V18MLE0805LH [LITTELFUSE]
Varistor, 18V, Surface Mount, CHIP, 0805, ROHS COMPLIANT;
| 型号： | V18MLE0805LH |
| 厂家： | 
LITTELFUSE |
| 描述： | Varistor, 18V, Surface Mount, CHIP, 0805, ROHS COMPLIANT 电阻器 |
| 文件： | 总6页 (文件大小：165K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLE Series
RoHS
MLE Varistor Series
Description
The MLE Series family of transient voltage suppression
devices are based on the Littelfuse multilayer fabrication
technology. These components are designed to suppress
ESD events, including those specified in IEC 61000-4-2
or other standards used for Electromagnetic Compliance
testing. The MLE Series is typically applied to protect
integrated circuits and other components at the circuit
board level operating at 18VDC, or less.
The fabrication method and materials of these devices
result in capacitance characteristics suitable for high
frequency attenuation/low-pass filter circuit functions,
thereby providing suppression and filtering in a single
device.
SizeTable
Metric
ꢆꢃꢃꢄ
1608
2012
EIA
The MLE Series is manufactured from semiconducting
ceramics and is supplied in a leadless, surface mount
package. The MLE Series is compatible with modern reflow
and wave soldering procedures.
0402
ꢃꢉꢃꢊ
ꢃꢋꢃꢄ
1206
Littelfuse Inc. manufactures other Multilayer Series
products. See the ML Series data sheet for higher energy/
peak current transient applications. See the AUML Series
for automotive applications and the MLN Quad Array. For
high–speed applications see the MHS Series.
ꢊꢂꢆꢉ
Applications
Features
tꢀ "&$ꢀꢁꢀ2ꢂꢃꢃꢀDPNQMJBOU
tꢀ 3P)4ꢀ$PNQMJBOU
tꢀ ꢁꢄꢄ$ꢀUPꢀꢅꢆꢂꢄ$ꢀ
tꢀ 1SPUFDUJPOꢀPGꢀ
components and
circuits sensitive
to ESDTransients
occurring on power
supplies, control
and signal lines
electromagnetic
compliance (EMC)
operating temp. range
tꢀ -FBEMFTTꢀꢃꢇꢃꢂꢈꢀꢃꢉꢃꢊꢈꢀ
ꢃꢋꢃꢄꢈꢀBOEꢀꢆꢂꢃꢉꢀTJ[FTꢀ
tꢀ 6TFEꢀJOꢀNPCJMFꢀ
communications,
DPNQVUFSꢎ&%1ꢀ
tꢀ 3BUFEꢀGPSꢀ&4%ꢀ
(IEC-61000-4-2)
tꢀ 0QFSBUJOHꢀWPMUBHFTꢀ
tꢀ $IBSBDUFSJ[FEꢀGPSꢀ
impedance and
capacitance
products, medical
products, hand held/
portable devices,
industrial equipment,
including diagnostic
port protection and
*ꢎ0ꢀJOUFSGBDFTꢀ
up to 18VM(DC)
tꢀ .VMUJMBZFSꢀDFSBNJDꢀ
tꢀ 4VQQSFTTJPOꢀPGꢀ
ESD events such
as specified in
construction technology
IEC-61000-4-2 or
.*-ꢁ45%ꢁꢋꢋꢊ$ꢀ
.FUIPEꢁꢊꢃꢆꢄꢌꢍꢈꢀGPSꢀ
Absolute Maximum Ratings
tꢀꢀ'PSꢀSBUJOHTꢀPGꢀJOEJWJEVBMꢀNFNCFSTꢀPGꢀBꢀTFSJFTꢈꢀTFFꢀEFWJDFꢀSBUJOHTꢀBOEꢀTQFDJmDBUJPOTꢀUBCMFꢌ
Continuous
MLE Series
Units
Steady State Applied Voltage:
%$ꢀ7PMUBHFꢀ3BOHFꢀꢏ7M(DC)
)
≤18
V
$
C
0QFSBUJOHꢀ"NCJFOUꢀ5FNQFSBUVSFꢀ3BOHFꢀꢏ5A)
ꢁꢄꢄꢀUPꢀꢅꢆꢂꢄ
ꢁꢄꢄꢀUPꢀꢅꢆꢄꢃ
4UPSBHFꢀ5FNQFSBUVSFꢀ3BOHFꢀꢏ5STG
)
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MLE.html for current information.
