S-SODZ8.2A-SH [LRC]
GLASS PASSIVATED JUNCTION Zener voltage regulator diodes 1.0 Watt Steady State;型号: | S-SODZ8.2A-SH |
厂家: | LESHAN RADIO COMPANY |
描述: | GLASS PASSIVATED JUNCTION Zener voltage regulator diodes 1.0 Watt Steady State |
文件: | 总11页 (文件大小:1234K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
S-SODZ ***A -SH Series
GLASS PASSIVATED JUNCTION Zener voltage regulator diodes
1.0 Watt Steady State
Feature
* 1 W SOD-123-FL
* Zener voltage regulator diodes
* Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
* We declare that the material of product
compliance with RoHS requirements.
* S- prefix for automotive and other applications requiring
unique site and control change requirements; AEC-Q101
qualified and PPAP capable.
SOD123FL
* Guarding for over voltage protection
* High temperature soldering guaranteed:
260°C/10 seconds at terminals
* MSL: 1
Mechanical Data
Case: JEDEC SOD-123-FL/MINI SMA molded plastic
Terminals :Plated terminals, solderable per
MIL-STD-750,Method 2026
Polarity: Color band denoted cathode except Bipolar
Mounting Position: Any
Weight : Approximated 0.0155 gram
1.Electrical Characteristic
Ratings at 25°C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
RATING
SYMBOL
VALUE
UNITS
Steady State Power Dissipation at T=75°C(Note1)
PM(AV)
1.0
Watts
L
Z-current
IZ
PV/VZ
mA
°C
TJ,TSTG
Operating and Storage Temperature Range
-50 to +150
NOTES:
1. 8.0mm2 (.013mm thick) land areas
2. 8.3ms single half sine-wave, duty cycle= 4 pulses per minutes maximum.
Leshan Radio Company, LTD.
Rev.H Jul. 2019
1/6
S-SODZ ***A -SH Series
2.Product Characteristic
Vz tolerance : ±5%; Tested with pulese tp=40ms;Ta=25℃ Vfmax =1.2V @ IF = 200mA P=1 W
Maximum
Regulator
Current2)
Zener
Current
I zt
A and B Sufflx only
Leakage Current
Device
marking
code
Type
IZM @
Tamb =50 °C
IR
VR
Voltage
Vz@Izt
Volts
Z zt @ I zt Z zk@ Izk Z zk@ Izk
mA
49
45
Ohms
Ohms
550
m A
uA Max
Volts
1.0
mA
Z5.1
Z5.6
Z6.2
Z6.8
S-SODZ5.1A-SH
S-SODZ5.6A-SH
5.1
5.6
7
5
178
164
600
2.0
1
S-SODZ6.2A-SH
S-SODZ6.8A-SH
6.2
6.8
41
37
2
4
700
3.0
4
146
133
121
110
100
91
1300
100
S-SODZ7.5A-SH
S-SODZ8.2A-SH
S-SODZ9.1A-SH
Z7.5
Z8.2
Z9.1
7.5
8.2
9.1
34
31
28
4.5
5.5
6
1300
1300
1300
0.5
0.5
0.5
5
6
7
S-SODZ10A-SH
S-SODZ11A-SH
S-SODZ12A-SH
S-SODZ13A-SH
S-SODZ15A-SH
S-SODZ16A-SH
S-SODZ18A-SH
S-SODZ20A-SH
S-SODZ22A-SH
S-SODZ24A-SH
S-SODZ27A-SH
S-SODZ30A-SH
Z10
Z11
Z12
Z13
Z15
Z16
Z18
Z20
Z22
Z24
Z27
Z30
10
11
12
13
15
16
18
20
22
24
27
30
25
23
7
8
1300
1300
1300
1300
1300
1300
1300
1300
1300
1300
1300
1500
7.6
8.4
83
21
9
9.1
76
5
5
19
10
14
16
20
22
23
25
35
40
9.9
69
17
11.4
12.2
13.7
15.2
16.7
18.2
20.6
22.8
61
15.5
