LTC1555LEGN [Linear]
SIM Power Supply and Level Translator; SIM电源和电平转换器型号: | LTC1555LEGN |
厂家: | Linear |
描述: | SIM Power Supply and Level Translator |
文件: | 总8页 (文件大小:133K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTC1555L
SIM Power Supply and
Level Translator
U
FEATURES
DESCRIPTIO
The LTC®1555L provides power conversion and level
shiftingneededforlowvoltageGSMcellulartelephonesto
interface with either 3V or 5V Subscriber Identity Modules
(SIMs). The part contains a patented buck/boost charge
pump DC/DC converter* that delivers a regulated VCC
supply voltage to the SIM card. Input voltage may range
from 2.6V to 6V allowing direct connection to the battery.
Theoutputvoltagemaybeprogrammedto3V,5Vordirect
connection to the VIN pin.
■
Buck/Boost Charge Pump Generates 3V or 5V
■
Input Voltage Range: 2.6V to 6V
■
Controller VCC Range: 1.425V to 4.4V
>10kV ESD on All SIM Contact Pins
■
■
Short-Circuit and Overtemperature Protected
■
3V to 5V Signal Level Translators
■
Very Low Operating Current: 40µA
■
Very Low Shutdown Current: <1µA
■
Soft-Start Limits Inrush Current at Turn-On
■
1MHz Switching Frequency
Internal level translators allow controllers operating with
supplies as low as 1.425V to interface with 3V and 5V
SIMs. A soft-start feature limits inrush current at turn-on,
mitigating start-up problems that may result when the
input is supplied by another low-power DC/DC converter.
Battery life is maximized by 40µA operating current, and
1µA shutdown current. Board area is minimized by the
miniature 16-pin narrow SSOP packages and the need for
only three small external capacitors.
■
Available in 16-Pin Narrow SSOP Package
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APPLICATIO S
■
SIM Interface in GSM Cellular Telephones
Smart Card Readers
■
, LTC and LT are registered trademarks of Linear Technology Corporation.
*U.S. Patent No.: 5,973,944
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TYPICAL APPLICATIO
GSM Cellular Telephone SIM Interface
GSM
V
IN
2.6V TO 6V
1.425V TO 4.4V
CONTROLLER
LTC1555L
CIN
SIM
1
16
15
14
13
12
11
10
9
CLK
RST
I/O
CLK
RST
I/O
2
3
4
5
6
7
8
RIN
OUTPUT VOLTAGE
MODES
DATA
DDRV
V
V
= 3V
= 5V
= V
IN
CC
V
V
VCC
CC
CC
CC
*
I
= 10mA
V
DV
CC
V
CC
IN
+
V
CC
2.2µF
N/C
M1
M0
C1
C1
*
ACTUAL V WILL
CC
0.1µF
DEPEND ON OUTPUT
–
1µF
GND
CURRENT IN THIS MODE
GND
1555L TA01
1
LTC1555L
W W U W
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W
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ABSOLUTE AXI U RATI GS
PACKAGE/ORDER I FOR ATIO
(Note 1)
ORDER PART
VIN, DVCC to GND .....................................–0.3V to 6.5V
VCC to GND ...............................................–0.3V to 6.5V
Digital Inputs to GND................................–0.3V to 6.5V
CLK, RST, I/O to GND ..................... –0.3V to VCC + 0.3V
VCC Short-Circuit Duration............................... Indefinite
Operating Temperature Range (Note 2) .. – 40°C to 85°C
Storage Temperature Range ................. – 65°C to 150°C
Lead Temperature (Soldering,10 sec)................... 300°C
TOP VIEW
NUMBER
CIN
RIN
1
2
3
4
5
6
7
8
16 CLK
15 RST
LTC1555LEGN
DATA
DDRV
14
13
12
11
10
9
I/0
V
V
CC
DV
CC
IN
+
N/C
