SMF30A [LITTELFUSE]
Transient Voltage Suppression Diodes; 瞬态电压抑制二极管
| 型号： | SMF30A |
| 厂家： | 
LITTELFUSE |
| 描述： | Transient Voltage Suppression Diodes |
| 文件： | 总6页 (文件大小：1365K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TransientVoltage Suppression Diodes
Surface Mount – 200W > SMF Series
RoHS
SMF Series
™
TVS Diode Arrays (SPA Family of Products)
Description
The SMF series is designed specifically to protect sensitive
electronic equipment from voltage transients induced by
lightning and other transient voltage events.
SMF package is 50% smaller in footprint when compare
to SMA package and deliverying one of the lowest height
profiles (1.1mm) in the industry.
Features
Maximum Ratings andThermal Characteristics
(TA=25OC unless otherwise noted)
•Compatible with
industrial standard
package SOD-123
• For surface mounted
applications to optimize
board space
• EFT protection of data
lines in accordance with
IEC 61000-4-4 (IEC801-4)
• Low inductance, excellent
clamping capability
• 200W peak pulsepower
capability at 10 x 1000µs
waveform, repetition rate
(duty cycle): 0.01%
• Fast response time:
typically less than 1.0ns
from 0 Volts to VBR min
• High temperature
soldering: 260°C/40
seconds at terminals
• Glass passivated junction
• Built-in strain relief
Parameter
Symbol
PPPM
Value
200
Unit
W
Peak Pulse Power Dissipation at
TA=25ºC by 10x1000µs (Note 1)
Thermal Resistance Junction- to-
Ambient
RTHJ-A
RTHJ-L
220
100
°C/W
°C/W
°C
• Low profile: maximum
height of 1.1mm.
Thermal Resistance Junction- to-
Lead
•Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
Operating and StorageTemperature
Range
TJ,TSTG -55 to 150
Notes:
1. Non-repetitive current pulse, per Fig. 4 and derated aboveTA=25ºC per Fig. 3.
15kV(Air), 8kV (Contact)
• Matte tin lead–free plated
• Halogen-free and RoHS
compliant
• ESD protection of data
lines in accordance with
IEC 61000-4-2 (IEC801-2)
Applications
SMF devices are ideal for the protection of I/O interfaces,
CC bus and other vulnerable circuit used in cellular phones,
V
portable devices, business machines, power supplies and
other consumer applications.
©2012 Littelfuse, Inc.
SMF Series
9
Specifications are subject to change without notice.
Please refer to http://www.Littelfuse.com/series/SMF.html for current information.
Revised: July 17, 2012
TransientVoltage Suppression Diodes
Surface Mount – 200W > SMF Series
Electrical Characteristics (TA=25°C unless otherwise noted)
Breakdown
Voltage VBR
(Volts) @ IT
Test
Current
IT
Maximum
Reverse
Maximum
Peak Pulse
Maximum
Clamping
Voltage @Ipp
VC (V)
Part
Number
Reverse
Stand off
Voltage VR (V)
Marking
Code
Leakage @ VR Current Ipp
IR (µA)
(A)
(mA)
MIN
MAX
SMF5.0A
SMF6.0A
SMF6.5A
SMF7.0A
SMF7.5A
SMF8.0A
SMF8.5A
SMF9.0A
SMF10A
SMF11A
SMF12A
SMF13A
SMF14A
SMF15A
SMF16A
SMF17A
SMF18A
SMF20A
SMF22A
SMF24A
SMF26A
SMF28A
SMF30A
SMF33A
SMF36A
SMF40A
SMF43A
SMF45A
SMF48A
SMF51A
SMF54A
AE
AG
AK
AM
AP
AR
AT
6.4
7. 0
10
10
10
10
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
5.0
6.0
6.5
7.0
7.5
8.0
8.5
9.0
10
400
400
250
100
50
25
10
5
21.7
19.4
17. 9
16.7
15.5
14.7
13.9
13
9.2
10.3
11.2
12
12.9
13.6
14.4
15.4
17
18.2
19.9
21.5
23.2
24.4
26
27.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
53.3
58.1
64.5
69.4
72.7
77.4
