1725I [Linear]

General Purpose Isolated Flyback Controller; 通用隔离反激式控制器
1725I
型号: 1725I
厂家: Linear    Linear
描述:

General Purpose Isolated Flyback Controller
通用隔离反激式控制器

控制器
文件: 总28页 (文件大小:189K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LT1725  
General Purpose  
Isolated Flyback Controller  
U
FEATURES  
DESCRIPTIO  
The LT®1725 is a monolithic switching regulator control-  
ler specifically designed for the isolated flyback topology.  
It drives the gate of an external MOSFET and is generally  
poweredfromathirdtransformerwinding. Thesefeatures  
allow for an application input voltage limited only by  
external power path components. The third transformer  
winding also provides output voltage feedback informa-  
tion, such that an optoisolator is not required. Its gate  
drive capability coupled with a suitable external MOSFET  
can deliver load power up to tens of watts.  
Drives External Power MOSFET with External  
I
SENSE Resistor  
Application Input Voltage Limited Only by  
External Power Components  
Senses Output Voltage Directly from Primary Side  
Winding—No Optoisolator Required  
Accurate Regulation Without User Trims  
Regulation Maintained Well into Discontinuous Mode  
Switching Frequency from 50kHz to 250kHz with  
External Capacitor  
Optional Load Compensation  
Optional Undervoltage Lockout  
Available in 16-Pin SO and SSOP Packages  
The LT1725 has a number of features not found on most  
other switching regulator ICs. By utilizing current mode  
switchingtechniques, itprovidesexcellentACandDCline  
regulation. Its unique control circuitry can maintain regu-  
lation well into discontinuous mode in most applications.  
Optionalloadcompensationcircuitryallowsforimproved  
load regulation. An optional undervoltage lockout pin  
halts operation when the application input voltage is too  
low. An optional external capacitor implements a soft-  
start function. A 3V output is available at up to several mA  
for powering primary side application circuitry.  
U
APPLICATIO S  
Telecom Isolated Converters  
Offline Isolated Power Supplies  
Instrumentation Power Supplies  
, LTC and LT are registered trademarks of Linear Technology Corporation.  
U
TYPICAL APPLICATIO  
48V to Isolated 5V Converter  
CTX02-14989  
6
Output Load Regulation  
470pF  
5.25  
LT1725  
18  
V
36V TO 72V  
IN  
35.7k  
1%  
BAS16  
3V  
FB  
OUT  
1
V
IN  
= 48V  
V
V
= 36V  
= 72V  
IN  
22Ω  
47k  
V
I
= 5V  
= 0 to 2A  
3.01k  
1%  
OUT  
OUT  
V
CC  
SFST  
VC  
IN  
2
9
1nF  
47pF  
+
12CWQ06  
15µF  
1µF  
5.00  
4.75  
51Ω  
1W  
68Ω  
OSCAP  
11  
150pF  
820k  
33k  
UVLO  
t
ON  
10  
+
51k  
1.5µF  
100pF  
150µF  
ENDLY  
51k  
51k  
2.7k  
4
12  
MENAB  
0
0.5  
1.0  
1.5  
2.0  
I
(A)  
LOAD  
GATE  
R
IRF620  
OCMP  
1725 F10b  
I
R
SENSE  
CMPC  
SGND  
PGND  
0.1µF  
0.18Ω  
1725 TA01a  
1725f  
1
LT1725  
W W U W  
U W  
U
ABSOLUTE AXI U RATI GS  
PACKAGE/ORDER I FOR ATIO  
(Note 1)  
VCC Supply Voltage................................................. 22V  
UVLO Pin Voltage .................................................... VCC  
ISENSE Pin Voltage .................................................... 2V  
FB Pin Current ..................................................... ±2mA  
Operating Junction  
TOP VIEW  
ORDER PART  
NUMBER  
PGND  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
GATE  
I
V
CC  
SENSE  
LT1725CGN  
LT1725CS  
LT1725IGN  
LT1725IS  
SFST  
t
ON  
R
OCMP  
ENDLY  
MINENAB  
SGND  
R
Temperature Range  
CMPC  
OSCAP  
LT1725C.............................................. 0°C to 100°C  
LT1725I ........................................... –40°C TO 125°C  
Storage Temperature Range ................ 65°C to 150°C  
Lead Temperature (Soldering, 10 sec)................ 300°C  
V
C
UVLO  
GN PART  
MARKING  
FB  
3V  
OUT  
GN PACKAGE  
S PACKAGE  
1725  
1725I  
16-LEAD PLASTIC SSOP 16-LEAD PLASTIC SO  
TJMAX = 125°C, θJA = 110°C/W (GN)  
TJMAX = 125°C, θJA = 100°C/W (SO)  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
ELECTRICAL CHARACTERISTICS  
The denotes specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VCC = 14V, GATE open, VC = 1.4V unless otherwise noted.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Power Supply  
V
CC  
V
V
V
Turn-On Voltage  
Turn-Off Voltage  
Hysteresis (Note 3)  
14.0  
8
4.0  
15.1  
9.7  
5.4  
16.0  
11  
6.5  
V
V
V
CC  
CC  
CC  
(V  
– V  
)
TURN-ON  
TURN-OFF  
I
Supply Current  
Start-Up Current  
V = Open  
C
6
10  
120  
15  
280  
mA  
µA  
CC  
Feedback Amplifier  
V
FB  
Feedback Voltage  
1.230  
1.220  
1.245  
1.260  
1.270  
V
V
I
Feedback Pin Input Current  
500  
1000  
50  
nA  
µmho  
µA  
FB  
g
Feedback Amplifier Transconductance  
Feedback Amplifier Source or Sink Current  
Feedback Amplifier Clamp Voltage  
Reference Voltage/Current Line Regulation  
Voltage Gain  
l = ±10µA  
400  
30  
1800  
80  
m
C
I
, I  
SRC SNK  
V
2.5  
V
CL  
12V V 18V  
0.01  
2000  
40  
0.05  
50  
%/V  
V/V  
µA  
IN  
V = 1V to 2V  
C
Soft-Start Charging Current  
V
V
= 0V  
25  
SFST  
SFST  
Soft-Start Discharge Current  
= 1.5V, V  
= 0V  
0.8  
1.5  
mA  
UVLO  
Gate Output  
V
GATE  
Output High Level  
Output Low Level  
I
I
= 100mA  
= 500mA  
11.5  
11.0  
12.1  
11.8  
V
V
GATE  
GATE  
I
I
= 100mA  
= 500mA  
0.3  
0.6  
0.45  
1.0  
V
V
GATE  
GATE  
I
t
t
Output Sink Current in Shutdown, V  
= 0V  
V = 2V  
GATE  
1.2  
2.5  
30  
30  
mA  
ns  
GATE  
UVLO  
Rise Time  
Fall Time  
C = 1000pF  
L
r
f
C = 1000pF  
L
ns  
1725f  
2
LT1725  
ELECTRICAL CHARACTERISTICS  
The denotes specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VCC = 14V, GATE open, VC = 1.4V unless otherwise noted.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Current Amplifier  
V
V
Control Pin Threshold  
Switch Current Limit  
Duty Cycle = Min  
0.90  
0.80  
1.12  
250  
1.25  
1.35  
V
V
C
Duty Cycle 30%  
Duty Cycle 30%  
Duty Cycle = 80%  
220  
200  
270  
280  
mV  
mV  
mV  
ISENSE  
220  
V  
ISENSE  
/V  
0.30  
mV  
C
Timing  
f
Switching Frequency  
C
= 100pF  
90  
80  
100  
115  
125  
kHz  
kHz  
OSCAP  
C
Oscillator Capacitor Value  
Minimum Switch On Time  
Flyback Enable Delay Time  
Minimum Flyback Enable Time  
Timing Resistor Value  
(Note 2)  
33  
200  
pF  
ns  
ns  
ns  
kΩ  
%
OSCAP  
t
t
t
R
R
R
= 50k  
tON  
200  
200  
200  
ON  
= 50k  
= 50k  
ED  
EN  
ENDLY  
MENAB  
R
(Note 2)  
24  
85  
200  
t
Maximum Switch Duty Cycle  
90  
Load Compensation  
Sense Offset Voltage  
Current Gain Factor  
UVLO Function  
2
5
mV  
mV  
0.80  
1.21  
0.95  
1.05  
V
UVLO Pin Threshold  
1.25  
1.29  
V
UVLO  
UVLO  
I
UVLO Pin Bias Current  
V
V
= 1.2V  
= 1.3V  
0.25  
4.50  
+0.1  
3.5  
+0.25  
2.50  
µA  
µA  
UVLO  
UVLO  
3V Output Function  
V
REF  
Reference Output Voltage  
Output Impedance  
Current Limit  
I
= 1mA  
2.8  
8
3.0  
10  
15  
3.2  
V
LOAD  
mA  
Note 1: Absolute Maximum Ratings are those values beyond which the life of  
a device may be impaired.  
Note 2: Component value range guaranteed by design.  
Note 3: The V turn-on/turn-off voltages and hysteresis voltage are  
CC  
proportional in magnitude to each other-guaranteed by design.  
