S3B [LRC]

Surface Mount Glass Passivated Junction Rectifiers Reverse Voltage 50 to 1000V; 表面安装玻璃钝化结整流器反向电压50〜 1000V
S3B
型号: S3B
厂家: LESHAN RADIO COMPANY    LESHAN RADIO COMPANY
描述:

Surface Mount Glass Passivated Junction Rectifiers Reverse Voltage 50 to 1000V
表面安装玻璃钝化结整流器反向电压50〜 1000V

二极管 光电二极管
文件: 总9页 (文件大小:189K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
S3A thru S3M  
Surface Mount Glass Passivated Junction Rectifiers  
Reverse Voltage 50 to 1000V Forward Current 3.0A  
FEATURES  
* Plastic package has Underwriters Laboratory  
Flammability Classification 94V-0  
* High temperature metallurgically  
bonded construction  
* Cavity-free glass passivated junction  
* Capable of meeting environmental standards  
of MIL-S-19500  
* 3.0 A operation at TA=75°C with no thermal runaway  
* Typical IR less than 1.0µA  
* High temperature soldering guaranteed:  
260°C/10 seconds  
Mechanical Data  
Case: JEDEC DO-214AB/SMC, molded plastic over glass Die  
Terminals: Plated axial leads, solderable per  
MIL-STD-750, Method 2026  
We declare that the material of product compliance  
with ROHS requirements  
Polarity: Color band denotes cathode end  
Mounting Position: Any  
Weight:  
0.21g  
Handling precautin:None  
Electrical Characteristic  
1.Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.  
S3A  
S3A  
50  
S3B  
S3B  
100  
70  
S3D  
S3D  
200  
140  
200  
S3G  
S3G  
400  
280  
400  
S3J  
S3J  
600  
420  
600  
S3K  
S3K  
800  
560  
800  
S3M  
S3M  
1000  
700  
Parameter Symbol  
symbol  
Unit  
Device marking code  
VRRM  
VRSM  
VDC  
Maximum repetitive peak reverse voltage  
Maximum RSM voltage  
V
V
V
35  
50  
100  
1000  
Maximum DC blocking voltage  
Maximum average forward rectified current  
0.375" (9.5mm) lead length at TA = 75°C  
3.0  
IF(AV)  
IFSM  
A
A
Peak forward surge current 8.3ms single half sine-  
wave superimposed on rated load (JEDEC Method)  
200  
55  
Typical thermal resistance (Note 1)  
RθJA  
°C/W  
°C  
50 to +150  
Operating junction and storage temperature range  
TJ, TSTG  
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.  
S3A  
S3B  
S3D  
S3G  
S3J  
S3K  
S3M  
Parameter Symbol  
symbol  
Unit  
V
VF  
1.1  
Maximum instantaneous forward voltage at 3.0A  
5.0  
100  
Maximum DC reverse current TA = 25°C  
at rated DC blocking voltage TA = 125°C  
IR  
µA  
30.0  
Typical junction capacitance at 4.0V, 1MHz  
CJ  
PF  
NOTES:  
1. Mounted on Copper Leaf area of 1.57in2(40mm2).  
S3A thru S3M  
2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted )  
Fig. 2 Maximum Non-repetitive Peak  
Fig. 1 Forward Current Derating Curve  
Forward Surge Current  
50  
60 Hz  
TJ = TJ max  
Resistive or  
Inductive Load  
8.3ms Single Half Sine-wave  
(JEDEC Method)  
3.0  
1.5  
200  
150  
100  
50  
0
0.375" (9.5mm) Lead Length  
0
1
10  
100  
0
25  
50 75 100 125 150 175  
Ambient Temperature, °C  
Number of Cycles at 60Hz  
Fig 3. Typical Instantaneous Forward  
Fig 4. Typical Reverse Characteristics  
Characteristics  
100  
10  
100  
TJ = 25°C  
Pulse width = 300µs  
1% Duty Cycle  
Tj=125  
10  
1.0  
0.1  
1.0  
Tj=25℃  
0.1  
0.01  
0.01  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
0
20  
40  
60  
80  
100  
Instantaneous Forward Voltage (V)  
Percent of Rated Peak Reverse Voltage (%)  
Fig 5. typical transient thermal  
Fig 6. Typical Junction Capacitance  
impedance  
100  
10  
20  
10  
TJ = 25°C  
f = 1.0 MHz  
Vsig = 50mVp-p  
1.0  
0.1  
1.0  
0.1  
