LTM4630EY#PBF [Linear]

LTM4630 - Dual 18A or Single 36A DC/DC µModule (Power Module) Regulator; Package: BGA; Pins: 144; Temperature Range: -40°C to 85°C;
LTM4630EY#PBF
型号: LTM4630EY#PBF
厂家: Linear    Linear
描述:

LTM4630 - Dual 18A or Single 36A DC/DC µModule (Power Module) Regulator; Package: BGA; Pins: 144; Temperature Range: -40°C to 85°C

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LTM4630  
Dual 18A or Single 36A  
DC/DC µModule Regulator  
FEATURES  
DESCRIPTION  
n
Dual 18A or Single 36A Output  
TheLTM®4630isadual18Aorsingle36Aoutputswitching  
modestep-downDC/DCµModule® (micromodule)regula-  
tor. Included in the package are the switching controllers,  
power FETs, inductors, and all supporting components.  
Operating from an input voltage range of 4.5V to 15V, the  
LTM4630supportstwooutputseachwithanoutputvoltage  
range of 0.6V to 1.8V, each set by a single external resistor.  
Its high efficiency design delivers up to 18A continuous  
current for each output. Only a few input and output ca-  
pacitors are needed. The LTM4630 is pin compatible with  
the LTM4620 and LTM4620A (dual 13A, single 26A) and  
the LTM4628 (dual 8A, single 16A).  
n
Wide Input Voltage Range: 4.5V to 15V  
n
Output Voltage Range: 0.6V to 1.8V  
n
1.5ꢀ ꢁaꢂiꢃuꢃ ꢄotal DC Output Error Over Line,  
Load and ꢄeꢃperature  
Differential Reꢃote Sense Aꢃplifier  
n
n
Current ꢁode Control/Fast ransient Response  
n
Adjustable Switching Frequency  
Overcurrent Foldback Protection  
n
n
ꢁultiphase Parallel Current Sharing with ꢁultiple  
Lꢁ4630s Up to 144A  
n
Frequency Synchronization  
n
Internal ꢄeꢃperature ꢁonitor  
The device supports frequency synchronization, multi-  
phaseoperation,BurstModeoperationandoutputvoltage  
tracking for supply rail sequencing and has an onboard  
temperaturediodefordevicetemperaturemonitoring.High  
switchingfrequencyandacurrentmodearchitectureenable  
a very fast transient response to line and load changes  
without sacrificing stability.  
n
Pin Compatible with the LTM4620 and LTM4620A (Dual  
13A, Single 26A) and LTM4628 (Dual 8A, Single 16A)  
Selectable Burst Mode® Operation  
n
n
Soft-Start/Voltage Tracking  
Output Overvoltage Protection  
16mm × 16mm × 4.41mm LGA and 16mm × 16mm ×  
5.01mm BGA Packages  
n
n
Fault protection features include overvoltage and  
overcurrent protection. The LTM4630 is offered in 16mm  
× 16mm × 4.41mm LGA and 16mm × 16mm × 5.01mm  
BGA packages. The LTM4630 is ROHS compliant.  
L, LT, LTC, LTM, Linear Technology, the Linear logo, µModule, Burst Mode and PolyPhase are  
registered trademarks of Linear Technology Corporation. All other trademarks are the property  
of their respective owners. Protected by U.S. Patents, including 5481178, 5705919, 5929620,  
6100678, 6144194, 6177787, 6304066 and 6580258. Other patents pending.  
APPLICATIONS  
n
Telecom and Networking Equipment  
n
Storage and ATCA Cards  
n
Industrial Equipment  
TYPICAL APPLICATION  
36A, 1.2V Output DC/DC µꢁodule Regulator  
INTV  
CC  
1.2VOUꢄ Efficiency vs IOUꢄ  
4.7µF  
10k  
PGOOD  
95  
90  
85  
80  
75  
70  
65  
MODE_PLLIN CLKOUT INTV  
EXTV  
PGOOD1  
CC  
V
= 5V  
CC  
IN  
V
IN  
4.5V TO 15V  
V
IN  
V
OUT1  
+
+
22µF  
25V  
×4  
100µF  
6.3V  
470µF  
6.3V  
TEMP  
V
OUTS1  
10k  
120k  
V
= 12V  
IN  
RUN1  
DIFFOUT  
RUN2  
SW1  
TRACK1  
TRACK2  
V
V
FB1  
FB2  
LTM4630  
5.1V  
60.4k  
f
0.1µF  
COMP1  
COMP2  
SET  
PHASMD  
V
OUTS2  
V
1.2V  
36A  
OUT  
V
121k  
OUT2  
SW2  
100µF  
6.3V  
0
2
4
6
8
10 12 14 16 18  
OUTPUT CURRENT (A)  
470µF  
6.3V  
PGOOD2  
SGND  
GND  
DIFFP  
DIFFN  
4630 TA01b  
PGOOD  
4630 TA01a  
4630fa  
1
For more information www.linear.com/LTM4630  
LTM4630  
ABSOLUTE MAXIMUM RATINGS (Note 1)  
V (Note 8) ............................................... –0.3V to 16V  
SW1 SW2  
DIFFP, DIFFN.......................................... –0.3V to INTV  
IN  
V
CC  
, V  
................................................... –1V to 16V  
COMP1, COMP2, V , V (Note 6)........ –0.3V to 2.7V  
FB1 FB2  
PGOOD1, PGOOD2, RUN1, RUN2,  
INTV Peak Output Current ................................100mA  
Internal Operating Temperature Range  
(Note 2) ............................................. –40°C to 125°C  
Storage Temperature Range................... –55°C to 125°C  
Peak Package Body Temperature .......................... 245°C  
CC  
INTV , EXTV ........................................... –0.3V to 6V  
CC  
CC  
MODE_PLLIN, f , TRACK1, TRACK2,  
SET  
DIFFOUT, PHASMD................................ –0.3V to INTV  
CC  
V
, V  
, V  
, V  
(Note 6)........ –0.3V to 6V  
OUT1 OUT2 OUTS1 OUTS2  
PIN CONFIGURATION  
TOP VIEW  
TOP VIEW  
TEMP  
EXTV  
CC  
TEMP  
EXTV  
CC  
M
L
M
L
V
IN  
K
J
K
J
H
G
F
INTV  
SW2  
PGOOD1  
PGOOD2  
RUN2  
CC  
CLKOUT  
SW1  
H
G
F
INTV  
SW2  
PGOOD1  
PGOOD2  
RUN2  
CC  
CLKOUT  
SW1  
PHASMD  
RUN1  
SGND  
PHASMD  
RUN1  
SGND  
MODE_PLLIN  
DIFFOUT  
MODE_PLLIN  
GND  
COMP1 COMP2  
DIFFOUT  
GND  
COMP1 COMP2  
DIFFP  
E
DIFFP  
DIFFN  
E
TRACK1  
V
TRACK2  
GND  
DIFFN  
SGND FB2  
TRACK1  
V
TRACK2  
SGND FB2  
GND  
V
FB1  
D
C
B
A
V
FB1  
D
C
B
A
V
f
SGND OUTS2  
SET  
V
f
SGND OUTS2  
SET  
V
OUTS1  
V
OUTS1  
V
V
OUT1  
OUT2  
GND  
V
OUT2  
GND  
1
2
3
4
5
6
7
8
9
10  
11  
12  
1
2
3
4
5
6
7
8
9
10  
11  
12  
LGA PACKAGE  
144-LEAD (16mm × 16mm × 4.41mm)  
BGA PACKAGE  
144-LEAD (16mm × 16mm × 4.41mm)  
T
JMAX  
= 125°C, Θ = 7°C/W, Θ  
= 1.5°C/W, Θ  
= 3.7°C/W, Θ + Θ ≅ 7°C/W  
JA  
JCbottom  
JCtop JB JBA  
T
JMAX  
= 125°C, Θ = 7°C/W, Θ  
= 1.5°C/W, Θ  
= 3.7°C/W, Θ + Θ ≅ 7°C/W  
JA  
JCbottom  
JCtop  
JB  
JBA  
Θ VALUES DEFINED PER JESD 51-12  
Θ VALUES DEFINED PER JESD 51-12  
WEIGHT = 3.2g  
WEIGHT = 3.2g  
ORDER INFORMATION  
PARꢄ ꢁARKING*  
PACKAGE  
ꢄYPE  
ꢁSL  
RAING  
ꢄEꢁPERAURE RANGE  
(Note 2)  
PARꢄ NUꢁBER  
LTM4630EV#PBF  
LTM4630IV#PBF  
LTM4630EY#PBF  
LTM4630IY#PBF  
LTM4630IY  
PAD OR BALL FINISH  
Au (RoHS)  
DEVICE  
FINISH CODE  
LTM4630V  
LTM4630V  
LTM4630Y  
LTM4630Y  
LTM4630Y  
e4  
e4  
e1  
e1  
e0  
LGA  
LGA  
BGA  
BGA  
BGA  
3
3
3
3
3
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 125°C  
Au (RoHS)  
SAC305 (RoHS)  
SAC305 (RoHS)  
SnPb (63/37)  
Consult Marketing for parts specified with wider operating temperature  
ranges. *Device temperature grade is indicated by a label on the shipping  
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.  
• Recommended LGA and BGA PCB Assembly and Manufacturing  
Procedures:  
www.linear.com/umodule/pcbassembly  
• LGA and BGA Package and Tray Drawings:  
www.linear.com/packaging  
• Terminal Finish Part Marking:  
www.linear.com/leadfree  
4630fa  
2
For more information www.linear.com/LTM4630  
LTM4630  
ELECTRICAL CHARACTERISTICS ꢄhe l denotes the specifications which apply over the specified internal  
operating teꢃperature range. Specified as each individual output channel. ꢄA = 25°C (Note 2), VIN = 12V and VRUN1, VRUN2 at 5V  
unless otherwise noted. Per the typical application in Figure 23.  
