LTC1324CS [Linear]
IC LINE TRANSCEIVER, PDSO16, 0.150 INCH, PLASTIC, SO-16, Line Driver or Receiver;
| 型号： | LTC1324CS |
| 厂家： | 
Linear |
| 描述： | IC LINE TRANSCEIVER, PDSO16, 0.150 INCH, PLASTIC, SO-16, Line Driver or Receiver 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总8页 (文件大小：213K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LTC1324
Single Supply LocalTalk®
Transceiver
U
FEATURES
DESCRIPTION
The LTC®1324 is a single 5V line transceiver designed to
operate on Apple®LocalTalk networks. The driver features
a digitally selectable low slew rate mode for reduced EMI
emissions. The chip draws only 1mA quiescent current
when active and 1µA in shutdown. The differential driver
outputs three-state when disabled, during shutdown or
when the power is off. The driver outputs will maintain
high impedance even with output common mode voltages
beyondthepowersupplyrails. Boththedriveroutputsand
receiver inputs are protected against ESD damage to
±10kV.
■
Single Chip 5V LocalTalk Port
■
Low Power: ICC = 1mA Typ
■
Shutdown Pin Reduces ICC to 1µA Typ
■
Digitally Selectable Low Slew Rate Mode for
Reduced EMI Emmisions
■
Drivers Maintain High Impedance in Three-State or
with Power Off
■
Thermal Shutdown Protection
■
Drivers Are Short-Circuit Protected
U
APPLICATIONS
■
LocalTalk Peripherals
Notebook and Palmtop Computers
Battery-Powered Systems
The LTC1324 is available in a 16-pin SO Wide package.
, LTC and LT are registered trademarks of Linear Technology Corporation.
Apple and LocalTalk are registered trademarks of Apple Computer, Inc.
■
■
U
TYPICAL APPLICATION
Waveform of Driver
Typical LocalTalk Connection for Low EMI
5V
16
LocalTalk
TRANSFORMER
DIN
5V/DIV
12
11
2
3
4
5
6
7
8
SLEW RATE CONTROL
DATA IN
120Ω
TX ENABLE
DOUT
1V/DIV
LTC1324
SHUTDOWN
RX ENABLE
10
9
DATA OUT
1324 TA01
TIME (0.5µs/DIV)
1324 TA02
1
LTC1324
W W
U W
U
W U
ABSOLUTE MAXIMUM RATINGS
PACKAGE/ORDER INFORMATION
(Note 1)
TOP VIEW
ORDER PART
NUMBER
Supply Voltage (VCC) ................................................ 7V
Input Voltage (Logic Inputs) ........ –0.3V to (VCC +0.3V)
Input Voltage (Receiver Inputs) ............................ ±15V
Driver Output Voltage (Forced) ............................. ±15V
Driver Short-Circuit Duration .......................... Indefinite
Operating Temperature Range .................... 0°C to 70°C
Storage Temperature Range ................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C
16
V
CC
NC
SR
1
2
3
4
5
6
7
8
15 TXDEN
14 RXEN
13 NC
TXD
LTC1324CN
LTC1324CSW
DX
TXDEN
SHDN
RXEN
RXO
–
12 TXD
+
11 TXD
–
10 RXD
RX
+
9
RXD
GND
N PACKAGE
16-LEAD PDIP
SW PACKAGE
16-LEAD PLASTIC SO WIDE
TJMAX = 150°C, θJA = 110°C/ W (N)
JMAX = 150°C, θJA = 150°C/ W (SW)
T
Consult factory for Industrial and Military grade parts.
VCC = 5V, TA = 0°C to 70°C (Notes 2, 3), unless otherwise noted.
