V14MLA1206T [LITTELFUSE]
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| 型号： | V14MLA1206T |
| 厂家： | 
LITTELFUSE |
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| 文件： | 总11页 (文件大小：195K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
The ML Series family of Transient Voltage Surge Suppression devices is
based on the Littelfuse Multilayer fabrication technology. These compo-
nents are designed to suppress a variety of transient events, including
those specified in IEC 61000-4-2 or other standards used for Electromagnetic
Compliance (EMC). The ML Series is typically applied to protect integrated
circuits and other components at the circuit board level.
The wide operating voltage and energy range make the ML Series suit-
able for numerous applications on power supply, control and signal lines.
The ML Series is manufactured from semiconducting ceramics, and is
supplied in a leadless, surface mount package. The ML Series is compat-
ible with modern reflow and wave soldering procedures.
It can operate over a wider temperature range than zener diodes, and
has a much smaller footprint than plastic-housed components.
Littelfuse Inc. manufactures other Multilayer Series products. See the
MLE Series data sheet for ESD applications, MHS Series data sheet for
high-speed ESD applications, the MLN for multiline protection and the
AUML Series for automotive applications.
Features
• Leadless 0402, 0603, 0805, 1206 and 1210 Chip Sizes
• Multilayer Ceramic Construction Technology
•-55oC to +125oC Operating Temperature Range
• Operating Voltage Range V
M(DC)
= 5.5V to 120V
• Rated for Surge Current (8 x 20µs)
• Rated for Energy (10 x 1000µs)
• Inherent Bi-directional Clamping
• No Plastic or Epoxy Packaging Assures Better than 94V-0
Flammability Rating
• Standard Low Capacitance Types Available
Applications
• Suppression of Inductive Switching or Other Transient Events Such
as EFT and Surge Voltage at the Circuit Board Level
• ESD Protection for Components Sensitive to IEC 61000-4-2,
MIL-STD-883C Method 3015.7, and Other Industry Specifications
(See Also the MLE or MLN Series)
• Provides On-Board Transient Voltage Protection for ICs and Transistors
• Used to Help Achieve Electromagnetic Compliance of End Products
• Replace Larger Surface Mount TVS Zeners in
Many Applications
140
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Absolute Maximum Ratings For ratings of individual members of a series, see Device Ratings and Specifications table.
Continuous:
Steady State Applied Voltage:
ML SERIES
UNITS
DC Voltage Range (V
AC Voltage Range (V
Transient:
). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 to 120
V
V
M(DC)
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5 to 107
M(AC)RMS
Non-Repetitive Surge Current, 8/20µs Waveform, (I ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 to 500
A
J
TM
Non-Repetitive Surge Energy, 10/1000µs Waveform, (W ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.2 to 2.5
TM
Operating Ambient Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 125
A
OC
Storage Temperature Range (T