SYꢁBOL  
PARAꢁEꢄER  
CONDIꢄIONS  
ꢁIN  
4.5  
ꢄYP  
ꢁAX  
15  
UNIꢄS  
l
l
l
V
V
Input DC Voltage  
Output Voltage  
V
V
V
IN  
0.6  
1.8  
OUT  
V
V
,
Output Voltage, Total Variation with  
Line and Load  
1.477  
1.5  
1.523  
C
= 22µF × 3, C  
= 100µF × 1 Ceramic,  
OUT1(DC)  
OUT2(DC)  
IN  
OUT  
470µF POSCAP  
= 12V, V  
V
IN  
= 1.5V, I  
= 0A to 18A  
OUT  
OUT  
Input Specifications  
V
V
, V  
RUN Pin On/Off Threshold  
RUN Pin On Hysteresis  
RUN Rising  
1.1  
1.25  
150  
1
1.40  
V
mV  
A
RUN1 RUN2  
, V  
RUN1HYS RUN2HYS  
I
Input Inrush Current at Start-Up  
I
= 0A, C = 22µF ×3, C = 0.01µF,  
OUT  
= 12V  
INRUSH(VIN)  
OUT  
C
V
IN  
SS  
= 100µF ×3, V  
= 1.5V, V  
= 1.5V,  
OUT2  
OUT1  
IN  
I
Input Supply Bias Current  
Input Supply Current  
V
V
V
= 12V, V  
= 12V, V  
= 1.5V, Burst Mode Operation  
= 1.5V, Pulse-Skipping Mode  
3
mA  
mA  
mA  
µA  
Q(VIN)  
IN  
IN  
IN  
OUT  
OUT  
15  
65  
50  
= 12V, V = 1.5V, Switching Continuous  
OUT  
Shutdown, RUN = 0, V = 12V  
IN  
I
V
IN  
V
IN  
= 5V, V  
= 1.5V, I = 18A  
OUT  
6
2.6  
A
A
S(VIN)  
OUT  
= 12V, V  
= 1.5V, I  
= 18A  
OUT  
OUT  
Output Specifications  
, I  
I
Output Continuous Current Range  
Line Regulation Accuracy  
V
V
= 12V, V  
= 1.5V (Note 7)  
0
18  
A
OUT1(DC) OUT2(DC)  
IN  
OUT  
l
l
ΔV  
ΔV  
/V  
= 1.5V, V from 4.5V to 15V  
0.01  
0.5  
15  
0.025  
%/V  
OUT1(LINE) OUT1  
OUT  
IN  
/V  
I
= 0A for Each Output,  
OUT  
OUT2(LINE) OUT2  
ΔV  
ΔV  
/V  
Load Regulation Accuracy  
Output Ripple Voltage  
For Each Output, V  
V = 12V (Note 7)  
IN  
= 1.5V, 0A to 18A  
0.75  
%
OUT1 OUT1  
OUT  
/V  
OUT2 OUT2  
V
, V  
For Each Output, I  
= 0A, C  
= 100µF ×3/  
IN  
mV  
P-P  
OUT1(AC) OUT2(AC)  
OUT  
OUT  
X7R/Ceramic, 470µF POSCAP, V = 12V,  
V
OUT  
= 1.5V, Frequency = 450kHz  
f (Each Channel)  
Output Ripple Voltage Frequency  
SYNC Capture Range  
V
IN  
= 12V, V  
= 1.5V, f = 1.25V (Note 4)  
500  
kHz  
kHz  
S
OUT  
SET  
f
400  
780  
SYNC  
(Each Channel)  
ΔV  
Turn-On Overshoot  
Turn-On Time  
C
V
= 100µF/X5R/Ceramic, 470µF POSCAP,  
10  
5
mV  
ms  
OUTSTART  
OUT  
OUT  
(Each Channel)  
= 1.5V, I  
= 0A V = 12V  
OUT IN  
t
C
OUT  
= 100µF/X5R/Ceramic, 470µF POSCAP,  
START  
(Each Channel)  
No Load, TRACK/SS with 0.01µF to GND,  
V
= 12V  
IN  
ΔV  
Peak Deviation for Dynamic Load  
Load: 0% to 50% to 0% of Full Load  
30  
mV  
OUT(LS)  
(Each Channel)  
C
= 22µF ×3/X5R/Ceramic, 470µF POSCAP  
OUT  
V
= 12V, V  
= 1.5V  
OUT  
IN  
t
Settling Time for Dynamic Load  
Step  
Load: 0% to 50% to 0% of Full Load,  
20  
30  
µs  
A
SETTLE  
(Each Channel)  
V
= 12V, C  
= 100µF, 470µF POSCAP  
IN  
OUT  
I
Output Current Limit  
V
IN  
= 12V, V  
= 1.5V  
OUT(PK)  
OUT  
(Each Channel)  
Control Section  
l
l
V
, V  
Voltage at V Pins  
I
= 0A, V = 1.5V  
OUT  
0.592  
0.600  
–5  
0.606  
–20  
V
nA  
V
FB1 FB2  
FB  
OUT  
I
FB  
(Note 6)  
V
OVL  
Feedback Overvoltage Lockout  
0.64  
1
0.66  
1.25  
0.68  
1.5  
TRACK1 (I),  
TRACK2 (I)  
Track Pin Soft-Start Pull-Up Current TRACK1 (I),TRACK2 (I) Start at 0V  
µA  
4630fa  
3
For more information www.linear.com/LTM4630  
LTM4630  
ELECTRICAL CHARACTERISTICS ꢄhe l denotes the specifications which apply over the specified internal  
operating teꢃperature range. Specified as each individual output channel. ꢄA = 25°C (Note 2), VIN = 12V and VRUN1, VRUN2 at 5V  
unless otherwise noted. Per the typical application in Figure 23.  
SYꢁBOL  
PARAꢁEꢄER  
CONDIꢄIONS  
ꢁIN  
ꢄYP  
3.3  
ꢁAX  
UNIꢄS  
V
UVLO  
Undervoltage Lockout (Falling)  
UVLO Hysteresis  
0.6  
V
t
Minimum On-Time  
(Note 6)  
90  
ns  
ON(MIN)  
R
, R  
Resistor Between V  
, V  
60.05  
60.4  
60.75  
0.3  
5
kΩ  
FBHI1 FBHI2  
OUTS1 OUTS2  
and V , V Pins for Each Output  
FB1 FB2  
V
, V  
PGOOD Voltage Low  
I
= 2mA  
= 5V  
0.1  
V
PGOOD1 PGOOD2  
PGOOD  
Low  
I
PGOOD Leakage Current  
PGOOD Trip Level  
V
µA  
PGOOD  
PGOOD  
V
V
V
V
with Respect to Set Output Voltage  
Ramping Negative  
Ramping Positive  
PGOOD  
FB  
FB  
FB  
–10  
10  
%
%
INꢄV Linear Regulator  
CC  
V
Internal V Voltage  
6V < V < 15V  
4.8  
4.5  
5
5.2  
2
V
INTVCC  
CC  
IN  
V
INTV Load Regulation  
I
CC  
= 0mA to 50mA  
0.5  
%
INTVCC  
CC  
Load Regulation  
V
V
V
EXTV Switchover Voltage  
EXTV Ramping Positive  
4.7  
50  
V
mV  
mV  
EXTVCC  
CC  
CC  
EXTV Dropout  
I
CC  
= 20mA, V = 5V  
EXTVCC  
100  
EXTVCC(DROP)  
EXTVCC(HYST)  
CC  
EXTV Hysteresis  
220  
CC  
Oscillator and Phase-Locked Loop  
Frequency Nominal Nominal Frequency  
f
f
f
= 1.2V  
450  
210  
700  
9
500  
250  
780  
10  
550  
290  
860  
11  
kHz  
kHz  
kHz  
µA  
SET  
SET  
SET  
Frequency Low  
Frequency High  
Lowest Frequency  
= 0V (Note 5)  
> 2.4V, Up to INTV  
Highest Frequency  
CC  
f
Frequency Set Current  
MODE_PLLIN Input Resistance  
SET  
R
250  
kΩ  
MODE_PLLIN  
CLKOUT  
Phase (Relative to V  
)
PHASMD = GND  
PHASMD = Float  
PHASMD = INTV  
60  
90  
120  
Deg  
Deg  
Deg  
OUT1  
CC  
CLK High  
CLK Low  
Clock High Output Voltage  
Clock Low Output Voltage  
2
V
V
0.2  
Differential Aꢃplifier  
A Differential  
Gain  
1
V/V  
V
Amplifier  
R
Input Resistance  
Measured at DIFFP Input  
= V = 1.5V, I = 100µA  
DIFFOUT  
80  
kΩ  
mV  
dB  
IN  
V
OS  
Input Offset Voltage  
V
DIFFP  
3
DIFFOUT  
PSRR Differential  
Amplifier  
Power Supply Rejection Ratio  
5V < V < 15V  
90  
3
IN  
I
CL  
Maximum Output Current  
Maximum Output Voltage  
Gain Bandwidth Product  
Diode Connected PNP  
Temperature Coefficient  
mA  
V
V
I
= 300µA  
INTV – 1.4  
CC  
OUT(MAX)  
DIFFOUT  
GBW  
3
MHz  
V
V
TEMP  
I = 100µA  
0.6  
l
TC  
–2.2  
mV/C  
4630fa  
4
For more information www.linear.com/LTM4630  
LTM4630  
ELECTRICAL CHARACTERISTICS  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
Note 3: Two outputs are tested separately and the same testing condition  
is applied to each output.  
Note 4: The switching frequency is programmable from 400kHz to 750kHz.  
Note 5: LTM4630 device is designed to operate from 400kHz to 750kHz  
Note 6: These parameters are tested at wafer sort.  
Note 2: The LTM4630 is tested under pulsed load conditions such that  
T ≈ T . The LTM4630E is guaranteed to meet specifications from  
J
A
Note 7: See output current derating curves for different V , V  
and T .  
A
IN OUT  
0°C to 125°C internal temperature. Specifications over the –40°C to  
125°C internal operating temperature range are assured by design,  
characterization and correlation with statistical process controls. The  
LTM4630I is guaranteed over the full –40°C to 125°C internal operating  
temperature range. Note that the maximum ambient temperature  
consistent with these specifications is determined by specific operating  
conditions in conjunction with board layout, the rated package thermal  
impedance and other environmental factors.  
TYPICAL PERFORMANCE CHARACTERISTICS  
Dual Phase Single Output Efficiency  
vs Output Current, VIN = 12V,  
fS = 450kHz  
Efficiency vs Output Current,  
VIN = 5V, fS = 450kHz  
Efficiency vs Output Current,  
VIN = 12V, fS = 450kHz  
95  
90  
85  
80  
75  
70  
65  
95  
90  
85  
80  
75  
70  
65  
100  
95  
90  
85  
80  
75  
V
= 1V  
V
= 1V  
OUT  
OUT  
OUT  
OUT  
V
V
V
V
= 1V  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
V
= 1.2V  
= 1.5V  
= 1.8V  
V
= 1.2V  
= 1.5V  
= 1.8V  
= 1.2V  
= 1.5V  
= 1.8V  
V
V
V
V
0
2
4
6
8
10 12 14 16 18  
0
5
10 15 20 25 30 35 40  
LOAD CURRENT (A)  
0
2
4
6
8
10 12 14 16 18  
LOAD CURRENT (A)  
LOAD CURRENT (A)  
4630 G02  
4630 G03  
4630 G01  
Burst ꢁode and Pulse-Skip ꢁode  
Efficiency VIN=12V, VOUꢄ = 1.2V,  
fS = 450kHz  
1V Single Phase Output Load  
ꢄransient Response  
1.2V Single Phase Output Load  
ꢄransient Response  
100  
90  
80  
70  
60  
50  
40  
30  
CCM  
Burst Mode OPERATION  
PULSE-SKIP MODE  
V
V
OUT(AC)  
OUT(AC)  
50mV/Div  
50mV/Div  
LOAD STEP  
2A/DIV  
LOAD STEP  
2A/DIV  
4630 G05  
4630 G06  
20µs/DIV  
20µs/DIV  
12V , 1V , 450kHz, 4.5A LOAD STEP,  
12V , 1.2V , 450kHz, 4.5A LOAD STEP,  
IN  
OUT  
IN  
OUT  
4.5A/µs STEP-UP AND STEP-DOWN  
= 1 • 470µF 4V POSCAP + 1 • 100µF  
4.5A/µs STEP-UP AND STEP-DOWN  
C = 1 • 470µF 4V POSCAP + 1 • 100µF  
OUT  
0.01  
0.1  
1
10  
C
OUT  
LOAD CURRENT (A)  
6.3V CERAMIC  
6.3V CERAMIC  
4630 G04  
4630fa  
5
For more information www.linear.com/LTM4630  
LTM4630  
TYPICAL PERFORMANCE CHARACTERISTICS  
1.5V Single Phase Output Load  
ꢄransient Response  
1.8V Single Phase Output Load  
ꢄransient Response  
Single Phase Start-Up with No load  
V
V
V
SW  
10V/Div  
OUT(AC)  
OUT(AC)  
50mV/Div  
50mV/Div  
V
OUT  
0.5V/Div  
LOAD STEP  
2A/DIV  
LOAD STEP  
2A/DIV  
I
IN  
0.2A/Div  
4630 G07  
4630 G08  
4630 G09  
20µs/DIV  
20µs/DIV  
20ms/DIV  
12V , 1.5V , 450kHz, 4.5A LOAD STEP,  
12V , 1.8V , 450kHz, 4.5A LOAD STEP,  
12V , 1.2V , 450kHz  
IN  
OUT  
IN  
OUT  
IN  
OUT  
4.5A/µs STEP-UP AND STEP-DOWN  
4.5A/µs STEP-UP AND STEP-DOWN  
C
= 1 • 470µF 4V POSCAP + 1 • 100µF  
OUT  
C
OUT  
= 1 • 470µF 4V POSCAP + 1 • 100µF  
C
OUT  
= 1 • 470µF 4V POSCAP + 1 • 100µF  
6.3V CERAMIC, C = 0.1µF  
SS  
6.3V CERAMIC  
6.3V CERAMIC  
Single Phase Short Circuit  
Protection with 18A  
Single Phase Short Circuit  
Protection with No load  
Single Phase Start-up with 18A  
V
V
SW  
SW  
V
SW  
10V/Div  
10V/Div  
10V/Div  
V
OUT  
V
OUT  
0.5V/Div  
0.5V/Div  
V
OUT  
0.5V/Div  
I
I
I
IN  
1A/Div  
IN  
IN  
1A/Div  
1A/Div  
4630 G10  
4630 G11  
4630 G12  
20ms/DIV  
12V , 1.2V , 450kHz  
50µs/DIV  
12V , 1.2V , 450kHz  
50µs/DIV  
12V , 1.2V , 450kHz  
IN OUT  
C = 1 • 470µF 4V POSCAP + 1 • 100µF  
OUT  
IN  
OUT  
IN  
OUT  
6.3V CERAMIC  
OUT  
C
= 1 • 470µF 4V POSCAP + 1 • 100µF  
C
= 1 • 470µF 4V POSCAP + 1 • 100µF  
OUT  
6.3V CERAMIC, C = 0.1µF  
6.3V CERAMIC  
SS  
4630fa  
6
For more information www.linear.com/LTM4630  
LTM4630  
(Recoꢃꢃended to Use ꢄest Points to ꢁonitor Signal Pin Connections.)  