82.4
87.1
6.67
7.22
7.78
8.33
8.89
9.44
10.0
11.1
12.2
13.3
14.4
15.6
16.7
17. 8
18.9
20.0
22.2
24.4
26.7
28.9
31.1
33.3
36.7
40.0
44.4
47.8
50.0
53.3
56.7
60.0
7.37
7.98
8.6
9.21
9.83
10.4
11.1
12.3
13.5
14.7
15.9
17. 2
18.5
19.7
20.9
22.1
24.5
26.9
29.5
31.9
34.4
36.8
40.6
44.2
49.1
52.8
55.3
58.9
62.7
66.3
AV
AX
AZ
BE
BG
BK
BM
BP
BR
BT
BV
BX
BZ
CE
CG
CK
CM
CP
CR
CT
CV
CX
CZ
DE
2.5
2.5
2.5
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
11.8
11
11
12
13
14
15
16
17
10.1
9.3
8.6
8.2
7. 7
7. 2
18
20
22
24
26
28
30
33
36
40
43
45
48
51
54
6.8
6.2
5.6
5.1
4.8
4.4
4.1
3.8
3.4
3.1
2.9
2.8
2.6
2.4
2.3
Notes:
1. VBR measured after IT applied for 300µs, IT = sequare wave pulse or equivalent.
2. Surge current waveform per 10 x 1000µs exponential wave and derated per Fig.2.
3. All terms and symbols are consistent with ANSI/IEEE C62.35.
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
SMF Series
10
Revised: July 17, 2012
Please refer to http://www.Littelfuse.com/series/SMF.html for current information.
TransientVoltage Suppression Diodes
Surface Mount – 200W > SMF Series
I-V Curve Characteristics
TVS Diode Arrays (SPA Family of Products)
Uni-directional
Vc VBR
VR
V
IR
IT
VF
Ipp
PPPM Peak Pulse Power Dissipation -- Max power dissipation
VR Stand-off Voltage -- Maximum voltage that can be applied to theTVS without operation
VBR Breakdown Voltage -- Maximum current that flows though theTVS at a specified test current (IT)
VC Clamping Voltage -- Peak voltage measured across the suppressor at a specified Ippm (peak impulse current)
IR Reverse Leakage Current -- Current measured at VR
VF Forward Voltage Drop for Uni-directional
Ratings and Characteristic Curves (TA=25°C unless otherwise noted)
Figure 1 -TVSTransients ClampingWaveform
Figure 2 - Peak Pulse Power Rating Curve
Voltage Transients
10
Voltage Across TVS
Current Through TVS
1
0.1
0.000001
0.00001
0.0001
0.001
td-Pulse Width (sec.)
Time
continues on next page.
©2012 Littelfuse, Inc.
SMF Series
11
Revised: July 17, 2012
Specifications are subject to change without notice.
Please refer to http://www.Littelfuse.com/series/SMF.html for current information.
TransientVoltage Suppression Diodes
Surface Mount – 200W > SMF Series
Ratings and Characteristic Curves (TA=25°C unless otherwise noted) (Continued)
™
TVS Diode Arrays (SPA Family of Products)
Figure 3 - Pulse Derating Curve
Figure 4 - PulseWaveform - 10x1000µS
100
80
60
40
20
0
150
t =10µsec
T
=25°C
r
J
Pulse Width(td) is defined
as the point where the peak
current decays to 50% of I
PPM
Peak Value
I
100
PPM
Half Value
I
PPM
I
PPM
( )
2
50
0
10/1000µsec. Waveform
as defined by R.E.A
t
d
0
25
50
75
100
125
150
175
1.0
2.0
3.0
4.0
0
TA-Ambient temperature (ºC)
t-Time (ms)
Figure 5 - Steady State Power Dissipation
Derating Curve
Figure 6 - ForwardVoltage
1.2
1
1.50
1.25
1.00
0.75
0.50
0.8
0.6
0.4
0.2
0
0.25
0
-55
10
75
140
0
25
50
75
100 125 150 175
Temperature (ºC)
TL - Tab temperature (ºC)
Figure 7 - Cj vs.Working Peak ReverseVoltage
10000
1000
Measured@Vr=0v
Measured@50%Vr
100
10
1
10
br - Reverse breakdown voltage
100
V
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
SMF Series
12
Revised: July 17, 2012
Please refer to http://www.Littelfuse.com/series/SMF.html for current information.