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 150
OC
3
STG
Temperature Coefficient (αV) of Clamping Voltage (V ) at Specified Test Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <0.01
%/OC
C
Device Ratings and Specifications
o
o
MAXIMUM RATINGS (125 C)
SPECIFICATIONS (25 C)
MAXIMUM
NON-
REPETITIVE
SURGE
MAXIMUM
NON-
REPETITIVE
SURGE
MAXIMUM
CLAMPING
VOLTAGE AT
10A
MAXIMUM
CONTINUOUS
WORKING
NOMINAL VOLTAGE
AT 1mA DC TEST
CURRENT
TYPICAL
CAPACITANCE
AT f = 1MHz
CURRENT
(8/20µs)
ENERGY
(10/1000µs)
(OR AS NOTED)
(8/20µs)
VOLTAGE
V
V
N(DC)
N(DC)
MIN
V
V
I
W
V
C
MAX
(V)
7.0
7.0
7.0
7.0
9.3
9.3
9.3
9.3
9.3
14
C
M(DC)
(V)
M(AC)
(V)
TM
TM
PART
NUMBER
(A)
30
(J)
(V)
(V)
3.7
3.7
3.7
3.7
7.1
7.1
7.1
7.1
7.1
11
(pF)
1100
2200
1200
6000
220
V3.5MLA0603
V3.5MLA0805
V3.5MLA0805L
V3.5MLA1206
V5.5MLA0402
V5.5MLA0603
V5.5MLA0805
V5.5MLA0805L
V5.5MLA1206
V9MLA0402
3.5
3.5
3.5
3.5
5.5
5.5
5.5
5.5
5.5
9
2.5
2.5
2.5
2.5
4.0
4.0
4.0
4.0
4.0
6.5
0.1
0.3
10 at 2A
10 at 5A
10 at 2A
14
120
40
0.1
100
20
0.3
0.050
0.1
15.5 at 1A
15.5 at 2A
15.5 at 5A
15.5 at 2A
15.5
NEW
30
660
120
40
0.3
1600
860
0.1
150
20
0.4
4500
120
0.050
22 at 1A
NEW
NEW
V9MLA0402L
V9MLA0603
9
6.5
6.5
6.5
9.0
10
4
0.020
0.1
25 at 1A
23 at 2A
20 at 2A
25 at 2A
30 at 1A
11
14
33
9.0
9.0
12
14
30
40
40
20
11.0
11
16.0
14
420
450
350
70
V9MLA0805L
V12MLA0805L
V14MLA0402
0.1
0.1
14
18.5
20.3
0.050
15.9
NEW
V14MLA0603
V14MLA0805
V14MLA0805L
V14MLA1206
14
14
14
14
10
10
10
10
30
120
40
0.1
0.3
0.1
0.4
30 at 2A
30 at 5A
30 at 2A
30
15.9
15.9
15.9
15.9
20.3
20.3
20.3
20.3
150
480
270
150
1600
141
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Device Ratings and Specifications (Continued)
o
o
MAXIMUM RATINGS (125 C)
SPECIFICATIONS (25 C)
MAXIMUM
NON-
REPETITIVE
SURGE
MAXIMUM
NON-
REPETITIVE
SURGE
MAXIMUM
CLAMPING
VOLTAGE AT
10A
MAXIMUM
CONTINUOUS
WORKING
NOMINAL VOLTAGE
AT 1mA DC TEST
CURRENT
TYPICAL
CAPACITANCE
AT f = 1MHz
CURRENT
(8/20µs)
ENERGY
(10/1000µs)
(OR AS NOTED)
(8/20µs)
VOLTAGE
V
V
N(DC)
N(DC)
MIN
V
V
I
W
V
C
MAX
C
M(DC)
(V)
M(AC)
(V)
TM
TM
PART
NUMBER
(A)
(J)
(V)
(V)
(V)
(pF)
NEW
V18MLA0402
V18MLA0603
V18MLA0805
V18MLA0805L
V18MLA1206
V18MLA1210
V26MLA0603
V26MLA0805
V26MLA0805L
V26MLA1206
V26MLA1210
V30MLA0603
V30MLA0805L
V30MLA1210
V30MLA1210L
V33MLA1206
V42MLA1206
V48MLA1210
V48MLA1210L
V56MLA1206
V60MLA1210
V68MLA1206
V85MLA1210
18
18
18
18
18
18
26
26
26
26
26
30
30
30
30
33
42
48
48
56
60
68
85
120
14
14
14
14
14
14
20
20
20
20
20
25
25
25
25
26
30
40
40
40
50
50
67
107
20
30
0.050
0.1
0.3
0.1
0.4
2.5
0.1
0.3
0.1
0.6
1.2
0.1
0.1
1.2
0.9
0.8
0.8
1.2
0.9
1.0
1.5
1.0
2.5
2.0
40 at 1A
40 at 2A
40 at 5A
40 at 2A
40
22
22
22
22
22
22
31
28.0
28.0
28.0
28.0
28.0
28.0
38
40
125
450
250
1100
1250
90
120
40
150
500
30
40
58 at 2A
58 at 5A
58 at 2A
56
100
40
29.5
29.5
29.5
29.5
37
38.5
38.5
38.5
38.5
46
190
115
900
1000
75
150
300
30
54
65 at 2A
65 at 2A
62
30
37
46
80
280
220
180
180
250
220
180
250
180
250
125
35
43
1575
1530
550
550
450
430
150
375
150
225
65
62
35
43
72
38
49
86
46
60
100
54.5
54.5
61
66.5
66.5
77
100
110
120
67
83
130
76
90
160
95
115
165
V120MLA1210
NOTES:
230
135
1.