PIN FUNCTIONS  
PACKAGE ROW AND COLUꢁN LABELING ꢁAY VARY  
AꢁONG µꢁodule PRODUCꢄS. REVIEW EACH PACKAGE  
LAYOUꢄ CAREFULLY.  
V
(A1-A5, B1-B5, C1-C4): Power Output Pins. Apply  
V
, V (D5, D7): The Negative Input of the Error  
FB2  
OUꢄ1  
FB1  
outputloadbetweenthesepinsandGNDpins.Recommend  
placing output decoupling capacitance directly between  
these pins and GND pins. Review Table 4. See Note 8 in  
the Electrical Characteristics section for output current  
guideline.  
Amplifier for Each Channel. Internally, this pin is con-  
nected to V  
or V  
with a 60.4kΩ precision  
OUTS1  
OUTS2  
resistor. Different output voltages can be programmed  
with an additional resistor between V and GND pins. In  
FB  
PolyPhase® operation, tying the V pins together allows  
FB  
for parallel operation. See the Applications Information  
section for details.  
GND (A6-A7, B6-B7, D1-D4, D9-D12, E1-E4, E10-E12,  
F1-F3, F10-F12, G1, G3, G10, G12, H1-H7, H9-H12, J1,  
J5, J8, J12, K1, K5-K8, K12, L1, L12, ꢁ1 , ꢁ12): Power  
Ground Pins for Both Input and Output Returns.  
ꢄRACK1, ꢄRACK2 (E5, D8): Output Voltage Tracking Pin  
and Soft-Start Inputs. Each channel has a 1.3µA pull-up  
current source. When one channel is configured to be  
master of the two channels, then a capacitor from this pin  
to ground will set a soft-start ramp rate. The remaining  
channel can be set up as the slave, and have the master’s  
output applied through a voltage divider to the slave  
output’s track pin. This voltage divider is equal to the  
slave output’s feedback divider for coincidental tracking.  
See the Applications Information section.  
V
(A8-A12, B8-B12, C9-C12): Power Output Pins.  
OUꢄ2  
Apply output load between these pins and GND pins.  
Recommend placing output decoupling capacitance di-  
rectly between these pins and GND pins. Review Table 4.  
See Note 8 in the Electrical Characteristics section for  
output current guideline.  
V
, V  
(C5, C8): This pin is connected to the top  
OUꢄS1 OUꢄS2  
of the internal top feedback resistor for each output. The  
pin can be directly connected to its specific output, or  
connected to DIFFOUT when the remote sense amplifier  
COꢁP1, COꢁP2 (E6, E7): Current control threshold and  
error amplifier compensation point for each channel. The  
current comparator threshold increases with this control  
voltage. Tie the COMP pins together for parallel operation.  
The device is internal compensated.  
is used. In paralleling modules, one of the V  
pins is  
OUTS  
connectedtotheDIFFOUTpininremotesensingordirectly  
to V with no remote sensing. It is very important to  
OUT  
connect these pins to either the DIFFOUT or V  
since  
DIFFP (E8): Positive input of the remote sense amplifier.  
Thispinisconnectedtotheremotesensepointoftheoutput  
voltage. See the Applications Information section.  
OUT  
this is the feedback path, and cannot be left open. See the  
Applications Information section.  
f
(C6): Frequency Set Pin. A 10µA current is sourced  
DIFFN (E9): Negative input of the remote sense amplifier.  
This pin is connected to the remote sense point of the  
output GND. See the Applications Information section.  
SEꢄ  
from this pin. A resistor from this pin to ground sets a  
voltage that in turn programs the operating frequency.  
Alternatively, this pin can be driven with a DC voltage  
that can set the operating frequency. See the Applications  
Information section.  
ꢁODE_PLLIN (F4): Force Continuous Mode, Burst Mode  
Operation, or Pulse-Skipping Mode Selection Pin and  
External Synchronization Input to Phase Detector Pin.  
Connect this pin to SGND to force both channels into  
SGND(C7, D6, G6-G7, F6-F7):SignalGroundPin. Return  
ground path for all analog and low power circuitry. Tie a  
single connection to the output capacitor GND in the ap-  
plication. See layout guidelines in Figure 22.  
force continuous mode of operation. Connect to INTV  
CC  
to enable pulse-skipping mode of operation. Leaving the  
pin floating will enable Burst Mode operation. A clock on  
the pin will force both channels into continuous mode of  
operation and synchronized to the external clock applied  
to this pin.  
4630fa  
7
For more information www.linear.com/LTM4630  
LTM4630  
PIN FUNCTIONS (Recoꢃꢃended to Use ꢄest Points to ꢁonitor Signal Pin Connections.)  
RUN1, RUN2 (F5, F9): Run Control Pin. A voltage above  
1.25V will turn on each channel in the module. A voltage  
below 1.25V on the RUN pin will turn off the related chan-  
nel. Each RUN pin has a 1µA pull-up current, once the  
RUN pin reaches 1.2V an additional 4.5µA pull-up current  
is added to this pin.  
PGOOD1, PGOOD2 (G9, G8): Output Voltage Power  
Good Indicator. Open drain logic output that is pulled to  
ground when the output voltage is not within 10% of  
the regulation point.  
INꢄV (H8): Internal 5V Regulator Output. The control  
CC  
circuits and internal gate drivers are powered from this  
DIFFOUꢄ (F8): Internal Remote Sense Amplifier Output.  
voltage. Decouple this pin to PGND with a 4.7µF low ESR  
Connect this pin to V  
or V  
depending on which  
tantalumorceramic.INTV isactivatedwheneitherRUN1  
OUTS1  
OUTS2  
CC  
outputisusingremotesense.Inparalleloperationconnect  
one of the V pin to DIFFOUT for remote sensing.  
or RUN2 is activated.  
OUTS  
ꢄEꢁP (J6): Onboard General Purpose Temperature Diode  
for Monitoring the VBE Junction Voltage Change with  
Temperature. See the Applications Information section.  
SW1, SW2 (G2, G11): Switching node of each channel  
that is used for testing purposes. Also an R-C snubber  
network can be applied to reduce or eliminate switch node  
ringing, or otherwise leave floating. See the Applications  
Information section.  
EXꢄV (J7): External power input that is enabled through  
CC  
a switch to INTV whenever EXTV is greater than 4.7V.  
CC  
CC  
Do not exceed 6V on this input, and connect this pin to  
V when operating V on 5V. An efficiency increase will  
PHASꢁD(G4):ConnectthispintoSGND,INTV ,oroat-  
CC  
IN  
IN  
ing this pin to select the phase of CLKOUT to 60 degrees,  
occur that is a function of the (V – INTV ) multiplied by  
IN  
CC  
120 degrees, and 90 degrees respectively.  
powerMOSFETdrivercurrent.Typicalcurrentrequirement  
is 30mA. V must be applied before EXTV , and EXTV  
CC  
IN  
CC  
CLKOUꢄ (G5): Clock output with phase control using the  
PHASMD pin to enable multiphase operation between  
devices. See the Applications Information section.  
must be removed before V .  
IN  
V (ꢁ2-ꢁ11, L2-L11, J2-J4, J9-J11, K2-K4, K9-K11):  
IN  
Power Input Pins. Apply input voltage between these pins  
and GND pins. Recommend placing input decoupling  
capacitance directly between V pins and GND pins.  
IN  
4630fa  
8
For more information www.linear.com/LTM4630  
LTM4630  
SIMPLIFIED BLOCK DIAGRAM  
PGOOD1  
V
IN  
4.5V TO 15V  
TRACK1  
SS CAP  
V
IN  
C
22µF  
25V  
C
IN1  
IN2  
0.1µF  
22µF  
25V  
GND  
R
T
V
R
TEMP  
CLKOUT  
RUN1  
IN  
= 100µA  
V
IN  
MTOP1  
MBOT1  
T
SW1  
V
OR TEMP  
MONITORS  
0.33µH  
V
OUT1  
OUT1  
1.5V  
+
18A  
MODE_PLLIN  
PHASEMD  
0.22µF  
C
OUT1  
GND  
V
OUTS1  
COMP1  
60.4k  
V
FB1  
INTERNAL  
COMP  
R
FB1  
40.2k  
SGND  
POWER  
CONTROL  
PGOOD2  
TRACK2  
V
IN  
INTV  
CC  
C
22µF  
25V  
C
22µF  
25V  
IN3  
IN4  
SS CAP  
0.1µF  
4.7µF  
EXTV  
GND  
SW2  
CC  
MTOP2  
MBOT2  
0.33µH  
V
1.2V  
18A  
OUT2  
V
OUT2  
+
RUN2  
0.22µF  
C
OUT2  
GND  
V
OUTS2  
60.4k  
COMP2  
V
FB2  
+
R
FB2  
INTERNAL  
COMP  
60.4k  
f
SET  
INTERNAL  
FILTER  
R
FSET  
SGND  
DIFFOUT  
DIFFN  
DIFFP  
4630 BD  
Figure 1. Siꢃplified Lꢁ4630 Block Diagraꢃ  
A = 25°C. Use Figure 1 configuration.  
CONDIꢄIONS  
DECOUPLING REQUIREMENTS  
SYꢁBOL  
PARAꢁEꢄER  
ꢁIN  
ꢄYP  
ꢁAX  
UNIꢄS  
External Input Capacitor Requirement  
C
C
C
(V = 4.5V to 15V, V  
= 1.5V)  
= 1.2V)  
I
I
= 18A  
= 18A  
44  
44  
µF  
µF  
IN1, IN2  
IN1  
OUT1  
OUT2  
OUT1  
OUT2  
C
(V = 4.5V to 15V, V  
IN2  
IN3, IN4  
External Output Capacitor Requirement  
C
C
(V = 4.5V to 15V, V  
= 1.5V)  
= 1.2V)  
I
I
= 18A  
= 18A  
400  
400  
µF  
µF  
OUT1  
OUT2  
IN1  
OUT1  
OUT2  
OUT1  
OUT2  
(V = 4.5V to 15V, V  
IN2  
4630fa  
9
For more information www.linear.com/LTM4630  
LTM4630  
OPERATION  
Power ꢁodule Description  
used for soft-starting the regulator. See the Applications  
Information section.  
The LTM4630 is a dual-output standalone nonisolated  
switching mode DC/DC power supply. It can provide two  
18A outputs with few external input and output capacitors  
and setup components. This module provides precisely  
regulated output voltages programmable via external  
TheLTM4630isinternallycompensatedtobestableoverall  
operatingconditions.Table4providesaguidelineforinput  
and output capacitances for several operating conditions.  
TheLinearTechnologyµModulePowerDesignToolwillbe  
resistors from 0.6V to 1.8V over 4.5V to 15V input  
DC  
DC  
voltages. The typical application schematic is shown in  
Figure 23.  
provided for transient and stability analysis. The V pin is  
FB  
used to program the output voltage with a single external  
resistor to ground. A differential remote sense amplifier is  
available for sensing the output voltage accurately on one  
of the outputs at the load point, or in parallel operation  
sensing the output voltage at the load point.  
TheLTM4630hasdualintegratedconstant-frequencycur-  
rent mode regulators and built-in power MOSFET devices  
withfastswitchingspeed. Thetypicalswitchingfrequency  
is 500kHz. For switching-noise sensitive applications, it  
can be externally synchronized from 400kHz to 780kHz. A  
resistor can be used to program a free run frequency on  
the FSET pin. See the Applications Information section.  
Multiphase operation can be easily employed with the  
MODE_PLLIN, PHASMD, and CLKOUT pins. Up to 12  
phases can be cascaded to run simultaneously with re-  
spect to each other by programming the PHASMD pin to  
different levels. See the Applications Information section.  
With current mode control and internal feedback loop  
compensation, the LTM4630 module has sufficient stabil-  
ity margins and good transient performance with a wide  
range of output capacitors, even with all ceramic output  
capacitors.  
High efficiency at light loads can be accomplished with  
selectable Burst Mode operation or pulse-skipping opera-  
tion using the MODE_PLLIN pin. These light load features  
willaccommodatebatteryoperation.Efficiencygraphsare  
providedforlightloadoperationintheTypicalPerformance  
Characteristics section. See the Applications Information  
section for details.  
Currentmodecontrolprovidescycle-by-cyclefastcurrent  
limitandfoldbackcurrentlimitinanovercurrentcondition.  
Internal overvoltage and undervoltage comparators pull  
the open-drain PGOOD outputs low if the output feedback  
voltage exits a 10% window around the regulation point.  
As the output voltage exceeds 10% above regulation, the  
bottom MOSFET will turn on to clamp the output voltage.  
