V18MLE0603NR [LITTELFUSE]
Varistor, 18V, Surface Mount, CHIP, 0603, ROHS COMPLIANT;
| 型号： | V18MLE0603NR |
| 厂家： | 
LITTELFUSE |
| 描述： | Varistor, 18V, Surface Mount, CHIP, 0603, ROHS COMPLIANT 电阻器 非线性电阻器 |
| 文件： | 总7页 (文件大小：155K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Surface Mount Varistors
Multilayer Transient Voltage Suppressor
MLE Varistor Series
The MLE Series family of Transient Voltage Suppression devices are based
on the Littelfuse Multilayer fabrication technology. These components are
designed to suppress ESD events, including those specified in IEC 61000-
4-2 or other standards used for Electromagnetic Compliance testing. The
MLE Series is typically applied to protect integrated circuits and other
components at the circuit board level operating at 18VDC, or less.
The fabrication method and materials of these devices result in capaci-
tance characteristics suitable for high frequency attenuation/low-pass
filter circuit functions, thereby providing suppression and filtering in a
single device.
3
The MLE Series is manufactured from semiconducting ceramics and is sup-
plied in a leadless, surface mount package. The MLE Series is compatible
with modern reflow and wave soldering procedures.
Littelfuse Inc. manufactures other Multilayer Series products. See the ML
Series data sheet for higher energy/peak current transient applications. See
the AUML Series for automotive applications and the MLN Quad Array. For
high speed applications see the MHS series.
Features
• Rated for ESD (IEC-61000-4-2)
• Characterized for Impedance and Capacitance
•-55oC to +125oC Operating Temperature Range
• Leadless 0402, 0603, 0805, and 1206 sizes
• Operating Voltages up to 18V
M(DC)
• Multilayer Ceramic Construction Technology
Applications
• Protection of Components and Circuits Sensitive to ESD Transients
Occurring on Power Supplies, Control and Signal Lines
• Suppression of ESD Events Such as Specified in IEC-61000-4-2 or
MIL-STD-883C Method-3015.7, for Electromagnetic Compliance (EMC)
• Used in Mobile Communications, Computer/EDP Products, Medical
Products, Hand Held/Portable Devices, Industrial Equipment,
Including Diagnostic Port Protection and I/O Interfaces
133
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Surface Mount Varistors
Multilayer Transient Voltage Suppressor
MLE Varistor Series
Absolute Maximum Ratings For ratings of individual members of a series, see device ratings and specifications table.
Continuous:
MLE SERIES
UNITS
Steady State Applied Voltage:
DC Voltage Range (V
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤18
Operating Ambient Temperature Range (T ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 125
V
M(DC)
OC
OC
A
Storage Temperature Range (T
). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 150
STG
Device Ratings and Specifications
o
PERFORMANCE SPECIFICATIONS (25 C)
MAX CONTINUOUS
WORKINGVOLTAGE
-55 C TO 125 C
MAXIMUM CLAMPING
VOLTAGE AT SPECIFIED
NOMINAL
VOLTAGE
MAXIMUM
ESD CLAMP VOLTAGE (NOTE 2)
MAXIMUM
LEAKAGE
o
o
CURRENT (8/20µS)
TYPICAL
CAPACITANCE
AT 1MHz
(NOTE 1)
V
AT
AT APPLIED
VOLTAGE
(NOTE 3)
8kV CONTACT
(NOTE 4)
15kV AIR
NOM
1mADC
Vc
V
I
L MAX
M(DC)
Clamp
(V)
Clamp
(V)
PART
NUMBER
MAX
(V)
(V)
(V)
MIN (V)
(pF)
( µA)
0.1
0.3
2
V
DC
<125
<75
V18MLE0402
V18MLE0603
V18MLE0603L
V18MLE0805
V18MLE0805L
V18MLE1206
18
22
28
50
at 10A
<160
<40
3.5
NEW
5.5
15
10
18
18
18
18
18
18
22
22
22
22
22
28
28
28
28
28
50
at 10A
<85
<100
<60
0.1
0.3
5.0
25
3.5
5.5
15
18
<100
<70
50
at 10A
<140
<75
0.1
0.3
5.0
25
3.5
5.5
15
18
50
at 10A
<500
<100
<1700
0.2
0.5
5.0
25
3.5
5.5
15
18
<75
50
at 10A
<135
<65
0.2
0.5
5.0
25
3.5
5.5
15
18
<65
50
at 10A
0.5
1.0
5.0
25
3.5
5.5
15
18
NOTES:
1. For applications of 18V
or less. Higher voltages available, contact your Littelfuse Sales Representative.