L suffix is a low capacitance and energy version; Contact your Littelfuse Sales Representative for custom capacitance requirements.
2. Typical leakage at 25oC<25µA, maximum leakage 50µA at VM(DC); for 0402 size, typical leakage <5µA, maximum leakage 10µA at VM(DC).
3.
Average power dissipation of transients for 0402, 0603, 0805, 1206 and 1210 sizes not to exceed 0.03W, 0.05W, 0.1W, 0.1W and 0.15W respectively.
142
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Temperature De-rating
100
When transients occur in rapid succession, the average power dissipa-
tion is the energy (watt-seconds) per pulse times the number of pulses
per second. The power so developed must be within the specifications
shown on the Device Ratings and Specifications table for the specific
device. For applications exceeding 125oC ambient temperature, the peak
surge current and energy ratings must be derated as shown in Figure 1.
50
0
t
3
O
TIME
100
80
1
t
1
t
2
60
40
FIGURE 2. PEAK PULSE CURRENT TEST WAVEFORM
FOR CLAMPING VOLTAGE
20
0
O
= VIRTUAL ORIGIN OFWAVE
1
t =TIME FROM 10% TO 90% OF PEAK
-55
50 60
70
80
90 100 110 120 130 140 150
o
t
t
= VIRTUAL FRONT TIME = 1.25 x t
= VIRTUALTIME TO HALFVALUE
(IMPULSE DURATION)
1
2
AMBIENTTEMPERATURE ( C)
FIGURE 1. PEAK CURRENT AND ENERGY
DERATING CURVE
EXAMPLE:
FOR AN 8/20µs CURRENT WAVEFORM
8µs = t = VIRTUAL FRONT TIME
1
20µs = t = VIRTUALTIME TO
2
HALFVALUE
100
MAXIMUM CLAMPING VOLTAGE
MAXIMUM LEAKAGE
10
V18MLA0402
V14MLA0402
V09MLA0402
V5.5MLA0402
1µA
10µA
100µA
1mA
10mA
100mA
1A
10A
100A
CURRENT (A)
FIGURE 3. LIMIT V-I CHARACTERISTIC FOR V5.5MLA0402 TO V18MLA0402
143
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Maximum Transient V-I Characteristic Curves
100
MAXIMUM LEAKAGE
MAXIMUM CLAMPING VOLTAGE
V9MLA0402L
10
1µA
10µA
100µ A
1mA
10mA
CURRENT (A)
100mA
1A
10A
FIGURE 4. LIMIT V-I CHARACTERISTIC FOR V9MLA0402L
MAXIMUM CLAMPING VOLTAGE
100
MAXIMUM LEAKAGE
10
V30MLA0603
V26MLA0603
V18MLA0603
V14MLA0603
V9MLA0603
V5.5MLA0603
V3.5MLA0603
1µA
10µA
100µA
1mA
10mA
100mA
1A
10A
100A
CURRENT (A)
FIGURE 5. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0603 TO V30MLA0603
100
MAXIMUM CLAMPING VOLTAGE
MAXIMUM LEAKAGE
10
V30MLA0805L
V26MLA0805L
V18MLA0805L
V14MLA0805L
V9MLA0805L
V5.5MLA0805L
V3.5MLA0805L
1µA
10µA
100µA
1mA
10mA
100mA
1A
10A
100A
CURRENT (A)
FIGURE 6. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0805L TO V30MLA0805L
144
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Maximum Transient V-I Characteristic Curves (Continued)
100
MAXIMUM CLAMPING VOLTAGE
MAXIMUM LEAKAGE
10
V26MLA0805
V18MLA0805
3
V14MLA0805
V5.5MLA0805
V3.5MLA0805
1µA
10µA
100µA
1mA
10mA
100mA
1A
10A
100A
1000A
CURRENT (A)
FIGURE 7. LIMIT V-I CHARACTERISTIC FOR V3.5MLA0805 TO V26MLA0805
1000
V68MLA1206
V56MLA1206
V42MLA1206
V33MLA1206
V26MLA1206
V18MLA1206
