SP1064-04UTG [LITTELFUSE]

Trans Voltage Suppressor Diode;
SP1064-04UTG
型号: SP1064-04UTG
厂家: LITTELFUSE    LITTELFUSE
描述:

Trans Voltage Suppressor Diode

二极管
文件: 总5页 (文件大小:931K)
中文:  中文翻译
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•ꢀ EFT,ꢀIECꢀ61000-4-4,ꢀ40Aꢀ  
(5/50ns)  
•ꢀ  
                                                                                       
SmallꢀformꢀfactorꢀμDFN(ꢀ  
JEDEC MO-229) package  
saves board space  
TVS Diode Arrays (SPA®Diodes)  
General Purpose ESD Protection - SP1064 Series  
RoHS  
GREEN  
Pb  
SP1064 Series 8.5pF, 15KV Diode Array  
Description  
Zener diodes fabricated in a proprietary silicon avalanche  
technology protect each I/O pin to provide a high level of  
protection for electronic equipment that may experience  
destructive electrostatic discharges (ESD). These  
robust diodes can safely absorb repetitive ESD strikes  
above the maximum level specified in IEC 61000-4-2  
international standard (Level 4, ±±kꢀ contact discharge)  
without performance degradation. Their very low loading  
capacitance also makes them ideal for protecting high  
speed signal pins.  
Pinout  
Features  
•ꢀ ESD,ꢀIECꢀ61000-4-2,ꢀ  
±15kꢀ contact, ±20kꢀ air  
•ꢀ ꢀLowꢀleakageꢀcurrentꢀofꢀ  
0.05μAꢀ(TYP)ꢀatꢀ60V  
6
5
7
8
3
9
10  
1
•ꢀ Lightning,ꢀIECꢀ61000-  
4-5,ꢀ2ndꢀedition,ꢀ2Aꢀ  
(tP=±/20μs)  
•ꢀLeadꢀfreeꢀandꢀRoHSꢀ  
compliant  
4
2
•ꢀ Lowꢀcapacitanceꢀofꢀ8.5pFꢀ  
(TYP) per I/O  
Functional Block Diagram  
Applications  
•ꢀꢀLCD/PDPTVs  
•ꢀꢀDVDꢀPlayers  
•ꢀꢀDesktops  
•ꢀꢀSetTopꢀBoxes  
•ꢀꢀMobileꢀPhones  
•ꢀꢀNotebooks  
Pin 2,9  
Pin 1,10  
Pin 4,7  
Pin 5,6  
•ꢀꢀMP3/PMP  
•ꢀꢀDigitalꢀCameras  
Application Example  
Source  
Board  
Control  
Board  
TFT-LCD  
Panel  
FPC  
PMIC  
Pin 3,8  
TFT Array  
Substrate  
SP1064-04UTG x (2)  
LifeꢀSupportꢀNote:  
Not Intended for Use in Life Support or Life Saving Applications  
The products shown herein are not designed for use in life sustaining or life saving  
applications unless otherwise expressly indicated.  
©2016 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revision: 11/09/16  
TVS Diode Arrays (SPA®Diodes)  
General Purpose ESD Protection - SP1064 Series  
Absolute Maximum Ratings  
Symbol  
Parameter  
ꢀalue  
2.0  
Units  
A
IPP  
Peak Current (tp=±/20μs)  
OperatingTemperature  
StorageTemperature  
TOP  
-40 to 125  
-55 to 150  
°C  
TSTOR  
°C  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of  
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
Electrical Characteristics (TOP=25ºC)  
Parameter  
Symbol  
RWM  
Test Conditions  
IRꢀ≤ꢀ1µA  
Min  
Typ  
Max  
60  
Units  
ReverseꢀStandoffꢀVoltage  
ReverseꢀLeakageꢀCurrent  
ILEAK  
R=60V,ꢀAnyꢀI/OꢀtoꢀGND  
IPP=1A,ꢀtp=8/20µs,ꢀFwd  
0.05  
±1  
95  
4
µA  
Clamp ꢀoltage1  
C  
RDYN  
ESD  
CL  
I
PP=2A,ꢀtp=8/20µs,ꢀFwd  
DynamicꢀResistanceꢀ3  
ESDꢀWithstandꢀVoltage1  
Line Capacitance1, 2  
TLP, tP=100ns,ꢀI/OꢀtoꢀGND  
IEC 61000-4-2 (Contact)  
IECꢀ61000-4-2ꢀ(Air)  
Ω
±15  
±20  
kꢀ  
kꢀ  
pF  
ReverseꢀBias=0V;ꢀf=1MHz  
±.5  
Noteꢀ1:ꢀParameterꢀisꢀguaranteedꢀbyꢀdesignꢀand/orꢀdeviceꢀcharacterization.  
Noteꢀ2:Testꢀequipmentꢀaccuracyꢀ±50fF.  
Noteꢀ3:TransmissionꢀLineꢀPulseꢀ(TLP)ꢀwithꢀ100nsꢀwidth,ꢀ2nsꢀriseꢀtime,ꢀandꢀaverageꢀwindowꢀt1=70nsꢀtoꢀt2=ꢀ90ns  
8/20μS PulseWaveform  
Capacitance vs. Reverse Bias  
110%  
100%  
90%  
80%  
70%  
60%  
50%  
40%  
30%  
20%  
10%  
0%  
10.0  
9.0  
8.0  
7.0  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
0.0  
5.0  
10.0  
15.0  
20.0  
25.0  
30.0  
0
5
10 15 20 25 30 35 40 45 50 55 60  
Bias Voltage (V)  
Time (μs)  