14
57
50
12.5
11.5
10.5
9.5
8.5
45
41
38
34
30
27
S-SODZ33A-SH
S-SODZ36A-SH
S-SODZ39A-SH
S-SODZ43A-SH
S-SODZ47A-SH
S-SODZ51A-SH
S-SODZ56A-SH
S-SODZ62A-SH
S-SODZ68A-SH
S-SODZ75A-SH
S-SODZ82A-SH
S-SODZ91A-SH
S-SODZ100A-SH
S-SODZ110A-SH
S-SODZ120A-SH
S-SODZ130A-SH
S-SODZ150A-SH
S-SODZ160A-SH
S-SODZ180A-SH
S-SODZ200A-SH
Z33
Z36
33
36
7.5
7
45
50
1500
1500
1500
2500
2500
2500
2500
2500
2500
2500
3000
3000
3000
5000
5500
6000
6500
7000
8500
10000
25.1
27.4
29.7
32.7
35.8
38.8
42.6
47.1
51.7
56
25
23
22
19
18
16
14
13
12
11
10
9
Z39
39
6.5
6
60
Z43
43
70
Z47
47
5.5
5
80
0.25
Z51
51
95
Z56
56
4.5
4
110
125
150
175
200
250
350
550
750
900
1200
1350
1650
1950
Z62
62
Z68
68
3.7
3.3
3
Z75
75
5
Z82
82
62.2
69.2
76
Z91
91
2.8
2.5
2
Z100
Z110
Z120
Z130
Z150
Z160
Z180
Z200
100
110
120
130
150
160
180
200
83
8
1.5
1
90
7
98
6
1
113
120
135
150
6
1
6
1
5
1
4
Leshan Radio Company, LTD.
Rev.H Jul. 2019
2/6
S-SODZ ***A -SH Series
3.Characteristic Curves
Vz--Iz
Vz--Iz
50
40
30
20
10
20
16
12
8
4
0
5
10
15
20
25
30
35
50
70
90
110
130
150
170
190
ZENER VOLTAGE Vz(V)
P--Ta
1000
750
500
250
0
50
100
150
200
AMBIENT TEMPERATURE Ta(℃)
Leshan Radio Company, LTD.
Rev.H Jul. 2019
3/6
4.OUTLINE AND DIMENSIONS
SOD123FL
DIM MIN NOR MAX
A 0.90 1.05 1.15
b 0.75 0.80 0.95
L
0.80REF.
E 2.60 2.75 2.90
D 1.60 1.75 1.90
HE 3.50 3.65 3.80
c 0.12 0.17 0.22
L1
0.45REF.
All Dimensions in mm
5.SOLDERING FOOTPRINT
DIM (mm)
X
Y
1.20
1.10
2.00
X1
Leshan Radio Company, LTD.
Rev.H Jul. 2019
4/6
S-SODZ ***A -SH Series
6.Suggested thermal profile for soldering process
1. Storage environment:Temperature=5~40℃ Humidity=55±25%
2. Reflow soldering of surface-mount device
3. Reflow soldering
Profile Feature
Average ramp-up rate(T
Preheat
Soldering Condition
L
to T
P)
<3℃/sec
- Temperature Min(Tsmin)
- Temperature Max(Tsmax)
- Time(min to max)(t
Tsmax to T
- Ramp-up Rate
150℃
200℃
60~120sec
s
)
L
<3sec
Time maintained above:
- Temperature (TL)
217℃
- Time(t
Peak Temperature(T
Time within 5℃ of actual Peak
Temperature(T
Ramp-down Rate
Time 25℃ to Peak Temperature
L
)
60-260sec
P
)
255 -0/+5℃
10~30sec
P
)
<6℃/sec
<6minutes
Leshan Radio Company, LTD.
Rev.H Jul. 2019
5/6
S-SODZ ***A -SH Series
7.High reliability test capabilities
Item Test
Condition
Reference
at 260±5℃ for 10±2sec immerse
body into solder 1/16" ± 1/32"
MIL-STD-750D METHOD-2031
Solder Resistance
MIL-STD-202F METHOD-208
MIL-STD-750D METHOD-1038
Solderability
at 245±5℃ for 5 sec
High Temperature Reverse Bias
VR=80% rate at Tj=150℃ for 168hrs
Rated average rectifier current
TA=25℃ for 500hrs
MIL-STD-750D METHOD-1027
Forward Operation Life
TA=25℃,IF=IO
On state:power on for 5 min.
