected PNP
Temperature Coefficient
mA
V
V
I
= 300µA
INTV – 1.4
CC
OUT(MAX)
DIFFOUT
GBW
3
MHz
V
V
TEMP
I = 100µA
0.6
l
TC
–2.2
mV/C
4630fa
4
For more information www.linear.com/LTM4630
LTM4630
ELECTRICAL CHARACTERISTICS
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 3: Two outputs are tested separately and the same testing condition
is applied to each output.
Note 4: The switching frequency is programmable from 400kHz to 750kHz.
Note 5: LTM4630 device is designed to operate from 400kHz to 750kHz
Note 6: These parameters are tested at wafer sort.
Note 2: The LTM4630 is tested under pulsed load conditions such that
T ≈ T . The LTM4630E is guaranteed to meet specifications from
J
A
Note 7: See output current derating curves for different V , V
and T .
A
IN OUT
0°C to 125°C internal temperature. Specifications over the –40°C to
125°C internal operating temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTM4630I is guaranteed over the full –40°C to 125°C internal operating
temperature range. Note that the maximum ambient temperature
consistent with these specifications is determined by specific operating
conditions in conjunction with board layout, the rated package thermal
impedance and other environmental factors.
TYPICAL PERFORMANCE CHARACTERISTICS
Dual Phase Single Output Efficiency
vs Output Current, VIN = 12V,
fS = 450kHz
Efficiency vs Output Current,
VIN = 5V, fS = 450kHz
Efficiency vs Output Current,
VIN = 12V, fS = 450kHz
95
90
85
80
75
70
65
95
90
85
80
75
70
65
100
95
90
85
80
75
V
= 1V
V
= 1V
OUT
OUT
OUT
OUT
V
V
V
V
= 1V
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
V
= 1.2V
= 1.5V
= 1.8V
V
= 1.2V
= 1.5V
= 1.8V
= 1.2V
= 1.5V
= 1.8V
V
V
V
V
0
2
4
6
8
10 12 14 16 18
0
5
10 15 20 25 30 35 40
LOAD CURRENT (A)
0
2
4
6
8
10 12 14 16 18
LOAD CURRENT (A)
LOAD CURRENT (A)
4630 G02
4630 G03
4630 G01
Burst ꢁode and Pulse-Skip ꢁode
Efficiency VIN=12V, VOUꢄ = 1.2V,
fS = 450kHz
1V Single Phase Output Load
ꢄransient Response
1.2V Single Phase Output Load
ꢄransient Response
100
90
80
70
60
50
40
30
CCM
Burst Mode OPERATION
PULSE-SKIP MODE
V
V
OUT(AC)
OUT(AC)
50mV/Div
50mV/Div
LOAD STEP
2A/DIV
LOAD STEP
2A/DIV
4630 G05
4630 G06
20µs/DIV
20µs/DIV
12V , 1V , 450kHz, 4.5A LOAD STEP,
12V , 1.2V , 450kHz, 4.5A LOAD STEP,
IN
OUT
IN
OUT
4.5A/µs STEP-UP AND STEP-DOWN
= 1 • 470µF 4V POSCAP + 1 • 100µF
4.5A/µs STEP-UP AND STEP-DOWN
C = 1 • 470µF 4V POSCAP + 1 • 100µF
OUT
0.01
0.1
1
10
C
OUT
LOAD CURRENT (A)
6.3V CERAMIC
6.3V CERAMIC
4630 G04
4630fa
5
For more information www.linear.com/LTM4630
LTM4630
TYPICAL PERFORMANCE CHARACTERISTICS
1.5V Single Phase Output Load
ꢄransient Response
1.8V Single Phase Output Load
ꢄransient Response
Single Phase Start-Up with No load
V
V
V
SW
10V/Div
OUT(AC)
OUT(AC)
50mV/Div
50mV/Div
V
OUT
0.5V/Div
LOAD STEP
2A/DIV
LOAD STEP
2A/DIV
I
IN
0.2A/Div
4630 G07
4630 G08
4630 G09
20µs/DIV
20µs/DIV
20ms/DIV
12V , 1.5V , 450kHz, 4.5A LOAD STEP,
12V , 1.8V , 450kHz, 4.5A LOAD STEP,
12V , 1.2V , 450kHz
IN
OUT
IN
OUT
IN
OUT
4.5A/µs STEP-UP AND STEP-DOWN
4.5A/µs STEP-UP AND STEP-DOWN
C
= 1 • 470µF 4V POSCAP + 1 • 100µF
OUT
C
OUT
= 1 • 470µF 4V POSCAP + 1 • 100µF
C
OUT
= 1 • 470µF 4V POSCAP + 1 • 100µF
6.3V CERAMIC, C = 0.1µF
SS
6.3V CERAMIC
6.3V CERAMIC
Single Phase Short Circuit
Protection with 18A
Single Phase Short Circuit
Protection with No load
Single Phase Start-up with 18A
V
V
SW
SW
V
SW
10V/Div
10V/Div
10V/Div
V
OUT
V
OUT
0.5V/Div
0.5V/Div
V
OUT
0.5V/Div
I
I
I
IN
1A/Div
IN
IN
1A/Div
1A/Div
4630 G10
4630 G11
4630 G12
20ms/DIV
12V , 1.2V , 450kHz
50µs/DIV
12V , 1.2V , 450kHz
50µs/DIV
12V , 1.2V , 450kHz
IN OUT
C = 1 • 470µF 4V POSCAP + 1 • 100µF
OUT
IN
OUT
IN
OUT
6.3V CERAMIC
OUT
C
= 1 • 470µF 4V POSCAP + 1 • 100µF
C
= 1 • 470µF 4V POSCAP + 1 • 100µF
OUT
6.3V CERAMIC, C = 0.1µF
6.3V CERAMIC
SS
4630fa
6
For more information www.linear.com/LTM4630
LTM4630
(Recoꢃꢃended to Use ꢄest Points to ꢁonitor Signal Pin Connections.)
PIN FUNCTIONS
PACKAGE ROW AND COLUꢁN LABELING ꢁAY VARY
AꢁONG µꢁodule PRODUCꢄS. REVIEW EACH PACKAGE
LAYOUꢄ CAREFULLY.
V
(A1-A5, B1-B5, C1-C4): Power Output Pins. Apply
V
, V (D5, D7): The Negative Input of the Error
FB2
OUꢄ1
FB1
outputloadbetweenthesepinsandGNDpins.Recommend
placing output decoupling capacitance directly between
these pins and GND pins. Review Table 4. See Note 8 in
the Electrical Characteristics section for output current
guideline.
Amplifier for Each Channel. Internally, this pin is con-
nected to V
or V
with a 60.4kΩ precision
OUTS1
OUTS2
resistor. Different output voltages can be programmed
with an additional resistor between V and GND pins. In
FB
PolyPhase® operation, tying the V pins together allows
FB
for parallel operation. See the Applications Information
section for details.
GND (A6-A7, B6-B7, D1-D4, D9-D12, E1-E4, E10-E12,
F1-F3, F10-F12, G1, G3, G10, G12, H1-H7, H9-H12, J1,
J5, J8, J12, K1, K5-K8, K12, L1, L12, ꢁ1 , ꢁ12): Power
Ground Pins for Both Input and Output Returns.
ꢄRACK1, ꢄRACK2 (E5, D8): Output Voltage Tracking Pin
and Soft-Start Inputs. Each channel has a 1.3µA pull-up
current source. When one channel is configured to be
master of the two channels, then a capacitor from this pin
to ground will set a soft-start ramp rate. The remaining
channel can be set up as the slave, and have the master’s
output applied through a voltage divider to the slave
output’s track pin. This voltage divider is equal to the
slave output’s feedback divider for coincidental tracking.
See the Applications Information section.
V
(A8-A12, B8-B12, C9-C12): Power Output Pins.
OUꢄ2
Apply output load between these pins and GND pins.
Recommend placing output decoupling capacitance di-
rectly between these pins and GND pins. Review Table 4.
See Note 8 in the Electrical Characteristics section for
output current guideline.
V
, V
(C5, C8): This pin is connected to the top
OUꢄS1 OUꢄS2
of the internal top feedback resistor for each output. The
pin can be directly connected to its specific output, or
connected to DIFFOUT when the remote sense amplifier
COꢁP1, COꢁP2 (E6, E7): Current control threshold and
error amplifier compensation point for each channel. The
current comparator threshold increases with this control
voltage. Tie the COMP pins together for parallel operation.
The device is internal compensated.
is used. In paralleling modules, one of the V
pins is
OUTS
connectedtotheDIFFOUTpininremotesensingordirectly
to V with no remote sensing. It is very important to
OUT
connect these pins to either the DIFFOUT or V
since
DIFFP (E8): Positive input of the remote sense amplifier.
Thispinisconnectedtotheremotesensepointoftheoutput
voltage. See the Applications Information section.
OUT
this is the feedback path, and cannot be left open. See the
Applications Information section.
f
(C6): Frequency Set Pin. A 10µA current is sourced
DIFFN (E9): Negative input of the remote sense amplifier.
This pin is connected to the remote sense point of the
output GND. See the Applications Information section.
SEꢄ
from this pin. A resistor from this pin to ground sets a
voltage that in turn programs the operating frequency.
Alternatively, this pin can be driven with a DC voltage
that can set the operating frequency. See the Applications
Information section.