M1
M0
C1
C1
GN PART MARKING
1555L
–
GND
GN PACKAGE
16-LEAD PLASTIC SSOP
TJMAX = 125°C, θJA = 150°C/W
Consult factory for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (VIN = 2.6V to 6V, DVCC = 1.425V to 4.4V, controller digital pins tied to
DVCC, SIM digital pins floating, C1 = 0.1µF, COUT = 2.2µF unless otherwise noted)
PARAMETER
Operating Voltage
CONDITIONS
MIN
2.6
TYP
MAX
6
UNITS
V
V
●
●
IN
DV Operating Voltage
CC
1.425
4.4
V
DV Undervoltage Lockout
1.2
35
V
CC
V
V
Operating Current
Shutdown Current
V
= 5V, I = 0V
VCC
●
●
●
●
65
1
µA
µA
µA
µA
IN
IN
CC
M0, M1 = 0V
M0, M1, DATA = DV , C = 1MHz
DV Operating Current
CC
5
30
1
CC IN
DV Shutdown Current
CC
M0, M1 = 0V, DATA, C = DV
IN CC
V
Output Voltage
0 < I
< 10mA
VCC
CC
M0, M1 = DV , 2.6V < V < 6V
M0, M1 = DV , 2.7V < V < 6V
M0 = DV , M1 = 0
M0 = 0, M1 = DV
●
●
●
●
4.55
4.75
2.8
5
5
3
5.25
5.25
3.2
V
V
V
V
CC
IN
CC
IN
CC
V
– 0.2
V
IN
CC
IN
V
Short-Circuit Current
V
Shorted to GND
●
50
1
150
mA
CC
CC
Charge Pump f
MHz
OSC
2
LTC1555L
ELECTRICAL CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (VIN = 2.6V to 6V, DVCC = 1.425V to 4.4V, controller digital pins tied to
DVCC, SIM digital pins floating, C1 = 0.1µF, COUT = 2.2µF unless otherwise noted)
PARAMETER
Controller Inputs/Outputs (DV = 3V)
CONDITIONS
MIN
TYP
MAX
UNITS
CC
Input Current (I /I )
M0, M1, M2, RIN, CIN
●
●
●
●
–100
–5
100
nA
µA
IH IL
Input Current (I /I )
DDRV
DATA
DATA
5
20
IH IL
High Level Input Current (I )
–20
µA
IH
Low Level Input Current (I )
1
mA
IL
High Input Voltage Threshold (V )
M0, M1, M2, RIN, CIN, DDRV
DATA
●
●
0.7 × DV
V
V
IH
CC
DV – 0.6
CC
Low Input Voltage Threshold (V )
M0, M1, M2, RIN, CIN, DDRV
DATA
●
●
0.2 × DV
V
V
IL
CC
CC
0.4
High Level Output Voltage (V
)
DATA Source Current = 20µA I/O = V
●
●
●
●
0.7 × DV
V
V
OH
CC
Low Level Output Voltage (V
DATA Pull-Up Resistance
DATA Output Rise/Fall Time
)
OL
DATA Sink Current = –200µA I/O = 0V (Note 3)
Between DATA and DV
0.4
30
2
13
20
kΩ
µs
CC
DATA Loaded with 30pF
1.3
SIM Inputs/Outputs (V = 3V or 5V)
CC
I/O High Input Voltage Threshold (V )
I
I
= ±20µA
●
●
●
●
●
●
●
0.7 × V
CC
V
V
IH
IH(MAX)
IL(MAX)
I/O Low Input Voltage Threshold (V )
= 1mA
0.4
IL
High Level Output Voltage (V
)
I/O, Source Current = 20µA DATA or DDRV = DV
0.8 × V
0.9 × V
6.5
V
OH
CC
CC
Low Level Output Voltage (V
)
OL
I/O, Sink Current = –1mA DATA or DDRV = 0V (Note 3)
RST, CLK Source Current = 20µA
0.4
V
High Level Output Voltage (V
)
V
OH
CC
Low Level Output Voltage (V
I/O Pull-Up Resistance
)
OL
RST, CLK Sink Current = –200µA
0.4
14
V
Between I/O and V
10
kΩ
CC
SIM Timing Parameters (DV = 3V, V = 5V)
CC
CC
CLK Rise/Fall Time
RST, I/O Rise/Fall Time
CLK Frequency
CLK Loaded with 30pF, V = 3V, or 5V
●
●
●
18
1
ns
µs
CC
RST, I/O Loaded with 30pF
CLK Loaded with 30pF
5
MHz
ms
V
V
Turn-On Time
C
= 2.2µF, I = 0
VCC
0.5
0.5
CC
CC
OUT
Discharge Time to 1V
I
= 0, V = 5V, C = 2.2µF
OUT
ms
VCC
CC
operating temperature range are assured by design, characterization and
correlation with statistical process controls.
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 3: The DATA and I/O pull-down drivers must also sink current
sourced by the internal pull-up resistor.