Off state:power off for 5 min.
on and off for 500 cycles
MIL-STD-750D METHOD-1036
Intermittent Operation Life
JESD22-A102
Pressure Cooker
15PSIG at TA=121℃ for 4hrs
-55℃ to +125℃ dwelled for 30 min.
and transferred for 5min. Total 10 cycles
MIL-STD-750D METHOD-1051
Temperature Cycling
0℃ for 5min. Rise to 100℃ for 5min.
Total 10 cycles
MIL-STD-750D METHOD-1056
MIL-STD-750D METHOD-4066-2
Thermal Shock
Forward Surge
8.3ms single half sine-wave
superimposed on rated load,one surge
MIL-STD-750D METHOD-1021
MIL-STD-750D METHOD-1031
Humidity
at TA=85℃,RH=85% for 1000hrs
at 175℃ for 1000hrs
High Temperature Storage Life
Leshan Radio Company, LTD.
Rev.H Jul. 2019
6/6
Title: Power Packages Product Packing Specification
功率产品包装规范
Document Number: APS-QA-QS-009
Proprietary Information
Revision C
Page 3 of 6
8.1.2 Label position and QA stamp position.(Empty area) 标签张贴位置及QA印章位置。(印章盖在标
签空白区
静电敏感器件标识
7英寸卷盘标签张贴及QA印章位置
13英寸卷盘标签张贴及QA印章位置
8.1.3 Ensure direction In the same reel. The same steel coil plate direction,With antistatic bubble to
package reel。Refer to the below picture.
同一箱内的卷盘方向一致,用防静电泡沫对卷盘进行包裹。
7英寸卷盘防静电泡沫包裹
13英寸卷盘防静电泡沫包裹
Do not copy without written permission from Advanced Power Semiconductor
Title: Power Packages Product Packing Specification
功率产品包装规范
Document Number: APS-QA-QS-009
Proprietary Information
Revision C
Page 4 of 6
8.1.4 Put in the antistatic packing box after packaged reels. And QA stamp on the box label .
将包装好的卷盘放入防静电纸箱中,并在盒标签上盖章。
7 英寸卷盘内盒及标签
13 英寸卷盘内盒及标签
8.1.5 Product use printing inner box. 产品使用LRC印字内箱。
印字内盒
印字内盒
7英寸卷盘内箱印字(侧面)
13英寸卷盘内箱印字(正面)
8.1.6 Inner box packing quantity requirement.内盒包装数量要求。
Product
QTY
Description
SOD123-FL
SOD323-HE
1-10Reels
1-10Reels
SMA-FL
SMB-FL
1-7Reels
1-4Reels
8.1.7 With transparent tape sealing. 透明胶带封箱。
Do not copy without written permission from Advanced Power Semiconductor
Title: Power Packages Product Packing Specification
功率产品包装规范
Document Number: APS-QA-QS-009
Proprietary Information
Revision C
Page 5 of 6
7英寸内箱封盒
13英寸内箱封盒
8.1.8 Outer box size and packing quantity requirement,外箱尺寸及包装数量要求。
Product
卷盘尺寸
7 英寸
Height(H) Width(W) Length(L) Max. Qty
Description
Power
410mm
410mm
400mm
400mm
445mm
445mm
12
5
Device
Power
13英寸
Device
统一方向
7 英寸卷盘产品装箱
13 英寸卷盘产品装箱
Do not copy without written permission from Advanced Power Semiconductor
Title: Power Packages Marking & Taping
Specification
功率封装字模和编带规范
Proprietary Information
Document Number:APS-QA-QS-010
Revision C
Page 6 of 9
8.2 Standard Products Taping Specification
标准产品编带规范
8.2.1 Tape length of no component
空带长度说明
Taping leader length 引导部分:440mm±40mm ,Tape trailer 尾部:200mm±40mmt
400mm-480mm
160mm-240mm
TAPE LEADER
8.2.2 Component packaging orientation: The cathode lead is close to the carrier tape’s index hole.
产品放置方向:印阴极带引脚邻近载带索引孔
Do not copy without written permission from Advanced Power Semiconductor
Title: Power Packages Marking & Taping
Specification
功率封装字模和编带规范
Proprietary Information
Document Number:APS-QA-QS-010
Revision C
Page 7 of 9
8.2.3 Tape enwind orientation
编带缠绕方向要求
Do not copy without written permission from Advanced Power Semiconductor
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