ThetopMOSFETwillbeturnedoff.Thisovervoltageprotect  
is feedback voltage referred.  
A general purpose temperature diode is included inside  
the module to monitor the temperature of the module. See  
the Applications Information section for details.  
The switch pins are available for functional operation  
monitoring and a resistor-capacitor snubber circuit can  
be careful placed on the switch pin to ground to dampen  
any high frequency ringing on the transition edges. See  
the Applications Information section for details.  
Pulling the RUN pins below 1.1V forces the regulators  
into a shutdown state, by turning off both MOSFETs.  
The TRACK pins are used for programming the output  
voltage ramp and voltage tracking during start-up or  
4630fa  
10  
For more information www.linear.com/LTM4630  
LTM4630  
APPLICATIONS INFORMATION  
The typical LTM4630 application circuit is shown in Fig-  
ure 23. External component selection is primarily deter-  
mined by the maximum load current and output voltage.  
RefertoTable4forspecificexternalcapacitorrequirements  
for particular applications.  
Inparalleloperation,theV pinshaveanI currentof20nA  
FB  
FB  
maximumeachchannel.Toreduceoutputvoltageerrordue  
to this current, an additional V  
pin can be tied to V  
,
OUTS  
OUT  
andanadditionalR resistorcanbeusedtolowerthetotal  
FB  
Thevenin equivalent resistance seen by this current. For  
exampleinFigure2,thetotalTheveninequivalentresistance  
of the V pin is (60.4k//R ), which is 30.2k where R is  
V to V  
Step-Down Ratios  
IN  
OUꢄ  
FB  
FB  
FB  
equal to 60.4k for a 1.2V output. Four phases connected  
in parallel equates to a worse case feedback current of  
There are restrictions in the maximum V and V  
step-  
IN  
OUT  
down ratio that can be achieved for a given input voltage.  
Each output of the LTM4630 is capable of 98% duty cycle,  
4 • I = 80nA maximum. The voltage error is 80nA • 30.2k  
FB  
= 2.4mV. If V  
is connected, as shown in Figure 2, to  
OUTS2  
but the V to V  
minimum dropout is still shown as a  
IN  
OUT  
V
,andanother60.4kresistorisconnectedfromV to  
OUT  
FB2  
function of its load current and will limit output current  
capability related to high duty cycle on the top side switch.  
ground, then the voltage error is reduced to 1.2mV. If the  
voltage error is acceptable then no additional connections  
arenecessary.Theonboard60.4kresistoris0.5%accurate  
Minimum on-time t  
is another consideration in  
ON(MIN)  
operating at a specified duty cycle while operating at a  
certain frequency due to the fact that t < D/f  
and the V resistor can be chosen by the user to be as  
FB  
,
SW  
ON(MIN)  
accurate as needed. All COMP pins are tied together for  
current sharing between the phases. The TRACK/SS pins  
can be tied together and a single soft-start capacitor can  
be used to soft-start the regulator. The soft-start equation  
willneedtohavethesoft-startcurrentparameterincreased  
by the number of paralleled channels. See Output Voltage  
Tracking section.  
where D is duty cycle and f is the switching frequency.  
SW  
t
is specified in the electrical parameters as 90ns.  
ON(MIN)  
Output Voltage Prograꢃꢃing  
ThePWMcontrollerhasaninternal0.6Vreferencevoltage.  
AsshownintheBlockDiagram,a60.4kinternalfeedback  
resistor connects between the V  
to V and V  
OUTS1  
FB1 OUTS2  
to V . It is very important that these pins be connected  
FB2  
to their respective outputs for proper feedback regulation.  
4 PARALLELED OUTPUTS  
LTM4630  
60.4k  
V
V
COMP1  
COMP2  
OUT1  
OUT2  
FOR 1.2V AT 70A  
OvervoltagecanoccuriftheseV  
andV  
pinsare  
OUTS1  
OUTS2  
left floating when used as individual regulators, or at least  
one of them is used in paralleled regulators. The output  
voltage will default to 0.6V with no feedback resistor on  
V
OUTS1  
OUTS2  
V
OPTIONAL CONNECTION  
V
FB1  
either V or V . Adding a resistor R from V pin to  
FB1  
FB2  
FB  
FB  
60.4k  
TRACK1  
TRACK2  
GND programs the output voltage:  
V
FB2  
60.4k+ RFB  
OPTIONAL  
FB  
60.4k  
VOUT = 0.6V •  
R
RFB  
LTM4630  
60.4k  
V
COMP1  
COMP2  
OUT1  
OUT2  
V
ꢄable 1. VFB Resistor ꢄable vs Various Output Voltages  
USE TO LOWER  
V
V
OUTS1  
OUTS2  
TOTAL EQUIVALENT  
RESISTANCE TO LOWER  
V
0.6V  
1.0V  
1.2V  
1.5V  
1.8V  
30.2k  
OUꢄ  
R
Open  
90.9k  
60.4k  
40.2k  
I
FB  
VOLTAGE ERROR  
FB  
V
FB1  
For parallel operation of multiple channels the same feed-  
back setting resistor can be used for the parallel design.  
60.4k  
TRACK1  
TRACK2  
V
FB2  
0.1µF  
R
FB  
60.4k  
This is done by connecting the V  
to the output as  
OUTS1  
4630 F02  
shown in Figure 2, thus tying one of the internal 60.4k  
resistors to the output. All of the V pins tie together with  
FB  
Figure 2. 4-Phase Parallel Configurations  
one programming resistor as shown in Figure 2.  
4630fa  
11  
For more information www.linear.com/LTM4630  
LTM4630  
APPLICATIONS INFORMATION  
Input Capacitors  
µModule Power Design Tool will be provided for stability  
analysis.Multiphaseoperationwillreduceeffectiveoutput  
ripple as a function of the number of phases. Application  
Note 77 discusses this noise reduction versus output  
ripple current cancellation, but the output capacitance  
should be considered carefully as a function of stability  
and transient response. The Linear Technology µModule  
Power Design Tool can calculate the output ripple reduc-  
tion as the number of implemented phases increases by  
N times. A small value 10Ω to 50Ω resistor can be place  
The LTM4630 module should be connected to a low ac-  
impedance DC source. For the regulator input four 22µF  
input ceramic capacitors are used for RMS ripple current.  
A4Fto100µFsurfacemountaluminumelectrolyticbulk  
capacitor can be used for more input bulk capacitance.  
This bulk input capacitor is only needed if the input source  
impedanceiscompromisedbylonginductiveleads,traces  
ornotenoughsourcecapacitance.Iflowimpedancepower  
planes are used, then this bulk capacitor is not needed.  
in series from V  
to the V  
pin to allow for a bode  
OUT  
OUTS  
For a buck converter, the switching duty-cycle can be  
estimated as:  
plot analyzer to inject a signal into the control loop and  
validate the regulator stability. The same resistor could  
be place in series from V  
to DIFFP and a bode plot  
OUT  
VOUT  
V
IN  
analyzer could inject a signal into the control loop and  
validate the regulator stability.  
D =  
Without considering the inductor current ripple, for each  
output, the RMS current of the input capacitor can be  
estimated as:  
Burst ꢁode Operation  
The LTM4630 is capable of Burst Mode operation on each  
regulator in which the power MOSFETs operate intermit-  
tently based on load demand, thus saving quiescent cur-  
rent. For applications where maximizing the efficiency at  
very light loads is a high priority, Burst Mode operation  
should be applied. Burst Mode operation is enabled with  
the MODE_PLLIN pin floating. During this operation, the  
peak current of the inductor is set to approximately one  
third of the maximum peak current value in normal opera-  
tion even though the voltage at the COMP pin indicates  
a lower value. The voltage at the COMP pin drops when  
the inductor’s average current is greater than the load  
requirement. As the COMP voltage drops below 0.5V, the  
BURST comparator trips, causing the internal sleep line  
to go high and turn off both power MOSFETs.  
IOUT(MAX)  
ICIN(RMS)  
=
D 1D  
(
)
η%  
In the above equation, η% is the estimated efficiency of  
the power module. The bulk capacitor can be a switcher-  
rated electrolytic aluminum capacitor, Polymer capacitor.  
Output Capacitors  
The LTM4630 is designed for low output voltage ripple  
noise and good transient response. The bulk output  
capacitors defined as C  
are chosen with low enough  
OUT  
effective series resistance (ESR) to meet the output volt-  
age ripple and transient requirements. C can be a low  
OUT  
ESR tantalum capacitor, the low ESR polymer capacitor  
or ceramic capacitor. The typical output capacitance range  
for each output is from 200µF to 470µF. Additional output  
filtering may be required by the system designer, if further  
reduction of output ripples or dynamic transient spikes  
is required. Table 4 shows a matrix of different output  
voltages and output capacitors to minimize the voltage  
droop and overshoot during a 4.5A/µs transient. The table  
optimizes total equivalent ESR and total bulk capacitance  
tooptimizethetransientperformance.Stabilitycriteriaare  
consideredintheTable4matrix,andtheLinearTechnology  
In sleep mode, the internal circuitry is partially turned off,  
reducing the quiescent current to about 450µA for each  
output. The load current is now being supplied from the  
output capacitors. When the output voltage drops, caus-  
ing COMP to rise above 0.5V, the internal sleep line goes  
low, and the LTM4630 resumes normal operation. The  
next oscillator cycle will turn on the top power MOSFET  
and the switching cycle repeats. Either regulator can be  
configured for Burst Mode operation.  
4630fa  
12  
For more information www.linear.com/LTM4630  
LTM4630  
APPLICATIONS INFORMATION  
Pulse-Skipping ꢁode Operation  
(floating) generates a phase difference (between  
MODE_PLLIN and CLKOUT) of 120 degrees, 60 degrees,  
or 90 degrees respectively. A total of 12 phases can be  
cascadedtorunsimultaneouslywithrespecttoeachother  
byprogrammingthePHASMDpinofeachLTM4630chan-  
nel to different levels. Figure 3 shows a 2-phase design,  
4-phase design and a 6-phase design example for clock  
phasing with the PHASMD table.  
In applications where low output ripple and high effi-  
ciencyatintermediatecurrentsaredesired,pulse-skipping  
mode should be used. Pulse-skipping operation allows  
the LTM4630 to skip cycles at low output loads, thus  
increasing efficiency by reducing switching loss. Tying  
the MODE_PLLIN pin to INTV enables pulse-skipping  
CC  
operation. At light loads the internal current comparator  
may remain tripped for several cycles and force the top  
MOSFETtostayoffforseveralcycles,thusskippingcycles.  
The inductor current does not reverse in this mode. This  
modewillmaintainhighereffectivefrequenciesthuslower  
output ripple and lower noise than Burst Mode operation.  
Eitherregulatorcanbeconfiguredforpulse-skippingmode.  
A multiphase power supply significantly reduces the  
amount of ripple current in both the input and output ca-  
pacitors. The RMS input ripple current is reduced by, and  
the effective ripple frequency is multiplied by, the number  
of phases used (assuming that the input voltage is greater  
thanthenumberofphasesusedtimestheoutputvoltage).  
Theoutputrippleamplitudeisalsoreducedbythenumber  
of phases used when all of the outputs are tied together  
to achieve a single high output current design.  
Forced Continuous Operation  
In applications where fixed frequency operation is more  
critical than low current efficiency, and where the lowest  
output ripple is desired, forced continuous operation  
should be used. Forced continuous operation can be  
enabled by tying the MODE_PLLIN pin to GND. In this  
mode, inductor current is allowed to reverse during low  
output loads, the COMP voltage is in control of the current  
comparator threshold throughout, and the top MOSFET  
alwaysturnsonwitheachoscillatorpulse.Duringstart-up,  
forced continuous mode is disabled and inductor current  
is prevented from reversing until the LTM4630’s output  
voltage is in regulation. Either regulator can be configured  
for force continuous mode.  
The LTM4630 device is an inherently current mode con-  
trolled device, so parallel modules will have very good  
current sharing. This will balance the thermals on the  
design. Figure 26 shows an example of parallel operation  
and pin connection.  
Input RꢁS Ripple Current Cancellation  
Application Note 77 provides a detailed explanation of  
multiphaseoperation.TheinputRMSripplecurrentcancel-  
lationmathematicalderivationsarepresented,andagraph  
isdisplayedrepresentingtheRMSripplecurrentreduction  
asafunctionofthenumberofinterleavedphases. Figure4  
shows this graph.  
ꢁultiphase Operation  
For output loads that demand more than 18A of current,  
two outputs in LTM4630 or even multiple LTM4630s can  
be paralleled to run out of phase to provide more output  
currentwithoutincreasinginputandoutputvoltageripples.  