1725f  
3
LT1725  
TYPICAL PERFOR A CE CHARACTERISTICS  
U W  
VCC Hysteresis Voltage vs  
Temperature  
VCC Turn-On Voltage vs  
Temperature  
Start-Up Current vs Temperature  
250  
200  
150  
100  
50  
6.50  
6.25  
6.00  
5.75  
5.50  
5.25  
5.00  
4.75  
16.00  
15.75  
15.50  
15.25  
15.00  
14.75  
14.50  
14.25  
0
–50  
0
25  
50  
75 100 125  
–25  
50  
TEMPERATURE (°C)  
100 125  
–50 –25  
0
25  
75  
50  
TEMPERATURE (°C)  
100 125  
–50 –25  
0
25  
75  
TEMPERATURE (°C)  
1725 G03  
1725 G02  
1725 G01  
UVLO Pin Input Current vs  
Temperature  
Oscillator Frequency vs  
Temperature  
Supply Current vs Temperature  
13  
12  
11  
10  
9
115  
110  
105  
100  
95  
1
0
V
= 1.2V  
UVLO  
–1  
–2  
–3  
–4  
–5  
–6  
V
= 1.3V  
UVLO  
90  
8
–50  
85  
50  
TEMPERATURE (°C)  
100 125  
0
25  
50  
75 100 125  
–50 –25  
0
25  
75  
–25  
50  
100 125  
–50 –25  
0
25  
75  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
1725 G06  
1725 G04  
1725 G05  
VC Clamp Voltage, Switching  
Threshold vs Temperature  
VCC-VGATE vs ISOURCE  
VGATE vs ISINK  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
0
–0.5  
–1.0  
–1.5  
–2.0  
–2.5  
–3.0  
1.0  
0.8  
0.6  
0.4  
0.2  
0
CLAMP VOLTAGE  
T
= 125°C  
A
T
= 125°C  
A
T
= 25°C  
A
T = 25°C  
A
SWITCHING THRESHOLD  
T
= –55°C  
A
T
= –55°C  
A
50  
TEMPERATURE (°C)  
100 125  
1725 G09  
–50 –25  
0
25  
75  
1
10  
I
100  
(mA)  
1000  
1
10  
100  
1000  
I
(mA)  
SOURCE  
SINK  
1725 G07  
1725 G08  
1725f  
4
LT1725  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
Enable Delay Time vs  
Temperature  
Minimum Switch-On Time vs  
Temperature  
Minimum Enable Time vs  
Temperature  
275  
250  
225  
200  
175  
150  
125  
275  
250  
225  
200  
175  
150  
125  
275  
250  
225  
200  
175  
150  
125  
R
TON  
= 50k  
R
= 50k  
MINENAB  
50  
TEMPERATURE (°C)  
100 125  
–50 –25  
0
25  
75  
50  
TEMPERATURE (°C)  
100 125  
50  
TEMPERATURE (°C)  
100 125  
–50 –25  
0
25  
75  
–50 –25  
0
25  
75  
1725 G10  
1725 G12  
1725 G11  
Feedback Amplifier  
Transconductance vs Temperature  
Feedback Amplifier Output Current  
vs FB Pin Voltage  
80  
60  
1600  
1400  
1200  
1000  
800  
40  
T
= –55°C  
A
T
= 25°C  
A
20  
0
–20  
–40  
–60  
–80  
T
= 125°C  
A
600  
400  
200  
–50 –25  
50  
TEMPERATURE (°C)  
100 125  
1.10 1.15 1.20 1.25 1.30  
FB PIN VOLTAGE (V)  
1.40  
0
25  
75  
1.05  
1.35  
1725 G14  
1725 G13  
Soft-Start Charging Current vs  
Temperature  
Soft-Start Sink Current vs  
Temperature  
2.5  
2.0  
1.5  
1.0  
0.5  
0
60  
50  
40  
30  
20  
10  
0
V(SFST) = 0V  
V(SFST) = 1.5V  
50  
TEMPERATURE (°C)  
100 125  
50  
TEMPERATURE (°C)  
125  
–50 –25  
0
25  
75  
–50  
0
25  
75  
–25  
100  
1725 G15  
1725 G16  
1725f  
5
LT1725  
U
U
U
PI FU CTIO S  
PGND (Pin 1): The power ground pin carries the GATE  
node discharge current. This is typically a current spike of  
several hundred mA with a duration of tens of nanosec-  
onds. It should be connected directly to a good quality  
ground plane.  
third winding transformer turns ratio is the primary deter-  
minant of the output voltage. The Thevenin equivalent  
resistance of the feedback divider should be roughly 3k.  
See Applications Information for more details.  
3VOUT (Pin 9): Output pin for nominal 3V reference. This  
facilitatesvarioususerapplications.Thisnodeisinternally  
current limited for protection and is intended to drive  
either moderate capacitive loads of several hundred pF or  
less, or, very large capacitive loads of 0.1µF or more. See  
Applications Information for more details.  
ISENSE (Pin 2): Pin to measure switch current with exter-  
nal sense resistor. The sense resistor should be of a  
noninductive construction as high speed performance is  
essential. Proper grounding technique is also required to  
avoid distortion of the high speed current waveform. A  
presetinternallimitofnominally250mVatthispineffects  
a switch current limit.  
UVLO (Pin 10): This pin allows the use of an optional  
external resistor divider to set an undervoltage lockout  
based upon VIN (not VCC) level. (Note: If the VCC voltage is  
sufficient to allow the part to start up, but the UVLO pin is  
held below its threshold, output switching action will be  
disabled, but the part will draw its normal quiescent  
currentfromVCC. Thistypicallycausesabenignrelaxation  
oscillation action on the VCC pin in the conventional  
“trickle-charge” bootstrapped configuration.)  
SFST (Pin 3): Pin for optional external capacitor to effect  
soft-start function.SeeApplicationsInformationfordetails.  
ROCMP(Pin4):Inputpinforoptionalexternalloadcompen-  
sation resistor. Use of this pin allows nominal compensa-  
tionfornonzerooutputimpedanceinthepowertransformer  
secondarycircuit,includingsecondarywindingimpedance,  
output Schottky diode impedance and output capacitor  
ESR. In less demanding applications, this resistor is not  
needed. See Applications Information for more details.  
The bias current on this pin is a function of the state of the  
UVLO comparator; as the threshold is exceeded, the bias  
current increases. This creates a hysteresis band equal to  
the change in bias current times the Thevenin impedance  
of the user’s resistive divider. The user may thereby adjust  
the impedance of the UVLO divider to achieve a desired  
degree of hysteresis. A 100pF capacitor to ground is  
recommended on this pin. See Applications Information  
for details.  
RCMPC (Pin 5): Pin for external filter capacitor for optional  
load compensation function. A common 0.1µF ceramic  
capacitor will suffice for most applications. See Applica-  
tions Information for further details.  
OSCAP (Pin 6): Pin for external timing capacitor to set  
oscillator switching frequency. See Applications Informa-  
tion for details.  
SGND (Pin 11): The signal ground pin is a clean ground.  
The internal reference, oscillator and feedback amplifier  
are referred to it. Keep the ground path connection to the  
FBpin, OSCAPcapacitorandtheVC compensationcapaci-  
tor free of large ground currents.  
VC (pin 7): This is the control voltage pin which is the  
output of the feedback amplifier and the input of the  
current comparator. Frequency compensation of the  
overall loop is effected in most cases by placing a capaci-  
tor between this node and ground.  
MINENAB (Pin 12): Pin for external programming resistor  
tosetminimumenabletime. SeeApplicationsInformation  
for details.  
FB (Pin 8): Input pin for external “feedback” resistor  
divider. The ratio of this divider, times the internal  
bandgap (VBG) reference, times the effective output-to-  
1725f  
6
LT1725  
U
U
U
PI FU CTIO S  
ENDLY (Pin 13): Pin for external programming resistor to  
set enable delay time. See Applications Information for  
details.  
V
CC (Pin 15): Supply voltage for the LT1725. Bypass this  
pin to ground with 1µF or more.  
GATE (Pin 16): This is the gate drive to the external power  
MOSFET switch and has large dynamic currents flowing  
through it. Keep the trace to the MOSFET as short as  
possible to minimize electromagnetic radiation and volt-  
age spikes. A series resistance of 5or more may help to  
dampen ringing in less than ideal layouts.  
t
ON (Pin 14): Pin for external programming resistor to set  
switch minimum on time. See Applications Information  
for details.  