31
Revision: July 16, 2009
MLEVaristor Series
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLE Series
Device Ratings and Specifications
Performance Specifications (25ºC)
Max Continuous
Working Voltage
-55ºC to 125ºC
Maximum Clamping
Voltage at Specified
Current (8/20μs)
Nominal
Voltage
Maximum ESD Clamp
Typical
Capacitance
at 1MHz
Voltage (Note 2)
Part Number
(Note 1)
V/0. at
1mA DC
8kV Contact
15kV Air
VC
VM(DC)
ꢏ/PUFꢀꢊꢐ
(Note 4)
(V)
18
18
18
18
18
18
MIN (V) MAX (V)
(V)
(V)
ꢑꢆꢂꢄ
ꢑꢍꢄ
<100
ꢑꢍꢃ
Clamp (V)
<110
(pF)
ꢑꢄꢄ
V18MLE0402N
7ꢆꢋ.-&ꢃꢉꢃꢊ/
7ꢆꢋ.-&ꢃꢉꢃꢊ-/
7ꢆꢋ.-&ꢃꢋꢃꢄ/
7ꢆꢋ.-&ꢃꢋꢃꢄ-/
V18MLE1206N
22
22
22
22
22
22
28
28
28
28
28
28
ꢄꢃꢀBUꢀꢆ"
ꢄꢃꢀBUꢀꢆ"
ꢄꢃꢀBUꢀꢆ"
ꢄꢃꢀBUꢀꢆ"
ꢄꢃꢀBUꢀꢆ"
ꢄꢃꢀBUꢀꢆ"
<110
<140
ꢑꢍꢄ
ꢑꢆꢂꢄ
<100
ꢑꢄꢃꢃ
<100
ꢑꢆꢍꢃꢃꢀ
ꢑꢍꢄ
ꢑꢆꢊꢄ
ꢑꢉꢄ
ꢑꢉꢄ
/05&4ꢒꢀ
1. For applications of 18VDCꢀPSꢀMFTTꢌꢀ)JHIFSꢀWPMUBHFTꢀBWBJMBCMFꢈꢀDPOUBDUꢀZPVSꢀ-JUUFMGVTFꢀ4BMFTꢀ3FQSFTFOUBUJWFꢌ
2. Tested with IEC-61000-4-2 Human Body Model (HBM) discharge test circuit.
ꢊꢌꢀ%JSFDUꢀEJTDIBSHFꢀUPꢀEFWJDFꢀUFSNJOBMTꢀꢏ*&$ꢀQSFGFSSFEꢀUFTUꢀNFUIPEꢐꢌꢀ
4. Corona discharge through air (represents actual ESD event).
ꢄꢌꢀ$BQBDJUBODFꢀNBZꢀCFꢀDVTUPNJ[FEꢈꢀDPOUBDUꢀZPVSꢀ-JUUFMGVTFꢀ4BMFTꢀ3FQSFTFOUBUJWFꢌ
6. Leakage current ratings are at 18 VDCꢀBOEꢀꢂꢄμA maximum.
NominalVoltage Stability to Multiple ESD Impulses
(8kV Contact Discharges per IEC 61000-4-2)
Peak Current and Energy Derating Curve
'PSꢀBQQMJDBUJPOTꢀFYDFFEJOHꢀꢆꢂꢄ$ꢀBNCJFOUꢀUFNQFSBUVSFꢈꢀUIFꢀ
peak surge current and energy ratings must be reduced as
shown below.
30
25
20
15
10
5
100
80
60
40
20
0
0
1
10
1000
100
10000
CURRENT (A)
Figure 2
-55
50 60
70
80
90 100 110 120 130 140 150
o
AMBIENTTEMPERATURE ( C)
Figure 1
Impedance (Z) vs FrequencyTypical Characteristic
100
Standby Current at NormalizedVaristorVoltage and
Temperature
-0402
-0603
10
-0805
1.2
1.0
0.8
-1206
1
0.1
25O
85O
0.6
0.01
10
1000
0.4
100
10000
FREQUENCY (MHz)
125O
Figure 4
0.2
0.0
0.0001
0.001
0.01
0.1
1
CURRENT (mA)
Figure 3
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MLE.html for current information.