Note 2: The LTC1555LEGN is guaranteed to meet performance
specifications from 0°C to 70°C. Specifications over the –40°C to 85°C
3
LTC1555L
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TYPICAL PERFOR A CE CHARACTERISTICS
IVIN vs Temperature
IDVCC vs VDVCC
IVIN vs VIN
50
40
30
20
10
50
40
30
20
10
20
15
10
5
V
I
= 3.6V
= 0mA
I
T
= 0mA
= 25°C
F
= 1MHz
IN
VCC
VCC
A
CLK
V
V
= 5V
= 3V
CC
V
= 5V
CC
T
= 85°C
A
CC
V
CC
= 3V
T
= –40°C
A
T
= 25°C
A
0
40
80
–40
120
4
5
0
2
6
3
3
1
4
5
2
TEMPERATURE (°C)
V
IN
(V)
V
(V)
DVCC
1555L • G02
1555L • G01
1555L • G03
VCC vs VIN
VCC vs VIN
3.6
3.3
3.0
2.7
2.4
6.0
5.5
5.0
4.5
4.0
V
= 5V
= 10mA
V
= 3V
= 10mA
CC
CC
I
I
VCC
VCC
T
= 85°C
A
T
= 85°C
A
T
= –40°C
A
T
= –40°C
T
= 25°C
A
A
T
= 25°C
A
4
5
4
5
2
6
2
6
3
3
V
IN
(V)
V
(V)
IN
1555L • G05
1555L • G04
U
U
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PIN FUNCTIONS
DDRV (Pin 4): Optional Data Input Pin for Sending Data to
the SIM Card. When not needed, the DDRV pin should
either be left floating or tied to DVCC (an internal 1µA
current source will pull the DDRV pin up to DVCC if left
floating).
CIN (Pin 1): Clock Input Pin from Controller.
RIN (Pin 2): Reset Input Pin from Controller.
DATA (Pin 3): Controller Side Data Input/Output Pin. Can
be used for single pin bidirectional data transfer between
the controller and the SIM card as long as the controller
data pin is open drain. The controller output must be able
to sink 1mA max when driving the DATA pin low due to the
internal pull-up resistors on the DATA and I/O pins. If the
controllerdataoutputisnotopendrain, thentheDDRVpin
should be used for sending data to the SIM card and the
DATA pin used for receiving data from the SIM card.
DVCC (Pin 5): Supply Voltage for Controller Side Digital
Input/Output Pins (typically 3V). May be between 1.425V
and 4.4V. The DVCC supply may be powered-down in
shutdown for further reduction in battery current. When
DVCC drops below 1.2V, the charge pump is disabled and
the LTC1555L goes into shutdown mode regardless of the
signals on the M0-M1 pins.
4
LTC1555L
U
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PIN FUNCTIONS
N/C (Pin 6): No Internal Connection.
VIN (Pin 12): Charge Pump Input Pin. May be between
2.6V and 6V. There is no power-up sequencing require-
ment for VIN with respect to DVCC.
M1 (Pin 7): Mode Control Bit 1 (see Table 1).
M0 (Pin 8): Mode Control Bit 0 (see Table 1).
VCC (Pin 13): SIM Card VCC Output. Should be connected
to the SIM VCC contact. The VCC output voltage is deter-
mined by the M0-M1 pins (see Table 1). VCC is discharged
to GND during shutdown (M0, M1 = 0V). A 2.2µF low ESR
ouptut capacitor should connect close to the VCC pin.
GND (Pin 9): Ground for Both the SIM and the Controller.
Should be connected to the SIM GND contact as well as to
the VIN/controller GND. Proper grounding and supply
bypassing is required to meet 15kV ESD specifications.
C1–(Pin10):ChargePumpFlyingCapacitorNegative Input.
C1+ (Pin11):ChargePumpFlyingCapacitorPositive Input.
I/O (Pin 14): SIM Side I/O Pin. The pin is an open drain
output with a nominal pull-up resistance of 10kΩ and
should be connected to the SIM I/O contact. The SIM card
must sink up to 1mA max when driving the I/O pin low due
to the internal pull-up resistors on the I/O and DATA pins.
The I/O pin is held active low during shutdown.
Table 1. Truth Table
M0
0V
0V
M1
OPERATING MODE
0V
Shutdown (V = 0V)
CC
*
DV
CC
V
= V
IN
CC
RST (Pin 15): Level Shifted Reset Output Pin. Should be
connected to the SIM RST contact.
DV
0V
DV
V
= 3V
= 5V
CC
CC
CC
CC
DV
V
CC
CLK (Pin 16): Level Shifted Clock Output Pin. Should be
connected to the SIM CLK contact. Careful trace routing is
recommended due to fast rise and fall edge speeds.
*Actual V will depend on the output current in this mode.