ELECTRICAL CHARACTERISTICS
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Supplies
I
Normal Operation Supply Current
Shutdown Supply Current
No Load, SHDN = 0V, TXDEN = 0V, RXEN = 0V
●
●
1
1
2
10
mA
µA
CC
No Load, SHDN = V
CC
Differential Driver
V
OD
Differential Output Voltage
No Load
R = 50Ω (Figure 1)
L
●
●
±4.0
±2.0
V
V
∆V
Change in Magnitude of Differential
Output Voltage
R = 50Ω (Figure 1)
L
0.2
V
OD
V
Differential Common Mode Output Voltage
Short-Circuit Current
R = 50Ω (Figure 1)
3.0
120
±2
V
mA
µA
OC
L
I
I
0V ≤ V ≤ 5V
●
●
35
250
SS
OZ
O
Three-State Output Current
(TXDEN = V and TXDEN = GND) or
±200
CC
SHDN = V or Power Off, –10V ≤ V ≤ 10V
CC
O
Logic Inputs
V
V
Input High Voltage
Input Low Voltage
Input Current
All Logic Input Pins
●
●
●
●
2.4
V
V
IH
IL
All Logic Input Pins
0.8
±20
60
I
I
SHDN, TXDEN, RXDEN, V = 0V to V
±1
µA
µA
IN
DN
CC
Pull-Down Current
RXDEN, TXDEN, SR, V = 0V to V
15
CC
Receiver
R
Input Resistance
–7V ≤ V ≤ 7V
12
kΩ
mV
mV
V
IN
IN
Receiver Threshold Voltage
Receiver Input Hysteresis
Output High Voltage
–7V ≤ V ≤ 7V
●
–200
200
CM
–7V ≤ V ≤ 7V
70
CM
V
V
I = –4mA
O
●
●
●
●
3.5
7
OH
Output Low Voltage
I = 4mA
O
0.4
85
V
OL
I
I
Output Short-Circuit Current
Output Three-State Current
0V ≤ V ≤ 5V
mA
µA
SS
OZ
O
0V ≤ V ≤ 5V, RXEN = V , RXEN = GND
±2
±100
O
CC
2
LTC1324
ELECTRICAL CHARACTERISTICS
VCC = 5V, TA = 0°C to 70°C (Notes 2, 3), unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Switching Characteristics
t
, t
Driver Propagation Delay
Without Slew Rate Control
R = 100Ω, C = 100pF (Figures 2, 4)
●
●
40
120
1.2
ns
PLH PHL
L
L
SR = GND
Driver Propagation Delay
with Slew Rate Control
R = 100Ω, C = 100pF (Figures 2, 4)
0.4
µs
L
L
SR = V
CC
Receiver Propagation Delay
C = 15pF (Figures 2, 6)
●
●
40
10
120
35
ns
ns
L
t
Driver Output to Output
Without Slew Rate Control
R = 100Ω, C = 100pF (Figures 2, 4)
SKEW
L
L
SR = GND
Driver Output to Output
with Slew Rate Control
R = 100Ω, C = 100pF (Figures 2, 4)
●
●
●
●
●
25
20
100
50
ns
ns
µs
ns
µs
L
L
SR = V
CC
t , t
r
Driver Rise/Fall Time
Without Slew Rate Control
R = 100Ω, C = 100pF (Figures 2,4)
f
L
L
SR = GND
Driver Rise/Fall Time
with Slew Rate Control
R = 100Ω, C = 100pF (Figures 2, 4)
0.4
50
1.2
150
2
L
L
SR = V
CC
t
t
, t
Driver Output Active to Disable
Without Slew Rate Control
C = 15pF (Figures 3, 5)
Hdis Ldis
L
SR = GND
Driver Output Active to Disable
with Slew Rate Control
C = 15pF (Figures 3, 5)
0.7
L
SR = V
CC
Receiver Output Active to Disable
C = 15pF (Figures 3, 7)
●
●
30
50
100
150
ns
ns
L
, t
Driver Enable to Output Active
Without Slew Rate Control
C = 15pF (Figures 3, 5)
ENH ENL
L
SR = GND
Driver Enable to Output Active
with Slew Rate Control
C = 15pF (Figures 3, 5)
●
●
250
30
750
100
ns
ns
L
SR = V
CC
Receiver Enable to Output Active
C = 15pF (Figures 3, 7)
L
The
●
denotes specifications which apply over the full operating
Note 2: All currents into device pins are positive and all currents out of
device pins are negative. All voltages are reference to ground unless
otherwise specified.
temperature range.