100
V14MLA1206
V5.5MLA1206
10
V3.5MLA1206
MAXIMUM
LEAKAGE
MAXIMUM CLAMP
VOLTAGE
1
1µA
10µA
100µA
1mA
10mA
100mA
1A
10A
100A
1000A
CURRENT (A)
FIGURE 8. LIMIT V-I CHARACTERISTIC FOR V3.5MLA1206 TO V68MLA1206
1000
MAXIMUM CLAMPING VOLTAGE
MAXIMUM LEAKAGE
100
V120MLA1210
V85MLA1210
V60MLA1210
10
V48MLA1210, V48MLA1210L
V30MLA1210, V30MLA1210L
V26MLA1210
V18MLA1210
1
1µA
10µA
100µA
1mA
10mA
100mA
1A
10A
100A
1000A
CURRENT (A)
FIGURE 9. LIMIT V-I CHARACTERISTIC FOR V18MLA1210 TO V120MLA1210
145
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
100
Device Characteristics
At low current levels, the V-I curve of the multilayer transient voltage
suppressor approaches a linear (ohmic) relationship and shows a
temperature dependent effect (Figure 10). At or below the maximum
working voltage, the suppressor is in a high resistance mode (approach-
ing 106Ω at its maximum rated working voltage). Leakage currents at
maximum rated voltage are below 50µA, typically 25µA; for 0402 size
below 10µA, typically 5µA.
V26MLA1206
100%
V5.5MLA1206
10
-60
-40
-20
0
20
TEMPERATURE ( C)
FIGURE 12. CLAMPINGVOLTAGE OVER TEMPERATURE
40
60
80
100 120 140
o
(V AT 10A)
C
Energy Absorption/Peak Current Capability
o
o
o
o
o
C
25 50 75
-8 -7
100 125
10%
1E
Energy dissipated within the ML is calculated by multiplying the clamping
voltage, transient current and transient duration. An important advantage
of the multilayer is its interdigitated electrode construction within the mass
of dielectric material. This results in excellent current distribution and the
peak temperature per energy absorbed is very low. The matrix of semicon-
ducting grains combine to absorb and distribute transient energy (heat)
(Figure 11). This dramatically reduces peak temperature; thermal stresses
and enhances device reliability.
-9
-6
-5
-4
-3
-2
1E
1E
1E
1E
1E
1E
1E
SUPPRESSOR CURRENT (A
DC
)
FIGURE 10. TYPICAL TEMPERATURE DEPENDANCE OF THE CHARACTERISTIC
CURVE IN THE LEAKAGE REGION
Speed of Response
The Multilayer Suppressor is a leadless device. Its response time is not
limited by the parasitic lead inductances found in other surface mount
packages. The response time of the Zinc Oxide dielectric material is less
than 1 nanosecond and the ML can clamp very fast dV/dT events such
as ESD. Additionally, in “real world” applications, the associated circuit
wiring is often the greatest factor effecting speed of response. Therefore,
transient suppressor placement within a circuit can be considered
important in certain instances.
As a measure of the device capability in energy and peak current
handling, the V26MLA1206A part was tested with multiple pulses at its
peak current rating (150A, 8/20µs). At the end of the test, 10,000 pulses
later, the device voltage characteristics are still well within specification
(Figure 13).