ꢁODE_PLLIN (F4): Force Continuous Mode, Burst Mode
Operation, or Pulse-Skipping Mode Selection Pin and
External Synchronization Input to Phase Detector Pin.
Connect this pin to SGND to force both channels into
SGND(C7, D6, G6-G7, F6-F7):SignalGroundPin. Return
ground path for all analog and low power circuitry. Tie a
single connection to the output capacitor GND in the ap-
plication. See layout guidelines in Figure 22.
force continuous mode of operation. Connect to INTV
CC
to enable pulse-skipping mode of operation. Leaving the
pin floating will enable Burst Mode operation. A clock on
the pin will force both channels into continuous mode of
operation and synchronized to the external clock applied
to this pin.
4630fa
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For more information www.linear.com/LTM4630
LTM4630
PIN FUNCTIONS (Recoꢃꢃended to Use ꢄest Points to ꢁonitor Signal Pin Connections.)
RUN1, RUN2 (F5, F9): Run Control Pin. A voltage above
1.25V will turn on each channel in the module. A voltage
below 1.25V on the RUN pin will turn off the related chan-
nel. Each RUN pin has a 1µA pull-up current, once the
RUN pin reaches 1.2V an additional 4.5µA pull-up current
is added to this pin.
PGOOD1, PGOOD2 (G9, G8): Output Voltage Power
Good Indicator. Open drain logic output that is pulled to
ground when the output voltage is not within 10% of
the regulation point.
INꢄV (H8): Internal 5V Regulator Output. The control
CC
circuits and internal gate drivers are powered from this
DIFFOUꢄ (F8): Internal Remote Sense Amplifier Output.
voltage. Decouple this pin to PGND with a 4.7µF low ESR
Connect this pin to V
or V
depending on which
tantalumorceramic.INTV isactivatedwheneitherRUN1
OUTS1
OUTS2
CC
outputisusingremotesense.Inparalleloperationconnect
one of the V pin to DIFFOUT for remote sensing.
or RUN2 is activated.
OUTS
ꢄEꢁP (J6): Onboard General Purpose Temperature Diode
for Monitoring the VBE Junction Voltage Change with
Temperature. See the Applications Information section.
SW1, SW2 (G2, G11): Switching node of each channel
that is used for testing purposes. Also an R-C snubber
network can be applied to reduce or eliminate switch node
ringing, or otherwise leave floating. See the Applications
Information section.
EXꢄV (J7): External power input that is enabled through
CC
a switch to INTV whenever EXTV is greater than 4.7V.
CC
CC
Do not exceed 6V on this input, and connect this pin to
V when operating V on 5V. An efficiency increase will
PHASꢁD(G4):ConnectthispintoSGND,INTV ,orfloat-
CC
IN
IN
ing this pin to select the phase of CLKOUT to 60 degrees,
occur that is a function of the (V – INTV ) multiplied by
IN
CC
120 degrees, and 90 degrees respectively.
powerMOSFETdrivercurrent.Typicalcurrentrequirement
is 30mA. V must be applied before EXTV , and EXTV
CC
IN
CC
CLKOUꢄ (G5): Clock output with phase control using the
PHASMD pin to enable multiphase operation between
devices. See the Applications Information section.
must be removed before V .
IN
V (ꢁ2-ꢁ11, L2-L11, J2-J4, J9-J11, K2-K4, K9-K11):
IN
Power Input Pins. Apply input voltage between these pins
and GND pins. Recommend placing input decoupling
capacitance directly between V pins and GND pins.
IN
4630fa
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For more information www.linear.com/LTM4630
LTM4630
SIMPLIFIED BLOCK DIAGRAM
PGOOD1
V
IN
4.5V TO 15V
TRACK1
SS CAP
V
IN
C
22µF
25V
C
IN1
IN2
0.1µF
22µF
25V
GND
R
T
V
R
TEMP
CLKOUT
RUN1
IN
= 100µA
V
IN
MTOP1
MBOT1
T
SW1
V
OR TEMP
MONITORS
0.33µH
V
OUT1
OUT1
1.5V
+
18A
MODE_PLLIN
PHASEMD
0.22µF
C
OUT1
GND
V
OUTS1
COMP1
60.4k
V
FB1
INTERNAL
COMP
R
FB1
40.2k
SGND
POWER
CONTROL
PGOOD2
TRACK2
V
IN
INTV
CC
C
22µF
25V
C
22µF
25V
IN3
IN4
SS CAP
0.1µF
4.7µF
EXTV
GND
SW2
CC
MTOP2
MBOT2
0.33µH
V
1.2V
18A
OUT2
V
OUT2
+
RUN2
0.22µF
C
OUT2
GND
V
OUTS2
60.4k
COMP2
V
FB2
+
–
R
FB2
INTERNAL
COMP
60.4k
f
SET
INTERNAL
FILTER
R
FSET
SGND
DIFFOUT
DIFFN
DIFFP
4630 BD
Figure 1. Siꢃplified Lꢄꢁ4630 Block Diagraꢃ
ꢄA = 25°C. Use Figure 1 configuration.
CONDIꢄIONS
DECOUPLING REQUIREMENTS
SYꢁBOL
PARAꢁEꢄER
ꢁIN
ꢄYP
ꢁAX
UNIꢄS
External Input Capacitor Requirement
C
C
C
(V = 4.5V to 15V, V
= 1.5V)
= 1.2V)
I
I
= 18A
= 18A
44
44
µF
µF
IN1, IN2
IN1
OUT1
OUT2
OUT1
OUT2
C
(V = 4.5V to 15V, V
IN2
IN3, IN4
External Output Capacitor Requirement
C
C
(V = 4.5V to 15V, V
= 1.5V)
= 1.2V)
I
I
= 18A
= 18A
400
400
µF
µF
OUT1
OUT2
IN1
OUT1
OUT2
OUT1
OUT2
(V = 4.5V to 15V, V
IN2
4630fa
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For more information www.linear.com/LTM4630
LTM4630
OPERATION
Power ꢁodule Description
used for soft-starting the regulator. See the Applications
Information section.
The LTM4630 is a dual-output standalone nonisolated
switching mode DC/DC power supply. It can provide two
18A outputs with few external input and output capacitors
and setup components. This module provides precisely
regulated output voltages programmable via external
TheLTM4630isinternallycompensatedtobestableoverall
operatingconditions.Table4providesaguidelineforinput
and output capacitances for several operating conditions.
TheLinearTechnologyµModulePowerDesignToolwillbe
resistors from 0.6V to 1.8V over 4.5V to 15V input
DC
DC
voltages. The typical application schematic is shown in
Figure 23.
provided for transient and stability analysis. The V pin is
FB
used to program the output voltage with a single external
resistor to ground. A differential remote sense amplifier is
available for sensing the output voltage accurately on one
of the outputs at the load point, or in parallel operation
sensing the output voltage at the load point.
TheLTM4630hasdualintegratedconstant-frequencycur-
rent mode regulators and built-in power MOSFET devices
withfastswitchingspeed. Thetypicalswitchingfrequency
is 500kHz. For switching-noise sensitive applications, it
can be externally synchronized from 400kHz to 780kHz. A
resistor can be used to program a free run frequency on
the FSET pin. See the Applications Information section.
Multiphase operation can be easily employed with the
MODE_PLLIN, PHASMD, and CLKOUT pins. Up to 12
phases can be cascaded to run simultaneously with re-
spect to each other by programming the PHASMD pin to
different levels. See the Applications Information section.
With current mode control and internal feedback loop
compensation, the LTM4630 module has sufficient stabil-
ity margins and good transient performance with a wide
range of output capacitors, even with all ceramic output
capacitors.
High efficiency at light loads can be accomplished with
selectable Burst Mode operation or pulse-skipping opera-
tion using the MODE_PLLIN pin. These light load features
willaccommodatebatteryoperation.Efficiencygraphsare
providedforlightloadoperationintheTypicalPerformance
Characteristics section. See the Applications Information
section for details.
Currentmodecontrolprovidescycle-by-cyclefastcurrent
limitandfoldbackcurrentlimitinanovercurrentcondition.
Internal overvoltage and undervoltage comparators pull
the open-drain PGOOD outputs low if the output feedback
voltage exits a 10% window around the regulation point.
As the output voltage exceeds 10% above regulation, the
bottom MOSFET will turn on to clamp the output voltage.
ThetopMOSFETwillbeturnedoff.Thisovervoltageprotect
is feedback voltage referred.
A general purpose temperature diode is included inside
the module to monitor the temperature of the module. See
the Applications Information section for details.
The switch pins are available for functional operation
monitoring and a resistor-capacitor snubber circuit can
be careful placed on the switch pin to ground to dampen
any high frequency ringing on the transition edges. See
the Applications Information section for details.
Pulling the RUN pins below 1.1V forces the regulators
into a shutdown state, by turning off both MOSFETs.
The TRACK pins are used for programming the output
voltage ramp and voltage tracking during start-up or
4630fa
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For more information www.linear.com/LTM4630
LTM4630
APPLICATIONS INFORMATION
The typical LTM4630 application circuit is shown in Fig-
ure 23. External component selection is primarily deter-
mined by the maximum load current and output voltage.
RefertoTable4forspecificexternalcapacitorrequirements
for particular applications.