TransientVoltage Suppression Diodes
Surface Mount – 200W > SMF Series
Soldering Parameters
Reflow Condition
Lead–free assembly
tp
TP
-Temperature Min (Ts(min)
)
150°C
Ramp-up
Critical Zone
to T
T
L
P
TL
Pre Heat -Temperature Max (Ts(max)
)
200°C
tL
Ts(max)
-Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (LiquidusTemp
(TL) to peak
Ramp-down
3°C/second max
Ts(min)
ts
Preheat
TS(max) toTL - Ramp-up Rate
3°C/second max
217°C
-Temperature (TL) (Liquidus)
Reflow
25˚C
t 25˚C to Peak
Time (t)
-Time (min to max) (ts)
60 – 150 seconds
260+0/-5 °C
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
8 minutes Max.
260°C
Time 25°C to peakTemperature (TP)
Do not exceed
Physical Specifications
Environmental Specifications
SOD-123 plastic over glass passivated
junction
Temperature Cycle
Pressure Cooker
HighTemp. Storage
HTRB
JESD22-A104
JESD22-A102
JESD22-A103
JESD22-A108
JESD22-A106
Case
Polarity
Terminal
Color band denotes cathode except bipolar
Matte tin-plated leads, solderable per
JESD22-B102D
Thermal Shock
©2012 Littelfuse, Inc.
SMF Series
13
Revised: July 17, 2012
Specifications are subject to change without notice.
Please refer to http://www.Littelfuse.com/series/SMF.html for current information.
TransientVoltage Suppression Diodes
Surface Mount – 200W > SMF Series
Dimensions - SOD-123 Package
™
TVS Diode Arrays (SPA Family of Products)
Millimeters
Inches
Dimensions
Min
2.50
3.40
0.70
1.50
0.35
0.05
0.00
0.95
Max
2.90
3.90
1.20
2.00
0.90
0.26
0.10
1.10
Min
Max
A
B
C
D
E
F
0.0984
0.1339
0.0275
0.0591
0.0138
0.0020
0.0000
0.0374
0.1142
0.1535
0.0472
0.0787
0.0354
0.0102
0.0039
0.0433
F
C
D
G
H
Mounting Pad Layout
1.3 (0.051)
1.6 (0.062)
1.4 (0.055)
Part Numbering System
Part Marking System
SMF xx A
Cathode Band
Marking Code
F
L
5% VBR VOLTAGETOLERANCE
XX
YM
V
R VOLTAGE
Trace Code Marking
SERIES
Y:Year Code
M: Month Code
Packaging
Component
Package
Packaging
Option
Packaging
Specification
Part number
Quantity
SMFXXX
SOD-123
3000
Tape & Reel – 8mm/7” tape
EIA RS-481
Tape and Reel Specification
0.157
(4.0)
Cathode
0.31
(8.0)
0.157
(4.0)
0.059
(1.5)
Cover tape
DIA
7.0 (178)
Dimensions are in inches
(and millimeters).
0.80 (20.2)
Arbor Hole Dia.
Direction of Feed
0.33
(8.5)
©2012 Littelfuse, Inc.
SMF Series
14
Specifications are subject to change without notice.
Please refer to http://www.Littelfuse.com/series/SMF.html for current information.
Revised: July 17, 2012
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