The MODE_PLLIN pin allows the LTM4630 to synchronize  
to an external clock (between 400kHz and 780kHz) and  
theinternalphase-locked-loopallowstheLTM4630tolock  
onto incoming clock phase as well. The CLKOUT signal  
can be connected to the MODE_PLLIN pin of the following  
stage to line up both the frequency and the phase of the  
Frequency Selection and Phase-Lock Loop  
(ꢁODE_PLLIN and f Pins)  
SEꢄ  
TheLTM4630deviceisoperatedoverarangeoffrequencies  
toimprovepowerconversionefficiency.Itisrecommended  
to operate the module at 500kHz over the output range for  
the best efficiency and inductor current ripple  
The LTM4630 switching frequency can be set with an  
external resistor from the f  
pin to SGND. An accurate  
SET  
10µA current source into the resistor will set a voltage  
that programs the frequency or a DC voltage can be  
entiresystem. TyingthePHASMDpintoINTV , SGND, or  
CC  
4630fa  
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LTM4630  
APPLICATIONS INFORMATION  
2-PHASE DESIGN  
PHASMD SGND FLOAT INTV  
CC  
FLOAT  
CONTROLLER1  
CONTROLLER2  
CLKOUT  
0
0
0
CLKOUT  
180  
60  
180  
90  
240  
120  
MODE_PLLIN  
0 PHASE  
180 PHASE  
V
V
OUT2  
OUT1  
PHASMD  
4-PHASE DESIGN  
90 DEGREE  
CLKOUT  
CLKOUT  
MODE_PLLIN  
MODE_PLLIN  
0 PHASE  
FLOAT  
180 PHASE  
90 PHASE  
270 PHASE  
V
V
V
OUT1  
V
OUT2  
OUT1  
OUT2  
FLOAT  
PHASMD  
PHASMD  
6-PHASE DESIGN  
60 DEGREE  
60 DEGREE  
CLKOUT  
MODE_PLLIN  
CLKOUT  
CLKOUT  
MODE_PLLIN  
MODE_PLLIN  
0 PHASE  
SGND  
180 PHASE  
60 PHASE  
SGND  
240 PHASE  
120 PHASE  
FLOAT  
300 PHASE  
V
OUT1  
V
V
V
V
OUT1  
V
OUT2  
OUT2  
OUT1  
OUT2  
PHASMD  
PHASMD  
PHASMD  
4630 F03  
Figure 3. Eꢂaꢃples of 2-Phase, 4-Phase, and 6-Phase Operation with PHASꢁD ꢄable  
0.60  
1-PHASE  
2-PHASE  
3-PHASE  
4-PHASE  
6-PHASE  
0.55  
0.50  
0.45  
0.40  
0.35  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0
0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7 0.75 0.8 0.85 0.9  
DUTY FACTOR (V /V  
)
OUT IN  
4630 F04  
Figure 4. Input RꢁS Current Ratios to DC Load Current as a Function of Duty Cycle  
4630fa  
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LTM4630  
APPLICATIONS INFORMATION  
applied. Figure 5 shows a graph of frequency setting  
Low duty cycle applications may approach this minimum  
on-time limit and care should be taken to ensure that:  
verses programming voltage. An external clock can be  
applied to the MODE_PLLIN pin from 0V to INTV over  
CC  
VOUT  
V FREQ  
IN  
a frequency range of 400kHz to 780kHz. The clock input  
high threshold is 1.6V and the clock input low threshold  
is 1V. The LTM4630 has the PLL loop filter components  
on board. The frequency setting resistor should always  
be present to set the initial switching frequency before  
locking to an external clock. Both regulators will operate  
in continuous mode while being externally clock.  
> tON(MIN)  
If the duty cycle falls below what can be accommodated  
by the minimum on-time, the controller will begin to skip  
cycles. The output voltage will continue to be regulated,  
buttheoutputrippleandcurrentwillincrease.Theon-time  
can be increased by lowering the switching frequency. A  
good rule of thumb is to keep on-time longer than 110ns.  
The output of the PLL phase detector has a pair of comple-  
mentary current sources that charge and discharge the  
internal filter network. When the external clock is applied  
Output Voltage racking  
then the f  
frequency resistor is disconnected with  
Output voltage tracking can be programmed externally  
using the TRACK pins. The output can be tracked up and  
downwithanotherregulator.Themasterregulator’soutput  
is divided down with an external resistor divider that is the  
same as the slave regulator’s feedback divider to imple-  
ment coincident tracking. The LTM4630 uses an accurate  
60.4k resistor internally for the top feedback resistor for  
each channel. Figure 6 shows an example of coincident  
tracking. Equations:  
SET  
an internal switch, and the current sources control the  
frequency adjustment to lock to the incoming external  
clock. When no external clock is applied, then the internal  
switch is on, thus connecting the external f frequency  
SET  
set resistor for free run operation.  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
60.4k  
RTA  
SLAVE = 1+  
• V  
TRACK  
V
V
is the track ramp applied to the slave’s track pin.  
has a control range of 0V to 0.6V, or the internal  
TRACK  
TRACK  
reference voltage. When the master’s output is divided  
down with the same resistor values used to set the slave’s  
output, then the slave will coincident track with the master  
until it reaches its final value. The master will continue to  
its final value from the slave’s regulation point. Voltage  
0
0.5  
1
1.5  
2
2.5  
f
PIN VOLTAGE (V)  
SET  
4630 F05  
Figure 5. Operating Frequency vs fSEꢄ Pin Voltage  
tracking is disabled when V  
is more than 0.6V. R  
TRACK  
TA  
in Figure 6 will be equal to the R for coincident tracking.  
FB  
Figure 7 shows the coincident tracking waveforms.  
ꢁiniꢃuꢃ On-ꢄiꢃe  
The TRACK pin of the master can be controlled by a  
capacitor placed on the master regulator TRACK pin to  
ground. A 1.3µA current source will charge the TRACK  
pin up to the reference voltage and then proceed up  
Minimum on-time t is the smallest time duration that  
ON  
the LTM4630 is capable of turning on the top MOSFET on  
either channel. It is determined by internal timing delays,  
and the gate charge required turning on the top MOSFET.  
4630fa  
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LTM4630  
APPLICATIONS INFORMATION  
INTV  
CC  
C10  
4.7µF  
R2  
10k  
PGOOD  
MODE_PLLIN CLKOUT INTV  
EXTV  
PGOOD1  
CC  
CC  
4V TO 15V INTERMEDIATE BUS  
1.5V AT 18A  
V
V
OUT1  
IN  
C4  
22µF  
25V  
C3  
22µF  
25V  
C2  
22µF  
25V  
C1  
22µF  
25V  
C6  
100µF  
6.3V  
C8  
R1*  
10k  
R6  
100k  
TEMP  
V
OUTS1  
SW1  
470µF  
6.3V  
RUN1  
RUN2  
V
V
FB1  
FB2  
TRACK1  
TRACK2  
D1*  
5.1V ZENER  
MASTER  
LTM4630  
R
FB  
60.4k  
40.2k  
COMP1  
COMP2  
C
SS  
0.1µF  
R
R
TA  
TB  
f
SET  
1.2V AT 18A  
60.4k  
60.4k  
PHASMD  
V
OUTS2  
SLAVE  
V
OUT2  
SW2  
1.5V  
C5  
100µF  
6.3V  
C7  
470µF  
6.3V  
R4  
121k  
PGOOD  
PGOOD2  
DIFFN DIFFOUT  
INTV  
SGND  
GND  
DIFFP  
CC  
R9  
10k  
RAMP TIME  
t
= (C /1.3µA) • 0.6  
SOFTSTART  
* PULL-UP RESISTOR AND ZENER ARE OPTIONAL.  
SS  
4630 F06  
Figure 6. Eꢂaꢃple of Output racking Application Circuit  
RegardlessofthemodeselectedbytheMODE_PLLINpin,  
the regulator channels will always start in pulse-skipping  
mode up to TRACK = 0.5V. Between TRACK = 0.5V and  
0.54V, it will operate in forced continuous mode and revert  
totheselectedmodeonceTRACK>0.54V. Inordertotrack  
with another channel once in steady state operation, the  
LTM4630 is forced into continuous mode operation as  
MASTER OUTPUT  
SLAVE OUTPUT  
soon as V is below 0.54V regardless of the setting on  
FB  
the MODE_PLLIN pin.  
Ratiometric tracking can be achieved by a few simple  
calculationsandtheslewratevalueappliedtothemaster’s  
TRACK pin. As mentioned above, the TRACK pin has a  
control range from 0 to 0.6V. The master’s TRACK pin  
slew rate is directly equal to the master’s output slew rate  
in Volts/Time. The equation:  
TIME  
4630 F07  
Figure 7. Output Coincident racking Waveforꢃ  
to INTVCC. After the 0.6V ramp, the TRACK pin will no  
longer be in control, and the internal voltage reference  
will control output regulation from the feedback divider.  
Foldback current limit is disabled during this sequence  
of turn-on during tracking or soft-starting. The TRACK  
pins are pulled low when the RUN pin is below 1.2V. The  
total soft-start time can be calculated as:  
MR  
SR  
• 60.4k = RTB  
where MR is the master’s output slew rate and SR is the  
slave’s output slew rate in Volts/Time. When coincident  
CSS  
1.3µA  
tSOFT-START  
=
• 0.6  
4630fa  
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LTM4630  
APPLICATIONS INFORMATION  
Run Enable  
tracking is desired, then MR and SR are equal, thus R  
TB  
is equal the 60.4k. R is derived from equation:  
TA  
TheRUNpinshaveanenablethresholdof1.4Vmaximum,  
typically1.25Vwith150mVofhysteresis. Theycontrolthe  
turnoneachofthechannelsandINTV .Thesepinscanbe  
pulleduptoV for5Voperation,ora5VZenerdiodecanbe  
placedonthepinsanda10kto100kresistorcanbeplaced  
up to higher than 5V input for enabling the channels. The  
RUN pins can also be used for output voltage sequencing.  
In parallel operation the RUN pins can be tie together and  
controlled from a single control. See the Typical Applica-  
tion circuits in Figure 23.  
0.6V  
RTA  
=
CC  
V
V
VTRACK  
RTB  
FB  
FB  
+
IN  
60.4k RFB  
where V is the feedback voltage reference of the regula-  
FB  
tor, and V  
is 0.6V. Since R is equal to the 60.4k  
TRACK  
TB  
top feedback resistor of the slave regulator in equal slew  
rate or coincident tracking, then R is equal to R with  
TA  
FB  
V
= V  
. Therefore R = 60.4k, and R = 60.4k in  
TRACK TB TA  
FB  
Figure 6.  
INꢄV and EXꢄV  
CC  
CC  
Inratiometrictracking, adifferentslewratemaybedesired  
The LTM4630 module has an internal 5V low dropout  
regulator that is derived from the input voltage. This regu-  
lator is used to power the control circuitry and the power  
MOSFET drivers. This regulator can source up to 70mA,  
and typically uses ~30mA for powering the device at the  
maximum frequency. This internal 5V supply is enabled  
by either RUN1 or RUN2.  
for the slave regulator. R can be solved for when SR is  
TB  
slower than MR. Make sure that the slave supply slew rate  
ischosentobefastenoughsothattheslaveoutputvoltage  
will reach it final value before the master output.  
For example, MR = 1.5V/1ms, and SR = 1.2V/1ms. Then  
R
TB  
= 76.8k. Solve for R to equal to 49.9k.  
TA  
EXTV allowsanexternal5VsupplytopowertheLTM4630  
andreducepowerdissipationfromtheinternallowdropout  
5V regulator. The power loss savings can be calculated by:  
Each of the TRACK pins will have the 1.3µA current source  
on when a resistive divider is used to implement tracking  
on that specific channel. This will impose an offset on the  
TRACK pin input. Smaller values resistors with the same  
ratios as the resistor values calculated from the above  
equation can be used. For example, where the 60.4k is  
used then a 6.04k can be used to reduce the TRACK pin  
offset to a negligible value.  
CC  
(V – 5V) • 30mA = PLOSS  
IN  
EXTV has a threshold of 4.7V for activation, and a  
CC  
maximum rating of 6V. When using a 5V input, connect  
this 5V input to EXTV also to maintain a 5V gate drive  
CC  
level. EXTV must sequence on after V , and EXTV  
CC  
IN  
CC  
must sequence off before V .  
IN  
Power Good  
The PGOOD pins are open drain pins that can be used to  
monitor valid output voltage regulation. This pin monitors  
a 10% window around the regulation point. A resistor can  
be pulled up to a particular supply voltage no greater than  
6V maximum for monitoring.  