Inparalleloperation,theV pinshaveanI currentof20nA
FB
FB
maximumeachchannel.Toreduceoutputvoltageerrordue
to this current, an additional V
pin can be tied to V
,
OUTS
OUT
andanadditionalR resistorcanbeusedtolowerthetotal
FB
Thevenin equivalent resistance seen by this current. For
exampleinFigure2,thetotalTheveninequivalentresistance
of the V pin is (60.4k//R ), which is 30.2k where R is
V to V
Step-Down Ratios
IN
OUꢄ
FB
FB
FB
equal to 60.4k for a 1.2V output. Four phases connected
in parallel equates to a worse case feedback current of
There are restrictions in the maximum V and V
step-
IN
OUT
down ratio that can be achieved for a given input voltage.
Each output of the LTM4630 is capable of 98% duty cycle,
4 • I = 80nA maximum. The voltage error is 80nA • 30.2k
FB
= 2.4mV. If V
is connected, as shown in Figure 2, to
OUTS2
but the V to V
minimum dropout is still shown as a
IN
OUT
V
,andanother60.4kresistorisconnectedfromV to
OUT
FB2
function of its load current and will limit output current
capability related to high duty cycle on the top side switch.
ground, then the voltage error is reduced to 1.2mV. If the
voltage error is acceptable then no additional connections
arenecessary.Theonboard60.4kresistoris0.5%accurate
Minimum on-time t
is another consideration in
ON(MIN)
operating at a specified duty cycle while operating at a
certain frequency due to the fact that t < D/f
and the V resistor can be chosen by the user to be as
FB
,
SW
ON(MIN)
accurate as needed. All COMP pins are tied together for
current sharing between the phases. The TRACK/SS pins
can be tied together and a single soft-start capacitor can
be used to soft-start the regulator. The soft-start equation
willneedtohavethesoft-startcurrentparameterincreased
by the number of paralleled channels. See Output Voltage
Tracking section.
where D is duty cycle and f is the switching frequency.
SW
t
is specified in the electrical parameters as 90ns.
ON(MIN)
Output Voltage Prograꢃꢃing
ThePWMcontrollerhasaninternal0.6Vreferencevoltage.
AsshownintheBlockDiagram,a60.4kΩinternalfeedback
resistor connects between the V
to V and V
OUTS1
FB1 OUTS2
to V . It is very important that these pins be connected
FB2
to their respective outputs for proper feedback regulation.
4 PARALLELED OUTPUTS
LTM4630
60.4k
V
V
COMP1
COMP2
OUT1
OUT2
FOR 1.2V AT 70A
OvervoltagecanoccuriftheseV
andV
pinsare
OUTS1
OUTS2
left floating when used as individual regulators, or at least
one of them is used in paralleled regulators. The output
voltage will default to 0.6V with no feedback resistor on
V
OUTS1
OUTS2
V
OPTIONAL CONNECTION
V
FB1
either V or V . Adding a resistor R from V pin to
FB1
FB2
FB
FB
60.4k
TRACK1
TRACK2
GND programs the output voltage:
V
FB2
60.4k+ RFB
OPTIONAL
FB
60.4k
VOUT = 0.6V •
R
RFB
LTM4630
60.4k
V
COMP1
COMP2
OUT1
OUT2
V
ꢄable 1. VFB Resistor ꢄable vs Various Output Voltages
USE TO LOWER
V
V
OUTS1
OUTS2
TOTAL EQUIVALENT
RESISTANCE TO LOWER
V
0.6V
1.0V
1.2V
1.5V
1.8V
30.2k
OUꢄ
R
Open
90.9k
60.4k
40.2k
I
FB
VOLTAGE ERROR
FB
V
FB1
For parallel operation of multiple channels the same feed-
back setting resistor can be used for the parallel design.
60.4k
TRACK1
TRACK2
V
FB2
0.1µF
R
FB
60.4k
This is done by connecting the V
to the output as
OUTS1
4630 F02
shown in Figure 2, thus tying one of the internal 60.4k
resistors to the output. All of the V pins tie together with
FB
Figure 2. 4-Phase Parallel Configurations
one programming resistor as shown in Figure 2.
4630fa
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For more information www.linear.com/LTM4630
LTM4630
APPLICATIONS INFORMATION
Input Capacitors
µModule Power Design Tool will be provided for stability
analysis.Multiphaseoperationwillreduceeffectiveoutput
ripple as a function of the number of phases. Application
Note 77 discusses this noise reduction versus output
ripple current cancellation, but the output capacitance
should be considered carefully as a function of stability
and transient response. The Linear Technology µModule
Power Design Tool can calculate the output ripple reduc-
tion as the number of implemented phases increases by
N times. A small value 10Ω to 50Ω resistor can be place
The LTM4630 module should be connected to a low ac-
impedance DC source. For the regulator input four 22µF
input ceramic capacitors are used for RMS ripple current.
A47µFto100µFsurfacemountaluminumelectrolyticbulk
capacitor can be used for more input bulk capacitance.
This bulk input capacitor is only needed if the input source
impedanceiscompromisedbylonginductiveleads,traces
ornotenoughsourcecapacitance.Iflowimpedancepower
planes are used, then this bulk capacitor is not needed.
in series from V
to the V
pin to allow for a bode
OUT
OUTS
For a buck converter, the switching duty-cycle can be
estimated as:
plot analyzer to inject a signal into the control loop and
validate the regulator stability. The same resistor could
be place in series from V
to DIFFP and a bode plot
OUT
VOUT
V
IN
analyzer could inject a signal into the control loop and
validate the regulator stability.
D =
Without considering the inductor current ripple, for each
output, the RMS current of the input capacitor can be
estimated as:
Burst ꢁode Operation
The LTM4630 is capable of Burst Mode operation on each
regulator in which the power MOSFETs operate intermit-
tently based on load demand, thus saving quiescent cur-
rent. For applications where maximizing the efficiency at
very light loads is a high priority, Burst Mode operation
should be applied. Burst Mode operation is enabled with
the MODE_PLLIN pin floating. During this operation, the
peak current of the inductor is set to approximately one
third of the maximum peak current value in normal opera-
tion even though the voltage at the COMP pin indicates
a lower value. The voltage at the COMP pin drops when
the inductor’s average current is greater than the load
requirement. As the COMP voltage drops below 0.5V, the
BURST comparator trips, causing the internal sleep line
to go high and turn off both power MOSFETs.
IOUT(MAX)
ICIN(RMS)
=
• D• 1− D
(
)
η%
In the above equation, η% is the estimated efficiency of
the power module. The bulk capacitor can be a switcher-
rated electrolytic aluminum capacitor, Polymer capacitor.
Output Capacitors
The LTM4630 is designed for low output voltage ripple
noise and good transient response. The bulk output
capacitors defined as C
are chosen with low enough
OUT
effective series resistance (ESR) to meet the output volt-
age ripple and transient requirements. C can be a low
OUT
ESR tantalum capacitor, the low ESR polymer capacitor
or ceramic capacitor. The typical output capacitance range
for each output is from 200µF to 470µF. Additional output
filtering may be required by the system designer, if further
reduction of output ripples or dynamic transient spikes
is required. Table 4 shows a matrix of different output
voltages and output capacitors to minimize the voltage
droop and overshoot during a 4.5A/µs transient. The table
optimizes total equivalent ESR and total bulk capacitance
tooptimizethetransientperformance.Stabilitycriteriaare
consideredintheTable4matrix,andtheLinearTechnology
In sleep mode, the internal circuitry is partially turned off,
reducing the quiescent current to about 450µA for each
output. The load current is now being supplied from the
output capacitors. When the output voltage drops, caus-
ing COMP to rise above 0.5V, the internal sleep line goes
low, and the LTM4630 resumes normal operation. The
next oscillator cycle will turn on the top power MOSFET
and the switching cycle repeats. Either regulator can be
configured for Burst Mode operation.
4630fa
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For more information www.linear.com/LTM4630
LTM4630
APPLICATIONS INFORMATION
Pulse-Skipping ꢁode Operation
(floating) generates a phase difference (between
MODE_PLLIN and CLKOUT) of 120 degrees, 60 degrees,
or 90 degrees respectively. A total of 12 phases can be
cascadedtorunsimultaneouslywithrespecttoeachother
byprogrammingthePHASMDpinofeachLTM4630chan-
nel to different levels. Figure 3 shows a 2-phase design,
4-phase design and a 6-phase design example for clock
phasing with the PHASMD table.
In applications where low output ripple and high effi-
ciencyatintermediatecurrentsaredesired,pulse-skipping
mode should be used. Pulse-skipping operation allows
the LTM4630 to skip cycles at low output loads, thus
increasing efficiency by reducing switching loss. Tying
the MODE_PLLIN pin to INTV enables pulse-skipping
CC
operation. At light loads the internal current comparator
may remain tripped for several cycles and force the top
MOSFETtostayoffforseveralcycles,thusskippingcycles.
The inductor current does not reverse in this mode. This
modewillmaintainhighereffectivefrequenciesthuslower
output ripple and lower noise than Burst Mode operation.
Eitherregulatorcanbeconfiguredforpulse-skippingmode.
A multiphase power supply significantly reduces the
amount of ripple current in both the input and output ca-
pacitors. The RMS input ripple current is reduced by, and
the effective ripple frequency is multiplied by, the number
of phases used (assuming that the input voltage is greater
thanthenumberofphasesusedtimestheoutputvoltage).