32
Revision: July 16, 2009
MLEVaristor Series
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLE Series
Device Characteristics
ClampingVoltage OverTemperature (VC at 10A)
At low current levels, the V-I curve of the multilayer
transient voltage suppressor approaches a linear (ohmic)
relationship and shows a temperature dependent effect.
At or below the maximum working voltage, the suppressor
is in a high resistance model (approaching 106Ω at its
maximum rated working voltage). Leakage currents at
maximum rated voltage are below 100μ"ꢈꢀUZQJDBMMZꢀꢂꢄμA;
GPSꢀꢃꢇꢃꢂꢀTJ[FꢀCFMPXꢀꢂꢃμ"ꢈꢀUZQJDBMMZꢀꢄμA.
100
V26MLA1206
V5.5MLA1206
TypicalTemperature Dependance of the Haracteristic
$VSWFꢀJOꢀUIFꢀ-FBLBHFꢀ3FHJPO
100%
10
-60
-40
-20
0
20
40
60
80
100 120 140
o
TEMPERATURE ( C)
Figure 6
Energy Absorption/Peak Current Capability
Energy dissipated within the MLE is calculated by
multiplying the clamping voltage, transient current
and transient duration. An important advantage of the
multilayer is its interdigitated electrode construction within
the mass of dielectric material. This results in excellent
current distribution and the peak temperature per energy
absorbed is very low. The matrix of semiconducting grains
combine to absorb and distribute transient energy (heat)
ꢏTFFꢀ4QFFEꢀPGꢀ3FTQPOTFꢐꢌꢀ5IJTꢀESBNBUJDBMMZꢀSFEVDFTꢀQFBLꢀ
temperature; thermal stresses and enhances device
reliability.
o
o
o
o
o
C
25 50 75
-8 -7
100 125
10%
1E
-9
-6
-5
-4
-3
-2
1E
1E
1E
1E
1E
1E
1E
SUPPRESSOR CURRENT (A
DC
)
Figure 5
Speed of Response
The Multilayer Suppressor is a leadless device. Its
response time is not limited by the parasitic lead
inductances found in other surface mount packages.
The response time of the ZN0ꢀEJFMFDUSJDꢀNBUFSJBMꢀJTꢀMFTTꢀ
than 1ns and the MLE can clamp very fast dV/dT events
such as ESD. Additionally, in "real world" applications,
the associated circuit wiring is often the greatest
factor effecting speed of response. Therefore, transient
suppressor placement within a circuit can be considered
important in certain instances.
As a measure of the device capability in energy and peak
current handling, the V26MLA1206A part was tested with
NVMUJQMFꢀQVMTFTꢀBUꢀJUTꢀQFBLꢀDVSSFOUꢀSBUJOHꢀꢏꢆꢄꢃ"ꢈꢀꢋꢎꢂꢃμs). At
the end of the test, 10,000 pulses later, the device voltage
characteristics are still well within specification.
3FQFUJUJWFꢀ1VMTFꢀ$BQBCJMJUZ
Multilayer Internal Construction
100
PEAK CURRENT = 150A
8/20 s DURATION, 30s BETWEEN PULSES
FIRED CERAMIC
DIELECTRIC
V26MLA1206
METAL
ELECTRODES
METAL END
TERMINATION
DEPLETION
REGION
10
0
2000
4000
6000
8000
10000
12000
NUMBER OF PULSES
DEPLETION
REGION
Figure 8
GRAINS
Figure 7
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MLE.html for current information.
33
Revision: July 16, 2009
MLEVaristor Series
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLE Series
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
DPNQPOFOUTꢀJOꢀTVSGBDFꢀNPVOUꢀUFDIOPMPHZꢀBSFꢀ*3ꢀ3FꢁnPXꢀ
and Wave soldering. Typical profiles are shown on the right.