©2016 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revision: 11/09/16  
TVS Diode Arrays (SPA®Diodes)  
General Purpose ESD Protection - SP1064 Series  
Transmission Line Pulsing (TLP) Plot  
16  
14  
12  
10  
8
6
4
2
0
0
20  
40  
60  
80  
100  
120  
140  
TLP Voltage (V)  
Soldering Parameters  
ReflowꢀCondition  
Pbꢀ–ꢀFreeꢀassembly  
tP  
TP  
Critical Zone  
TL to TP  
-Temperature Min (Ts(min)  
)
150°C  
Ramp-up  
TL  
TS(max)  
PreꢀHeat -Temperature Max (Ts(max)  
)
200°C  
tL  
-Time (min to max) (ts)  
60 – 1±0 secs  
Ramp-down  
Preheat  
Averageꢀrampꢀupꢀrateꢀ(Liquidus)ꢀTempꢀ(TL)  
to peak  
3°C/secondꢀmax  
TS(min)  
tS  
TS(max) toTLꢀ-ꢀRamp-upꢀRate  
3°C/secondꢀmax  
217°Cꢀ  
25  
-Temperature (TL) (Liquidus)  
Reflow  
time to peak temperature  
Time  
-Temperature (tL)  
60 – 150 seconds  
260+0/-5 °C  
PeakTemperature (TP)  
Time within 5°C of actual peak  
Temperature (tp)  
20 – 40 seconds  
Product Characteristics  
Ramp-downꢀRate  
6°C/second max  
± minutes Max.  
260°C  
Lead Plating  
Tin  
Time 25°C to peakTemperature (TP)  
Do not exceed  
Lead Material  
Lead Coplanarity  
Substrate material  
Body Material  
Flammability  
MSL Rating  
CopperꢀAlloy  
0.004 inches(0.102mm)  
Silicon  
Molded Epoxy  
UL 94 ꢀ-0  
Level 1  
Notesꢀ:ꢀ  
1.ꢀꢀAllꢀdimensionsꢀareꢀinꢀmillimeters  
2. Dimensions include solder plating.  
3.ꢀꢀDimensionsꢀareꢀexclusiveꢀofꢀmoldꢀflashꢀ&ꢀmetalꢀburr.  
4.ꢀꢀBloꢀisꢀfacingꢀupꢀforꢀmoldꢀandꢀfacingꢀdownꢀforꢀtrim/form,ꢀi.e.ꢀreverseꢀtrim/form.  
5.ꢀꢀPackageꢀsurfaceꢀmatteꢀfinishꢀVDIꢀ11-13.  
©2016 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revision: 11/09/16  
TVS Diode Arrays (SPA®Diodes)  
General Purpose ESD Protection - SP1064 Series  
Ordering Information  
PartꢀNumber  
Package  
µDFN-10  
Marking  
aT4  
Min. Order Qty.  
SP1064-04UTG  
3000  
Part Numbering System  
Part Marking System  
a
SP 1064 04 U T G  
T 4  
TVS Diode Arrays  
Product Series  
a = SP1064  
Number of  
Channels  
®
(SPA Diodes)  
G= Green  
Assembly Site  
T= Tape & Reel  
Series  
Package  
µDFN-10 (2.5x1.0mm)  
Number of  
Channels  
-04 = 4 Channel  
Package Dimensions — µDFN-10 (2.5x1.0x0.5mm)  
Package  
JEDEC  
µDFN-10ꢀ(2.5x1.0x0.5mm)  
D
b2  
BB  
10  
5
6
1
MO-229  
R
Millimeters  
Inches  
Symbol  
Min  
Max  
Min  
Max  
b1  
b
e
A
A1  
A2  
b
0.45  
0.00  
0.10  
0.15  
0.35  
0.55  
0.05  
0.20  
0.25  
0.45  
0.01±  
0.000  
0.004  
0.006  
0.014  
0.022  
0.002  
0.00±  
0.010  
0.01±  
PIN1  
Top View  
Side View  
Bottom View  
b1  
b2  
D
BB Detail  
0.25ꢀREFꢀ(Optional) 0.010ꢀREFꢀ(Optional)  
2.40  
0.90  
0.30  
2.60  
1.10  
0.45  
0.09±  
0.037ꢀ  
0.012  
0.106  
0.045  
0.01±  
E
L
2.25mm  
e
0.50ꢀBSC  
0.020ꢀꢀBSC  
0.25mm  
0.40mm  
R
0.05  
0.15  
0.002  
0.006  
0.50mm 0.50mm 0.50mm 0.50mm  
Recommended Soldering Layout  
©2016 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revision: 11/09/16  
TVS Diode Arrays (SPA®Diodes)  
General Purpose ESD Protection - SP1064 Series  
Embossed CarrierTape & Reel Specification — µDFN-10  
P0  
Package  
Symbol  
µDFN-10ꢀ(2.5x1.0x0.5mm)  
P1  
P2  
User Feeding Direction  
T
D0  
Millimeters  
A0  
B0  
D0  
D1  
E
1.30ꢀ+/-ꢀꢀ0.10  
2.83ꢀ+/-ꢀ0.10  
Ø 1.50 + 0.10  
Ø 1.00 + 0.25  
1.75ꢀ+/-ꢀ0.10  
F
3.50ꢀ+/-ꢀ0.05  
0.65 +/- 0.10  
4.00 +/- 0.10  
4.00 +/- 0.10  
2.00 +/- 0.05  
0.254 +/- 0.02  
8.00ꢀ+ꢀ0.30ꢀ/-ꢀ0.10  
K0  
P0  
P1  
P2  
T
5º Max  
D1  
A0  
Pin 1 Location  
W
5º Max  
©2016 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revision: 11/09/16  

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