TFLEXHR6120-DC1 [LSTD]
Thermal Gap Filler;
| 型号： | TFLEXHR6120-DC1 |
| 厂家： | 
Laird Connectivity |
| 描述： | Thermal Gap Filler |
| 文件： | 总2页 (文件大小：815K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TM
Tflex HR600 Series
Thermal Gap Filler
Innovative Technology
for a Connected World
ormance Gap Filler with 3 W/mK
00 is a cost-effective and compliant gap filler thermal interface material with
hermal performance and great handling for mass-production applications.
odulus interface pad conforms to component topography, resulting in little stress
ponents, mating chassis or parts. The softness relieves mechanical stress from
up tolerance and absorbs shock, resulting in improved device reliability. Tflex
covery properties for applications requiring material rework result in continued
integrity even after device rework and re-assembly.
0 is naturally tacky on both sides and requires no additional adhesive coating to
mal performance. The tack is designed to hold the pad in place during
nd component transport.
0 is electrically insulating, stable from -45ºC thru 200ºC, and meets UL 94V0
flame rating.
Features and Benefits
• Thermal conductivity 3 W/mK
• Soft and compliant
• Available in thicknesses from 0.010” thru 0.200” (0.25mm thru 5.0mm)
• Naturally tacky for adhesion during assembly and transport
Applications
• Cooling components to chassis, frame, or other mating components
• Memory modules
• Home and small office network equipment
• Mass storage devices
• Automotive electronics
• Telecommunication hardware
• Radios
• LED solid state lighting
• Power electronics
• LCD and PDP flat panel TV
• Set top boxes
• Audio and video components
• IT infrastructure
• GPS navigation and other portable devices
global solutions: local supportTM
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal
TM
Tflex HR600 Series
Thermal Gap Filler
Innovative Technology
for a Connected World
TflexTM HR600 Typical Properties
TM
Tflex HR600
Test Method
Filled silicone
elastomer
Construction
NA
Color
Dark Grey
3 W/mK
Visual
Thermal conductivity
ASTM D5470
40
Hardness (Shore 00)
Density
ASTM D2240
(at 3 second delay)
Helium
Pyncometer
2.5 g/cc
0.010" - .200"
(0.25 - 5.0mm)
Thickness range
Thickness tolerance
±10%
94 V0
UL flammability rating
UL
Temperature range
Volume resistivity
Outgassing TML
Outgassing CVCM
-45ºC to 200ºC
10 ^13 ohm-cm
0.19%
NA
ASTM D257
ASTM E595
ASTM E595
0.07%
Coefficient Thermal
Expansion (CTE)
IPC-TM-650
2.4.24
217 ppm/C
Standard Thicknesses
0.010-inch to 0.200-inch (0.25 to 5.0 mm)
0.010-inch and 0.015-inch thick materials come standard with fiberglass reinforcement designated by the suffix “FG”
Options
Proprietary DC1 option available to eliminate tack from one side to aid in handling.
erial Name and Thickness
™ indicates elastomeric gap filler product line
x indicates high recovery ‘6 series’ 3 W/mK material
sginates Fiberglass (available in 0.010 and 0.015-inch thickness only)
esignates proprietary option eliminating tack from one side
mples
™ HR6120 = 0.120-inch thick material
™ HR610FG = 0.010-inch thick material with fiberglass reinforecement
™ HR6120-DC1 = 0.120-inch thick material with proprietary DC1 option
600 1109
by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice.
nd application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential
kes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses.
be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms
fect from time to time, a copy of which will be furnished upon request. © Copyright 2009 Laird Technologies, Inc. All Rights Reserved. Laird,
d Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other
ay be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
A, 10/2009.
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