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 3: All typicals are given at V = 5V, T = 25°C.
CC A
W
U
TYPICAL PERFORMANCE CHARACTERISTICS
Driver Differential Output Voltage
vs Output Current
Driver Output Low Voltage
vs Output Current
Driver Output High Voltage
vs Output Current
120
100
80
60
40
20
0
–105
–90
–75
–60
–45
–30
–15
0
80
70
60
50
40
30
20
10
0
T
= 25°C
T
= 25°C
A
T
A
= 25°C
A
2.0
0
0.5
1.0
1.5
2.0
2.5
3.0
0
0.5 1.0 1.5
2.5 3.0 3.5 4.0
1.5 2.0 2.5 3.0 3.5
4.5 5.0
1.0
4.0
OUTPUT VOLTAGE (V)
DRIVER DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER OUTPUT HIGH VOLTAGE (V)
1324 G02
1324 G01
1324 G03
3
LTC1324
TYPICAL PERFORMANCE CHARACTERISTICS
W
U
Receiver Output High Voltage
vs Output Current
Receiver Output Low Voltage
vs Output Current
Driver Short-Circuit Current
vs Temperature
30
25
20
15
10
5
–16
–14
–12
–10
–8
110
100
90
T
A
= 25°C
T
= 25°C
A
80
70
–6
60
–4
50
–2
0
0
40
–55 –35
0
0.4
0.8
1.2
1.6
2.0
4.5
2.0
2.5
3.0
3.5
4.0
5.0
105
125
5
25 45
85
–15
65
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
TEMPERATURE (°C)
1324 G04
1324 G05
1324 G06
Receiver Short-Circuit Current
vs Temperature
Supply Current (Driver and
Receiver Enabled) vs Temperature
Driver Skew vs Temperature
900
875
850
825
800
775
750
725
700
19
4.2
4.0
3.8
3.6
3.4
3.2
3.0
18
17
16
15
14
13
12
11
10
105
125
–55 –35
5
25 45
85
105
–15
65
105
85 125
–55 –35
5
25 45
85
125
–55 –35
5
25 45
–15
65
–15
65
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
1324 G08
1324 G07
1324 G09
Receiver Output Low Voltage
vs Temperature
Receiver Output High Voltage
vs Temperature
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
4.00
3.75
3.50
3.25
3.00
2.75
2.50
2.25
2.00
I = 8mA
I = 8mA
105
105
125
–55 –35
5
25 45
85
125
–55 –35
5
25 45
85
–15
65
–15
65
TEMPERATURE (°C)
TEMPERATURE (°C)
1324 G10
1324 G11
4
LTC1324
W
U
TYPICAL PERFORMANCE CHARACTERISTICS
Receiver tPLH – tPHL
vs Temperature
Driver Differential Output Voltage
vs Temperature
3.1
8
7
6
5
4
3
2
1
0
R
= 100Ω
L
3.0
2.9
2.8
2.7
2.6
2.5
2.4
2.3
105
125
–55 –35
5
25 45
85
–15
65
105
125
–55 –35
5
25 45
85
–15
65
TEMPERATURE (°C)
TEMPERATURE (°C)
1324 G12
1324 G13
U
U
U
PIN FUNCTIONS
GND (Pin 8): Ground.
NC (Pins 1, 13): No Internal Connection.
RXD+ (Pin 9): RS485 Receiver Noninverting Input. When
thispinis ≥200mVaboveRXD–, RXDOwillbehigh. When
this pin is ≥ 200mV below RXD–, RXDO will be low.
RXD– (Pin 10): RS485 Receiver Inverting Input.
TXD+ (Pin 11): RS485 Driver Noninverting Output.
TXD– (Pin 12): RS485 Driver Inverting Output.
SR (Pin 2): Slew Rate Control (TTL Compatible). A high
level on this pin forces the RS485 driver into the low slew
rate mode. A low level forces the driver into the high slew
rate or normal mode. Connected to an internal pull-down.
TXD (Pin 3): RS485 Driver Input (TTL Compatible).
