TGON800 [LSTD]
Electrically and Thermally Conductive Interface Pad;
| 型号： | TGON800 |
| 厂家： | 
Laird Connectivity |
| 描述： | Electrically and Thermally Conductive Interface Pad |
| 文件： | 总2页 (文件大小：375K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TM
Tgon 800 Series
Electrically and Thermally
Conductive Interface Pad
Innovative Technology
for a Connected World
HꢀꢁH-PERFORMANCE, COST EFFECTꢀvE THERMAl ꢀNTERFACE MATERꢀAl
Used where electrical isolation is not required, Tgon™ 800 is ideal for where electrical
contact and thermal transfer are desired.
Its unique grain-oriented, plate-like structure provides a high thermal conductivity of
240 W/mK in the XY plane and 5 W/mK through the z-axis.. Tgon 800 can be supplied
in 12” x 18” (305mm x 457mm) or 18” x 24” (457mm x 610mm) sheets, rolls or die-cut
to specific configurations.
It is also available with proprietary pressure sensitive adhesive on one side. This adhesive
coating is the thinnest available, minimizing any impact on thermal performance.
FEATURES
• High thermal conductivity of 5 W/mK in Z axis and 240 W/mK in the X-Y axis
• >98% graphite
• Low thermal resistance
• Thicknesses of 0.005”, 0.010” and 0.020” (0.125mm, 0.25mm, and 0.50mm)
APPlꢀCATꢀONS
• Power conversion equipment
• Power supplies
• Large telecommunications switching hardware
• Notebook computers
• Where electrical grounding is required with good thermal conductivity
global solutions: local supportTM
Americas: +1.888.246.9050
Europe: +49.0.8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal
TM
Tgon 800 Series
Electrically and Thermally
Conductive Interface Pad
Innovative Technology
for a Connected World
TM
TꢁON 800 TYPꢀCAl PROPERTꢀES
TꢀꢁN™ 805
TꢀꢁN™ 810
Flexible Graphite
Pewter
TꢀꢁN™ 820
Flexible Graphite
Pewter
TꢂꢃT MꢂTHꢁꢄ
Construction & Composition
Color
Flexible Graphite
Pewter
Visual
Thickness
0.005" (0.13mm)
0.010" (0.25mm)
0.020" (0.51mm)
Thickness Tolerance
± 0.001"
± 0.001"
± 0.002"
(± 0.025mm)
(± 0.025mm)
(± 0.05mm)
Density
2.20 g/cc
85 Shore A
650 psi
2.20 g/cc
85 Shore A
650 psi
2.20 g/cc
85 Shore A
650 psi
Helium Pycnometer
ASTM D2240
ASTM D412
Hardness
Tensile strength
Outgassing TML
0.15%
0.15%
0.15%
ASTM E595
Outgassing CVCM
0.09%
0.09%
0.09%
ASTM E595
UL Flammability rating
Temperature range
94 VO
94 VO
94 VO
-240°C to 300°C
5 W/mK
-240°C to 300°C
5 W/mK
-240°C to 300°C
5 W/mK
Thermal conductivity - Z Axis
Thermal conductivity - XY Axis
Thermal resistance @ 100 psi
Thermal resistance @ 681 KPa
Volume resistivity (In-Plane)
ASTM D5470 (modified)
ASTM D5470 (modified)
ASTM D5470 (modified)
ASTM D5470 (modified)
ASTM D257
240 W/mK
0.07 °C-in2/W
0.42 °C-cm2/W
11 x 10-5 ohm-cm
240 W/mK
0.10 °C-in2/W
0.66 °C-cm2/W
11 x 10-5 ohm-cm
240 W/mK
0.17 °C-in2/W
1.07 °C-cm2/W
11 x 10-5 ohm-cm
STANDARD THꢀCKNESSES
0.005” (0.13mm), 0.010” (0.25mm), 0.020” (0.51mm)
Consult the factory for alternate thicknesses.
STANDARD SHEET SꢀzE
18” x 24” (457mm x 609.6mm)
Tgon™ 800 sheets are supplied with no liners when ordered without adhesive.
With adhesive, they are supplied with no top liner and white release liner on the bottom.
Tgon™ 800 is available on rolls and individual die cut shapes.
PRESSURE SENSꢀTꢀvE ADHESꢀvE
Request no adhesive with “AO” suffix.
Request adhesive on one side with “A1” suffix.
Striped adhesive option on one side designated with SA.
Double-sided adhesive is not available.
THR-DS-Tgon-800 1109
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with
the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or
general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy
of which will be furnished upon request. © Copyright 2009 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc.
or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. A13515-00 Rev I 11/2009
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