Differential Reꢃote Sense Aꢃplifier  
Anaccuratedifferentialremotesenseamplifierisprovided  
to sense low output voltages accurately at the remote  
load points. This is especially true for high current loads.  
The amplifier can be used on one of the two channels, or  
on a single parallel output. It is very important that the  
DIFFP and DIFFN are connected properly at the output,  
and DIFFOUT is connected to either V  
In parallel operation, the DIFFP and DIFFN are connected  
properly at the output, and DIFFOUT is connected to  
Stability Coꢃpensation  
The module has already been internally compensated  
for all output voltages. Table 4 is provided for most ap-  
plication requirements. The Linear Technology µModule  
Power Design Tool will be provided for other control loop  
optimization.  
or V  
.
OUTS1  
OUTS2  
one of the V  
pins. Review the parallel schematics in  
OUTS  
Figure 24 and review Figure 2.  
4630fa  
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LTM4630  
APPLICATIONS INFORMATION  
SW Pins  
where V is the thermal voltage (kT/q), and n, the ideality  
T
factor, is 1 for the diode connected PNP transistor be-  
The SW pins are generally for testing purposes by moni-  
toring these pins. These pins can also be used to dampen  
out switch node ringing caused by LC parasitic in the  
switched current paths. Usually a series R-C combina-  
tion is used called a snubber circuit. The resistor will  
dampen the resonance and the capacitor is chosen to  
only affect the high frequency ringing across the resistor.  
If the stray inductance or capacitance can be measured or  
approximated then a somewhat analytical technique can  
be used to select the snubber values. The inductance is  
usuallyeasiertopredict.Itcombinesthepowerpathboard  
inductance in combination with the MOSFET interconnect  
bond wire inductance.  
ing used in the LTM4630. I is expressed by the typical  
S
empirical equation:  
VG0  
VT  
IS = I0 exp  
where I is a process and geometry dependent current, (I  
0
0
is typically around 20k orders of magnitude larger than I  
S
at room temperature) and V is the band gap voltage of  
G0  
1.2V extrapolated to absolute zero or –273°C.  
If we take the I equation and substitute into the V equa-  
S
D
tion, then we get:  
First the SW pin can be monitored with a wide bandwidth  
scope with a high frequency scope probe. The ring fre-  
quency can be measured for its value. The impedance Z  
can be calculated:  
   
kT  
q
I0  
   
kT  
q
VD = VG0 –  
ln  
, VT =  
I
   
D
The expression shows that the diode voltage decreases  
(linearly if I were constant) with increasing temperature  
and constant diode current. Figure 6 shows a plot of V  
vs Temperature over the operating temperature range of  
0
ZL = 2πfL,  
D
where f is the resonant frequency of the ring, and L is the  
total parasitic inductance in the switch path. If a resistor  
is selected that is equal to Z, then the ringing should be  
dampened. The snubber capacitor value is chosen so that  
its impedance is equal to the resistor at the ring frequency.  
Calculatedby:ZC=1/(2πfC).Thesevaluesareagoodplace  
to start with. Modification to these components should  
be made to attenuate the ringing with the least amount  
of power loss.  
the LTM4630.  
If we take this equation and differentiate it with respect to  
temperature T, then:  
dVD  
dT  
VG0 VD  
T
= –  
This dV /dT term is the temperature coefficient equal to  
about –2mV/K or –2mV/°C. The equation is simplified for  
the first order derivation.  
D
ꢄeꢃperature ꢁonitoring  
A diode connected PNP transistor is used for the TEMP  
monitor function by monitoring its voltage over tempera-  
ture. The temperature dependence of this diode voltage  
can be understood in the equation:  
Solving for T, T = (V – V )/(dV /dT) provides the  
G0  
D
D
temperature.  
1st Example: Figure 8 for 27°C, or 300K the diode  
voltage is 0.598V, thus, 300K = –(1200mV – 598mV)/  
–2.0 mV/K)  
   
ID  
VD = nVT ln  
   
I
   
2nd Example: Figure 8 for 75°C, or 350K the diode  
voltage is 0.50V, thus, 350K = –(1200mV – 500mV)/  
–2.0mV/K)  
S
4630fa  
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LTM4630  
APPLICATIONS INFORMATION  
Converting the Kelvin scale to Celsius is simply taking the  
Kelvin temp and subtracting 273 from it.  
the µModule regulator’s thermal performance in their ap-  
plicationatvariouselectricalandenvironmentaloperating  
conditions to compliment any FEA activities. Without FEA  
software, the thermal resistances reported in the Pin Con-  
figuration section are in-and-of themselves not relevant to  
providing guidance of thermal performance; instead, the  
derating curves provided in the data sheet can be used in  
a manner that yields insight and guidance pertaining to  
one’s application-usage, and can be adapted to correlate  
thermal performance to one’s own application.  
A typical forward voltage is given in the electrical charac-  
teristics section of the data sheet, and Figure 6 is the plot  
of this forward voltage. Measure this forward voltage at  
27°C to establish a reference point. Then using the above  
expression while measuring the forward voltage over  
temperature will provide a general temperature monitor.  
Connect a resistor between TEMP and V to set the cur-  
IN  
rent to 100µA. See Figure 24 for an example.  
The Pin Configuration section typically gives four thermal  
coefficients explicitly defined in JESD 51-12; these coef-  
ficients are quoted or paraphrased below:  
0.8  
I
= 100µA  
D
0.7  
0.6  
0.5  
0.4  
0.3  
1. θ , the thermal resistance from junction to ambient, is  
JA  
the natural convection junction-to-ambient air thermal  
resistance measured in a one cubic foot sealed enclo-  
sure.Thisenvironmentissometimesreferredtoasstill  
airalthoughnaturalconvectioncausestheairtomove.  
This value is determined with the part mounted to a  
JESD 51-9 defined test board, which does not reflect  
an actual application or viable operating condition.  
–50 –25  
0
25  
50  
75 100 125  
TEMPERATURE (°C)  
4630 F08  
2. θ  
, the thermal resistance from junction to the  
JCbottom  
Figure 8. Diode Voltage VD vs ꢄeꢃperature ꢄ(K)  
for Different Bias Currents  
bottom of the product case, is the junction-to-board  
thermal resistance with all of the component power  
dissipation flowing through the bottom of the package.  
In the typical µModule, the bulk of the heat flows out  
the bottom of the package, but there is always heat  
flow out into the ambient environment. As a result, this  
thermal resistance value may be useful for comparing  
packages but the test conditions don’t generally match  
the user’s application.  
ꢄherꢃal Considerations and Output Current Derating  
The thermal resistances reported in the Pin Configuration  
section of the data sheet are consistent with those param-  
eters defined by JESD51-9 and are intended for use with  
finite element analysis (FEA) software modeling tools that  
leverage the outcome of thermal modeling, simulation,  
and correlation to hardware evaluation performed on a  
µModulepackagemountedtoahardwaretestboard—also  
defined by JESD51-9 (“Test Boards for Area Array Surface  
MountPackageThermalMeasurements”).Themotivation  
for providing these thermal coefficients is found in JESD  
51-12 (“Guidelines for Reporting and Using Electronic  
Package Thermal Information”).  
3. θ  
, the thermal resistance from junction to top of  
JCTOP  
the product case, is determined with nearly all of the  
component power dissipation flowing through the top  
of the package. As the electrical connections of the  
typical µModule are on the bottom of the package, it  
is rare for an application to operate such that most of  
the heat flows from the junction to the top of the part.  
As in the case of θ  
, this value may be useful  
JCBOTTOM  
Many designers may opt to use laboratory equipment  
and a test vehicle such as the demo board to anticipate  
for comparing packages but the test conditions don’t  
generally match the user’s application.  
4630fa  
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LTM4630  
APPLICATIONS INFORMATION  
4. θ , the thermal resistance from junction to the printed  
relative to different junctions of components or die are not  
exactly linear with respect to total package power loss. To  
reconcile this complication without sacrificing modeling  
simplicity—but also, not ignoring practical realities—an  
approach has been taken using FEA software modeling  
along with laboratory testing in a controlled-environment  
chamber to reasonably define and correlate the thermal  
resistance values supplied in this data sheet: (1) Initially,  
FEA software is used to accurately build the mechanical  
geometry of the µModule and the specified PCB with all  
of the correct material coefficients along with accurate  
power loss source definitions; (2) this model simulates  
a software-defined JEDEC environment consistent with  
JSED51-9topredictpowerlossheatowandtemperature  
readingsatdifferentinterfacesthatenablethecalculationof  
theJEDEC-definedthermalresistancevalues;(3)themodel  
and FEA software is used to evaluate the µModule with  
heat sink and airflow; (4) having solved for and analyzed  
these thermal resistance values and simulated various  
operating conditions in the software model, a thorough  
laboratory evaluation replicates the simulated conditions  
with thermocouples within a controlled-environment  
chamberwhileoperatingthedeviceatthesamepowerloss  
as that which was simulated. An outcome of this process  
and due-diligence yields a set of derating curves provided  
in other sections of this data sheet. After these laboratory  
test have been performed and correlated to the µModule  
JB  
circuitboard,isthejunction-to-boardthermalresistance  
wherealmostalloftheheatowsthroughthebottomof  
the µModule and into the board, and is really the sum of  
the θ  
and the thermal resistance of the bottom  
JCbottom  
of the part through the solder joints and through a por-  
tion of the board. The board temperature is measured a  
specified distance from the package, using a two sided,  
two layer board. This board is described in JESD 51-9.  
A graphical representation of the aforementioned ther-  
mal resistances is given in Figure 9; blue resistances are  
contained within the µModule regulator, whereas green  
resistances are external to the µModule.  
As a practical matter, it should be clear to the reader that  
no individual or sub-group of the four thermal resistance  
parameters defined by JESD 51-12 or provided in the  
Pin Configuration section replicates or conveys normal  
operatingconditionsofaµModule.Forexample,innormal  
board-mounted applications, never does 100% of the  
device’s total power loss (heat) thermally conduct exclu-  
sivelythroughthetoporexclusivelythroughbottomofthe  
µModule—asthestandarddefinesforθ  
andθ  
,
JCtop  
JCbottom  
respectively.Inpractice,powerlossisthermallydissipated  
inbothdirectionsawayfromthepackage—granted, inthe  
absence of a heat sink and airflow, a majority of the heat  
flow is into the board.  
model, then the θ and θ are summed together to cor-  
JB  
BA  
Within a SIP (system-in-package) module, be aware there  
are multiple power devices and components dissipating  
power, with a consequence that the thermal resistances  
relatequite wellwith the µModule modelwithno airflowor  
heat sinking in a properly define chamber. This θ + θ  
JB  
BA  
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)  
JUNCTION-TO-CASE (TOP)  
RESISTANCE  
CASE (TOP)-TO-AMBIENT  
RESISTANCE  
JUNCTION-TO-BOARD RESISTANCE  
JUNCTION  
AMBIENT  
JUNCTION-TO-CASE  
(BOTTOM) RESISTANCE  
CASE (BOTTOM)-TO-BOARD  
RESISTANCE  
BOARD-TO-AMBIENT  
RESISTANCE  
4630 F10  
µMODULE DEVICE  
Figure 9. Graphical Representation of JESD51-12 ꢄherꢃal Coefficients  
4630fa  
20  
For more information www.linear.com/LTM4630  
LTM4630  
APPLICATIONS INFORMATION  
valueisshowninthePinConfigurationsectionandshould  
Power Derating  
accurately equal the θ value because approximately  
JA  
The 1.0V and 1.5V power loss curves in Figures 13 and 14  
can be used in coordination with the load current derating  
curves in Figures 15 to 22 for calculating an approximate  
100% of power loss flows from the junction through the  
board into ambient with no airflow or top mounted heat  
sink. Each system has its own thermal characteristics,  
therefore thermal analysis must be performed by the user  
in a particular system.  
Θ thermal resistance for the LTM4630 with various heat  
JA  
sinking and airflow conditions. The power loss curves are  
taken at room temperature, and are increased with a 1.35  
to 1.4 multiplicative factor at 125°C. These factors come  
fromthe fact that thepowerloss of theregulatorincreases  
about 45% from 25°C to 150°C, thus a 50% spread over  
125°C delta equates to ~0.35%/°C loss increase. A 125°C  
maximumjunctionminus2Croomtemperatureequates  
to a 100°C increase. This 100°C increase multiplied by  
0.35%/°C equals a 35% power loss increase at the 125°C  
junction, thus the 1.35 multiplier.  
The LTM4630 module has been designed to effectively  
remove heat from both the top and bottom of the pack-  
age. The bottom substrate material has very low thermal  
resistance to the printed circuit board. An external heat  
sink can be applied to the top of the device for excellent  
heat sinking with airflow.  