Theoutputrippleamplitudeisalsoreducedbythenumber
of phases used when all of the outputs are tied together
to achieve a single high output current design.
Forced Continuous Operation
In applications where fixed frequency operation is more
critical than low current efficiency, and where the lowest
output ripple is desired, forced continuous operation
should be used. Forced continuous operation can be
enabled by tying the MODE_PLLIN pin to GND. In this
mode, inductor current is allowed to reverse during low
output loads, the COMP voltage is in control of the current
comparator threshold throughout, and the top MOSFET
alwaysturnsonwitheachoscillatorpulse.Duringstart-up,
forced continuous mode is disabled and inductor current
is prevented from reversing until the LTM4630’s output
voltage is in regulation. Either regulator can be configured
for force continuous mode.
The LTM4630 device is an inherently current mode con-
trolled device, so parallel modules will have very good
current sharing. This will balance the thermals on the
design. Figure 26 shows an example of parallel operation
and pin connection.
Input RꢁS Ripple Current Cancellation
Application Note 77 provides a detailed explanation of
multiphaseoperation.TheinputRMSripplecurrentcancel-
lationmathematicalderivationsarepresented,andagraph
isdisplayedrepresentingtheRMSripplecurrentreduction
asafunctionofthenumberofinterleavedphases. Figure4
shows this graph.
ꢁultiphase Operation
For output loads that demand more than 18A of current,
two outputs in LTM4630 or even multiple LTM4630s can
be paralleled to run out of phase to provide more output
currentwithoutincreasinginputandoutputvoltageripples.
The MODE_PLLIN pin allows the LTM4630 to synchronize
to an external clock (between 400kHz and 780kHz) and
theinternalphase-locked-loopallowstheLTM4630tolock
onto incoming clock phase as well. The CLKOUT signal
can be connected to the MODE_PLLIN pin of the following
stage to line up both the frequency and the phase of the
Frequency Selection and Phase-Lock Loop
(ꢁODE_PLLIN and f Pins)
SEꢄ
TheLTM4630deviceisoperatedoverarangeoffrequencies
toimprovepowerconversionefficiency.Itisrecommended
to operate the module at 500kHz over the output range for
the best efficiency and inductor current ripple
The LTM4630 switching frequency can be set with an
external resistor from the f
pin to SGND. An accurate
SET
10µA current source into the resistor will set a voltage
that programs the frequency or a DC voltage can be
entiresystem. TyingthePHASMDpintoINTV , SGND, or
CC
4630fa
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For more information www.linear.com/LTM4630
LTM4630
APPLICATIONS INFORMATION
2-PHASE DESIGN
PHASMD SGND FLOAT INTV
CC
FLOAT
CONTROLLER1
CONTROLLER2
CLKOUT
0
0
0
CLKOUT
180
60
180
90
240
120
MODE_PLLIN
0 PHASE
180 PHASE
V
V
OUT2
OUT1
PHASMD
4-PHASE DESIGN
90 DEGREE
CLKOUT
CLKOUT
MODE_PLLIN
MODE_PLLIN
0 PHASE
FLOAT
180 PHASE
90 PHASE
270 PHASE
V
V
V
OUT1
V
OUT2
OUT1
OUT2
FLOAT
PHASMD
PHASMD
6-PHASE DESIGN
60 DEGREE
60 DEGREE
CLKOUT
MODE_PLLIN
CLKOUT
CLKOUT
MODE_PLLIN
MODE_PLLIN
0 PHASE
SGND
180 PHASE
60 PHASE
SGND
240 PHASE
120 PHASE
FLOAT
300 PHASE
V
OUT1
V
V
V
V
OUT1
V
OUT2
OUT2
OUT1
OUT2
PHASMD
PHASMD
PHASMD
4630 F03
Figure 3. Eꢂaꢃples of 2-Phase, 4-Phase, and 6-Phase Operation with PHASꢁD ꢄable
0.60
1-PHASE
2-PHASE
3-PHASE
4-PHASE
6-PHASE
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7 0.75 0.8 0.85 0.9
DUTY FACTOR (V /V
)
OUT IN
4630 F04
Figure 4. Input RꢁS Current Ratios to DC Load Current as a Function of Duty Cycle
4630fa
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For more information www.linear.com/LTM4630
LTM4630
APPLICATIONS INFORMATION
applied. Figure 5 shows a graph of frequency setting
Low duty cycle applications may approach this minimum
on-time limit and care should be taken to ensure that:
verses programming voltage. An external clock can be
applied to the MODE_PLLIN pin from 0V to INTV over
CC
VOUT
V •FREQ
IN
a frequency range of 400kHz to 780kHz. The clock input
high threshold is 1.6V and the clock input low threshold
is 1V. The LTM4630 has the PLL loop filter components
on board. The frequency setting resistor should always
be present to set the initial switching frequency before
locking to an external clock. Both regulators will operate
in continuous mode while being externally clock.
> tON(MIN)
If the duty cycle falls below what can be accommodated
by the minimum on-time, the controller will begin to skip
cycles. The output voltage will continue to be regulated,
buttheoutputrippleandcurrentwillincrease.Theon-time
can be increased by lowering the switching frequency. A
good rule of thumb is to keep on-time longer than 110ns.
The output of the PLL phase detector has a pair of comple-
mentary current sources that charge and discharge the
internal filter network. When the external clock is applied
Output Voltage ꢄracking
then the f
frequency resistor is disconnected with
Output voltage tracking can be programmed externally
using the TRACK pins. The output can be tracked up and
downwithanotherregulator.Themasterregulator’soutput
is divided down with an external resistor divider that is the
same as the slave regulator’s feedback divider to imple-
ment coincident tracking. The LTM4630 uses an accurate
60.4k resistor internally for the top feedback resistor for
each channel. Figure 6 shows an example of coincident
tracking. Equations:
SET
an internal switch, and the current sources control the
frequency adjustment to lock to the incoming external
clock. When no external clock is applied, then the internal
switch is on, thus connecting the external f frequency
SET
set resistor for free run operation.
900
800
700
600
500
400
300
200
100
0
60.4k
RTA
SLAVE = 1+
• V
TRACK
V
V
is the track ramp applied to the slave’s track pin.
has a control range of 0V to 0.6V, or the internal
TRACK
TRACK
reference voltage. When the master’s output is divided
down with the same resistor values used to set the slave’s
output, then the slave will coincident track with the master
until it reaches its final value. The master will continue to
its final value from the slave’s regulation point. Voltage
0
0.5
1
1.5
2
2.5
f
PIN VOLTAGE (V)
SET
4630 F05
Figure 5. Operating Frequency vs fSEꢄ Pin Voltage
tracking is disabled when V
is more than 0.6V. R
TRACK
TA
in Figure 6 will be equal to the R for coincident tracking.
FB
Figure 7 shows the coincident tracking waveforms.
ꢁiniꢃuꢃ On-ꢄiꢃe
The TRACK pin of the master can be controlled by a
capacitor placed on the master regulator TRACK pin to
ground. A 1.3µA current source will charge the TRACK
pin up to the reference voltage and then proceed up
Minimum on-time t is the smallest time duration that
ON
the LTM4630 is capable of turning on the top MOSFET on
either channel. It is determined by internal timing delays,
and the gate charge required turning on the top MOSFET.
4630fa
15
For more information www.linear.com/LTM4630
LTM4630
APPLICATIONS INFORMATION
INTV
CC
C10
4.7µF
R2
10k
PGOOD
MODE_PLLIN CLKOUT INTV
EXTV
PGOOD1
CC
CC
4V TO 15V INTERMEDIATE BUS
1.5V AT 18A
V
V
OUT1
IN
C4
22µF
25V
C3
22µF
25V
C2
22µF
25V
C1
22µF
25V
C6
100µF
6.3V
C8
R1*
10k
R6
100k
TEMP
V
OUTS1
SW1
470µF
6.3V
RUN1
RUN2
V
V
FB1
FB2
TRACK1
TRACK2
D1*
5.1V ZENER
MASTER
LTM4630
R
FB
60.4k
40.2k
COMP1
COMP2
C
SS
0.1µF
R
R
TA
TB
f
SET
1.2V AT 18A
60.4k
60.4k
PHASMD
V
OUTS2
SLAVE
V
OUT2
SW2
1.5V
C5
100µF
6.3V
C7
470µF
6.3V
R4
121k
PGOOD
PGOOD2
DIFFN DIFFOUT
INTV
SGND
GND
DIFFP
CC
R9
10k
RAMP TIME
t
= (C /1.3µA) • 0.6
SOFTSTART
* PULL-UP RESISTOR AND ZENER ARE OPTIONAL.
SS
4630 F06
Figure 6. Eꢂaꢃple of Output ꢄracking Application Circuit
RegardlessofthemodeselectedbytheMODE_PLLINpin,
the regulator channels will always start in pulse-skipping
mode up to TRACK = 0.5V. Between TRACK = 0.5V and
0.54V, it will operate in forced continuous mode and revert
totheselectedmodeonceTRACK>0.54V. Inordertotrack
with another channel once in steady state operation, the
LTM4630 is forced into continuous mode operation as
MASTER OUTPUT
SLAVE OUTPUT
soon as V is below 0.54V regardless of the setting on
FB
the MODE_PLLIN pin.