CC
W
BLOCK DIAGRA
V
BATT
0.1µF
C
IN
1µF
+
–
C1
C1
LTC1555L
V
IN
V
CC
V
CC
C
OUT
2.2µF
M0
M1
STEP-UP/
STEP-DOWN
CHARGE PUMP
DC/DC
CONVERTER
1.8V
UVLO
DV
CC
V
CC
RIN
RST
CLK
RST
CLK
CONTROLLER
SIM
CIN
20k
10k
DATA
DDRV
I/O
I/O
1µA
OPTIONAL
GND
GND
1555L BD
5
LTC1555L
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APPLICATIO S I FOR ATIO
Iftheinputsourceimpedanceisverylow(<0.5Ω),CIN may
notbeneeded.IncreasingthesizeofCOUTto2.2µForgreater
willreduceoutputvoltageripple—particularlywithhighVIN
voltages (4V or greater). A ceramic X5R or X7R type
capacitor is recommended for the flying capacitor C1 with
a value of 0.1µF or 0.22µF.
The LTC1555L performs the two primary functions nec-
essary for low voltage controllers (e.g., GSM cellular
telephone controllers, smart card readers, etc.) to com-
municate with 5V SIMs or smart cards. The part produces
a regulated 3V or 5V VCC supply for the SIM, and also
provides level translators for communication between the
SIM and the controller.
Output Ripple
V
CC Voltage Regulator
Normal LTC1555L operation produces voltage ripple on
the VCC pin. Output voltage ripple is required for the parts
to regulate. Low frequency ripple exists due to the hyster-
esisinthesensecomparatorandpropagationdelaysinthe
chargepumpenable/disablecircuits.Highfrequencyripple
is also present mainly from the ESR (equivalent series
resistance) in the output capacitor. Typical output ripple
(VIN < 4V) under maximum load is 75mV peak-to-peak
with a low ESR, 2.2µF output capacitor. (VCC = 5V)
The regulator section of the LTC1555L (refer to Block
Diagram) consists of a buck/boost charge pump DC/DC
converter. Thechargepumpcanoperateoverawideinput
voltage range (2.6V to 6V) while maintaining a regulated
VCC output. The wide VIN range enables the part to be
powered directly from a battery (if desired) rather than
from a DC/DC converter output. When VIN is less than the
selected VCC voltage, the part operates as a switched
capacitor voltage doubler. When VIN is greater than VCC,
thepartoperatesasgatedswitchstep-down converter. In
either case, voltage conversion requires only one small
flying capacitor and output capacitor.
The magnitude of the ripple voltage depends on several
factors. High input voltages increase the output ripple
since more charge is delivered to COUT per charging cycle.
A large C1 flying capacitor (> 0.22µF) also increases ripple
instep-upmodeforthesamereason.Largeoutputcurrent
load and/or a small output capacitor (< 1µF) results in
higher ripple due to higher output voltage dV/dt. High ESR
capacitors (ESR > 0.5Ω) on the output pin cause high
frequency voltage spikes on VOUT with every clock cycle.
The VCC output can be programmed via the M0-M1 pins to
either 3V, 5V or direct connection to VIN. This flexibility is
useful in applications where multiple voltage SIMs may be
used. When the charge pump is put into shutdown (M0,
M1 = 0), VCC is pulled to GND via an internal switch to aid
in proper system supply sequencing.
A 2.2µF ceramic capacitor on the VCC pin should produce
acceptable levels of output voltage ripple in nearly all
applications. Also, in order to keep noise down to a
minimum all capacitors should be placed close to
LTC1555L.
An internal soft-start feature helps to limit inrush currents
upon start-up or when coming out of shutdown mode.
Inrush current limiting is especially useful when powering
the LTC1555L from a DC/DC output since the unlimited
inrush current may approach 300mA and cause voltage
transients on the 3V supply. The part is fully short-circuit
andovertemperatureprotected,andcansurviveanindefi-
nite short from VCC to GND.
Level Translators
All SIMs and smart cards contain a clock input, a reset
input,andabidirectionaldatainput/output.TheLTC1555L
provides level translators to allow controllers to
communicate with the SIM. (See Figure 1a and 1b). The
CLK and RST inputs to the SIM are level shifted from the
controller supply rails (DVCC and GND) to the SIM supply
rails (VCC and GND). The data input to the SIM may be
providedtwodifferentways. Thefirstmethodistousethe
DATA pin as a bidirectional level translator. This configu-
ration is only allowed if the controller data output pin is
Capacitor Selection
For best performance, it is recommended that low ESR
(<0.5Ω)capacitorsbeusedforbothCIN andCOUTtoreduce
noise and ripple. The CIN and COUT capacitors should be
either ceramic or tantalum and should be 1µF or greater
(ceramiccapacitorswillproducethesmallestoutputripple).