Figures10and11showtemperatureplotsoftheLTM4630  
with no heat sink and 200LFM airflow.  
The derating curves are plotted with CH1 and CH2 in  
parallel single output operation starting at 36A of load  
with low ambient temperature. The output voltages are  
1.0V and 1.5V. These are chosen to include the lower and  
higher output voltage ranges for correlating the thermal  
resistance. Thermal models are derived from several  
temperature measurements in a controlled temperature  
chamber along with thermal modeling analysis.  
These plots equate to a paralleled 12V to 1.0V at 36A  
design operating at 84.5% efficiency, and 12V to 1.2V at  
36A design operating at 86% efficiency.  
Safety Considerations  
The LTM4630 modules do not provide isolation from V  
IN  
to V . There is no internal fuse. If required, a slow blow  
OUT  
fuse with a rating twice the maximum input current needs  
to be provided to protect each unit from catastrophic  
failure. The device does support over current protection.  
A temperature diode is provided for monitoring internal  
temperature,andcanbeusedtodetecttheneedforthermal  
shutdown that can be done by controlling the RUN pin.  
Figure 11. ꢄherꢃal Iꢃage 12V to 1.2V,  
36A with 200LFꢁ without Heat Sink  
Figure 10. ꢄherꢃal Iꢃage 12V to 1.0V,  
36A with 200LFꢁ without Heat Sink  
4630fa  
21  
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LTM4630  
APPLICATIONS INFORMATION  
The junction temperatures are monitored while ambient  
temperature is increased with and without airflow. The  
power loss increase with ambient temperature change  
is factored into the derating curves. The junctions are  
maintained at ~120°C maximum while lowering output  
current or power while increasing ambient temperature.  
The decreased output current will decrease the internal  
module loss as ambient temperature is increased.  
from the efficiency curves and adjusted with the above  
ambient temperature multiplicative factors. The printed  
circuit board is a 1.6mm thick four layer board with two  
ounce copper for the two outer layers and one ounce  
copper for the two inner layers. The PCB dimensions are  
101mm×114mm. TheBGAheatsinksarelistedinTable3.  
Layout Checklist/Eꢂaꢃple  
The high integration of LTM4630 makes the PCB board  
layoutverysimpleandeasy.However,tooptimizeitselectri-  
cal and thermal performance, some layout considerations  
are still necessary.  
The monitored junction temperature of 120°C minus  
the ambient operating temperature specifies how much  
module temperature rise can be allowed. As an example in  
Figure15,theloadcurrentisderatedto~25Aat~86°Cwith  
no air or heat sink and the power loss for the 12V to 1.0V  
at 25A output is a ~5.5W loss. The 5.5W loss is calculated  
with the ~4.1W room temperature loss from the 12V to  
1.0V power loss curve at 25A, and the 1.35 multiplying  
factor at 125°C ambient. If the 86°C ambient temperature  
is subtracted from the 120°C junction temperature, then  
• Use large PCB copper areas for high current paths,  
including V , GND, V  
and V  
. It helps to mini-  
IN  
OUT1  
OUT2  
mize the PCB conduction loss and thermal stress.  
• Place high frequency ceramic input and output capaci-  
tors next to the V , PGND and V  
pins to minimize  
IN  
OUT  
high frequency noise.  
the difference of 34°C divided 5.5W equals a 6.2°C/W Θ  
JA  
thermal resistance. Table 2 specifies a 7°C/W value which  
is pretty close. The airflow graphs are more accurate due  
to the fact that the ambient temperature environment is  
controlled better with airflow. As an example in Figure 19,  
the load current is derated to ~30A at ~72°C with 200LFM  
of airflow and the power loss for the 12V to 1.5V at 30A  
output is a ~7.9W loss. The 7.9W loss is calculated with  
the ~5.9W room temperature loss from the 12V to 1.5V  
power loss curve at 22A, and the 1.35 multiplying factor  
at 125°C ambient. If the 72°C ambient temperature is  
subtracted from the 120°C junction temperature, then  
the difference of 48°C divided 7.9W equals a 6.0°C/W  
• Place a dedicated power ground layer underneath the  
unit.  
• Tominimizetheviaconductionlossandreducemodule  
thermal stress, use multiple vias for interconnection  
between top layer and other power layers.  
• Do not put via directly on the pad, unless they are  
capped or plated over.  
• Use a separated SGND ground copper area for com-  
ponents connected to signal pins. Connect the SGND  
to GND underneath the unit.  
• For parallel modules, tie the V , V , and COMP pins  
θ
thermal resistance. Table 2 specifies a 6.0°C/W value  
OUT FB  
JA  
together. Use an internal layer to closely connect these  
pins together. The TRACK pin can be tied a common  
capacitor for regulator soft-start.  
which is pretty close. Tables 2 and 3 provide equivalent  
thermal resistances for 1.0V and 1.5V outputs with and  
without airflow and heat sinking.  
• Bring out test points on the signal pins for monitoring.  
The derived thermal resistances in Tables 2 and 3 for the  
various conditions can be multiplied by the calculated  
power loss as a function of ambient temperature to derive  
temperature rise above ambient, thus maximum junction  
temperature.Roomtemperaturepowerlosscanbederived  
Figure 12 gives a good example of the recommended  
layout. LGA and BGA PCB layouts are identical with the  
exceptionofcirclepadsforBGA(seePackageDescription).  
4630fa  
22  
For more information www.linear.com/LTM4630  
LTM4630  
APPLICATIONS INFORMATION  
C
C
IN1  
IN2  
V
IN  
M
L
K
J
GND  
GND  
H
G
F
SGND  
C
C
OUT2  
OUT1  
E
D
C
B
A
1
2
3
4
5
6
7
8
9
10  
11  
12  
V
GND  
V
OUT2  
OUT1  
4630 F12  
CNTRL  
CNTRL  
Figure 12. Recoꢃꢃended PCB Layout (LGA Shown, for BGA Use Circle Pads)  
ꢄable 2. 1.0V Output  
DERAING CURVE  
Figures 15, 16  
Figures 15, 16  
Figures 15, 16  
Figures 17, 18  
Figures 17, 18  
Figures 17, 18  
V
(V)  
POWER LOSS CURVE  
Figure 13  
AIRFLOW (LFꢁ)  
HEASINK  
None  
None  
θ
(°C/W)  
7
6
5.5  
6.5  
5
IN  
JA  
5, 12  
5, 12  
5, 12  
5, 12  
5, 12  
5, 12  
0
Figure 13  
Figure 13  
Figure 13  
Figure 13  
200  
400  
0
200  
400  
None  
BGA Heat Sink  
BGA Heat Sink  
BGA Heat Sink  
Figure 13  
4
ꢄable 3. 1.5V Output  
DERAING CURVE  
Figures 19, 20  
V
(V)  
POWER LOSS CURVE  
Figure 14  
AIRFLOW (LFꢁ)  
HEASINK  
None  
θ
(°C/W)  
IN  
JA  
5, 12  
5, 12  
5, 12  
5, 12  
5, 12  
5, 12  
0
7
6
Figures 19, 20  
Figure 14  
200  
400  
0
None  
Figures 19, 20  
Figure 14  
None  
5.5  
6.5  
4
Figures 21, 22  
Figure 14  
BGA Heat Sink  
BGA Heat Sink  
BGA Heat Sink  
Figures 21, 22  
Figure 14  
200  
400  
Figures 21, 22  
Figure 14  
3.5  
HEASINK ꢁANUFACꢄURER  
PARꢄ NUꢁBER  
WEBSIꢄE  
www.aavid.com  
Aavid Thermalloy  
375424B00034G  
4630fa  
23  
For more information www.linear.com/LTM4630  
LTM4630  
APPLICATIONS INFORMATION  
ꢄable 4. Output Voltage Response vs Coꢃponent ꢁatriꢂ (Refer to Figure 23) 0A to 7A Load Step ꢄypical ꢁeasured Values  
VENDORS  
VALUE  
PARꢄ NUꢁBER  
TDK, C  
Murata, C  
Ceramic  
100µF 6.3V  
100µF 6.3V  
100µF 6.3V  
C4532X5R0J107MZ  
GRM32ER60J107M  
18126D107MAT  
OUT1  
Ceramic  
OUT1  
AVX, C  
Ceramic  
OUT1  
Sanyo POSCAP, C  
Sanyo POSCAP, C  
Bulk  
Bulk  
470µF 2R5  
470µF 6.3V  
56µF 25V  
2R5TPD470M5  
6TPD470M  
OUT2  
OUT2  
Sanyo, C Bulk  
25SVP56M  
IN  
P-P  
RECOVERY  
LOAD  
SꢄEP  
(A/µs)  
V
C
C
C
C
C
V
DROOP DEVIAION  
ꢄIꢁE  
(µs)  
LOAD SꢄEP  
(A)  
R
FB  
FREQ  
(kHz)  
OUꢄ  
IN  
IN  
OUꢄ  
OUꢄ  
FF  
(pF)  
IN  
(V) (CERAꢁIC) (BULK) (CERAꢁIC) (BULK)  
(V)  
(ꢃV)  
(ꢃV)  
120  
130  
140  
160  
160  
190  
170  
210  
(kΩ)  
90.9  
90.9  
60.4  
60.4  
40.2  
40.2  
30.2  
30.2  
1
1
22uF × 2  
22uF × 2  
22uF × 2  
22uF × 2  
22uF × 2  
22uF × 2  
22uF × 2  
22uF × 2  
150µF  
150µF  
150µF  
150µF  
150µF  
150µF  
150µF  
150µF  
100µF  
100µF × 4  
100µF  
100µF × 4  
100µF  
100µF × 4  
100µF  
100µF × 4  
470µF  
None  
470µF  
None  
470µF  
None  
470µF  
None  
None 5, 12  
None 5, 12  
None 5, 12  
None 5, 12  
None 5, 12  
None 5, 12  
None 5, 12  
None 5, 12  
0
0
0
0
0
0
0
0
25  
20  
25  
20  
25  
25  
30  
25  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
450  
450  
450  
450  
450  
450  
450  
450  
1.2  
1.2  
1.5  
1.5  
1.8  
1.8  
8
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
40  
35  
30  
25  
20  
15  
10  
5
V
= 12V  
V
= 12V  
IN  
IN  
V
= 5V  
V
= 5V  
IN  
IN  
0LFM  
200LFM  
400LFM  
0
70 80  
AMBIENT TEMPERATURE (°C)  
0
5
10 15 20 25 30 35 40  
LOAD CURRENT (A)  
0
5
10 15 20 25 30 35 40  
LOAD CURRENT (A)  
30 40 50 60  
90 100 110 120  
4630 F13  
4630 F14  
4630 F15  
Figure 13. 1.0V Power Loss Curve  
Figure 14. 1.5V Power Loss Curve  
Figure 15. 12V to 1V Derating  
Curve, No Heat Sink  
4630fa  
24  
For more information www.linear.com/LTM4630  
LTM4630  