Reflow Solder Profile
The recommended solder for the MLE suppressor is
Bꢀꢉꢂꢎꢊꢉꢎꢂꢀꢏ4Oꢎ1Cꢎ"Hꢐꢈꢀꢉꢃꢎꢇꢃꢀꢏ4Oꢎ1CꢐꢀPSꢀꢉꢊꢎꢊꢍꢀꢏ4Oꢎ1Cꢐꢌꢀ
-JUUFMGVTFꢀBMTPꢀSFDPNNFOETꢀBOꢀ3."ꢀTPMEFSꢀnVYꢌ
230
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the MLE chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
QFBLꢀUFNQFSBUVSFꢀJTꢀFTTFOUJBMꢀUPꢀNJOJNJ[FꢀUIFSNBMꢀTIPDLꢌ
Figure 9
Wave Solder Profile
0ODFꢀUIFꢀTPMEFSJOHꢀQSPDFTTꢀIBTꢀCFFOꢀDPNQMFUFEꢈꢀJUꢀJTꢀ
still necessary to ensure that any further thermal shocks
BSFꢀBWPJEFEꢌꢀ0OFꢀQPTTJCMFꢀDBVTFꢀPGꢀUIFSNBMꢀTIPDLꢀJTꢀIPUꢀ
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
UPꢀMFTTꢀUIBOꢀꢄꢃ$ꢀCFGPSFꢀDMFBOJOHꢌ
Figure 10
Lead–free (Pb-free) Soldering Recommendations
Littelfuse offers the Nickel BarrierTermination finish for the
optimum Lead–free solder performance.
Lead–free Re-flow Profile
5IFꢀQSFGFSSFEꢀTPMEFSꢀJTꢀꢓꢉꢌꢄꢎꢊꢌꢃꢎꢃꢌꢄꢀꢏ4O"H$VꢐꢀXJUIꢀBOꢀ3."ꢀ
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
RAMP RATE
<3˚C/s
60 - 150 SEC
> 217˚C
The reflow profile must be constrained by the maximums
JOꢀUIFꢀ-FBEoGSFFꢀ3FnPXꢀ1SPmMFꢌꢀ'PSꢀ-FBEoGSFFꢀ8BWFꢀ
TPMEFSJOHꢈꢀUIFꢀ8BWFꢀ4PMEFSꢀ1SPmMFꢀTUJMMꢀBQQMJFTꢌ
PREHEAT ZONE
/PUFꢒꢀUIFꢀ-FBEoGSFFꢀQBTUFꢈꢀnVYꢀBOEꢀQSPmMFꢀXFSFꢀVTFEꢀGPSꢀ
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
5.0
6.0
7.0
Figure 11
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MLE.html for current information.
34
Revision: July 16, 2009
MLEVaristor Series
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLE Series
Product Dimensions (mm)
1"%ꢀ-":065ꢀ%&.&/4*0/4
C
$)*1ꢀ-":065ꢀ%*.&/4*0/4
E
B
NOTE
D
L
A
NOTE: Avoid metal runs in this area.
W
/PUFꢒꢀ"WPJEꢀNFUBMꢀSVOTꢀJOꢀUIJTꢀBSFBꢈꢀQBSUTꢀBSFꢀ
not recommended for use in applications using
Silver (Ag) epoxy paste.
1206 Size
0805 Size
0603 Size
0402 Size
Dimension
IN
MM
4.06
ꢆꢌꢉꢄ
1.02
1.80
IN
MM
ꢊꢌꢃꢄ
ꢆꢌꢂꢍ
1.02
1.10
IN
MM
ꢂꢌꢄꢇ
ꢃꢌꢍꢉ
0.89
1.00
IN
MM
ꢆꢌꢍꢃ
ꢃꢌꢄꢆ
0.61
0.60
A
0.160
ꢃꢌꢃꢉꢄ
0.040
ꢃꢌꢃꢍꢆ
0.120
ꢃꢌꢃꢄꢃ
0.040
ꢃꢌꢃꢇꢊ
0.100
ꢃꢌꢃꢊꢃ
ꢃꢌꢃꢊꢄ
0.040
ꢃꢌꢃꢉꢍ
0.020
0.024
0.024
B
C
D (max.)