DC
2. Tested with IEC-61000-4-2 Human Body Model (HBM) discharge test circuit.
3. Direct discharge to device terminals (IEC preferred test method).
4. Corona discharge through air (represents actual ESD event).
5. Capacitance may be customized, contact your Littelfuse Sales Representative.
134
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Surface Mount Varistors
Multilayer Transient Voltage Suppressor
MLE Varistor Series
Typical Performance Curves
For applications exceeding 1250C ambient temperature, the peak surge
current and energy ratings must be reduced as shown in Figure 1.
30
25
20
15
10
5
100
80
60
40
20
0
3
0
1
10
1000
100
10000
-55
50 60
70
80
90 100 110 120 130 140 150
o
AMBIENTTEMPERATURE ( C)
CURRENT (A)
FIGURE 2. NOMINAL VOLTAGE STABILITY TO MULTIPLE
ESD IMPULSES (8KV CONTACT DISCHARGES
PER IEC 61000-4-2)
FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE
100
30
25
-0402
-0603
10
1
20
25O
85O
-0805
-1206
15
10
125O
5
0.1
10
0.0001
0.001
0.01
0.1
1
NUMBER OF PULSES
0.01
FIGURE 3. STANDBY CURRENT AT NORMALIZED VARISTOR
VOLTAGE AND TEMPERATURE
10
1000
100
10000
FREQUENCY (MHz)
FIGURE 4. IMPEDANCE (Z) vs FREQUENCY
TYPICAL CHARACTERISTIC
135
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Surface Mount Varistors
Multilayer Transient Voltage Suppressor
MLE Varistor Series
250
200
150
100
50
Soldering Recommendations
MAXIMUM
TEMPERATURE 222 C
o
The principal techniques used for the soldering of components in surface
mount technology are Infrared (IR) re-flow, vapour phase re-flow, and
wave soldering. When wave soldering, the MLE suppressor is attached
to the circuit board by means of an adhesive. The assembly is then
placed on a conveyor and run through the soldering process to contact
the wave. With IR and vapour phase re-flow, the device is placed in a
solder paste on the substrate. As the solder paste is heated, it reflows
and solders the unit to the board.
40-80
SECONDS
ABOVE 183 C
o
RAMP RATE
o
<2 C/s
PREHEAT DWELL
PREHEAT ZONE
The recommended solder for the MLE suppressor is a 62/36/2
(Sn/Pb/Ag), 60/40 (Sn/Pb), or 63/37 (Sn/Pb). Littelfuse also
recommends an RMA solder flux.
0
0
Wave soldering is the most strenuous of the processes. To avoid the
possibility of generating stresses due to thermal shock, a preheat stage
in the soldering process is recommended, and the peak temperature of
the solder process should be rigidly controlled. For 0402 size devices,
IR re-flow is recommended.
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
TIME (MINUTES)
FIGURE 5. REFLOW SOLDER PROFILE
When using a reflow process, care should be taken to ensure that the
MLE chip is not subjected to a thermal gradient steeper than 4 degrees
per second; the ideal gradient being 2 degrees per second. During the
soldering process, preheating to within 100 degrees of the solder’s peak
temperature is essential to minimize thermal shock. Examples of the
soldering conditions for the MLE series of suppressors are given in the
tables below.
300
250
200
150
100
50
o
MAXIMUMWAVE 260
C
Once the soldering process has been completed, it is still necessary to
ensure that any further thermal shocks are avoided. One possible cause of
thermal shock is hot printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room temperature. The
boards must be allowed to cool gradually to less than 50oC before cleaning.
SECOND PREHEAT
FIRST PREHEAT
Termination Options
Littelfuse offers two types of electrode termination finish for the
MLE series:
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
TIME (MINUTES)
1. Silver/Platinum (standard) (Not 0402 and 0603 sizes)
2. Silver/Palladium (optional)
FIGURE 6. WAVE SOLDER PROFILE
3. Nickel Barrier (optional for 0402-1210 package size)
(The ordering information section describes how to designate them.)
250
200
150
100
50
MAXIMUM
TEMPERATURE 222 C
o
40-80
SECONDS
o
ABOVE 183 C
RAMP RATE
o
>50 C/s
PREHEAT ZONE
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
TIME (MINUTES)
FIGURE 7. VAPOR PHASE SOLDER PROFILE
136
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Surface Mount Varistors
Multilayer Transient Voltage Suppressor
MLE Varistor Series
Recommended Pad Outline
C
B
NOTE
3
A
NOTE: Avoid metal runs in this area.