Ratiometric tracking can be achieved by a few simple
calculationsandtheslewratevalueappliedtothemaster’s
TRACK pin. As mentioned above, the TRACK pin has a
control range from 0 to 0.6V. The master’s TRACK pin
slew rate is directly equal to the master’s output slew rate
in Volts/Time. The equation:
TIME
4630 F07
Figure 7. Output Coincident ꢄracking Waveforꢃ
to INTVCC. After the 0.6V ramp, the TRACK pin will no
longer be in control, and the internal voltage reference
will control output regulation from the feedback divider.
Foldback current limit is disabled during this sequence
of turn-on during tracking or soft-starting. The TRACK
pins are pulled low when the RUN pin is below 1.2V. The
total soft-start time can be calculated as:
MR
SR
• 60.4k = RTB
where MR is the master’s output slew rate and SR is the
slave’s output slew rate in Volts/Time. When coincident
CSS
1.3µA
tSOFT-START
=
• 0.6
4630fa
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LTM4630
APPLICATIONS INFORMATION
Run Enable
tracking is desired, then MR and SR are equal, thus R
TB
is equal the 60.4k. R is derived from equation:
TA
TheRUNpinshaveanenablethresholdof1.4Vmaximum,
typically1.25Vwith150mVofhysteresis. Theycontrolthe
turnoneachofthechannelsandINTV .Thesepinscanbe
pulleduptoV for5Voperation,ora5VZenerdiodecanbe
placedonthepinsanda10kto100kresistorcanbeplaced
up to higher than 5V input for enabling the channels. The
RUN pins can also be used for output voltage sequencing.
In parallel operation the RUN pins can be tie together and
controlled from a single control. See the Typical Applica-
tion circuits in Figure 23.
0.6V
RTA
=
CC
V
V
VTRACK
RTB
FB
FB
+
−
IN
60.4k RFB
where V is the feedback voltage reference of the regula-
FB
tor, and V
is 0.6V. Since R is equal to the 60.4k
TRACK
TB
top feedback resistor of the slave regulator in equal slew
rate or coincident tracking, then R is equal to R with
TA
FB
V
= V
. Therefore R = 60.4k, and R = 60.4k in
TRACK TB TA
FB
Figure 6.
INꢄV and EXꢄV
CC
CC
Inratiometrictracking, adifferentslewratemaybedesired
The LTM4630 module has an internal 5V low dropout
regulator that is derived from the input voltage. This regu-
lator is used to power the control circuitry and the power
MOSFET drivers. This regulator can source up to 70mA,
and typically uses ~30mA for powering the device at the
maximum frequency. This internal 5V supply is enabled
by either RUN1 or RUN2.
for the slave regulator. R can be solved for when SR is
TB
slower than MR. Make sure that the slave supply slew rate
ischosentobefastenoughsothattheslaveoutputvoltage
will reach it final value before the master output.
For example, MR = 1.5V/1ms, and SR = 1.2V/1ms. Then
R
TB
= 76.8k. Solve for R to equal to 49.9k.
TA
EXTV allowsanexternal5VsupplytopowertheLTM4630
andreducepowerdissipationfromtheinternallowdropout
5V regulator. The power loss savings can be calculated by:
Each of the TRACK pins will have the 1.3µA current source
on when a resistive divider is used to implement tracking
on that specific channel. This will impose an offset on the
TRACK pin input. Smaller values resistors with the same
ratios as the resistor values calculated from the above
equation can be used. For example, where the 60.4k is
used then a 6.04k can be used to reduce the TRACK pin
offset to a negligible value.
CC
(V – 5V) • 30mA = PLOSS
IN
EXTV has a threshold of 4.7V for activation, and a
CC
maximum rating of 6V. When using a 5V input, connect
this 5V input to EXTV also to maintain a 5V gate drive
CC
level. EXTV must sequence on after V , and EXTV
CC
IN
CC
must sequence off before V .
IN
Power Good
The PGOOD pins are open drain pins that can be used to
monitor valid output voltage regulation. This pin monitors
a 10% window around the regulation point. A resistor can
be pulled up to a particular supply voltage no greater than
6V maximum for monitoring.
Differential Reꢃote Sense Aꢃplifier
Anaccuratedifferentialremotesenseamplifierisprovided
to sense low output voltages accurately at the remote
load points. This is especially true for high current loads.
The amplifier can be used on one of the two channels, or
on a single parallel output. It is very important that the
DIFFP and DIFFN are connected properly at the output,
and DIFFOUT is connected to either V
In parallel operation, the DIFFP and DIFFN are connected
properly at the output, and DIFFOUT is connected to
Stability Coꢃpensation
The module has already been internally compensated
for all output voltages. Table 4 is provided for most ap-
plication requirements. The Linear Technology µModule
Power Design Tool will be provided for other control loop
optimization.
or V
.
OUTS1
OUTS2
one of the V
pins. Review the parallel schematics in
OUTS
Figure 24 and review Figure 2.
4630fa
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For more information www.linear.com/LTM4630
LTM4630
APPLICATIONS INFORMATION
SW Pins
where V is the thermal voltage (kT/q), and n, the ideality
T
factor, is 1 for the diode connected PNP transistor be-
The SW pins are generally for testing purposes by moni-
toring these pins. These pins can also be used to dampen
out switch node ringing caused by LC parasitic in the
switched current paths. Usually a series R-C combina-
tion is used called a snubber circuit. The resistor will
dampen the resonance and the capacitor is chosen to
only affect the high frequency ringing across the resistor.
If the stray inductance or capacitance can be measured or
approximated then a somewhat analytical technique can
be used to select the snubber values. The inductance is
usuallyeasiertopredict.Itcombinesthepowerpathboard
inductance in combination with the MOSFET interconnect
bond wire inductance.
ing used in the LTM4630. I is expressed by the typical
S
empirical equation:
–VG0
VT
IS = I0 exp
where I is a process and geometry dependent current, (I
0
0
is typically around 20k orders of magnitude larger than I
S
at room temperature) and V is the band gap voltage of
G0
1.2V extrapolated to absolute zero or –273°C.
If we take the I equation and substitute into the V equa-
S
D
tion, then we get:
First the SW pin can be monitored with a wide bandwidth
scope with a high frequency scope probe. The ring fre-
quency can be measured for its value. The impedance Z
can be calculated:
kT
q
I0
kT
q
VD = VG0 –
ln
, VT =
I
D
The expression shows that the diode voltage decreases
(linearly if I were constant) with increasing temperature
and constant diode current. Figure 6 shows a plot of V
vs Temperature over the operating temperature range of
0
ZL = 2πfL,
D
where f is the resonant frequency of the ring, and L is the
total parasitic inductance in the switch path. If a resistor
is selected that is equal to Z, then the ringing should be
dampened. The snubber capacitor value is chosen so that
its impedance is equal to the resistor at the ring frequency.
Calculatedby:ZC=1/(2πfC).Thesevaluesareagoodplace
to start with. Modification to these components should
be made to attenuate the ringing with the least amount
of power loss.
the LTM4630.
If we take this equation and differentiate it with respect to
temperature T, then:
dVD
dT
VG0 – VD
T
= –
This dV /dT term is the temperature coefficient equal to
about –2mV/K or –2mV/°C. The equation is simplified for
the first order derivation.
D
ꢄeꢃperature ꢁonitoring
A diode connected PNP transistor is used for the TEMP
monitor function by monitoring its voltage over tempera-
ture. The temperature dependence of this diode voltage
can be understood in the equation:
Solving for T, T = –(V – V )/(dV /dT) provides the
G0
D
D
temperature.
1st Example: Figure 8 for 27°C, or 300K the diode
voltage is 0.598V, thus, 300K = –(1200mV – 598mV)/
–2.0 mV/K)
ID
VD = nVT ln
I
2nd Example: Figure 8 for 75°C, or 350K the diode
voltage is 0.50V, thus, 350K = –(1200mV – 500mV)/
–2.0mV/K)
S
4630fa
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For more information www.linear.com/LTM4630
LTM4630
APPLICATIONS INFORMATION
Converting the Kelvin scale to Celsius is simply taking the
Kelvin temp and subtracting 273 from it.
the µModule regulator’s thermal performance in their ap-
plicationatvariouselectricalandenvironmentaloperating
conditions to compliment any FEA activities. Without FEA
software, the thermal resistances reported in the Pin Con-
figuration section are in-and-of themselves not relevant to
providing guidance of thermal performance; instead, the
derating curves provided in the data sheet can be used in
a manner that yields insight and guidance pertaining to
one’s application-usage, and can be adapted to correlate
thermal performance to one’s own application.
A typical forward voltage is given in the electrical charac-
teristics section of the data sheet, and Figure 6 is the plot
of this forward voltage. Measure this forward voltage at
27°C to establish a reference point. Then using the above
expression while measuring the forward voltage over
temperature will provide a general temperature monitor.
Connect a resistor between TEMP and V to set the cur-
IN
rent to 100µA. See Figure 24 for an example.
The Pin Configuration section typically gives four thermal
coefficients explicitly defined in JESD 51-12; these coef-
ficients are quoted or paraphrased below:
0.8
I
= 100µA
D
0.7
0.6
0.5
0.4
0.3
1. θ , the thermal resistance from junction to ambient, is
JA
the natural convection junction-to-ambient air thermal
resistance measured in a one cubic foot sealed enclo-
sure.Thisenvironmentissometimesreferredtoas“still
air”althoughnaturalconvectioncausestheairtomove.