W
BLOCK DIAGRA  
V
CC  
3V  
OUT  
UVLO  
BIAS  
3V REG  
(INTERNAL)  
t
MINENAB ENDLY  
ON  
OSCAP  
GATE  
MOSFET  
DRIVER  
OSC  
LOGIC  
PGND  
I
SENSE  
COMP  
I
AMP  
SGND  
FB  
LOAD  
COMPENSATION  
FDBK  
SOFT-START  
SFST  
1725 BD  
V
R
R
CMPC  
C
OCMP  
1725f  
7
LT1725  
W U  
W
TI I G DIAGRA  
V
SW  
VOLTAGE  
COLLAPSE  
DETECT  
V
FLBK  
0.80×  
FLBK  
V
V
IN  
GND  
SWITCH  
STATE  
OFF  
ON  
OFF  
ON  
MINIMUM t  
ON  
ENABLE DELAY  
DISABLED  
MINIMUM ENABLE TIME  
FLYBACK AMP  
STATE  
ENABLED  
DISABLED  
1725 TD  
W
FLYBACK ERROR A PLIFIER  
T1  
D1  
+
+
ISOLATED  
C1  
V
OUT  
V
IN  
M1  
I
I
FXD  
M
V
C
R1  
R2  
ENAB  
FB  
V
BG  
C2  
Q1 Q2  
I
1725 EA  
I
M
1725f  
8
LT1725  
U
OPERATIO  
The LT1725 is a current mode switcher controller IC  
designedspecificallyfortheisolatedflybacktopology. The  
Block Diagram shows an overall view of the system. Many  
of the blocks are similar to those found in traditional  
designs, including: Internal Bias Regulator, Oscillator,  
Logic, Current Amplifier and Comparator, Driver and Out-  
put Switch. The novel sections include a special Flyback  
Error Amplifier and a Load Compensation mechanism.  
Also, due to the special dynamic requirements of flyback  
control, the Logic system contains additional functionality  
not found in conventional designs.  
The relatively high gain in the overall loop will then cause  
the voltage at the FB pin to be nearly equal to the bandgap  
reference VBG. The relationship between VFLBK and VBG  
may then be expressed as:  
R1+R2  
(
)
VFLBK  
=
VBG  
R2  
Combination with the previous VFLBK expression yields an  
expression for VOUT in terms of the internal reference,  
programming resistors, transformer turns ratio and diode  
forward voltage drop:  
TheLT1725operatesmuchthesameastraditionalcurrent  
mode switchers, the major difference being a different  
type of error amplifier that derives its feedback informa-  
tion from the flyback pulse. Due to space constraints, this  
discussion will not reiterate the basics of current mode  
switcher/controllers and isolated flyback converters. A  
good source of information on these topics is Application  
Note AN19.  
R1+R2  
(
)
1
NST  
VOUT = VBG  
– V ISEC ESR  
F
R2  
Additionally, it includes the effect of nonzero secondary  
output impedance, which is discussed below in further  
detail, see Load Compensation Theory. The practical as-  
pects of applying this equation for VOUT are found in the  
Applications Information section.  
ERROR AMPLIFIER—PSEUDO DC THEORY  
So far, this has been a pseudo-DC treatment of flyback  
error amplifier operation. But the flyback signal is a pulse,  
not a DC level. Provision must be made to enable the  
flyback amplifier only when the flyback pulse is present.  
This is accomplished by the dotted line connections to the  
block labeled “ENAB”. Timing signals are then required to  
enable and disable the flyback amplifier.  
Please refer to the simplified diagram of the Flyback Error  
Amplifier. Operation is as follows: when MOSFET output  
switch M1 turns off, its drain voltage rises above the VIN  
rail.Theamplitudeofthisflybackpulseasseenonthethird  
winding is given as:  
V
OUT + VF +ISEC ESR  
(
=
)
VFLBK  
NST  
ERROR AMPLIFIER—DYNAMIC THEORY  
There are several timing signals which are required for  
proper LT1725 operation. Please refer to the Timing  
Diagram.  
VF = D1 forward voltage  
ISEC = transformer secondary current  
ESR = total impedance of secondary circuit  
Minimum Output Switch On Time  
NST = transformer effective secondary-to-third  
winding turns ratio  
The LT1725 effects output voltage regulation via flyback  
pulse action. If the output switch is not turned on at all,  
there will be no flyback pulse and output voltage informa-  
tion is no longer available. This would cause irregular loop  
responseandstart-up/latchupproblems.Thesolutioncho-  
sen is to require the output switch to be on for an absolute  
minimumtimepereachoscillatorcycle.Thisinturnestab-  
lishes a minimum load requirement to maintain regula-  
The flyback voltage is then scaled by external resistor  
divider R1/R2 and presented at the FB pin. This is then  
compared to the internal bandgap reference by the differ-  
ential transistor pair Q1/Q2. The collector current from Q1  
is mirrored around and subtracted from fixed current  
source IFXD at the VC pin. An external capacitor integrates  
this net current to provide the control voltage to set the  
current mode trip point.  
tion. See Applications Information for further details.  
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OPERATIO  
Enable Delay  
Minimum Enable Time  
When the output switch shuts off, the flyback pulse  
appears. However, it takes a finite time until the trans-  
formerprimarysidevoltagewaveformapproximatelyrep-  
resents the output voltage. This is partly due to rise time  
on the MOSFET drain node, but more importantly, due to  
transformer leakage inductance. The latter causes a volt-  
age spike on the primary side not directly related to output  
voltage. (Some time is also required for internal settling of  
the feedback amplifier circuitry.)  
The feedback amplifier, once enabled, stays enabled for a  
fixed minimum time period termed “minimum enable  
time.” This prevents lockup, especially when the output  
voltage is abnormally low, e.g., during start-up. The mini-  
mum enable time period ensures that the VC node is able  
to “pump up” and increase the current mode trip point to  
the level where the collapse detect system exhibits proper  
operation. The “minimum enable time” often determines  
thelowloadlevelatwhichoutputvoltageregulationislost.  
See Applications Information for details.  
In order to maintain immunity to these phenomena, a  
fixed delay is introduced between the switch turnoff  
commandandtheenablingofthefeedbackamplifier.This  
is termed “enable delay”. In certain cases where the  
leakage spike is not sufficiently settled by the end of the  
enable delay period, regulation error may result. See  
Applications Information for further details.  
Effects of Variable Enable Period  
It should now be clear that the flyback amplifier is enabled  
during only a portion of the cycle time. This can vary from  
thefixedminimumenabletimedescribedtoamaximum  
of roughly the “off” switch time minus the enable delay  
time. Certain parameters of flyback amp behavior will then  
be directly affected by the variable enable period. These  
include effective transconductance and VC node slew rate.  
Collapse Detect  
Oncethefeedbackamplifierisenabled, somemechanism  
is then required to disable it. This is accomplished by a  
collapse detect comparator, which compares the flyback  
voltage (FB referred) to a fixed reference, nominally 80%  
of VBG. When the flyback waveform drops below this  
level, the feedback amplifier is disabled. This action  
accommodatesbothcontinuousanddiscontinuousmode  
operation.  
LOAD COMPENSATION THEORY  
The LT1725 uses the flyback pulse to obtain information  
about the isolated output voltage. A potential error source  
is caused by transformer secondary current flow through  
the real life nonzero impedances of the output rectifier,  
T1  
V
IN  
I
M
M1  
R1  
R2  
+
FB  
R3  
50k  
Q1 Q2  
V
BG  
Q3  
A1  
I
SENSE  
LOAD  
COMP I  
R
SENSE  
I
M
R
OCMP  
R
CMPC  
1725 F01  
Figure 1. Load Compensation Diagram  
1725f  
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OPERATIO  
transformer secondary and output capacitor. This has  
been represented previously by the expression “ISEC  
VOUT  
V EFF  
IIN =  
IOUT  
IN  
ESR.” However, it is generally more useful to convert this  
expression to an effective output impedance. Because the  
secondary current only flows during the off portion of the  
duty cycle, the effective output impedance equals the  
lumpedsecondaryimpedancetimestheinverseoftheOFF  
duty cycle. That is:  
combining the efficiency and voltage terms in a single  
variable:  
IIN = K1 • IOUT, where  
VOUT  
V EFF  
IN  
K1=  
1
ROUT = ESR  
where  
Switch current is converted to voltage by the external  
sense resistor and averaged/lowpass filtered by R3 and  
the external capacitor on RCMPC. This voltage is then  
impressed across the external ROCMP resistor by op amp  
A1 and transistor Q3. This produces a current at the  
collector of Q3 which is then mirrored around and then  
subtracted from the FB node. This action effectively in-  
creases the voltage required at the top of the R1/R2  
feedback divider to achieve equilibrium. So the effective  
change in VOUT target is:  
DCOFF  
ROUT = effective supply output impedance  
ESR = lumped secondary impedance  
DCOFF = OFF duty cycle  
Expressing this in terms of the ON duty cycle, remember-  
ing DCOFF = 1 – DC,  
1
ROUT = ESR  
1DC  
RSENSE  
ROCMP  
DC = ON duty cycle  
VOUT = K1• IOUT  
(R1||R2)or  
(
)
In less critical applications, or if output load current  
remains relatively constant, this output impedance error  
may be judged acceptable and the external FB resistor  
divider adjusted to compensate for nominal expected  
error. Inmoredemandingapplications, outputimpedance  
error may be minimized by the use of the load compensa-  
tion function.  
VOUT  
IOUT  
RSENSE  
ROCMP  
= K1  
(R1||R2)  
Nominal output impedance cancellation is obtained by  
equating this expression with ROUT  
:
RSENSE  
ROCMP  
Toimplementtheloadcompensationfunction,avoltageis  
developed that is proportional to average output switch  
current.Thisvoltageisthenimpressedacrosstheexternal  
ROCMP resistor, and the resulting current acts to increase  
the VBG reference used by the flyback error amplifier. As  
outputloadingincreases,averageswitchcurrentincreases  
to maintain rough output voltage regulation. This causes  
an increase in ROCMP resistor current which effects a  
corresponding increase in target output voltage.  