TABLE 1: PAD LAYOUT DIMENSIONS
RECOMMENDED PAD SIZE DIMENSIONS
0805 SIZE DEVICE
1206 SIZE DEVICE
0603 SIZE DEVICE
0402 SIZE DEVICE
DIMENSION
IN
MM
4.06
1.65
1.02
IN
MM
3.05
1.27
1.02
IN
MM
2.54
0.76
0.89
IN
MM
1.70
0.51
0.61
A
B
C
0.160
0.065
0.040
0.120
0.050
0.040
0.100
0.030
0.035
0.067
0.020
0.024
137
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Surface Mount Varistors
Multilayer Transient Voltage Suppressor
MLE Varistor Series
Mechanical Dimensions
E
D
L
W
DEVICE DIMENSIONS
1206 SIZE
0805 SIZE
0603 SIZE
0402 SIZE
DIMENSION
IN
MM
IN
0.043
MM
1.1
IN
0.035
MM
0.9
IN
MM
0.6
D Max
0.071
1.80
0.024
E
L
0.02 0.01
0.125 0.012
0.06 0.011
0.50 0.25
3.20 0.03
1.60 0.28
0.02 0.01
0.079 0.008
0.049 0.008
0.50 0.25
2.01 0.2
1.25 0.2
0.015 0.008
0.063 0.006
0.032 0.006
0.4 0.2
1.6 0.15
0.8 0.15
0.010 0.006
0.039 0.004
0.020 0.004
0.25 0.15
1.0 0.1
0.5 0.1
W
Ordering Information
VXXMLE TYPES
V
18 MLE 1206
X
X
X
DEVICE FAMILY
PACKING OPTIONS
Littelfuse TVSS Device
A: Bulk Pack (not 0402 size)
H: 7in (178mm) Diameter Reel
MAXIMUM DC
WORKING VOLTAGE
T: 13in (330mm) Diameter Reel
(not 0402 size)
END TERMINATION OPTION
No Letter: Ag/Pt (Standard)
W: Ag/Pd
MULTILAYER SERIES
DESIGNATOR
N: Nickel Barrier (0402-1210) For 0402 package size,
Nickel Barrier termination is subject to availibility.
Please contact a Littelfuse sales representative.
CAPACITANCE OPTION
No Letter: Standard
L: Low Capacitance Version
DEVICE SIZE:
i.e., 120 mil x 60 mil
(3mm x 1.5mm)
Standard Shipping Quantities
DEVICE SIZE
1206
“13”INCH REEL (“T”OPTION)
10,000
“7”INCH REEL (“H”OPTION)
BULKPACK (“A”OPTION)
2,500
2,500
2,500
10,000
2500
2500
2500
N/A
0805
10,000
10,000
N/A
0603
0402
138
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Surface Mount Varistors
Multilayer Transient Voltage Suppressor
MLE Varistor Series
Tape and Reel Specifications
• Conforms to EIA - 481-1, Revision A
• Can be supplied to IEC publication 286 - 3
DIMENSIONS IN MILLIMETERS
SYMBOL
DESCRIPTION
0402 Size
0603, 0805, & 1206 Sizes
A
B
K
Width of Cavity
Length of Cavity
Depth of Cavity
Width of Tape
Dependent on Chip Size to Minimize Rotation.
Dependent on Chip Size to Minimize Rotation.
Dependent on Chip Size to Minimize Rotation.
0
0
0
3
W
F
8 0.2
Distance Between Drive Hole Centers and Cavity Centers
Distance Between Drive Hole Centers and Tape Edge
Distance Between Cavity Centers
3.5 0.05
1.75 0.1
E
P
P
P
2 0.05
4
2
4
0.1
0.1
0.1
1
2
0
Axial Drive Distance Between Drive Hole Centers & Cavity Centers
Axial Drive Distance Between Drive Hole Centers
Drive Hole Diameter
D
D
1.55 0.05
1.05 0.05
0.1 Max
0
1
Diameter of Cavity Piercing
N/A
T
Top Tape Thickness
1
D
P
0
0
P
2
E
F
W
K
0
B
0
P
A
0
1
t
D
1
1
PRODUCT
IDENTIFYING
LABEL
PLASTIC CARRIERTAPE
EMBOSSMENT
TOP TAPE
178mm
OR 330mm
DIA. REEL
8mm
NOMINAL
139
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