This value is determined with the part mounted to a
JESD 51-9 defined test board, which does not reflect
an actual application or viable operating condition.
–50 –25
0
25
50
75 100 125
TEMPERATURE (°C)
4630 F08
2. θ
, the thermal resistance from junction to the
JCbottom
Figure 8. Diode Voltage VD vs ꢄeꢃperature ꢄ(K)
for Different Bias Currents
bottom of the product case, is the junction-to-board
thermal resistance with all of the component power
dissipation flowing through the bottom of the package.
In the typical µModule, the bulk of the heat flows out
the bottom of the package, but there is always heat
flow out into the ambient environment. As a result, this
thermal resistance value may be useful for comparing
packages but the test conditions don’t generally match
the user’s application.
ꢄherꢃal Considerations and Output Current Derating
The thermal resistances reported in the Pin Configuration
section of the data sheet are consistent with those param-
eters defined by JESD51-9 and are intended for use with
finite element analysis (FEA) software modeling tools that
leverage the outcome of thermal modeling, simulation,
and correlation to hardware evaluation performed on a
µModulepackagemountedtoahardwaretestboard—also
defined by JESD51-9 (“Test Boards for Area Array Surface
MountPackageThermalMeasurements”).Themotivation
for providing these thermal coefficients is found in JESD
51-12 (“Guidelines for Reporting and Using Electronic
Package Thermal Information”).
3. θ
, the thermal resistance from junction to top of
JCTOP
the product case, is determined with nearly all of the
component power dissipation flowing through the top
of the package. As the electrical connections of the
typical µModule are on the bottom of the package, it
is rare for an application to operate such that most of
the heat flows from the junction to the top of the part.
As in the case of θ
, this value may be useful
JCBOTTOM
Many designers may opt to use laboratory equipment
and a test vehicle such as the demo board to anticipate
for comparing packages but the test conditions don’t
generally match the user’s application.
4630fa
19
For more information www.linear.com/LTM4630
LTM4630
APPLICATIONS INFORMATION
4. θ , the thermal resistance from junction to the printed
relative to different junctions of components or die are not
exactly linear with respect to total package power loss. To
reconcile this complication without sacrificing modeling
simplicity—but also, not ignoring practical realities—an
approach has been taken using FEA software modeling
along with laboratory testing in a controlled-environment
chamber to reasonably define and correlate the thermal
resistance values supplied in this data sheet: (1) Initially,
FEA software is used to accurately build the mechanical
geometry of the µModule and the specified PCB with all
of the correct material coefficients along with accurate
power loss source definitions; (2) this model simulates
a software-defined JEDEC environment consistent with
JSED51-9topredictpowerlossheatflowandtemperature
readingsatdifferentinterfacesthatenablethecalculationof
theJEDEC-definedthermalresistancevalues;(3)themodel
and FEA software is used to evaluate the µModule with
heat sink and airflow; (4) having solved for and analyzed
these thermal resistance values and simulated various
operating conditions in the software model, a thorough
laboratory evaluation replicates the simulated conditions
with thermocouples within a controlled-environment
chamberwhileoperatingthedeviceatthesamepowerloss
as that which was simulated. An outcome of this process
and due-diligence yields a set of derating curves provided
in other sections of this data sheet. After these laboratory
test have been performed and correlated to the µModule
JB
circuitboard,isthejunction-to-boardthermalresistance
wherealmostalloftheheatflowsthroughthebottomof
the µModule and into the board, and is really the sum of
the θ
and the thermal resistance of the bottom
JCbottom
of the part through the solder joints and through a por-
tion of the board. The board temperature is measured a
specified distance from the package, using a two sided,
two layer board. This board is described in JESD 51-9.
A graphical representation of the aforementioned ther-
mal resistances is given in Figure 9; blue resistances are
contained within the µModule regulator, whereas green
resistances are external to the µModule.
As a practical matter, it should be clear to the reader that
no individual or sub-group of the four thermal resistance
parameters defined by JESD 51-12 or provided in the
Pin Configuration section replicates or conveys normal
operatingconditionsofaµModule.Forexample,innormal
board-mounted applications, never does 100% of the
device’s total power loss (heat) thermally conduct exclu-
sivelythroughthetoporexclusivelythroughbottomofthe
µModule—asthestandarddefinesforθ
andθ
,
JCtop
JCbottom
respectively.Inpractice,powerlossisthermallydissipated
inbothdirectionsawayfromthepackage—granted, inthe
absence of a heat sink and airflow, a majority of the heat
flow is into the board.
model, then the θ and θ are summed together to cor-
JB
BA
Within a SIP (system-in-package) module, be aware there
are multiple power devices and components dissipating
power, with a consequence that the thermal resistances
relatequite wellwith the µModule modelwithno airflowor
heat sinking in a properly define chamber. This θ + θ
JB
BA
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
JUNCTION-TO-CASE (TOP)
RESISTANCE
CASE (TOP)-TO-AMBIENT
RESISTANCE
JUNCTION-TO-BOARD RESISTANCE
JUNCTION
AMBIENT
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
CASE (BOTTOM)-TO-BOARD
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
4630 F10
µMODULE DEVICE
Figure 9. Graphical Representation of JESD51-12 ꢄherꢃal Coefficients
4630fa
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For more information www.linear.com/LTM4630
LTM4630
APPLICATIONS INFORMATION
valueisshowninthePinConfigurationsectionandshould
Power Derating
accurately equal the θ value because approximately
JA
The 1.0V and 1.5V power loss curves in Figures 13 and 14
can be used in coordination with the load current derating
curves in Figures 15 to 22 for calculating an approximate
100% of power loss flows from the junction through the
board into ambient with no airflow or top mounted heat
sink. Each system has its own thermal characteristics,
therefore thermal analysis must be performed by the user
in a particular system.
Θ thermal resistance for the LTM4630 with various heat
JA
sinking and airflow conditions. The power loss curves are
taken at room temperature, and are increased with a 1.35
to 1.4 multiplicative factor at 125°C. These factors come
fromthe fact that thepowerloss of theregulatorincreases
about 45% from 25°C to 150°C, thus a 50% spread over
125°C delta equates to ~0.35%/°C loss increase. A 125°C
maximumjunctionminus25°Croomtemperatureequates
to a 100°C increase. This 100°C increase multiplied by
0.35%/°C equals a 35% power loss increase at the 125°C
junction, thus the 1.35 multiplier.
The LTM4630 module has been designed to effectively
remove heat from both the top and bottom of the pack-
age. The bottom substrate material has very low thermal
resistance to the printed circuit board. An external heat
sink can be applied to the top of the device for excellent
heat sinking with airflow.
Figures10and11showtemperatureplotsoftheLTM4630
with no heat sink and 200LFM airflow.
The derating curves are plotted with CH1 and CH2 in
parallel single output operation starting at 36A of load
with low ambient temperature. The output voltages are
1.0V and 1.5V. These are chosen to include the lower and
higher output voltage ranges for correlating the thermal
resistance. Thermal models are derived from several
temperature measurements in a controlled temperature
chamber along with thermal modeling analysis.
These plots equate to a paralleled 12V to 1.0V at 36A
design operating at 84.5% efficiency, and 12V to 1.2V at
36A design operating at 86% efficiency.
Safety Considerations
The LTM4630 modules do not provide isolation from V
IN
to V . There is no internal fuse. If required, a slow blow
OUT
fuse with a rating twice the maximum input current needs
to be provided to protect each unit from catastrophic
failure. The device does support over current protection.
A temperature diode is provided for monitoring internal
temperature,andcanbeusedtodetecttheneedforthermal
shutdown that can be done by controlling the RUN pin.
Figure 11. ꢄherꢃal Iꢃage 12V to 1.2V,
36A with 200LFꢁ without Heat Sink
Figure 10. ꢄherꢃal Iꢃage 12V to 1.0V,
36A with 200LFꢁ without Heat Sink
4630fa
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LTM4630
APPLICATIONS INFORMATION
The junction temperatures are monitored while ambient
temperature is increased with and without airflow. The
power loss increase with ambient temperature change
is factored into the derating curves. The junctions are
maintained at ~120°C maximum while lowering output
current or power while increasing ambient temperature.
The decreased output current will decrease the internal
module loss as ambient temperature is increased.
from the efficiency curves and adjusted with the above
ambient temperature multiplicative factors. The printed
circuit board is a 1.6mm thick four layer board with two
ounce copper for the two outer layers and one ounce
copper for the two inner layers. The PCB dimensions are
101mm×114mm. TheBGAheatsinksarelistedinTable3.
Layout Checklist/Eꢂaꢃple
The high integration of LTM4630 makes the PCB board
layoutverysimpleandeasy.However,tooptimizeitselectri-
cal and thermal performance, some layout considerations
are still necessary.
The monitored junction temperature of 120°C minus
the ambient operating temperature specifies how much
module temperature rise can be allowed. As an example in
Figure15,theloadcurrentisderatedto~25Aat~86°Cwith
no air or heat sink and the power loss for the 12V to 1.0V
at 25A output is a ~5.5W loss. The 5.5W loss is calculated
with the ~4.1W room temperature loss from the 12V to
1.0V power loss curve at 25A, and the 1.35 multiplying
factor at 125°C ambient. If the 86°C ambient temperature
is subtracted from the 120°C junction temperature, then
• Use large PCB copper areas for high current paths,
including V , GND, V
and V
. It helps to mini-
IN
OUT1
OUT2
mize the PCB conduction loss and thermal stress.