ROUT = K1  
(R1||R2) and  
RSENSE  
ROUT  
R
OCMP = K1  
(R1||R2)where  
K1 = dimensionless variable related to VIN, VOUT and  
efficiency as above  
RSENSE = external sense resistor  
ROUT = uncompensated output impedance  
Assuming a relatively fixed power supply efficiency, Eff,  
(R1||R2) = impedance of R1 and R2 in parallel  
Power Out = Eff • Power In  
VOUT • IOUT = Eff • VIN • IIN  
The practical aspects of applying this equation to deter-  
mineanappropriatevaluefortheROCMP resistorarefound  
in the Applications Information section.  
Average primary side current may be expressed in terms  
of output current as follows:  
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TRANSFORMER DESIGN CONSIDERATIONS  
As a rough guide, total leakage inductances of several  
percent (of mutual inductance) or less may require a  
snubber, but exhibit little to no regulation error due to  
leakage spike behavior. Inductances from several percent  
up to perhaps ten percent cause increasing regulation  
error.  
Transformer specification and design is perhaps the most  
critical part of applying the LT1725 successfully. In addi-  
tion to the usual list of caveats dealing with high frequency  
isolated power supply transformer design, the following  
information should prove useful.  
Severe leakage inductances in the double digit percentage  
range should be avoided if at all possible as there is a  
potential for abrupt loss of control at high load current.  
This curious condition potentially occurs when the leak-  
age spike becomes such a large portion of the flyback  
waveform that the processing circuitry is fooled into  
thinking that the leakage spike itself is the real flyback  
signal! It then reverts to a potentially stable state whereby  
the top of the leakage spike is the control point, and the  
trailing edge of the leakage spike triggers the collapse  
detect circuitry. This will typically reduce the output volt-  
age abruptly to a fraction, perhaps between one-third to  
two-thirds of its correct value. If load current is reduced  
sufficiently, the system will snap back to normal opera-  
tion. When using transformers with considerable leakage  
inductance, it is important to exercise this worst-case  
check for potential bistability:  
Turns Ratios  
Note that due to the use of the external feedback resistor  
divider ratio to set output voltage, the user has relative  
freedominselectingtransformerturnsratiotosuitagiven  
application. In other words, “screwball” turns ratios like  
“1.736:1.0” can scrupulously be avoided! In contrast,  
simpler ratios of small integers, e.g., 1:1, 2:1, 3:2, etc. can  
be employed which yield more freedom in setting total  
turns and mutual inductance. Turns ratio can then be  
chosen on the basis of desired duty cycle. However,  
remember that the input supply voltage plus the second-  
ary-to-primary referred version of the flyback pulse (in-  
cludingleakagespike)mustnotexceedtheallowedexternal  
MOSFET breakdown rating.  
Leakage Inductance  
1. Operate the prototype supply at maximum expected  
load current.  
Transformer leakage inductance (on either the primary or  
secondary)causesaspikeafteroutputswitchturnoff.This  
is increasingly prominent at higher load currents, where  
more stored energy must be dissipated. In many cases a  
“snubber” circuit will be required to avoid overvoltage  
breakdown at the output switch node. Application Note  
AN19 is a good reference on snubber design.  
2. Temporarily short circuit the output.  
3. Observe that normal operation is restored.  
If the output voltage is found to hang up at a abnormally  
low value, the system has a problem. This will usually be  
evident by simultaneously monitoring the VSW waveform  
on an oscilloscope to observe leakage spike behavior  
firsthand. A final note—the susceptibility of the system to  
bistable behavior is somewhat a function of the load I/V  
characteristics. A load with resistive, i.e., I = V/R behavior  
is the most susceptible to bistability. Loads which exhibit  
“CMOSsy”, i.e., I = V2/R behavior are less susceptible.  
In situations where the flyback pulse extends beyond the  
enable delay time, the output voltage regulation will be  
affected to some degree. It is important to realize that the  
feedback system has a deliberately limited input range,  
roughly ±50mV referred to the FB node, and this works to  
the user’s advantage in rejecting large, i.e., higher voltage,  
leakage spikes. In other words, once a leakage spike is  
several volts in amplitude, a further increase in amplitude  
has little effect on the feedback system. So the user is  
generally advised to arrange the snubber circuit to clamp  
at as high a voltage as comfortably possible, observing  
MOSFET breakdown, such that leakage spike duration is  
as short as possible.  
Secondary Leakage Inductance  
In addition to the previously described effects of leakage  
inductance in general, leakage inductance on the second-  
ary in particular exhibits an additional phenomenon. It  
forms an inductive divider on the transformer secondary,  
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U
which reduces the size of the primary-referred flyback  
pulse used for feedback. This will increase the output  
voltage target by a similar percentage. Note that unlike  
leakage spike behavior, this phenomena is load indepen-  
dent. To the extent that the secondary leakage inductance  
is a constant percentage of mutual inductance (over  
manufacturing variations), this can be accommodated by  
adjusting the feedback resistor divider ratio.  
The above equation defines only the ratio of R1 to R2, not  
their individual values. However, a “second equation for  
two unknowns” is obtained from noting that the Thevenin  
impedance of the resistor divider should be roughly 3k for  
bias current cancellation and other reasons.  
SELECTING ROCMP RESISTOR VALUE  
The Operation section previously derived the following  
expressions for ROUT, i.e., effective output impedance and  
ROCMP, the external resistor value required for its nominal  
compensation:  
Winding Resistance Effects  
Resistance in either the primary or secondary will act to  
reduce overall efficiency (POUT/PIN). Resistance in the  
secondary increases effective output impedance which  
degrades load regulation, (at least before load compensa-  
tion is employed).  
1
ROUT = ESR  
1DC  
RSENSE  
ROUT  
ROCMP = K1  
R1||R2  
(
)
Bifilar Winding  
A bifilar or similar winding technique is a good way to  
minimize troublesome leakage inductances. However re-  
member that this will increase primary-to-secondary ca-  
pacitance and limit the primary-to-secondary breakdown  
voltage, so bifilar winding is not always practical.  
While the value for ROCMP may therefore be theoretically  
determined, it is usually better in practice to employ  
empirical methods. This is because several of the required  
input variables are difficult to estimate precisely. For  
instance, the ESR term above includes that of the trans-  
former secondary, but its effective ESR value depends on  
high frequency behavior, not simply DC winding resis-  
tance. Similarly, K1 appears to be a simple ratio of VIN to  
VOUT times (differential) efficiency, but theoretically esti-  
mating efficiency is not a simple calculation. The sug-  
gested empirical method is as follows:  
Finally, the LTC Applications group is available to assist  
in the choice and/or design of the transformer. Happy  
Winding!  
SELECTING FEEDBACK RESISTOR DIVIDER VALUES  
The expression for VOUT developed in the Operation sec-  
tioncanberearrangedtoyieldthefollowingexpressionfor  
the R1/R2 ratio:  
Build a prototype of the desired supply using the eventual  
secondary components. Temporarily ground the RCMPC  
pintodisabletheloadcompensationfunction. Operatethe  
supply over the expected range of output current loading  
while measuring the output voltage deviation. Approxi-  
mate this variation as a single value of ROUT (straight line  
approximation). Calculate a value for the K1 constant  
based on VIN, VOUT and the measured (differential) effi-  
ciency. These are then combined with RSENSE as indicated  
R1+R2  
VOUT + VF +ISEC ESR  
(
)
(
)
=
NST  
R2  
where:  
VOUT = desired output voltage  
VF = switching diode forward voltage  
VBG  
to yield a value for ROCMP  
.
ISEC • ESR = secondary resistive losses  
Verify this result by connecting a resistor of roughly this  
value from the ROCMP pin to ground. (Disconnect the  
ground short to RCMPC and connect the requisite 0.1µF  
filter capacitor to ground.) Measure the output impedance  
VBG = data sheet reference voltage value  
NST = effective secondary-to-third winding turns ratio  
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with the new compensation in place. Modify the original  
ROCMP value if necessary to increase or decrease the  
effective compensation.  
1000  
500  
SELECTING OSCILLATOR CAPACITOR VALUE  
The switching frequency of the LT1725 is set by an  
external capacitor connected between the OSCAP pin and  
ground. Recommended values are between 200pF and  
33pF, yielding switching frequencies between 50kHz and  
250kHz. Figure 2 shows the nominal relationship between  
external capacitance and switching frequency. To mini-  
mize stray capacitance and potential noise pickup, this  
capacitor should be placed as close as possible to the IC  
and the OSCAP node length/area minimized.  
100  
20  
100  
250  
R
(k)  
T
1725 F03  
Figure 3. “One Shot” Times vs Programming Resistor  
Minimum On Time  
300  
This time defines a period whereby the normal switch  
current limit is ignored. This feature provides immunity to  
the leading edge current spike often seen at the source  
nodeoftheexternalpowerMOSFET, duetorapidcharging  
of its gate/source capacitance. This current spike is not  
indicative of actual current level in the transformer pri-  
mary, and may cause irregular current mode switching  
action, especially at light load.  
