SACB6.0 [LITTELFUSE]

Transient Voltage Suppression Diodes; 瞬态电压抑制二极管
SACB6.0
型号: SACB6.0
厂家: LITTELFUSE    LITTELFUSE
描述:

Transient Voltage Suppression Diodes
瞬态电压抑制二极管

瞬态抑制器 二极管
文件: 总4页 (文件大小:176K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TransientVoltage Suppression Diodes  
Surface Mount – 500W > SACB series  
RoHS  
SACB Series  
Description  
SACB series is designed specifically to protect sensitive  
electronic equipment from voltage transients induced by  
lightning and other transient voltage events.  
Features  
tꢀ)BMPHFOꢁ'SFF  
tꢀ 3P)4ꢀDPNQMJBOU  
tꢀ 'PSꢀTVSGBDFꢀNPVOUFEꢀ  
applications in order to  
optimize board space  
tꢀ 'BTUꢀSFTQPOTFꢀUJNFꢄꢀ  
typically less than 1.0ps  
from 0V to BV min  
tꢀ &YDFMMFOUꢀDMBNQJOHꢀ  
capability  
Agency Approvals  
tꢀ -PXꢀJODSFNFOUBMꢀTVSHFꢀ  
resistance  
tꢀ -PXꢀQSPmMFꢀQBDLBHF  
tꢀ #VJMUꢁJOꢀTUSBJOꢀSFMJFG  
tꢀ 5ZQJDBMꢀNBYJNVNꢀ  
temperature coefficient  
ΔVBR = 0.1% x VBR@25°C x ΔT  
AGENCY  
AGENCY FILE NUMBER  
E230531  
tꢀ )JHI5FNQFSBUVSFꢀ  
soldering guaranteed:  
260°C/40 seconds at  
terminals  
tꢀ 1MBTUJDꢀQBDLBHFꢀIBTꢀ  
Underwriters Laboratory  
Flammability 94V-O  
tꢀ (MBTTꢀQBTTJWBUFEꢀDIJQꢀ  
junction  
tꢀ ꢂꢃꢃ8ꢀQFBLꢀQVMTFꢀQPXFSꢀ  
capability at 10×1000μs  
waveform, repetition rate  
(duty cycles):0.01%  
Maximum Ratings andThermal Characteristics  
(TA=25OC unless otherwise noted)  
tꢀ .BUUF5JOꢀ-FBEoGSFFꢀ1MBUFE  
Parameter  
Symbol  
PPPM  
Value  
500  
Unit  
W
Peak pulse power dissipation at  
ta=25OC by 10×1000μs waveform  
(fig.1)( Note 1)  
Power dissipation on infinite heat  
PM(AV)  
IPPM  
3.0  
W
Applications  
sink atTL=50ºC  
Peak Pulse Power Dissipation at  
Ta=25ºC by 10×1000μs waveform  
(Fig. 3) (Note 1)  
See  
Table 1  
TVS devices are ideal for the protection of I/O Interfaces,  
CC bus and other vulnerable circuits used inTelecom,  
Amps  
V
Operating Junction and Storage  
Temperature Range  
Computer, Industrial and Consumer electronic applications.  
T , TSTG -65 to 150  
°C  
J
TypicalThermal Resistance Junction  
to Lead  
TypicalThermal Resistance Junction  
to Ambient  
RuJL  
RuJA  
30  
°C/W  
°C/W  
120  
Note:  
1. Non-repetitive current pulse , per Fig. 3 and derated aboveTA = 25OC per Fig. 2.  
©2009 Littelfuse, Inc.  
19  
Revision: January 09, 2009  
SACB Series  
Specifications are subject to change without notice.  
Please refer to http://www.Littelfuse.com/series/SACB.html for current information.  
TransientVoltage Suppression Diodes  
Surface Mount – 500W > SACB series  
Electrical Characteristics  
Maximum  
Peak  
Pulse  
Current  
per (Fig.3)  
IPP(A)  
Inverse  
Blocking  
Leakage  
Current at  
VWIB@ IIB  
(mA)  
Maximum  
Clamping  
Voltage at  
IPP=5.0A  
Minimum  
Breakdown  
Voltage at  
IT =1.0MA  
Maximum  
Reverse  
Leakage  
at VR IR  
Maximum Working  
Junction Inverse  
Capacitance Blocking  
Stand-Off  
Voltage  
(Note1) VR  
Peak Inverse  