• Place high frequency ceramic input and output capaci-
tors next to the V , PGND and V
pins to minimize
IN
OUT
high frequency noise.
the difference of 34°C divided 5.5W equals a 6.2°C/W Θ
JA
thermal resistance. Table 2 specifies a 7°C/W value which
is pretty close. The airflow graphs are more accurate due
to the fact that the ambient temperature environment is
controlled better with airflow. As an example in Figure 19,
the load current is derated to ~30A at ~72°C with 200LFM
of airflow and the power loss for the 12V to 1.5V at 30A
output is a ~7.9W loss. The 7.9W loss is calculated with
the ~5.9W room temperature loss from the 12V to 1.5V
power loss curve at 22A, and the 1.35 multiplying factor
at 125°C ambient. If the 72°C ambient temperature is
subtracted from the 120°C junction temperature, then
the difference of 48°C divided 7.9W equals a 6.0°C/W
• Place a dedicated power ground layer underneath the
unit.
• Tominimizetheviaconductionlossandreducemodule
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
• Do not put via directly on the pad, unless they are
capped or plated over.
• Use a separated SGND ground copper area for com-
ponents connected to signal pins. Connect the SGND
to GND underneath the unit.
• For parallel modules, tie the V , V , and COMP pins
θ
thermal resistance. Table 2 specifies a 6.0°C/W value
OUT FB
JA
together. Use an internal layer to closely connect these
pins together. The TRACK pin can be tied a common
capacitor for regulator soft-start.
which is pretty close. Tables 2 and 3 provide equivalent
thermal resistances for 1.0V and 1.5V outputs with and
without airflow and heat sinking.
• Bring out test points on the signal pins for monitoring.
The derived thermal resistances in Tables 2 and 3 for the
various conditions can be multiplied by the calculated
power loss as a function of ambient temperature to derive
temperature rise above ambient, thus maximum junction
temperature.Roomtemperaturepowerlosscanbederived
Figure 12 gives a good example of the recommended
layout. LGA and BGA PCB layouts are identical with the
exceptionofcirclepadsforBGA(seePackageDescription).
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For more information www.linear.com/LTM4630
LTM4630
APPLICATIONS INFORMATION
C
C
IN1
IN2
V
IN
M
L
K
J
GND
GND
H
G
F
SGND
C
C
OUT2
OUT1
E
D
C
B
A
1
2
3
4
5
6
7
8
9
10
11
12
V
GND
V
OUT2
OUT1
4630 F12
CNTRL
CNTRL
Figure 12. Recoꢃꢃended PCB Layout (LGA Shown, for BGA Use Circle Pads)
ꢄable 2. 1.0V Output
DERAꢄING CURVE
Figures 15, 16
Figures 15, 16
Figures 15, 16
Figures 17, 18
Figures 17, 18
Figures 17, 18
V
(V)
POWER LOSS CURVE
Figure 13
AIRFLOW (LFꢁ)
HEAꢄ SINK
None
None
θ
(°C/W)
7
6
5.5
6.5
5
IN
JA
5, 12
5, 12
5, 12
5, 12
5, 12
5, 12
0
Figure 13
Figure 13
Figure 13
Figure 13
200
400
0
200
400
None
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
Figure 13
4
ꢄable 3. 1.5V Output
DERAꢄING CURVE
Figures 19, 20
V
(V)
POWER LOSS CURVE
Figure 14
AIRFLOW (LFꢁ)
HEAꢄ SINK
None
θ
(°C/W)
IN
JA
5, 12
5, 12
5, 12
5, 12
5, 12
5, 12
0
7
6
Figures 19, 20
Figure 14
200
400
0
None
Figures 19, 20
Figure 14
None
5.5
6.5
4
Figures 21, 22
Figure 14
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
Figures 21, 22
Figure 14
200
400
Figures 21, 22
Figure 14
3.5
HEAꢄ SINK ꢁANUFACꢄURER
PARꢄ NUꢁBER
WEBSIꢄE
www.aavid.com
Aavid Thermalloy
375424B00034G
4630fa
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For more information www.linear.com/LTM4630
LTM4630
APPLICATIONS INFORMATION
ꢄable 4. Output Voltage Response vs Coꢃponent ꢁatriꢂ (Refer to Figure 23) 0A to 7A Load Step ꢄypical ꢁeasured Values
VENDORS
VALUE
PARꢄ NUꢁBER
TDK, C
Murata, C
Ceramic
100µF 6.3V
100µF 6.3V
100µF 6.3V
C4532X5R0J107MZ
GRM32ER60J107M
18126D107MAT
OUT1
Ceramic
OUT1
AVX, C
Ceramic
OUT1
Sanyo POSCAP, C
Sanyo POSCAP, C
Bulk
Bulk
470µF 2R5
470µF 6.3V
56µF 25V
2R5TPD470M5
6TPD470M
OUT2
OUT2
Sanyo, C Bulk
25SVP56M
IN
P-P
RECOVERY
LOAD
SꢄEP
(A/µs)
V
C
C
C
C
C
V
DROOP DEVIAꢄION
ꢄIꢁE
(µs)
LOAD SꢄEP
(A)
R
FB
FREQ
(kHz)
OUꢄ
IN
IN
OUꢄ
OUꢄ
FF
(pF)
IN
(V) (CERAꢁIC) (BULK) (CERAꢁIC) (BULK)
(V)
(ꢃV)
(ꢃV)
120
130
140
160
160
190
170
210
(kΩ)
90.9
90.9
60.4
60.4
40.2
40.2
30.2
30.2
1
1
22uF × 2
22uF × 2
22uF × 2
22uF × 2
22uF × 2
22uF × 2
22uF × 2
22uF × 2
150µF
150µF
150µF
150µF
150µF
150µF
150µF
150µF
100µF
100µF × 4
100µF
100µF × 4
100µF
100µF × 4
100µF
100µF × 4
470µF
None
470µF
None
470µF
None
470µF
None
None 5, 12
None 5, 12
None 5, 12
None 5, 12
None 5, 12
None 5, 12
None 5, 12
None 5, 12
0
0
0
0
0
0
0
0
25
20
25
20
25
25
30
25
4.5
4.5
4.5
4.5
4.5
4.5
4.5
4.5
4.5
4.5
4.5
4.5
4.5
4.5
4.5
4.5
450
450
450
450
450
450
450
450
1.2
1.2
1.5
1.5
1.8
1.8
8
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
40
35
30
25
20
15
10
5
V
= 12V
V
= 12V
IN
IN
V
= 5V
V
= 5V
IN
IN
0LFM
200LFM
400LFM
0
70 80
AMBIENT TEMPERATURE (°C)
0
5
10 15 20 25 30 35 40
LOAD CURRENT (A)
0
5
10 15 20 25 30 35 40
LOAD CURRENT (A)
30 40 50 60
90 100 110 120
4630 F13
4630 F14
4630 F15
Figure 13. 1.0V Power Loss Curve
Figure 14. 1.5V Power Loss Curve
Figure 15. 12V to 1V Derating
Curve, No Heat Sink
4630fa
24
For more information www.linear.com/LTM4630
LTM4630
APPLICATIONS INFORMATION
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
0LFM
200LFM
400LFM
0LFM
200LFM
400LFM
0LFM
200LFM
400LFM
0
0
0
70 80
70 80
70 80
AMBIENT TEMPERATURE (°C)
30 40 50 60
90 100 110 120
30 40 50 60
90 100 110 120
30 40 50 60
90 100 110 120
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
4630 F16
4630 F1t
4630 F18
Figure 18. 5V to 1V Derating
Curve, BGA Heat Sink
Figure 16. 5V to 1V Derating
Curve, No Heat Sink
Figure 17. 12V to 1V Derating
Curve, BGA Heat Sink
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
0LFM
200LFM
400LFM
0LFM
200LFM
400LFM
5
0
0
70 80
30 40 50 60
90 100 110 120
AMBIENT TEMPERATURE (°C)
70 80
AMBIENT TEMPERATURE (°C)
30 40 50 60
90 100 110 120
4630 F19
4630 F20
Figure 19. 12V to 1.5V Derating
Curve, No Heat Sink
Figure 20. 5V to 1.5V Derating
Curve, No Heat Sink
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
0LFM
200LFM
400LFM
0LFM
200LFM
400LFM
0
0
70 80
AMBIENT TEMPERATURE (°C)
70 80
AMBIENT TEMPERATURE (°C)
30 40 50 60
90 100 110 120
30 40 50 60
90 100 110 120
4630 F21
4630 F22
Figure 21. 12V to 1.5V Derating
Curve, BGA Heat Sink
Figure 22. 5V to 1.5V Derating
Curve, BGA Heat Sink
4630fa
25