200  
100  
50  
However, the user must remember that the LT1725 does  
not “skip cycles” at light loads. Therefore, minimum on  
time will set a limit on minimum delivered power and con-  
sequently a minimum load requirement to maintain regu-  
lation (see Minimum Load Considerations). Similarly,  
minimum on time has a direct effect on short-circuit be-  
havior(seeMaximumLoad/Short-CircuitConsiderations).  
30  
100  
(pF)  
200  
C
OSCAP  
1725 F02  
Figure 2. fOSC vs OSCAP Value  
SELECTING TIMING RESISTOR VALUES  
The user is normally tempted to set the minimum on time  
to be short to minimize these load related consequences.  
(Afterall, asmallerminimumontimeapproachestheideal  
caseofzero, ornominimum.)However, alongertimemay  
be required in certain applications based on MOSFET  
switching current spike considerations.  
There are three internal “one-shot” times that are pro-  
grammed by external application resistors: minimum on  
time, enable delay time and minimum enable time. These  
are all part of the isolated flyback control technique, and  
theirfunctionshavebeenpreviouslyoutlinedintheTheory  
of Operation section. Figures 3 shows nominal observed  
time versus external resistor value for these functions.  
Enable Delay Time  
This function provides a programmed delay between  
turnoffofthegatedrivenodeandthesubsequentenabling  
of the feedback amplifier. At high loads, a primary side  
voltage spike after MOSFET turnoff may be observed due  
The following information should help in selecting and/or  
optimizing these timing values.  
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U
to transformer leakage inductance. This spike is not in-  
dicative of actual output voltage (see Figure 4B). Delaying  
the enabling of the feedback amplifier allows this system  
to effectively ignore most or all of the voltage spike and  
maintain proper output voltage regulation. The enable  
delay time should therefore be set to the maximum ex-  
pected duration of the leakage spike. This may have  
implications regarding output voltage regulation at mini-  
mum load (see Minimum Load Considerations).  
Minimum Enable Time  
This function sets a minimum duration for the expected  
flyback pulse. Its primary purpose is to provide a mini-  
mum source current at the VC node to avoid start-up  
problems.  
Average “start-up” VC current =  
MinimumEnable Time  
ISRC  
SwitchingFrequency  
A second benefit of the enable delay time function occurs  
at light load. Under such conditions the amount of energy  
stored in the transformer is small. The flyback waveform  
becomes “lazy” and some time elapses before it indicates  
the actual secondary output voltage (see Figure 4C). So  
the enable delay time should also be set long enough to  
ignore the “irrelevant” portion of the flyback waveform at  
light load.  
Minimum enable time can also have implications at light  
load (see Minimum Load Considerations). The temptation  
is to set the minimum enable time to be fairly short, as this  
is the least restrictive in terms of minimum load behavior.  
However,toprovideareliableminimumstart-upcurrent  
of say, nominally 1µA, the user should set the minimum  
enable time at no less that 2% of the switching period  
(= 1/switching frequency).  
Additionally, there are cases wherein the gate output is  
called upon to drive a large geometry MOSFET such that  
the turnoff transition is slowed significantly. Under such  
circumstances, the enable delay time may be increased to  
accommodate for the lengthy transition.  
CURRENT SENSE RESISTOR CONSIDERATIONS  
The external current sense resistor allows the user to  
optimize the current limit behavior for the particular appli-  
cation under consideration. As the current sense resistor  
is varied from several ohms down to tens of milliohms,  
peak switch current goes from a fraction of an ampere to  
tens of amperes. Care must be taken to ensure proper  
circuit operation, especially with small current sense  
resistor values.  
MOSFET GATE DRIVE  
A
B
IDEALIZED FLYBACK  
WAVEFORM  
Forexample,apeakswitchcurrentof10Arequiresasense  
resistorof0.025.Notethattheinstantaneouspeakpower  
in the sense resistor is 2.5W, and it must be rated accord-  
ingly. The LT1725 has only a single sense line to this re-  
sistor.Therefore,anyparasiticresistanceinthegroundside  
connection of the sense resistor will increase its apparent  
value.Inthecaseofa0.025senseresistor, onemilliohm  
of parasitic resistance will cause a 4% reduction in peak  
switch current. So resistance of printed circuit copper  
traces and vias cannot necessarily be ignored.  
FLYBACK WAVEFORM  
WITH LARGE LEAKAGE  
SPIKE AT HEAVY LOAD  
ENABLE  
DELAY  
TIME  
DISCONTINUOUS  
MODE  
NEEDED  
RINGING  
“SLOW” FLYBACK  
WAVEFORM AT  
LIGHT LOAD  
C
Anadditionalconsiderationisparasiticinductance.Induc-  
tance in series with the current sense resistor will accen-  
tuate the high frequency components of the current  
waveform. In particular, the gate switching spike and  
ENABLE DELAY  
TIME NEEDED  
1725 F04  
Figure 4  
multimegahertzringingattheMOSFETcanbeconsiderably  
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The soft-start function is enagaged whenever VCC power  
is removed, or as a result of either undervoltage lockout  
or thermal (overtemperature) shutdown. The SFST node  
is then discharged to roughly a VBE above ground.  
(RememberthattheVCpincontrolnodeswitchingthresh-  
old is deliberately set at a VBE plus several hundred  
millivolts.) When this condition is removed, a nominal  
40µA current acts to charge up the SFST node towards  
roughly 3V. So, for example, a 0.1µF soft-start capacitor  
will place a 0.4V/ms limit on the ramp rate at the VC node.  
amplified. If severe enough, this can cause erratic opera-  
tion. For example, assume 3nH of parasitic inductance  
(equivalenttoabout0.1inchofwireinfreespace)isinseries  
withanideal0.025senseresistor.Azerowillbeformed  
at f = R/(2πL), or 1.3MHz. Above this frequency the sense  
resistor will behave like an inductor.  
Several techniques can be used to tame this potential  
parasitic inductance problem. First, any resistor used for  
current sensing purposes must be of an inherently non-  
inductive construction. Mounting this resistor directly  
above an unbroken ground plane and minimizing its  
ground side connection will serve to absolutely minimize  
parasitic inductance. In the case of low valued sense  
resistors, these may be implemented as a parallel combi-  
nation of several resistors for the thermal considerations  
citedabove. Theparallelcombinationwillhelptolowerthe  
parasitic inductance. Finally, it may be necessary to place  
a “pole” between the current sense resistor and the  
LT1725 ISENSE pin to undo the action of the inductive zero  
(seeFigure5).Avalueof51issuggestedfortheresistor,  
whilethecapacitorisselectedempiricallyfortheparticular  
application and layout. Using good high frequency mea-  
surement techniques, the ISENSE pin waveform may be  
observed directly with an oscilloscope while the capacitor  
value is varied.  
UVLO PIN FUNCTION  
The UVLO pin effects an undervoltage lockout function  
with at threshold of roughly 1.25V. An external resistor  
divider between the input supply and ground can then be  
used to achieve a user-programmable undervoltage lock-  
out (see Figure 6a).  
An additional feature of this pin is that there is a change in  
the input bias current at this pin as a function of the state  
of the internal UVLO comparator. As the pin is brought  
abovetheUVLOthreshold, thebiascurrentsourcedbythe  
part increases. This positive feedback effects a hysteresis  
band for reliable switching action. Note that the size of the  
hysteresis is proportional to the Thevenin impedance of  
the external UVLO resistor divider network, which makes  
it user programmable. As a rough rule of thumb, each 4k  
or so of impedance generates about 1% of hysteresis.  
(This is based on roughly 1.25V for the threshold and 3µA  
for the bias current shift.)  
SENSE RESISTOR ZERO AT:  
R
2πL  
SENSE  
GATE  
SENSE  
f =  
P
51Ω  
I
COMPENSATING POLE AT:  
C
COMP  
R
SENSE  
SGND PGND  
1
f =  
2π(51)C  
COMP  
Even in good quality ground plane layouts, it is common  
for the switching node (MOSFET drain) to couple to the  
UVLO pin with a stray capacitance of several thousandths  
of a pF. To ensure proper UVLO action, a 100pF capacitor  
is recommended from this pin to ground as shown in  
Figure 6b. This will typically reduce the coupled noise to  
a few millivolts. The UVLO filter capacitor should not be  
mademuchlargerthanafewhundredpF, however, asthe  
hysteresis action will become too slow. In cases where  
further filtering is required, e.g., to attenuate high speed  
supply ripple, the topology in Figure 6c is recommended.  
Resistor R1 has been split into two equal parts. This  
provides a node for effecting capacitor filtering of high  
L
P
FOR CANCELLATION:  
PARASITIC  
L
P
INDUCTANCE  
C
COMP  
=
R
(51)  
SENSE  
1725 F05  
Figure 5  
SOFT-START FUNCTION  
The LT1725 contains an optional soft-start function that is  
enabled by connecting an explicit external capacitor be-  
tweentheSFSTpinandground. Internalcircuitryprevents  
thecontrolvoltageattheVC pinfromexceedingthatonthe  
SFST pin.  
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U
V
IN  
R1/2  
R1/2  
R2  
V
V
IN  
IN  
C2  
R1  
R2  
R1  
R2  
UVLO  
UVLO  
UVLO  
C1  
100pF  
C1  
100pF  
1725 F06  
(6a) “Standard” UVLO  
Divider Topology  
(6b) Filter Capacitor  
Directly On UVLO Node  
(6c) Recommended Topology to  
Filter High Frequency Ripple  
Figure 6  
speed supply ripple, while leaving the UVLO pin node  
impedance relatively unchanged at high frequency.  