TXDEN (Pin 4): Driver Output Enable (TTL Compatible). A
high level on this pin and a low level on TXDEN (Pin 15)
forces the RS485 driver into three-state. A low level
enables the driver.
RXEN (Pin 14): Receiver Enable (TTL Compatible). A low
level on this pin and a high level on RXEN (Pin 6) disables
thereceiverandthree-statesthelogicoutputs. Ahighlevel
allows normal operation. Connected to an internal pull-
down.
SHDN (Pin 5): Shutdown Input (TTL Compatible). When
this pin is high, the chip is shut down; the driver and
receiver outputs three-state; and the supply current drops
to 1µA. A low level on this pin allows normal operation.
TXDEN (Pin 15): Driver Output Enable (TTL Compatible).
A low level on this pin and a high level on TXDEN (Pin 4)
forces the RS485 driver into three-state. A high level
enables the driver. Connected to an internal pull-down.
RXEN (Pin 6): Receiver Enable (TTL Compatible). A high
level on this pin and a low level on RXEN (Pin 14) disables
the receiver and three-states the logic outputs. A low level
allows normal operation.
VCC (Pin 16): The Positive Supply Input. 4.75V ≤ VCC
5.25V. Requires a 1µF bypass capacitor to ground.
≤
RXDO (Pin 7): RS485 Receiver Output.
5
LTC1324
TEST CIRCUITS
V
CC
+
TXD
+
–
+
C
C
L
R
L
RXD
TXD
S1
RXDO
TXI
R
L
500Ω
V
OD
–
OUTPUT
RXD
TXD
L
15pF
V
OC
C
L
S2
R
L
1324 F02
–
TXD
1324 F01
1324 F03
Figure 1
Figure 2
Figure 3
U
W
SWITCHING WAVEFORMS
3V
f = 1MHz: t ≤ 10ns: t ≤ 10ns
r
f
1.5V
TXD
1.5V
0V
t
t
PHL
PLH
V
–V
–
O
O
+
–
90%
90%
V
DIFF
= V(TXD ) – V(TXD )
50%
10%
50%
10%
1/2 V
O
t
t
f
r
TXD
TXD
V
O
+
t
t
SKEW
1324 F04
SKEW
Figure 4. Differential Driver
3V
1.5V
1.5V
TXDEN
f = 1MHz: t ≤ 10ns: t ≤ 10ns
r
f
0V
5V
t
t
LZ
ZL
+
–
TXD , TXD
2.3V
OUTPUT NORMALLY LOW
OUTPUT NORMALLY HIGH
0.5V
0.5V
V
OL
OH
0V
t
t
ZH
HZ
V
–
+
2.3V
TXD , TXD
1324 F05
Figure 5. Differential Driver Enable and Disable
V
OD2
f = 1MHz: t ≤ 10ns: t ≤ 10ns
r
f
+
–
0V
t
(RXD) – (RXD )
0V
–V
OD2
t
PLH
PHL
V
OH
RXDO
1.5V
1.5V
V
OL
1324 F06
Figure 6. Differential Receiver
6
LTC1324
U
W
SWITCHING WAVEFORMS
3V
1.5V
1.5V
RXEN
f = 1MHz: t ≤ 10ns: t ≤ 10ns
r
f
0V
t
t
LZ
ZL
5V
RXO, RXO, RXDO
2.3V
2.3V
OUTPUT NORMALLY LOW
OUTPUT NORMALLY HIGH
0.5V
0.5V
V
OL
OH
0V
t
t
ZH
HZ
V
RXO, RXO, RXDO
1324 F07
Figure 7. Receiver Enable and Disable
U
W U U
APPLICATIONS INFORMATION
Thermal Shutdown Protection
capacitor T network between each driver, receiver and the
connector. Unfortunately, the resistors will attenuate the
driver’s output signal applied to the cable. Because the
LTC1324 uses a single 5V supply, the resistors’ values
should be reduced to 5.1Ω to ensure enough voltage
swing on the cable (Figure 8). Another way to get maxi-
mum swing and EMI immunity is to use a ferrite bead and
capacitor as the T network (Figure 9). For data rates below
250kbps, the LTC1324 features a low EMI mode which
limits the rise time of the drivers to 400ns. With a lower
rise time, the EMI network can be eliminated, allowing
more signal voltage to reach the cable. Figures 10 and 11
show the output signals of the driver with different slew
rates.