0.01  
0.1  
1.0  
10  
100  
1
10  
100  
t,Pulse duration,sec  
Reverse Voltage (V)  
S3A thru S3M  
3. dimension:  
文件编号: WI - 258  
标题Ti t i l e:  
3 版 第 0 次修改  
塑封生产线SMD产品包装规范  
Packaging specification of SMD  
2 页  
SMD产品通用包装材料规格以及包装产品数量  
General packaging materials spec. and quantity  
1.1 卷装 reel  
A.卷盘规格reel spec  
单位:mm  
规格  
A
B
C
W
卷数量  
2K  
SMA 7"卷盘  
SMA13"卷盘  
SMB13"卷盘  
SMC13"卷盘  
177.0±2.0 54.0±0.5 13.0±0.5  
330.0±2.0 75.0±0.5 13.0±0.5  
330.0±2.0 75.0±0.5 13.0±0.5  
330.0±2.0 75.0±0.5 13.0±0.5  
13.2±0.2  
13.2±0.2  
13.5±0.5  
17.0±0.5  
5K  
3K  
3K  
B. 13"卷盘内盒 inner box  
单位:mm  
A
B
C
尺寸  
335±5.0  
335±2.0  
40±1.0  
按以上包装方式,产品包装数量:quant i t y  
规格  
盒数量  
10K  
SMA13"卷盘  
SMB13"卷盘  
SMC13"卷盘  
6K  
6K  
文件编号: WI - 258  
文件编号: WI - 258  
标题Ti t i l e:  
塑封生产线SMD产品包装规范  
Packaging specification of SMD  
3 页  
C. 7"卷盘盒 box  
单位:mm  
A
B
C
尺寸  
188±2.0  
188±2.0  
138±2.0  
按以上包装方式,产品包装数量:quant i t y  
盒数量  
16K  
7"卷盘  
D. 卷盘外reel carton  
单位:mm  
A
B
C
尺寸  
350±2.0  
340±2.0  
350±2.0  
按以上包装方式,产品包装数量:  
规格  
每箱数量  
80K  
SMA 7"卷盘  
SMA13"卷盘  
SMB13"卷盘  
SMC13"卷盘  
80K  
48K  
36K  
1.2 编带规格 tape spec  
A. Cover tape  
单位:mm  
B
A
SMA  
9.30±0.10  
0.068±0.005  
SMB  
SMC  
13.30±0.10  
文件编号: WI - 258  
标题Ti t i l e:  
3 版 第 0 次修改  
塑封生产线SMD产品包装规范  
Packaging specification of SMD  
4 页  
B. 带  
t
Do  
Po  
P2  
类型  
W
SMA  
SMC  
SMB  
B'  
12±0.3  
16±0.3  
12±0. 3  
P1  
E
4±0.1  
8±0.1  
8±0. 1  
1.75±0.1  
5.5±.05  
1.55±0.05  
1.5±0.1  
4±0.1  
1.75±0.1  
7.5±.05  
1.55±0.05  
1.55±0.05  
4±0.1  
1. 75±0. 1  
5. 5±0. 05  
1. 55±0. 05  
1. 55±0. 05  
4±0. 1  
F
D0  
D1  
P0  
P2  
10P0  
A0  
B0  
K0  
T
D1  
P1  
A'  
A
B
SEC.:B-B'  
2±0.05  
2±0.05  
2±0. 05  
40±0.2  
40±0.2  
40±0. 2  
2.79±0.1  
5.33±0.1  
2.36±0.1  
0.25±0.05  
6.05±0.1  
8.31±0.1  
2.54±0.1  
0.25±0.05  
3. 8±0. 1  
5. 4±0. 1  
2. 45±0. 1  
0. 25±0. 05  
Ao  
产品负极端( 编  
带有孔一边)  
SEC.:A-A'  
2SMD产品通用包装规范 General spec of SMD  
5.2.1国内客户domestic  
A. 7"卷盘reel  
所有标签贴在卷盘负极 al l t he l abel on cat hode si de  
C
A
C
A:LRC标签;  
B:ROHS标签  
C:卤标签 HF label  
B. 13"卷盘  
所有标签贴在卷盘负极 al l t he l abel o产品才贴HF onl y)  
A
C
C
A
A:LRC标签;  
B:ROHS标签 C:卤标签产品才贴HF only)  
文件编号: WI - 258  
标题Ti t i l e:  
3 版 第 0 次修改  
塑封生产线SMD产品包装规范  
Packaging specification of SMD  
5 页  
C. 标签要求label spec:  
LRC标签label  
LRC产品t ype  
产品数量 quant i t y  
******  
******  
产品LOT  
******  
******  
产品生产日期  
dat e  
ROHS标签  
卤标签 HF l abel  
Green  
2.2 国外客户  
overseas  
所有标签贴在卷盘负极 al l t he l abel on cat hode si de  
A
C
7"卷盘盒 inner box  
13"卷盘内盒inner box  
C
C
A
A:LRC标签;  
B: ROHS标签  
C: 卤标签HF l abel  
产品才贴HF onl y)  
文件编号: WI - 258  
标题Ti t i l e:  
3 版 第 0 次修改  
塑封生产线SMD产品包装规范  
Packaging specification of SMD  
6 页  
LRC标签label  
TYPE:******  
MARK:******  
Q'TY:******  
DATE:******  
LRC产品号  
印字型号  
产品数量  
产品生产日期  
ROHS标签  
卤标签 HF l abel  
Green  
注意事项NOTE:  
1. 13"卷盘内盒装产品,热缩膜包装;13"reelinner box must be packed by shrink film  
2. 有编带产品卷装完成后,白色胶编带粘牢;  
every tape after packingmust be fixed by white adhesive tape  
3.1产品出厂检验报告 testing report of the OQC  
每批出货时要附上出厂检验报告 ever y l ot must wi t h t est r epor t  
3.2尾箱  
码每批只允许出现一个尾,对于料,缓冲材料对空余部分,  
证物在受到一定的外作用力下明显移动且物碰撞。  
The same coding is only one ending for each batch box materials for the mantissa to  
be good filled with cushioning material.  
S3A thru S3M  
4. Update Record  
更新记录  
第一版  
更新作者  
周杰  
更新日期  
2011- 3- 4  
2011- 9- 15  
版次  
1
2
增加包装规范  
周杰  

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