V
IN  
R1  
V
IN  
INTERNAL WIDE HYSTERESIS  
UNDERVOLTAGE LOCKOUT  
+
I
VCC  
C1  
V
CC  
The LT1725 is designed to implement isolated DC/DC  
converters operating from input voltages of typically 48V  
or more. The standard operating topology utilizes a third  
transformer winding on the primary side that provides  
both feedback information and local power for the LT1725  
viaitsVCC pin.However,thisarrangementisnotinherently  
self-starting. Start-up is effected by the use of an external  
“trickle-charge” resistor and the presence of an internal  
widehysteresisundervoltagelockoutcircuitthatmonitors  
VCC pin voltage (see Figure 7). Operation is as follows:  
LT1725 GATE  
SGND  
PGND  
1725 F07  
V
THRESHOLD  
ON  
V
VCC  
I
VCC  
0
V
GATE  
Figure 7  
“Trickle charge” resistor R1 is connected to VIN and  
supplies a small current, typically on the order of a single  
mA, tochargeC1. Atfirst, theLT1725isoffanddrawsonly  
its start-up current. After some time, the voltage on C1  
(VCC)reachestheVCC turn-onthreshold. TheLT1725then  
turns on abruptly and draws its normal supply current.  
Switching action commences at the GATE pin and the  
MOSFET begins to deliver power. The voltage on C1  
begins to decline as the LT1725 draws its normal supply  
current, which greatly exceeds that delivered by R1. After  
some time, typically tens of milliseconds, the output  
voltage approaches its desired value. By this time, the  
third transformer winding is providing virtually all the  
supply current required by the LT1725.  
drawn by the LT1725 will discharge C1 too rapidly; before  
the third winding drive becomes effective, the VCC turn-off  
threshold will be reached. The LT1725 turns off, and the  
V
CC node begins to charge via R1 back up to the turn-on  
threshold. Depending upon the particular situation, this  
may result in either several on-off cycles before proper  
operation is reached, or, permanent relaxation oscillation  
at the VCC node.  
Component selection is as follows:  
Resistor R1 should be selected to yield a worst-case  
minimum charging current greater than the maximum  
rated LT1725 start-up current, and a worst-case maxi-  
mum charging current less than the minimum rated  
One potential design pitfall is undersizing the value of  
capacitor C1. In this case, the normal supply current  
LT1725 supply current.  
1725f  
17  
LT1725  
W U U  
U
APPLICATIO S I FOR ATIO  
Capacitor C1 should then be made large enough to avoid  
the relaxation oscillatory behavior described above. This  
is complicated to determine theoretically as it depends on  
the particulars of the secondary circuit and load behavior.  
Empirical testing is recommended. (Use of the optional  
soft-start function will lengthen the power-up timing and  
require a correspondingly larger value for C1.)  
OUTPUT VOLTAGE ERROR SOURCES  
Conventional nonisolated switching power supply ICs  
typically have only two substantial sources of output  
voltage error: the internal or external resistor divider  
network that connects to VOUT and the internal IC refer-  
ence.TheLT1725,whichsensestheoutputvoltageinboth  
a dynamic and an isolated manner, exhibits additional  
potential error sources to contend with. Some of these  
errors are proportional to output voltage, others are fixed  
in an absolute millivolt sense. Here is a list of possible  
error sources and their effective contribution.  
A further note—certain users may wish to utilize the  
general functionality of the LT1725, but may have an  
available input voltage significantly lower than, say, 48V.  
If this input voltage is within the allowable VCC range, i.e.,  
perhaps20Vmaximum, theinternalwidehysteresisrange  
UVLOfunctionbecomescounterproductive.Insuchcases  
it is simply better to operate the LT1725 directly from the  
available DC input supply. The LT1737 is identical to the  
LT1725, with the exception that it lacks the internal wide  
hysteresis UVLO function. It is therefore designed to  
operate directly from DC input supplies in the range of  
4.5V to 20V. See the LT1737 data sheet for further  
information.  
Internal Voltage Reference  
The internal bandgap voltage reference is, of course,  
imperfect. Its error, both at 25°C and over temperature is  
already included in the specifications.  
User Programming Resistors  
Outputvoltageiscontrolledbytheuser-suppliedfeedback  
resistor divider ratio. To the extent that the resistor ratio  
differs from the ideal value, the output voltage will be  
proportionally affected. Highest accuracy systems will  
demand 1% components.  
FREQUENCY COMPENSATION  
Loop frequency compensation is performed by connect-  
ing a capacitor from the output of the error amplifier (VC  
pin) to ground. An additional series resistor, often re-  
quired in traditional current mode switcher controllers, is  
usually not required and can even prove detrimental. The  
phase margin improvement traditionally offered by this  
extra resistor will usually be already accomplished by the  
nonzerosecondarycircuitimpedance,whichaddsazero”  
to the loop response.  
Schottky Diode Drop  
The LT1725 senses the output voltage from the trans-  
formerprimarysideduringtheflybackportionofthecycle.  
This sensed voltage therefore includes the forward drop,  
VF, of the rectifier (usually a Schottky diode). The nominal  
VF of this diode should therefore be included in feedback  
resistor divider calculations. Lot to lot and ambient tem-  
perature variations will show up as output voltage shift/  
drift.  
In further contrast to traditional current mode switchers,  
VC pinrippleisgenerallynotanissuewiththeLT1725. The  
dynamic nature of the clamped feedback amplifier forms  
an effective track/hold type response, whereby the VC  
voltagechangesduringtheflybackpulse,butisthenheld”  
during the subsequent “switch on” portion of the next  
cycle. This action naturally holds the VC voltage stable  
duringthecurrentcomparatorsenseaction(currentmode  
switching).  
Secondary Leakage Inductance  
Leakage inductance on the transformer secondary re-  
duces the effective secondary-to-third winding turns ratio  
(NS/NT) from its ideal value. This will increase the output  
voltage target by a similar percentage. To the extent that  
secondary leakage inductance is constant from part to  
part, this can be accommodated by adjusting the feedback  
resistor ratio.  
1725f  
18  
LT1725  
W U U  
APPLICATIO S I FOR ATIO  
U
f = switching frequency  
Output Impedance Error  
LPRI = transformer primary side inductance  
VIN = input voltage  
An additional error source is caused by transformer sec-  
ondary current flow through the real life nonzero imped-  
ances of the output rectifier, transformer secondary and  
output capacitor. Because the secondary current only  
flows during the off portion of the duty cycle, the effective  
output impedance equals the “DC” lumped secondary  
impedance times the inverse of the off duty cycle. If the  
output load current remains relatively constant, or, in less  
critical applications, the error may be judged acceptable  
and the feedback resistor divider ratio adjusted for nomi-  
nal expected error. In more demanding applications, out-  
put impedance error may be minimized by the use of the  
load compensation function (see Load Compensation).  
VOUT = output voltage  
tON = output switch minimum on time  
An additional constraint has to do with the minimum  
enable time. The LT1725 derives its output voltage infor-  
mation from the flyback pulse. If the internal minimum  
enable time pulse extends beyond the flyback pulse, loss  
of regulation will occur. The onset of this condition can be  
determined by setting the width of the flyback pulse equal  
to the sum of the flyback enable delay, tED, plus the  
minimum enable time, tEN. Minimum power delivered to  
the load is then:  
MINIMUM LOAD CONSIDERATIONS  
2
]
1
f
The LT1725 generally provides better low load perfor-  
mance than previous generation switcher/controllers uti-  
lizing indirect output voltage sensing techniques.  
Specifically, it contains circuitry to detect flyback pulse  
“collapse,” thereby supporting operation well into discon-  
tinuousmode. Nevertheless, therestillremainconstraints  
to ultimate low load operation. These relate to the mini-  
mum switch on time and the minimum enable time.  
Discontinuous mode operation will be assumed in the  
following theoretical derivations.  
Minimum Power =  
VOUT • tEN + tED  
(
)
[
2 LSEC  
= VOUT IOUT  
Which yields a minimum output constraint:  
2
)
1 f VOUT  
IOUT(MIN)  
=
tED + tEN  
(
where  
2
LSEC  
f = switching frequency  
LSEC = transformer secondary side inductance  
VOUT = output voltage  
As outlined in the Operation section, the LT1725 utilizes a  
minimum output switch on time, tON. This value can be  
combined with expected VIN and switching frequency to  
yield an expression for minimum delivered power.  
tED = enable delay time  
tEN = minimum enable time  
1
f
2
Note that generally, depending on the particulars of input  
and output voltages and transformer inductance, one of  
the above constraints will prove more restrictive. In other  
words, the minimum load current in a particular applica-  
tion will be either “output switch minimum on time”  
constrained,orminimumflybackpulsetimeconstrained.  
(A final note—LPRI and LSEC refer to transformer induc-  
tance as seen from the primary or secondary side respec-  
tively. This general treatment allows these expressions to  
be used when the transformer turns ratio is nonunity.)  