For more information www.linear.com/LTM4630
LTM4630
APPLICATIONS INFORMATION
4630fa
26
For more information www.linear.com/LTM4630
LTM4630
TYPICAL APPLICATIONS
4630fa
27
For more information www.linear.com/LTM4630
LTM4630
TYPICAL APPLICATIONS
4630fa
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For more information www.linear.com/LTM4630
LTM4630
TYPICAL APPLICATIONS
INTV
CC
C10
4.7µF
R2
5k
CLK1
PGOOD1
MODE_PLLIN CLKOUT INTV
EXTV
PGOOD1
CC
CC
4.5V TO 15V INTERMEDIATE BUS
V
IN
4.5V TO 15V
V
IN
V
OUT1
C3
C2
22µF
25V
C1
22µF
25V
C
C
OUT2
+
+
OUT1
R1
R6
TEMP
V
OUTS1
SW1
22µF
25V
100µF
470µF
6.3V
10k
100k
6.3V
RUN1
RUN
V
V
FB1
RUN2
FB
V
R5
FB2
TRACK1
TRACK1
TRACK2
D1
LTM4630
60.4k
COMP1
COMP2
5.1V ZENER
f
COMP
SET
PHASMD
V
OUTS2
V
OUT2
SW2
C
C
OUT1
OUT2
R4
121k
100µF
6.3V
470µF
6.3V
PGOOD2
DIFFN DIFFOUT
PGOOD1
SGND GND
DIFFP
V
1.2V
70A
OUT
C16
4.7µF
CLK1
MODE_PLLIN CLKOUT INTV
PGOOD1
EXTV
PGOOD1
CC
CC
4.5V TO 15V INTERMEDIATE BUS
V
V
OUT1
IN
C12
22µF
25V
C15
22µF
25V
C5
22µF
25V
C
C
+
+
OUT1
OUT2
R9
TEMP
V
OUTS1
SW1
100µF
6.3V
470µF
6.3V
100k
RUN1
RUN1
RUN2
V
V
V
FB
FB1
FB2
TRACK1
TRACK1
TRACK2
LTM4630
COMP1
COMP2
COMP
C19
0.22µF
f
SET
PHASMD
V
OUTS2
V
OUT2
SW2
C
C
OUT1
OUT2
R10
121k
100µF
6.3V
470µF
6.3V
PGOOD2
DIFFN DIFFOUT
PGOOD1
SGND GND
DIFFP
4630 F26
INTV
CC
Figure 26. Lꢄꢁ4630 4-Phase, 1.2V at 70A
4630fa
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For more information www.linear.com/LTM4630
LTM4630
PACKAGE DESCRIPTION
Lꢄꢁ4630 Coꢃponent LGA and BGA Pinout
PIN ID FUNCꢄION
PIN ID
B1
FUNCꢄION
VOUT1
VOUT1
VOUT1
VOUT1
VOUT1
GND
PIN ID
C1
FUNCꢄION PIN ID FUNCꢄION
PIN ID
E1
FUNCꢄION
GND
PIN ID
F1
FUNCꢄION
GND
A1
A2
VOUT1
VOUT1
VOUT1
VOUT1
VOUT1
GND
VOUT1
VOUT1
VOUT1
VOUT1
VOUT1S
D1
D2
GND
GND
B2
C2
E2
GND
F2
GND
A3
B3
C3
D3
GND
E3
GND
F3
GND
A4
B4
C4
D4
GND
E4
GND
F4
MODE_PLLIN
RUN1
A5
B5
C5
D5
VFB1
SGND
VFB2
TRACK2
GND
E5
TRACK1
COMP1
COMP2
DIFFP
DIFFN
GND
F5
A6
B6
C6
f
D6
E6
F6
SGND
SET
A7
GND
B7
GND
C7
SGND
VOUT2S
VOUT2
VOUT2
VOUT2
VOUT2
D7
E7
F7
SGND
A8
VOUT2
VOUT2
VOUT2
VOUT2
VOUT2
B8
VOUT2
VOUT2
VOUT2
VOUT2
VOUT2
C8
D8
E8
F8
DIFFOUT
RUN2
A9
B9
C9
D9
E9
F9
A10
A11
A12
B10
B11
B12
C10
C11
C12
D10
D11
D12
GND
E10
E11
E12
F10
F11
F12
GND
GND
GND
GND
GND
GND
GND
PIN ID FUNCꢄION
PIN ID
H1
FUNCꢄION
GND
PIN ID
J1
FUNCꢄION PIN ID FUNCꢄION
PIN ID
L1
FUNCꢄION
GND
VIN
PIN ID
M1
FUNCꢄION
GND
VIN
G1
G2
GND
SW1
GND
VIN
K1
K2
GND
VIN
H2
GND
J2
L2
M2
G3
GND
H3
GND
J3
VIN
K3
VIN
L3
VIN
M3
VIN
G4
PHASEMD
CLKOUT
SGND
H4
GND
J4
VIN
K4
VIN
L4
VIN
M4
VIN
G5
H5
GND
J5
GND
TEMP
EXTVCC
GND
VIN
K5
GND
GND
GND
GND
VIN
L5
VIN
M5
VIN
G6
H6
GND
J6
K6
L6
VIN
M6
VIN
G7
SGND
H7
GND
J7
K7
L7
VIN
M7
VIN
G8
PGOOD2
PGOOD1
GND
H8
INTVCC
GND
J8
K8
L8
VIN
M8
VIN
G9
H9
J9
K9
L9
VIN
M9
VIN
G10
G11
G12
H10
H11
H12
GND
J10
J11
J12
VIN
K10
K11
K12
VIN
L10
L11
L12
VIN
M10
M11
M12
VIN
SW2
GND
VIN
VIN
VIN
VIN
GND
GND
GND
GND
GND
GND
4630fa
30
For more information www.linear.com/LTM4630
LTM4630
PACKAGE DESCRIPTION
Please refer to http://www.linear.coꢃ/designtools/packaging/ for the ꢃost recent package drawings.
Z
/ / b b b
Z
6 . 9 8 5 0
5 . 7 1 5 0
4 . 4 4 5 0
3 . 1 7 5 0
1 . 9 0 5 0
0 . 6 3 5 0
0 . 0 0 0 0
0 . 6 3 5 0
1 . 9 0 5 0
3 . 1 7 5 0
4 . 4 4 5 0
5 . 7 1 5 0
6 . 9 8 5 0
a a a
Z
4630fa
31
For more information www.linear.com/LTM4630
LTM4630
PACKAGE DESCRIPTION
Please refer to http://www.linear.coꢃ/designtools/packaging/ for the ꢃost recent package drawings.
Z
/ / b b b
Z
6 . 9 8 5 0
5 . 7 1 5 0
4 . 4 4 5 0
3 . 1 7 5 0
1 . 9 0 5 0
0 . 6 3 5 0
0 . 0 0 0 0
0 . 6 3 5 0
1 . 9 0 5 0
3 . 1 7 5 0
4 . 4 4 5 0
5 . 7 1 5 0
6 . 9 8 5 0
a a a
Z
4630fa
32
For more information www.linear.com/LTM4630
LTM4630
REVISION HISTORY
REV
DAꢄE
DESCRIPꢄION
PAGE NUꢁBER
A
03/14 Added BGA package
1, 2, 32
4630fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
33
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
LTM4630
PACKAGE PHOTO
LGA
BGA
DESIGN RESOURCES
SUBJECꢄ
DESCRIPꢄION
µModule Design and Manufacturing Resources
Design:
Manufacturing:
• Selector Guides
• Quick Start Guide
• Demo Boards and Gerber Files
• Free Simulation Tools
• PCB Design, Assembly and Manufacturing Guidelines
• Package and Board Level Reliability
µModule Regulator Products Search
1. Sort table of products by parameters and download the result as a spread sheet.
2. Search using the Quick Power Search parametric table.
TechClip Videos
Quick videos detailing how to bench test electrical and thermal performance of µModule products.
Digital Power System Management
Linear Technology’s family of digital power supply management ICs are highly integrated solutions that
offer essential functions, including power supply monitoring, supervision, margining and sequencing,
and feature EEPROM for storing user configurations and fault logging.
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COꢁꢁENꢄS
LTM4620
Dual 13A Single 26A µModule Regulator
Pin Compatible with LTM4630; 4.5V ≤ V ≤ 16V, 0.6V ≤ V
≤ 2.5V,
IN
OUT
15mm × 15mm × 4.32mm
LTM4628
Dual 8A, Single 16A µModule Regulator
15A µModule Regulator
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≤ 5.5V,
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15mm × 15mm × 4.32mm
LTM4627
LTM4611
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1.5V ≤ V ≤ 5.5V, 0.8V ≤ V
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4.5V ≤ V ≤ 26.5V; 0.8V ≤ V
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IN
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2.375 ≤ V ≤ 5.5V; Two 4A and One 1.5A Output
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≤ 5V
OUT
IN
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LTM8062/
LTM8062A
32V , 2A µModule Battery Charger with Maximum Adjustable V
Up to 14.4V (18.8V for the LTM8062A), C/10 or Timer
IN
BATT
Peak Power Tracking (MPPT)
Termination, 9mm × 15mm × 4.32mm LGA Package
LTM8027
LTM4613
60V , 4A DC/DC Step-Down µModule Regulator
4.5V ≤ V ≤ 60V, 2.5V ≤ V ≤ 24V, 15mm × 15mm × 4.32mm LGA Package
IN
IN
OUT
EN55022B Compliant 36V , 8A Step-Down
5V ≤ V ≤ 36V, 3.3V ≤ V
≤ 15V, Synchronizable, Parallelable,
IN
IN
OUT
µModule Regulator
15mm × 15mm × 4.32mm LGA Package
4630fa
LT 0314 REV A • PRINTED IN USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
34
●
●
LINEAR TECHNOLOGY CORPORATION 2013
(408)432-1900 FAX: (408) 434-0507 www.linear.com/LTM4630
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