100
PEAK CURRENT = 150A
8/20µs DURATION, 30s BETWEEN PULSES
FIRED CERAMIC
DIELECTRIC
V26MLA1206
METAL
ELECTRODES
10
METAL END
0
2000
4000
6000
8000
10000
12000
TERMINATION
NUMBER OF PULSES
FIGURE 13. REPETITIVE PULSE CAPABILITY
DEPLETION
REGION
DEPLETION
REGION
GRAINS
FIGURE 11. MULTILAYER INTERNAL CONSTRUCTION
146
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
250
Soldering Recommendations
MAXIMUM
TEMPERATURE 222 C
o
The principal techniques used for the soldering of components in surface
mount technology are Infrared (IR) re-flow, vapour phase re-flow and wave
soldering. Typical profiles are shown in Figures 14, 15 and 16. When wave
soldering, the ML suppressor is attached to the circuit board by means of an
adhesive. The assembly is then placed on a conveyor and run through the
soldering process to contact the wave. With IR and vapour phase reflow; the
device is placed in a solder paste on the substrate. As the solder paste is
heated, it re-flows and solders the unit to the board.
200
150
100
50
40-80
SECONDS
ABOVE 183
o
C
RAMP RATE
o
<2 C/s
PREHEAT DWELL
PREHEAT ZONE
3
The recommended solder for the ML suppressor is a 62/36/2 (Sn/Pb/Ag),
60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an RMA
solder flux.
0
0.0
Wave soldering is the most strenuous of the processes. To avoid the
possibility of generating stresses due to thermal shock, a preheat stage
in the soldering process is recommended, and the peak temperature of
the solder process should be rigidly controlled. For 0402 size devices, IR
re-flow is recommended.
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
TIME (MINUTES)
FIGURE 14. REFLOW SOLDER PROFILE
When using a reflow process, care should be taken to ensure that the ML
chip is not subjected to a thermal gradient steeper than 4 degrees per
second; the ideal gradient being 2 degrees per second. During the
soldering process, preheating to within 100 degrees of the solder’s peak
temperature is essential to minimize thermal shock. Examples of the
soldering conditions for the ML suppressor are given in the tables below.
300
250
200
150
100
50
o
MAXIMUMWAVE 260
C
Once the soldering process has been completed, it is still necessary
to ensure that any further thermal shocks are avoided. One possible
cause of thermal shock is hot printed circuit boards being removed
from the solder process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually to less than
50oC before cleaning.
SECOND PREHEAT
FIRST PREHEAT
Termination Options
Littelfuse offers three types of electrode termination finish for the
Multilayer product series:
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
TIME (MINUTES)
1. Silver/Platinum (standard, not available for 0402)
2. Silver/Palladium (optional)
FIGURE 15. WAVE SOLDER PROFILE
(The ordering information section describes how to designate them.)
3. Nickel Barrier (optional for 0402-1210 package size)
(The ordering information section describes how to designate them.)
250
200
150
100
50
MAXIMUM
TEMPERATURE 222 C
o
40-80
SECONDS
o
ABOVE 183
C
RAMP RATE
o
>50 C/s
PREHEAT ZONE
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
TIME (MINUTES)
FIGURE 16. VAPOR PHASE SOLDER PROFILE
147
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Recommended Pad Outline
C
B
NOTE
A
NOTE: Avoid metal runs in this area.
TABLE 1: PAD LAYOUT DIMENSIONS
PAD SIZE
0402
1210
1206
0805
0603
SIZE DEVICE
SIZE DEVICE
SIZE DEVICE
SIZE DEVICE
SIZE DEVICE
IN
MM
1.70
0.51
0.61
DIMENSION
IN
MM
4.06
2.54
1.02
IN
MM
4.06
1.65
1.02
IN
MM
3.05
1.27
1.02
IN
MM
2.54
0.76
0.89
0.067
0.020
0.024
A
B
C
0.160
0.100
0.040
0.160
0.065
0.040
0.120
0.050
0.040
0.100
0.030
0.035
148
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Mechanical Dimensions
E
D
L
3
W
CHIP SIZE
1210
1206
0805
0603
0402
DIMENSION
IN
MM
IN
MM
IN
MM
IN
MM
IN
MM
0.61
D Max.