Minimum Power =  
V • t  
IN ON  
(
)
2 LPRI  
= VOUT IOUT  
This expression then yields a minimum output current  
constraint:  
2
)
1
f
IOUT(MIN)  
=
V • tON  
IN  
(
where  
2 LPRI VOUT  
1725f  
19  
LT1725  
W U U  
U
APPLICATIO S I FOR ATIO  
MAXIMUM LOAD/SHORT-CIRCUIT CONSIDERATIONS  
VIN = input voltage  
NSP = secondary-to-primary turns ratio ( NSEC/NPRI  
)
The LT1725 is a current mode controller. It uses the VC  
node voltage as an input to a current comparator which  
turns off the output switch on a cycle-by-cycle basis as  
this peak current is reached. The internal clamp on the VC  
node, nominally 2.5V, then acts as an output switch peak  
current limit.  
Trouble is typically only encountered in applications with  
a relatively high product of input voltage times secondary-  
to-primary turns ratio and/or a relatively long minimum  
switchontime.(Additionally,severalrealworldeffectssuch  
astransformerleakageinductance,ACwindinglosses,and  
output switch voltage drop combine to make this simple  
theoretical calculation a conservative estimate.)  
This 2.5V at the VC pin corresponds to a value of 250mV  
at the ISENSE pin, when the (ON) switch duty cycle is less  
than 40%. For a duty cycle above 40%, the internal slope  
compensation mechanism lowers the effective ISENSE  
voltage limit. For example, at a duty cycle of 80%, the  
nominal ISENSE voltage limit is 220mV. This action be-  
comes the switch current limit specification. Maximum  
available output power is then determined by the switch  
current limit, which is somewhat duty cycle dependent  
due to internal slope compensation action.  
THERMAL CONSIDERATIONS  
Care should be taken to ensure that the worst-case input  
voltage condition does not cause excessive die tempera-  
tures. The 16-lead SO package is rated at 100°C/W, and  
the 16-lead GN at 110°C/W.  
Average supply current is simply the sum of quiescent  
current given in the specifications section plus gate drive  
current. Gate drive current can be computed as:  
Overcurrent conditions are handled by the same mecha-  
nism. The output switch turns on, the peak current is  
quickly reached and the switch is turned off. Because the  
outputswitchisonlyonforasmallfractionoftheavailable  
period, power dissipation is controlled.  
IG = f • QG where  
QG = total gate charge  
f = switching frequency  
Loss of current limit is possible under certain conditions.  
Remember that the LT1725 normally exhibits a minimum  
switchontime,irrespectiveofcurrenttrippoint.Iftheduty  
cycleexhibitedbythisminimumontimeisgreaterthanthe  
ratio of secondary winding voltage (referred-to-primary)  
divided by input voltage, then peak current will not be  
controlled at the nominal value, and will cycle-by-cycle  
ratchet up to some higher level. Expressed mathemati-  
cally, the requirement to maintain short-circuit control is:  
(Note:TotalgatechargeismorecomplicatedthanCGS VG  
as it is frequently dominated by Miller effect of the CGD.  
Furthermore, both capacitances are nonlinear in practice.  
Fortunately, most MOSFET data sheets provide figures  
and graphs which yield the total gate charge directly per  
operating conditions.) Nearly all gate drive power is dissi-  
pated in the IC, except for a small amount in the external  
gate series resistor, so total IC dissipation may be com-  
puted as:  
V +ISC RSEC  
(
F
)
PD(TOTAL) = VCC (IQ + • f • QG ), where  
tON • f <  
where  
V NSP  
IN  
IQ = quiescent current (from specifications)  
QG = total gate charge  
tON = output switch minimum on time  
f = switching frequency  
f = switching frequency  
ISC = short-circuit output current  
VF = output diode forward voltage at ISC  
RSEC = resistance of transformer secondary  
VCC = LT1725 supply voltage  
1725f  
20  
LT1725  
W U U  
APPLICATIO S I FOR ATIO  
U
GATE DRIVE RESISTOR CONSIDERATIONS  
SWITCH NODE CONSIDERATIONS  
The gate drive circuitry internal to the LT1725 has been  
designed to have as low an output impedance as practi-  
cally possible—only a few ohms. A strong L/C resonance  
is potentially presented by the inductance of the path  
leading to the gate of the power MOSFET and its overall  
gate capacitance. For this reason the path from the GATE  
package pin to the physical MOSFET gate should be kept  
as short as possible, and good layout/ground plane prac-  
tice used to minimize the parasitic inductance.  
For maximum efficiency, gate drive rise and fall times are  
made as short as practical. To prevent radiation and high  
frequency resonance problems, proper layout of the  
components connected to the IC is essential, especially  
the power paths (primary and secondary). B field (mag-  
netic) radiation is minimized by keeping MOSFET leads,  
output diode, and output bypass capacitor leads as short  
as possible. E field radiation is kept low by minimizing the  
length and area of all similar traces. A ground plane  
should always be used under the switcher circuitry to  
prevent interplane coupling.  
Anexplicitseriesgatedriveresistormaybeusefulinsome  
applications to damp out this potential L/C resonance  
(typically tens of MHz). A minimum value of perhaps  
several ohms is suggested, and higher values (typically a  
few tens of ohms) will offer increased damping. However,  
as this resistor value becomes too large, gate voltage rise  
time will increase to unacceptable levels, and efficiency  
will suffer due to the sluggish switching action.  
The high speed switching current paths are shown sche-  
matically in Figure 8. Minimum lead length in these paths  
are essential to ensure clean switching and minimal EMI.  
The path containing the input capacitor, transformer pri-  
mary and MOSFET, and the path containing the trans-  
former secondary, output diode and output capacitor  
contain “nanosecond” rise and fall times. Keep these  
paths as short as possible.  
V
V
IN  
CC  
+
+
+
V
CC  
SECONDARY  
POWER  
PATH  
GATE  
PRIMARY  
POWER  
PATH  
GATE  
PGND  
DISCHARGE  
PATH  
1725 F08  
Figure 8. High Speed Current Switching Paths  
1725f  
21  
LT1725  
U
TYPICAL APPLICATIO S  
TELECOM 48V TO ISOLATED 15V APPLICATION  
ground-referred version of the flyback voltage waveform  
for both feedback information and providing power to the  
LT1725 itself.  
The design in Figure 9 accepts an input voltage in the  
range of 36V to 72V and outputs an isolated 15V at up to  
2A. Transformer T1 is an off-the-shelf VERSA-PAKTM  
#VP5-0155, produced by Coiltronics. As manufactured, it  
consists of six ideally identical independent windings. In  
this application, three windings are stacked in series on  
the primary side and two are placed in parallel on the  
secondaryside.Thisarrangementprovidesa3:1primary-  
to-secondary turns ratio while maximizing overall effi-  
ciency. The remaining winding provides a primary-side  
Capacitor C7 sets the switching frequency at approxi-  
mately 200kHz. Optimal load compensation for the trans-  
formerandsecondarycircuitcomponentsissetbyresistor  
R8. Output voltage regulation and overall efficiency are  
shown in the accompanying graphs. The resistor divider  
formed by R14 and R15 sets the undervoltage lockout  
thresholdatabout32V,withahysteresisbandofabout2V.  
The soft-start and 3VOUT features are unused as shown.  