6
LTC1555L
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APPLICATIO S I FOR ATIO
forces the LTC1555L into shutdown mode regardless of
the status of the M0-M1 pins.
open drain (all SIM I/O pins are open drain). Internal
pull-up resistors are provided for both the DATA pin and
the I/O pin on the SIM side. The second method is to use
theDDRVpintosenddatatotheSIMandusetheDATApin
to receive data from the SIM. When the DDRV pin is not
used, it should either be left floating or tied to DVCC.
10kV ESD Protection
All pins that connect to the SIM (CLK, RST, I/O, VCC, GND)
withstand over 10kV of human body model ESD. In order
to ensure proper ESD protection, careful board layout is
required. The GND pin should be tied directly to a GND
plane. The VCC capacitor should be located very close to
the VCC pin and tied immediately to the GND plane.
Shutting Down the DVCC Supply
To conserve power, the DVCC supply may be shut down
while the VIN supply is still active. When the DVCC supply
is forced below 1.2V, an undervoltage lockout circuit
LTC1555L
LTC1555L
CLK TO SIM
RST TO SIM
CIN
CLK
RST
I/O
CLK TO SIM
RST TO SIM
CIN
CLK
RST
I/O
RIN
RIN
DATA TO/FROM SIM
DATA
DDRV
DATA FROM SIM
DATA TO SIM
DATA
DDRV
V
V
CC
CC
CONTROLLER
SIDE
CONTROLLER
SIDE
DV
CC
DV
CC
SIM SIDE
SIM SIDE
1555L F01a
1555L F01b
Figure 1a. Level Translator Connections for
Bidirectional Controller DATA Pin
Figure 1b. Level Translator Connections for
One-Directional Controller Side DATA Flow
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.
7
LTC1555L
U
TYPICAL APPLICATIO
GSM Cellular Telephone SIM Interface
GSM
V
IN
1.425V TO 4.4V
CONTROLLER
LTC1555L
CIN
2.6V TO 6V
SIM
1
16
15
14
13
12
11
10
9
CLK
RST
I/O
CLK
RST
I/O
2
3
4
5
6
7
8
RIN
DATA
DDRV
V
= 3V, 5V
CC
V
CC
or V
IN
I
= 10mA
V
VCC
DV
CC
V
IN
+
CC
2.2µF
N/C
M1
M0
C1
C1
0.1µF
–
1µF
GND
GND
1555L TA01a
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PACKAGE DESCRIPTIO
Dimensions in inches (millimeters) unless otherwise noted.
GN Package
16-Lead Plastic SSOP (Narrow 0.150)
(LTC DWG # 05-08-1641)
0.189 – 0.196*
(4.801 – 4.978)
0.009
(0.229)
REF
16 15 14 13 12 11 10 9
0.229 – 0.244
(5.817 – 6.198)
0.150 – 0.157**
(3.810 – 3.988)
1
2
3
4
5
6
7
8
0.015 ± 0.004
(0.38 ± 0.10)
× 45°
0.053 – 0.068
(1.351 – 1.727)
0.004 – 0.0098
(0.102 – 0.249)
0.007 – 0.0098
(0.178 – 0.249)
0° – 8° TYP
0.016 – 0.050
(0.406 – 1.270)
0.0250
(0.635)
BSC
0.008 – 0.012
(0.203 – 0.305)
* DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
GN16 (SSOP) 1098
RELATED PARTS
PART NUMBER
LTC1555L-1.8
LTC1555/LTC1556
LTC1755
DESCRIPTION
COMMENTS
SIM Power Supply and Level Translator
SIM Power Supply and Level Translator
Smart Card Interface
V
IN
V
IN
V
IN
V
IN
V
IN
= 2.6V to 6V; Interface with 1.8V, 3V and 5V SIMs
= 2.7V to 10V; Step-Up/Step-Down Charge Pump; 3V and 5V V
OUT
= 2.7V to 6V; 24-Pin SSOP Package; I = 60µA
Q
LTC1756
Smart Card Interface
= 2.7V to 6V; 16-Pin SSOP Package; I = 75µA
Q
LTC1986
3V/5V SIM Power Supply in SOT-23
= 2.6V to 4.4V; I = 14µA
Q
1555lf LT/TP 0601 2K • PRINTED IN USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
8
●
●
LINEAR TECHNOLOGY CORPORATION 2000
(408)432-1900 FAX:(408)434-0507 www.linear-tech.com
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LTC1556IGN#PBF
LTC1556 - SIM Power Supplyand Level Translator; Package: SSOP; Pins: 20; Temperature Range: -40°C to 85°C
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