0.113
2.87
0.071
1.80
0.043
1.10
0.035
0.90
0.024
E
L
0.02 0.01
0.125 0.012
0.10 0.012
0.50 0.25
3.20 0.30
2.54 0.30
0.02 0.01
0.50 0.25
3.20 0.30
1.60 0.28
0.01 to 0.029
0.079 0.008
0.049 0.008
0.50 to 0.25
2.01 0.20
1.25 0.20
0.015 0.008
0.063 0.006
0.032 0.06
0.4 0.2
1.6 0.15
0.8 0.15
0.010 0.006
0.039 0.004
0.020 0.004
0.25 0.15
1.0 0.1
0.5 0.1
0.125 0.012
0.06 0.011
W
Ordering Information
VXXML TYPES
1206 X
V
18 MLA
X
X
DEVICE FAMILY
PACKING OPTIONS
Littelfuse TVSS Device
T: 13in (330mm) Diameter Reel
H: 7in (178mm) Diameter Reel (Note)
A: Bulk Pack
MAXIMUM DC
WORKING VOLTAGE
END TERMINATION OPTION
No Letter: Ag/Pt (Standard)
W: Ag/Pd
MULTILAYER SERIES
DESIGNATOR
N: Nickel Barrier (0402 -1210). For 0402 package size,
Nickel Barrier termination is subject to availibility.
Please contact a Littelfuse sales representative.
CAPACITANCE OPTION
No Letter: Standard
L: Low Capacitance Version
DEVICE SIZE:
i.e 120 mil x 60 mil
(3MM X 1.5MM)
Standard Shipping Quantities
DEVICE SIZE
1210
“13”INCH REEL (“T”OPTION)
8,000
“7”INCH REEL (“H”OPTION)
BULKPACK (“A”OPTION)
2,500
2,500
2,500
2,500
10,000
2500
2500
2500
2500
N/A
1206
10,000
10,000
10,000
N/A
0805
0603
0402
149
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Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
ML Varistor Series
Tape and Reel Specifications
• Conforms to EIA - 481-1, Revision A
• Can be supplied to IEC Publication 286 - 3
DIMENSIONS IN MILLIMETERS
SYMBOL
DESCRIPTION
0402 Size
0603, 0805, 1206 & 1210 Sizes
A
B
K
Width of Cavity
Length of Cavity
Depth of Cavity
Width of Tape
Dependent on Chip Size to Minimize Rotation.
Dependent on Chip Size to Minimize Rotation.
Dependent on Chip Size to Minimize Rotation.
0
0
0
W
F
8 0.2
Distance Between Drive Hole Centers and Cavity Centers
Distance Between Drive Hole Centers and Tape Edge
Distance Between Cavity Centers
3.5 0.05
1.75 0.1
E
P
P
P
2 0.05
4
2
4
0.1
0.1
0.1
1
2
0
Axial Drive Distance Between Drive Hole Centers & Cavity Centers
Axial Drive Distance Between Drive Hole Centers
Drive Hole Diameter
D
D
1.55 0.05
1.05 0.05
0.1 Max
0
1
Diameter of Cavity Piercing
N/A
T
Top Tape Thickness
1
D
P
0
0
P
2
E
F
W
K
0
B
0
P
A
0
1
t
D
1
1
PRODUCT
IDENTIFYING
LABEL
PLASTIC CARRIER TAPE
EMBOSSED PAPER (0402 SIZE ONLY)
EMBOSSMENT
TOP TAPE
178mm
OR 330mm
DIA. REEL
8mm
NOMINAL
150
www. littelfuse. com
相关型号：
V14MLA1206WA
RESISTOR, VOLTAGE DEPENDENT, 14V, 0.05J, SURFACE MOUNT, CHIP, 1206, LEAD FREE
LITTELFUSE
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