LS3N166 [Linear]

Small Signal Field-Effect Transistor, 0.05A I(D), 30V, 2-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, TO-78, 6 PIN;
LS3N166
型号: LS3N166
厂家: Linear    Linear
描述:

Small Signal Field-Effect Transistor, 0.05A I(D), 30V, 2-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, TO-78, 6 PIN

晶体管
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中文:  中文翻译
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LS/3N165, LS/3N166  
MONOLITHIC DUAL P-CHANNEL  
ENHANCEMENT MODE MOSFET  
FEATURES  
VERY HIGH INPUT IMPEDANCE  
HIGH GATE BREAKDOWN  
ULTRA LOW LEAKAGE  
LOW CAPACITANCE  
LS3N165, LS3N166  
3N165, 3N166  
ABSOLUTE MAXIMUM RATINGS (NOTE 1)  
(TA=25°C unless otherwise noted)  
Drain-Source or Drain-Gate Voltage (NOTE 2)  
3N165  
40 V  
3N166  
30 V  
Gate-Gate Voltage  
±80 V  
Drain Current (NOTE 2)  
Storage Temperature  
50 mA  
TO-99  
TOP VIEW  
SOIC  
TOP VIEW  
-55ºC to +150ºC  
-55ºC to +150ºC  
+300ºC  
Operating Temperature  
Lead Temperature (Soldering, 10 sec.)  
Power Dissipation (One Side)  
Total Derating above 25ºC  
300 mW  
4.2 mW/ºC  
ELECTRICAL CHARACTERISTICS (TA=25°C and VBS=0 unless otherwise noted)  
3N165 &  
3N166  
LS3N165 &  
LS3N166  
SYMBOL  
IGSSR  
CHARACTERISTIC  
Gate Reverse Leakage Current  
Gate Forward Leakage Current  
MIN MAX MIN MAX UNITS  
CONDITIONS  
--  
--  
10  
-10  
-25  
-200  
-400  
-30  
-5  
--  
--  
--  
100  
-100  
--  
VGS=40V  
IGSSF  
VGS=-40V  
TA=+125ºC  
--  
pA  
IDSS  
Drain to Source Leakage Current  
Source to Drain Leakage Current  
On Drain Current  
--  
-200  
-400  
-30  
-5  
VDS=-20 V, VGS=VBS=0V  
ISDS  
--  
--  
-5  
-2  
-2  
--  
VSD=-20 V, VGD=VDB=0V  
ID(on)  
VGS(th)  
VGS(th)  
rDS(on)  
gfs  
-5  
-2  
-2  
--  
mA  
V
VDS=-15V VGS=-10 V VSB=0V  
Gate Source Threshold Voltage  
Gate Source Threshold Voltage  
Drain Source ON Resistance  
Forward Transconductance  
Output Admittance  
VDS=-15V ID=-10µA  
VDS=VGS ID=-10µA  
VSB=0V  
VSB=0V  
-5  
-5  
V
300  
300 ohms VGS=-20V ID=-100µA VSB=0V  
1500 3000 1500 3000 µS  
VDS=-15V ID=-10mA  
VSB=0V  
f=1kHz  
gos  
--  
--  
300  
3.0  
0.7  
3.0  
--  
--  
--  
--  
--  
300  
3.0  
1.0  
3.0  
µS  
pF  
µS  
Clss  
Input Capacitance  
Crss  
Reverse Transfer Capacitance  
Output Capacitance  
--  
VDS=-15V ID=-10mA  
(NOTE 3) VSB=0V  
VDS=-15V ID=-10mA  
(NOTE 3) VSB=0V  
f=1MHz  
Coss  
RE(Yls)  
--  
1200  
f=100MHz  
Common Source Forward  
Transconductance  
Linear Integrated Systems  
• 4042 Clipper Court • Fremont, CA 94538 • Tel: 510 490-9160 • Fax: 510 353-0261  
Doc 201138 06/26/2013 Rev#A6 ECN# 3N165 3N166  
MATCHING CHARACTERISTICS 3N165  
LIMITS  
SYMBOL  
Gfs1/Gfs2  
VGS1-2  
CHARACTERISTIC  
MIN. MAX. UNITS  
CONDITIONS  
Forward Transconductance Ratio  
Gate Source Threshold Voltage Differential  
0.90  
--  
1.0  
VDS=-15V ID=-500 µA f=1kHz VSB=0V  
VDS=-15V ID=-500 µA VSB=0V  
100  
mV  
ΔVGS1-2/ΔT Gate Source Threshold Voltage Differential  
--  
100 µV/ºC VDS=-15V ID=-500 µA VSB=0V  
TA=-55ºC to = +125ºC  
Change with Temperature  
TYPICAL SWITCHING WAVEFORM  
INPUT PULSE  
Rise Time≤2ns  
Pulse Width≥200ns  
SAMPLING SCOPE  
Tr≤0.2ns  
CIN≤2pF  
RIN≥10M  
Typical Switching Time Test Circuit  
Circuit  
NOTES:  
1. MOS field effect transistors have extremely high input resistance and can be damaged by the accumulation of excess static charge. To  
avoid possible damage to the device while wiring, testing, or in actual operation, follow these procedures:  
To avoid the build-up of static charge, the leads of the devices should remain shorted together with a metal ring except when being tested  
or used. Avoid unnecessary handling. Pick up devices by the case instead of the leads. Do not insert or remove devices from circuits  
with the power on, as transient voltages may cause permanent damage to the devices.  
2. Per transistor.  
3. For design reference only, not 100% tested.  
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional  
operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
Linear Integrated Systems (LIS) is a 25-year-old, third-generation precision semiconductor company providing  
high-quality discrete components. Expertise brought to LIS is based on processes and products developed  
at Amelco, Union Carbide, Intersil and Micro Power Systems by company President John H. Hall. Hall,  
a protégé of Silicon Valley legend Dr. Jean Hoerni, was the director of IC Development at Union Carbide,  
co-founder and vice president of R&D at Intersil, and founder/president of Micro Power Systems.  
Linear Integrated Systems  
• 4042 Clipper Court • Fremont, CA 94538 • Tel: 510 490-9160 • Fax: 510 353-0261  
Doc 201138 06/26/2013 Rev#A6 ECN# 3N165 3N166  

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