APPLICATIONS INFORMATION  
40  
35  
30  
25  
20  
15  
10  
5
40  
35  
30  
25  
20  
15  
10  
5
40  
35  
30  
25  
20  
15  
10  
5
0LFM  
200LFM  
400LFM  
0LFM  
200LFM  
400LFM  
0LFM  
200LFM  
400LFM  
0
0
0
70 80  
70 80  
70 80  
AMBIENT TEMPERATURE (°C)  
30 40 50 60  
90 100 110 120  
30 40 50 60  
90 100 110 120  
30 40 50 60  
90 100 110 120  
AMBIENT TEMPERATURE (°C)  
AMBIENT TEMPERATURE (°C)  
4630 F16  
4630 F1t  
4630 F18  
Figure 18. 5V to 1V Derating  
Curve, BGA Heat Sink  
Figure 16. 5V to 1V Derating  
Curve, No Heat Sink  
Figure 17. 12V to 1V Derating  
Curve, BGA Heat Sink  
40  
35  
30  
25  
20  
15  
10  
5
40  
35  
30  
25  
20  
15  
10  
0LFM  
200LFM  
400LFM  
0LFM  
200LFM  
400LFM  
5
0
0
70 80  
30 40 50 60  
90 100 110 120  
AMBIENT TEMPERATURE (°C)  
70 80  
AMBIENT TEMPERATURE (°C)  
30 40 50 60  
90 100 110 120  
4630 F19  
4630 F20  
Figure 19. 12V to 1.5V Derating  
Curve, No Heat Sink  
Figure 20. 5V to 1.5V Derating  
Curve, No Heat Sink  
40  
35  
30  
25  
20  
15  
10  
5
40  
35  
30  
25  
20  
15  
10  
5
0LFM  
200LFM  
400LFM  
0LFM  
200LFM  
400LFM  
0
0
70 80  
AMBIENT TEMPERATURE (°C)  
70 80  
AMBIENT TEMPERATURE (°C)  
30 40 50 60  
90 100 110 120  
30 40 50 60  
90 100 110 120  
4630 F21  
4630 F22  
Figure 21. 12V to 1.5V Derating  
Curve, BGA Heat Sink  
Figure 22. 5V to 1.5V Derating  
Curve, BGA Heat Sink  
4630fa  
25  
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LTM4630  
APPLICATIONS INFORMATION  
4630fa  
26  
For more information www.linear.com/LTM4630  
LTM4630  
TYPICAL APPLICATIONS  
4630fa  
27  
For more information www.linear.com/LTM4630  
LTM4630  
TYPICAL APPLICATIONS  
4630fa  
28  
For more information www.linear.com/LTM4630  
LTM4630  
TYPICAL APPLICATIONS  
INTV  
CC  
C10  
4.7µF  
R2  
5k  
CLK1  
PGOOD1  
MODE_PLLIN CLKOUT INTV  
EXTV  
PGOOD1  
CC  
CC  
4.5V TO 15V INTERMEDIATE BUS  
V
IN  
4.5V TO 15V  
V
IN  
V
OUT1  
C3  
C2  
22µF  
25V  
C1  
22µF  
25V  
C
C
OUT2  
+
+
OUT1  
R1  
R6  
TEMP  
V
OUTS1  
SW1  
22µF  
25V  
100µF  
470µF  
6.3V  
10k  
100k  
6.3V  
RUN1  
RUN  
V
V
FB1  
RUN2  
FB  
V
R5  
FB2  
TRACK1  
TRACK1  
TRACK2  
D1  
LTM4630  
60.4k  
COMP1  
COMP2  
5.1V ZENER  
f
COMP  
SET  
PHASMD  
V
OUTS2  
V
OUT2  
SW2  
C
C
OUT1  
OUT2  
R4  
121k  
100µF  
6.3V  
470µF  
6.3V  
PGOOD2  
DIFFN DIFFOUT  
PGOOD1  
SGND GND  
DIFFP  
V
1.2V  
70A  
OUT  
C16  
4.7µF  
CLK1  
MODE_PLLIN CLKOUT INTV  
PGOOD1  
EXTV  
PGOOD1  
CC  
CC  
4.5V TO 15V INTERMEDIATE BUS  
V
V
OUT1  
IN  
C12  
22µF  
25V  
C15  
22µF  
25V  
C5  
22µF  
25V  
C
C
+
+
OUT1  
OUT2  
R9  
TEMP  
V
OUTS1  
SW1  
100µF  
6.3V  
470µF  
6.3V  
100k  
RUN1  
RUN1  
RUN2  
V
V
V
FB  
FB1  
FB2  
TRACK1  
TRACK1  
TRACK2  
LTM4630  
COMP1  
COMP2  
COMP  
C19  
0.22µF  
f
SET  
PHASMD  
V
OUTS2  
V
OUT2  
SW2  
C
C
OUT1  
OUT2  
R10  
121k  
100µF  
6.3V  
470µF  
6.3V  
PGOOD2  
DIFFN DIFFOUT  
PGOOD1  
SGND GND  
DIFFP  
4630 F26  
INTV  
CC  
Figure 26. Lꢁ4630 4-Phase, 1.2V at 70A  
4630fa  
29  
For more information www.linear.com/LTM4630  
LTM4630  
PACKAGE DESCRIPTION  
Lꢁ4630 Coꢃponent LGA and BGA Pinout  
PIN ID FUNCꢄION  
PIN ID  
B1  
FUNCꢄION  
VOUT1  
VOUT1  
VOUT1  
VOUT1  
VOUT1  
GND  
PIN ID  
C1  
FUNCꢄION PIN ID FUNCꢄION  
PIN ID  
E1  
FUNCꢄION  
GND  
PIN ID  
F1  
FUNCꢄION  
GND  
A1  
A2  
VOUT1  
VOUT1  
VOUT1  
VOUT1  
VOUT1  
GND  
VOUT1  
VOUT1  
VOUT1  
VOUT1  
VOUT1S  
D1  
D2  
GND  
GND  
B2  
C2  
E2  
GND  
F2  
GND  
A3  
B3  
C3  
D3  
GND  
E3  
GND  
F3  
GND  
A4  
B4  
C4  
D4  
GND  
E4  
GND  
F4  
MODE_PLLIN  
RUN1  
A5  
B5  
C5  
D5  
VFB1  
SGND  
VFB2  
TRACK2  
GND  
E5  
TRACK1  
COMP1  
COMP2  
DIFFP  
DIFFN  
GND  
F5  
A6  
B6  
C6  
f
D6  
E6  
F6  
SGND  
SET  
A7  
GND  
B7  
GND  
C7  
SGND  
VOUT2S  
VOUT2  
VOUT2  
VOUT2  
VOUT2  
D7  
E7  
F7  
SGND  
A8  
VOUT2  
VOUT2  
VOUT2  
VOUT2  
VOUT2  
B8  
VOUT2  
VOUT2  
VOUT2  
VOUT2  
VOUT2  
C8  
D8  
E8  
F8  
DIFFOUT  
RUN2  
A9  
B9  
C9  
D9  
E9  
F9  
A10  
A11  
A12  
B10  
B11  
B12  
C10  
C11  
C12  
D10  
D11  
D12  
GND  
E10  
E11  
E12  
F10  
F11  
F12  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
PIN ID FUNCꢄION  
PIN ID  
H1  
FUNCꢄION  
GND  
PIN ID  
J1  
FUNCꢄION PIN ID FUNCꢄION  
PIN ID  
L1  
FUNCꢄION  
GND  
VIN  
PIN ID  
M1  
FUNCꢄION  
GND  
VIN  
G1  
G2  
GND  
SW1  
GND  
VIN  
K1  
K2  
GND  
VIN  
H2  
GND  
J2  
L2  
M2  
G3  
GND  
H3  
GND  
J3  
VIN  
K3  
VIN  
L3  
VIN  
M3  
VIN  
G4  
PHASEMD  
CLKOUT  
SGND  
H4  
GND  
J4  
VIN  
K4  
VIN  
L4  
VIN  
M4  
VIN  
G5  
H5  
GND  
J5  
GND  
TEMP  
EXTVCC  
GND  
VIN  
K5  
GND  
GND  
GND  
GND  
VIN  
L5  
VIN  
M5  
VIN  
G6  
H6  
GND  
J6  
K6  
L6  
VIN  
M6  
VIN  
G7  
SGND  
H7  
GND  
J7  
K7  
L7  
VIN  
M7  
VIN  
G8  
PGOOD2  
PGOOD1  
GND  
H8  
INTVCC  
GND  
J8  
K8  
L8  
VIN  
M8  
VIN  
G9  
H9  
J9  
K9  
L9  
VIN  
M9  
VIN  
G10  
G11  
G12  
H10  
H11  
H12  
GND  
J10  
J11  
J12  
VIN  
K10  
K11  
K12  
VIN  
L10  
L11  
L12  
VIN  
M10  
M11  
M12  
VIN  
SW2  
GND  
VIN  
VIN  
VIN  
VIN  
GND  
GND  
GND  
GND  
GND  
GND  
4630fa  
30  
For more information www.linear.com/LTM4630  
LTM4630  
PACKAGE DESCRIPTION  
Please refer to http://www.linear.coꢃ/designtools/packaging/ for the ꢃost recent package drawings.  
Z
/ / b b b  
Z
6 . 9 8 5 0  
5 . 7 1 5 0  
4 . 4 4 5 0  
3 . 1 7 5 0  
1 . 9 0 5 0  
0 . 6 3 5 0  
0 . 0 0 0 0  
0 . 6 3 5 0  
1 . 9 0 5 0  
3 . 1 7 5 0  
4 . 4 4 5 0  
5 . 7 1 5 0  
6 . 9 8 5 0  
a a a  
Z
4630fa  
31  
For more information www.linear.com/LTM4630  
LTM4630  
PACKAGE DESCRIPTION  
Please refer to http://www.linear.coꢃ/designtools/packaging/ for the ꢃost recent package drawings.  
Z
/ / b b b  
Z
6 . 9 8 5 0  
5 . 7 1 5 0  
4 . 4 4 5 0  
3 . 1 7 5 0  
1 . 9 0 5 0  
0 . 6 3 5 0  
0 . 0 0 0 0  
0 . 6 3 5 0  
1 . 9 0 5 0  
3 . 1 7 5 0  
4 . 4 4 5 0  
5 . 7 1 5 0  
6 . 9 8 5 0  
a a a  
Z
4630fa  
32  
For more information www.linear.com/LTM4630  
LTM4630  
REVISION HISTORY  
REV  
DAE  
DESCRIPꢄION  
PAGE NUꢁBER  
A
03/14 Added BGA package  
1, 2, 32  
4630fa  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-  
33  
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.  
LTM4630  
PACKAGE PHOTO  
LGA  
BGA  
DESIGN RESOURCES  
SUBJECꢄ  
DESCRIPꢄION  
µModule Design and Manufacturing Resources  
Design:  
Manufacturing:  
• Selector Guides  
• Quick Start Guide  
• Demo Boards and Gerber Files  
• Free Simulation Tools  
• PCB Design, Assembly and Manufacturing Guidelines  
• Package and Board Level Reliability  
µModule Regulator Products Search  
1. Sort table of products by parameters and download the result as a spread sheet.  
2. Search using the Quick Power Search parametric table.  
TechClip Videos  
Quick videos detailing how to bench test electrical and thermal performance of µModule products.  
Digital Power System Management  
Linear Technology’s family of digital power supply management ICs are highly integrated solutions that  
offer essential functions, including power supply monitoring, supervision, margining and sequencing,  
and feature EEPROM for storing user configurations and fault logging.  
RELATED PARTS  
PARꢄ NUꢁBER DESCRIPꢄION  
COꢁꢁENꢄS  
LTM4620  
Dual 13A Single 26A µModule Regulator  
Pin Compatible with LTM4630; 4.5V ≤ V ≤ 16V, 0.6V ≤ V  
≤ 2.5V,  
IN  
OUT  
15mm × 15mm × 4.32mm  
LTM4628  
Dual 8A, Single 16A µModule Regulator  
15A µModule Regulator  
Pin Compatible with LTM4630; 4.5V ≤ V ≤ 26.5V, 0.6V ≤ V  
≤ 5.5V,  
IN  
OUT  
15mm × 15mm × 4.32mm  
LTM4627  
LTM4611  
LTM4619  
LTM4615  
LTM4616  
4.5V ≤ V ≤ 20V, 0.6V ≤ V  
≤ 5.5V, 15mm × 15mm × 4.32mm  
OUT  
IN  
Ultralow V , 15A µModule Regulator  
1.5V ≤ V ≤ 5.5V, 0.8V ≤ V  
≤ 5V, 15mm × 15mm × 4.32mm  
OUT  
IN  
IN  
Dual 26V , 4A DC/DC µModule Regulator  
4.5V ≤ V ≤ 26.5V; 0.8V ≤ V  
≤ 5V  
OUT  
IN  
IN  
Triple Low V , 4A DC/DC µModule Regulator  
2.375 ≤ V ≤ 5.5V; Two 4A and One 1.5A Output  
IN  
IN  
Dual 8A, Low V , DC/DC µModule Regulator  
2.7V ≤ V ≤ 5.5V; 0.6V ≤ V  
≤ 5V  
OUT  
IN  
IN  
LTM8062/  
LTM8062A  
32V , 2A µModule Battery Charger with Maximum Adjustable V  
Up to 14.4V (18.8V for the LTM8062A), C/10 or Timer  
IN  
BATT  
Peak Power Tracking (MPPT)  
Termination, 9mm × 15mm × 4.32mm LGA Package  
LTM8027  
LTM4613  
60V , 4A DC/DC Step-Down µModule Regulator  
4.5V ≤ V ≤ 60V, 2.5V ≤ V ≤ 24V, 15mm × 15mm × 4.32mm LGA Package  
IN  
IN  
OUT  
EN55022B Compliant 36V , 8A Step-Down  
5V ≤ V ≤ 36V, 3.3V ≤ V  
≤ 15V, Synchronizable, Parallelable,  
IN  
IN  
OUT  
µModule Regulator  
15mm × 15mm × 4.32mm LGA Package  
4630fa  
LT 0314 REV A • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
34  
LINEAR TECHNOLOGY CORPORATION 2013  
(408)432-1900 FAX: (408) 434-0507 www.linear.com/LTM4630  

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