The LTC1324 includes a thermal shutdown circuit which
protects against prolonged shorts at the driver outputs. If
a driver output is shorted to another output, ground or to
the power supply, the current will be initially limited to a
maximum of 250mA. When the die temperature rises
above 150°C, the thermal shutdown circuit turns off the
driver outputs. When the die cools to about 130°C, the
outputs turn on. If the short still exists, the part will heat
again and the cycle will repeat. This oscillation occurs at
about 10Hz and prevents the part from being damaged by
excessive power dissipation. When the short is removed,
the part will return to normal operation.
Power Shutdown
5.1Ω
100pF
5.1Ω
100pF
5.1Ω
+
TXD
The power shutdown feature of the LTC1324 is designed
for battery-powered systems. When SHDN is forced high,
the part enters shutdown mode. In shutdown, the supply
currenttypicallydropsfrom1mAto1µAandthedriverand
receiver outputs are three-stated.
TXD
120Ω
–
5.1Ω
TXD
1324 F08
Figure 8
Supply Bypassing
The LTC1324 requires VCC be bypassed to prevent data
errors. A 1µF capacitor from VCC to ground is adequate.
FERRITE BEAD
FERRITE BEAD
100pF
EMI Filters and Slew Rate Control
1324 F09
Most LocalTalk applications need to use an electromag-
netic interference (EMI) filter consisting of a resistor-
Figure 9
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.
7
LTC1324
U
W U U
APPLICATIONS INFORMATION
1324 F10
1324 F11
Figure 10. High Slew Rate Mode
Figure 11. Low Slew Rate Mode
U
Dimensions in inches (millimeters) unless otherwise noted.
PACKAGE DESCRIPTION
N Package
16-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510)
0.770*
(19.558)
MAX
0.300 – 0.325
0.130 ± 0.005
0.045 – 0.065
(7.620 – 8.255)
(3.302 ± 0.127)
(1.143 – 1.651)
14
12
10
9
15
13
11
16
0.015
0.255 ± 0.015*
(6.477 ± 0.381)
(0.381)
MIN
0.065
(1.651)
TYP
0.009 – 0.015
(0.229 – 0.381)
+0.025
2
1
3
4
6
8
5
7
0.325
–0.015
0.125
(3.175)
MIN
0.045 ± 0.015
(1.143 ± 0.381)
0.018 ± 0.003
(0.457 ± 0.076)
N16 0694
+0.635
8.255
(
)
–0.381
0.100 ± 0.010
(2.540 ± 0.254)
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTURSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm).
SW Package
0.398 – 0.413
(10.109 – 10.490)
(NOTE 2)
16-Lead Plastic Small Outline (Wide 0.300)
(LTC DWG # 05-08-1620)
15 14
12
10
9
16
13
11
0.291 – 0.299
(7.391 – 7.595)
(NOTE 2)
0.037 – 0.045
0.093 – 0.104
0.005
(0.127)
RAD MIN
0.010 – 0.029
(0.940 – 1.143)
(2.362 – 2.642)
× 45°
(0.254 – 0.737)
0.394 – 0.419
(10.007 – 10.643)
NOTE 1
0° – 8° TYP
0.050
(1.270)
TYP
0.004 – 0.012
(0.102 – 0.305)
0.009 – 0.013
(0.229 – 0.330)
NOTE 1
0.014 – 0.019
0.016 – 0.050
(0.356 – 0.482)
TYP
(0.406 – 1.270)
2
3
5
7
8
1
4
6
NOTE:
1. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS.
SOL16 0392
2. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 INCH (0.15mm).
RELATED PARTS
PART NUMBER
DESCRIPTION
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LT/GP 0596 7K • PRINTED IN USA
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
8
●
●
(408) 432-1900 FAX: (408) 434-0507 TELEX: 499-3977
LINEAR TECHNOLOGY CORPORATION 1995
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