ꢃꢌꢃꢆꢄꢀꢁꢎꢅꢀ
0.008
ꢃꢌꢃꢉꢊꢀꢁꢎꢅꢀ
0.006
ꢃꢌꢃꢊꢂꢀꢁꢎꢅꢀ
0.006
ꢃꢌꢃꢆꢃꢀꢁꢎꢅꢀ
0.006
ꢃꢌꢃꢊꢓꢀꢁꢎꢅꢀ
0.004
ꢃꢌꢃꢂꢃꢀꢁꢎꢅꢀ
0.004
E
L
ꢃꢌꢃꢂꢀꢁꢎꢅꢀꢃꢌꢃꢆ ꢃꢌꢄꢃꢀꢁꢎꢅꢀꢃꢌꢂꢄ ꢃꢌꢃꢂꢀꢁꢎꢅꢀꢃꢌꢃꢆ ꢃꢌꢄꢃꢀꢁꢎꢅꢀꢃꢌꢂꢄ
ꢃꢌꢇꢀꢁꢎꢅꢀꢃꢌꢂ
ꢆꢌꢉꢀꢁꢎꢅꢀꢃꢌꢆꢄ
ꢃꢌꢋꢀꢁꢎꢅꢀꢃꢌꢆꢄ
ꢃꢌꢂꢄꢀꢁꢎꢅꢀꢃꢌꢆꢄꢀ
ꢆꢌꢃꢀꢁꢎꢅꢀꢃꢌꢆ
ꢃꢌꢆꢂꢄꢀꢁꢎꢅꢀ
ꢃꢌꢃꢍꢓꢀꢁꢎꢅꢀ
0.008
ꢊꢌꢂꢃꢀꢁꢎꢅꢀꢃꢌꢃꢊ
ꢂꢌꢃꢆꢀꢁꢎꢅꢀꢃꢌꢂ
ꢆꢌꢂꢄꢀꢁꢎꢅꢀꢃꢌꢂ
0.012
ꢃꢌꢃꢇꢓꢀꢁꢎꢅꢀ
0.008
W
ꢃꢌꢃꢉꢀꢁꢎꢅꢀꢃꢌꢃꢆꢆ ꢆꢌꢉꢃꢀꢁꢎꢅꢀꢃꢌꢂꢋ
ꢃꢌꢄꢀꢁꢎꢅꢀꢃꢌꢆ
Part Numbering System
V 18 MLE1206 X X X
DEVICE FAMILY
Littelfuse TVSS Device
PACKING OPTIONS (see Packaging section for quantities)
T: 13in (330mm) Diameter Reel, Plastic Carrier Tape
H: 7in (178mm) Diameter Reel, Plastic Carrier Tape
R: 7in (178mm) Diameter Reel, Paper Carrier Tape
MAXIMUM DC
WORKING VOLTAGE
END TERMINATION OPTION
N: Nickel Barrier (Ni/Sn)
MULTILAYER SERIES
DESIGNATOR
CAPACITANCE OPTION
No Letter: Standard
L: Low Capacitance Version
DEVICE SIZE:
i.e., 120 mil x 60 mil
(3mm x 1.5mm)
Packaging*
Quantity
7” Inch Reel
Device Size
13” Inch Reel
7” Inch Reel
('R' Option)
Bulk Pack
'T' Option)
10,000
10,000
10,000
N/A
('H' Option)
('A' Option)
1206
ꢃꢋꢃꢄ
ꢃꢉꢃꢊ
0402
ꢂꢈꢄꢃꢃ
N/A
N/A
ꢂꢄꢃꢃ
ꢂꢄꢃꢃ
ꢂꢄꢃꢃ
N/A
ꢂꢈꢄꢃꢃ
ꢂꢈꢄꢃꢃ
4,000
10,000
N/A
ꢔꢏ1BDLBHJOHꢐꢀ*UꢀJTꢀSFDPNNFOEFEꢀUIBUꢀQBSUTꢀCFꢀLFQUꢀJOꢀUIFꢀTFBMFEꢀCBHꢀQSPWJEFEꢀBOEꢀUIBUꢀQBSUTꢀCFꢀVTFEꢀBTꢀTPPOꢀBTꢀQPTTJCMFꢀXIFOꢀSFNPWFEꢀGSPNꢀCBHTꢌ
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MLE.html for current information.