VERSA-PAK is a trademark of Coiltronics, Inc  
T1  
VP5-0155  
7
D5  
BAS16  
6
V
IN  
C2  
1.5µF  
×3  
3
D3  
1N5257  
D1  
MBRD660  
V
OUT  
15V  
10  
4
R14  
R1  
R10  
18Ω  
R11  
12  
1
11  
C5  
1µF  
C4  
150µF  
820k  
24k  
150Ω  
R13  
750Ω  
1W  
D4  
+
1N5257  
+
C1  
22µF  
2
9
5
C3  
100pF  
C10  
R15  
100pF 33k  
R3  
34.0k  
1%  
D2  
MBRS1100  
8
15  
9
10  
R12  
5.1Ω  
16  
M1  
3V  
OUT  
UVLO  
V
CC  
GATE  
8
7
IRF620  
R9  
FB  
LT1725  
51Ω  
2
V
C
I
SENSE  
SGND PGND  
11  
R4  
3.01k  
1%  
C9  
470pF  
R2  
0.1Ω  
OSCAP SFST  
t
ENDLY MENAB  
13 12  
R6 R7  
R
R
CMPC  
ON  
OCMP  
4
6
3
14  
5
1
1725 F09a  
C6  
1nF  
C7  
47pF  
R5  
51k  
R8  
6.2k  
C8  
0.1µF  
51k 51k  
Figure 9. 48V to Isolated 15V Converter  
1725f  
22  
LT1725  
U
TYPICAL APPLICATIO S  
Application Regulation  
Application Efficiency  
15.5  
90  
80  
70  
60  
50  
40  
30  
20  
V
V
= 48V  
IN  
OUT  
= 15V  
V
= 48V  
IN  
V
= 36V  
IN  
15.0  
V
= 72V  
IN  
14.5  
0
0.5  
1.0  
1.5  
(A)  
2.0  
2.5  
0.01  
0.1  
1
10  
I
I
(A)  
LOAD  
LOAD  
1725 F09c  
1725 F09b  
48V to Isolated 15V Application Parts List  
T1: Coiltronics VP5-0155 VERSA-PAK  
C8: 0.1µF, 25V, Z5U ceramic capacitor  
C9: 470pF, 25V, X7R ceramic capacitor  
C10: 100pF, 25V, X7R ceramic capacitor  
R1: 24k, 1/4W, 5% resistor  
M1: International Rectifier IRF620. 200V, 0.8N-channel  
MOSFET  
D1: Motorola MBRD660. 6A, 60V Schottky diode  
D2: Motorola MBRS1100. 1A, 100V Schottky diode  
D3, D4: 1N5257. 33V, 500mW Zener diode  
D5: BAS16. 75V rectifier diode  
R2: IRC LR2010. 0.1, 1/2W current sense resistor  
R3: 34.0k, 1% resistor  
R4: 3.01k, 1% resistor  
C1: AVX TPSD226M025R0200. 22µF, 25V tantalum  
capacitor  
R5, R6, R7: 51k, 5% resistor  
R8: 6.2k, 5% resistor  
C2a,C2b,C2c:Vishay/VitramonVJ1825Y155MXB.1.5µF,  
100V X7R ceramic capacitor  
R9: 51, 5% resistor  
R10: 18, 5% resistor  
C3: 100pF, 100V, X7R ceramic capacitor  
R11: 150, 1/4W, 5% resistor  
R12: 5.1, 5% resistor  
C4: Sanyo 20SV150M. 150µF, 20V, OS-CON electrolytic  
capacitor  
C5: 1µF, 25V, Z5U ceramic capacitor  
C6: 1nF, 25V, X7R ceramic capacitor  
C7: 47pF, 25V NPO/COG ceramic capacitor  
R13a, R13b: 1.5k, 1/2W, 5% resistor  
R14: 820k, 5% resistor  
R15: 33k, 5% resistor  
1725f  
23  
LT1725  
U
TYPICAL APPLICATIO S  
TELECOM 48V TO ISOLATED 5V APPLICATION  
The design in Figure 10 accepts an input voltage in the  
rangeof36Vto72Vandoutputsanisolated5Vatupto2A.  
TransformerT1isavailableasaCoiltronicsCTX02-14989.  
Capacitor C7 sets the switching frequency at approxi-  
mately 275kHz. Optimal load compensation for the trans-  
formerandsecondarycircuitcomponentsissetbyresistor  
R8. Output voltage regulation and overall efficiency are  
shown in the accompanying graphs. Efficiency is shown  
bothwithandwithouttheR11preload.Theresistordivider  
formed by R13 and R14 sets the undervoltage lockout  
thresholdatabout32V,withahysteresisbandofabout2V.  
The soft-start and 3VOUT features are unused as shown.  
T1  
CTX02-14989  
6
C5  
R9  
470pF  
D2  
18Ω  
BAS16  
1
2
V
IN  
V
OUT  
5V  
9
C2  
1.5µF  
R13  
R10  
R1  
47k  
D1  
12CWQ06  
R12  
820k  
22Ω  
R11  
51Ω  
1W  
68Ω  
11  
10  
C4  
150pF  
C9  
R14  
100pF 33k  
+
+
R3  
35.7k  
1%  
C1  
15µF  
C10  
1µF  
C3  
150µF  
12  
4
15  
9
10  
3V  
OUT  
UVLO  
V
CC  
8
7
16  
2
M1  
IRF620  
FB  
GATE  
SENSE  
LT1725  
V
C
I
R4  
3.01k  
1%  
R2  
OSCAP SFST  
t
ENDLY MENAB  
13 12  
R6 R7  
R
R
SGND PGND  
11  
ON  
OCMP  
4
CMPC  
0.18Ω  
6
3
14  
5
1
1725 F10a  
C6  
1nF  
C7  
47pF  
R5  
51k  
R8  
2.7k  
C8  
0.1µF  
51k 51k  
Figure 10. 48V to Isolated 5V Converter  
Application Regulation  
Application Efficiency  
5.25  
5.00  
90  
V
IN  
= 48V  
80  
70  
60  
50  
40  
30  
20  
V
= 48V  
WITHOUT R11  
PRELOAD  
IN  
V
V
= 36V  
= 72V  
IN  
IN  
WITH R11  
PRELOAD  
4.75  
0
0.5  
1.0  
1.5  
2.0  
0.01  
0.1  
1
10  
I
(A)  
I
(A)  
LOAD  
LOAD  
1725 F10c  
1725 F10b  
1725f  
24  
LT1725  
U
TYPICAL APPLICATIO S  
48V to Isolated 5V Application Parts List  
T1: Coiltronics CTX02-14989  
C9: 100pF, 25V, X7R ceramic capacitor  
C10: 1µF, 25V, Z5U ceramic capacitor  
R1: 47k, 1/4W, 5% resistor  
M1: International Rectifier IRF620. 200V, 0.8N-channel  
MOSFET  
D1:InternationalRectifier12CWQ06FN.12A,60VSchottky  
diode  
R2: Panasonic type ERJ-14RSJ. 0.18, 1/4W, 5%  
resistor  
D2: BAS16. 75V switching diode  
R3: 35.7k, 1% resistor  
R4: 3.01k, 1% resistor  
R5, R6, R7: 51k, 5% resistor  
R8: 2.7k, 5% resistor  
C1: AVX TPSD156M035R0300. 15µF, 35V tantalum  
capacitor  
C2:Vishay/VitramonVJ1825Y155MXB.1.5µF,100V,X7R  
ceramic capacitor  
R9: 18, 5% resistor  
R10: 22, 5% resistor  
R11: 51, 1W, 5% resistor  
R12: 68, 5% resistor  
R13: 820k, 5% resistor  
R14: 33k, 5% resistor  
C3: Sanyo 6SA150M. 150µF, 6.3V, OS-CON electrolytic  
capacitor  
C4: 150pF, 100V, X7R ceramic capacitor  
C5: 470pF, 50V, X7R ceramic capacitor  
C6: 1nF, 25V X7R ceramic capacitor  
C7: 47pF, 25V, NPO ceramic capacitor  
C8: 0.1µF, 25V, Z5U ceramic capacitor  
1725f  
25  
LT1725  
U
PACKAGE DESCRIPTIO  
GN Package  
16-Lead Plastic SSOP (Narrow .150 Inch)  
(Reference LTC DWG # 05-08-1641)  
0.189 – 0.196*  
(4.801 – 4.978)  
0.009  
(0.229)  
REF  
16 15 14 13 12 11 10 9  
0.229 – 0.244  
(5.817 – 6.198)  
0.150 – 0.157**  
(3.810 – 3.988)  
1
2
3
4
5
6
7
8
0.015 ± 0.004  
(0.38 ± 0.10)  
× 45°  
0.053 – 0.068  
(1.351 – 1.727)  
0.004 – 0.0098  
(0.102 – 0.249)  
0.007 – 0.0098  
(0.178 – 0.249)  
0° – 8° TYP  
0.016 – 0.050  
(0.406 – 1.270)  
0.0250  
(0.635)  
BSC  
0.008 – 0.012  
(0.203 – 0.305)  
* DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE  
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD  
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE  
GN16 (SSOP) 1098  
1725f  
26  
LT1725  
U
PACKAGE DESCRIPTIO  
S Package  
16-Lead Plastic Small Outline (Narrow .150 Inch)  
(Reference LTC DWG # 05-08-1610)  
0.386 – 0.394*  
(9.804 – 10.008)  
16  
15  
14  
13  
12  
11  
10  
9
0.150 – 0.157**  
0.228 – 0.244  
(3.810 – 3.988)  
(5.791 – 6.197)  
5
7
8
1
2
3
4
6
0.010 – 0.020  
(0.254 – 0.508)  
× 45°  
0.053 – 0.069  
(1.346 – 1.752)  
0.004 – 0.010  
(0.101 – 0.254)  
0.008 – 0.010  
(0.203 – 0.254)  
0° – 8° TYP  
0.050  
(1.270)  
BSC  
0.014 – 0.019  
(0.355 – 0.483)  
TYP  
0.016 – 0.050  
(0.406 – 1.270)  
S16 1098  
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE  
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD  
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE  
1725f  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.  
27  
LT1725  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
LT1424-5  
Isolated Flyback Switching Regulator  
Isolated Flyback Switching Regulator  
Isolated Flyback Switching Regulator  
Ultralow Noise 1A Switching Regulator  
5V Output Voltage, No Optoisolator Required  
9V Output , Regulation Maintained Under Light Loads  
No Third Winding or Optoisolator Required  
LT1424-9  
LT1425  
LT1533  
Low Switching Harmonics and Reduced EMI, V = 2.7V to 23V  
IN  
LT1681/LTC1698  
Isolated DC/DC Controller Chip-Set in Ouarter  
and Half-Brick Footprint  
36V V 72V; V : 3.3V, 5V; P  
Half the cost of a DC/DC Module; Low Profile, High Efficiency  
100W;  
IN  
OUT  
OUT  
LT1737  
High Power Isolated Flyback Controller  
Powered from a DC Supply Voltage  
1725f  
LT/TP 1201 2K • PRINTED IN THE USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
28  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  
LINEAR TECHNOLOGY CORPORATION 2000  

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