35
MLEVaristor Series
Revision: July 16, 2009
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MLE Series
Tape and Reel Specifications
PRODUCT
IDENTIFYING
LABEL
D
P
0
0
For T and H Pack Options: PLASTIC CARRIER TAPE
For R Pack Options: EMBOSSED PAPER CARRIER TAPE
P
2
E
F
W
K
0
B
0
EMBOSSMENT
TOP TAPE
178mm
OR 330mm
DIA. REEL
8mm
NOMINAL
P
A
0
1
t
D
1
1
Dimensions in Millimeters
0402 Size 0603, 0805 & 1206 Sizes
Symbol
Description
A0
B0
K0
W
F
Width of Cavity
Length of Cavity
Depth of Cavity
Width ofTape
%FQFOEFOUꢀPOꢀ$IJQꢀ4J[FꢀUPꢀ.JOJNJ[Fꢀ3PUBUJPOꢌ
%FQFOEFOUꢀPOꢀ$IJQꢀ4J[FꢀUPꢀ.JOJNJ[Fꢀ3PUBUJPOꢌ
%FQFOEFOUꢀPOꢀ$IJQꢀ4J[FꢀUPꢀ.JOJNJ[Fꢀ3PUBUJPOꢌ
ꢋꢀꢁꢎꢅꢀꢃꢌꢂꢀ
ꢊꢌꢄꢀꢁꢎꢅꢀꢃꢌꢃꢄꢀꢀ
ꢆꢌꢍꢄꢀꢁꢎꢅꢀꢃꢌꢆꢀꢀ
ꢂꢀꢁꢎꢅꢀꢃꢌꢃꢄ
ꢂꢀꢁꢎꢅꢀꢃꢌꢆꢀꢀ
ꢇꢀꢁꢎꢅꢀꢃꢌꢆꢀ
ꢆꢌꢄꢄꢀꢁꢎꢅꢀꢃꢌꢃꢄ
N/A
ꢋꢀꢁꢎꢅꢀꢃꢌꢊꢀ
ꢊꢌꢄꢀꢁꢎꢅꢀꢃꢌꢃꢄꢀꢀ
ꢆꢌꢍꢄꢀꢁꢎꢅꢀꢃꢌꢆꢀꢀ
ꢇꢀꢁꢎꢅꢀꢃꢌꢆꢀ
Distance Between Drive Hole Centers and Cavity Centers
Distance Between Drive Hole Centers andTape Edge
Distance Between Cavity Centers
E
P1
P2
P0
D0
D1
T1
Axial Drive Distance Between Drive Hole Centers & Cavity Centers
Axial Drive Distance Between Drive Hole Centers
Drive Hole Diameter
ꢂꢀꢁꢎꢅꢀꢃꢌꢆꢀꢀ
ꢇꢀꢁꢎꢅꢀꢃꢌꢆꢀ
ꢆꢌꢄꢄꢀꢁꢎꢅꢀꢃꢌꢃꢄ
ꢆꢌꢃꢄꢀꢁꢎꢅꢀꢃꢌꢃꢄꢀꢀ
0.1 Max
%JBNFUFSꢀPGꢀ$BWJUZꢀ1JFSDJOH
TopTapeThickness
0.1 Max
/PUFTꢀꢒ
tꢀ$POGPSNTꢀUPꢀ&*"ꢁꢇꢋꢆꢁꢆꢈꢀ3FWJTJPOꢀ"
tꢀ$BOꢀCFꢀTVQQMJFEꢀUPꢀ*&$ꢀQVCMJDBUJPOꢀꢂꢋꢉꢁꢊ
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MLE.html for current information.
36
MLEVaristor Series
Revision: July 16, 2009
相关型号：
©2020 ICPDF网 联系我们和版权申明