Blocking  
Voltage VPIB Recognition  
(V)  
Part  
Marking  
UL  
Number Code  
at  
Voltage  
(V)  
(μA)  
0 Volts (pF)  
VWIB(V)  
VBR(V)  
VC(V)  
SACB5.0  
SACB6.0  
SACB7.0  
SACB8.0  
SACB8.5  
SACB10  
SACB12  
SACB15  
SACB18  
SACB22  
SACB26  
SACB30  
SACB36  
SACB45  
SACB50  
SKE  
SKG  
SKM  
SKR  
SKT  
SKX  
SLE  
SLM  
SLT  
5.0  
6.0  
7.0  
8.0  
8.5  
10.0  
12.0  
15.0  
18.0  
22.0  
26.0  
30.0  
36.0  
45.0  
50.0  
7.60  
7.90  
8.33  
8.89  
9.44  
11.10  
13.30  
16.70  
20.00  
24.40  
28.90  
33.30  
40.00  
50.00  
55.50  
300  
300  
300  
100  
50  
5
5
5
5
5
10.0  
11.2  
44.0  
41.0  
38.0  
36.0  
34.0  
29.0  
25.0  
20.0  
15.0  
14.0  
11.1  
10.0  
8.6  
45  
45  
45  
45  
45  
45  
45  
45  
45  
45  
45  
45  
45  
45  
45  
75  
75  
75  
75  
75  
75  
75  
75  
75  
75  
75  
75  
75  
150  
150  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
200  
200  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
12.6  
13.4  
14.0  
16.3  
19.0  
23.6  
28.8  
35.4  
42.3  
48.6  
60.0  
77.0  
88.0  
SLX  
SME  
SMK  
SMP  
SMV  
SMZ  
5
5
5
5
6.8  
5.8  
5
Ratings and Characteristic Curves A=25°Cunlessotherwisenoted)  
Figure 1 - Peak Pulse Power Rating Curve  
Figure 2 - Pulse Derating Curve  
100  
100  
Average Power  
30  
Non-repetitive Pulse  
Waveform shown in Fig. 3  
75  
T
=25°C  
A
10  
Peak Power  
(Single Pulse)  
50  
Impulse  
Exponential  
Decay  
PPK".5"  
td  
td  
1
25  
Half Sine  
PPK  
td=7tp  
Square  
PPK  
td  
Current Waveforms  
0
0.1  
0.1s  
1.0s  
10s  
100s  
1.0ms  
10ms  
0
25  
50  
75  
100  
125  
150  
t
- Pulse Width (sec.)  
TL - LeadTemperature (ºC)  
d
Figure 3 - PulseWaveform  
Figure 4 - AC Line Protection Application  
150  
t =10μsec  
r
T
=25°C  
J
Pulse Width(td) is defined  
as the point where the peak  
current decays to 50% of I  
PPM  
Peak Value  
I
100  
PPM  
Half Value  
I
PPM  
2
I
PPM  
( )  
50  
10/1000μsec. Waveform  
as defined by R.E.A  
Low Capacitance  
Application Note: Device must be used with two  
units in parallel, opposite in polarity as shown in  
circuit for AC signal line protection.  
t
d
0
1.0  
2.0  
t-Time (ms)  
3.0  
4.0  
0
©2009 Littelfuse, Inc.  
20  
SACB Series  
Specifications are subject to change without notice.  
Please refer to http://www.Littelfuse.com/series/SACB.html for current information.  
Revision: January 09, 2009  
TransientVoltage Suppression Diodes  
Surface Mount – 500W > SACB series  
Soldering Parameters  
Reflow Condition  
-FBEoGSFFꢀBTTFNCMZ  
tp  
TP  
Ramp-up  
Critical Zone  
to T  
-Temperature Min (Ts(min)  
)
150°C  
T
L
P
TL  
tL  
Pre Heat -Temperature Max (Ts(max)  
)
200°C  
Ts(max)  
-Time (min to max) (ts)  
ꢅꢃꢀoꢀꢆꢇꢃꢀTFDT  
Ramp-down  
Average ramp up rate (LiquidusTemp  
(TL) to peak  
Ts(min)  
3°C/second max  
ts  
Preheat  
TS(max) toTL - Ramp-up Rate  
3°C/second max  
25˚C  
-Temperature (TL) (Liquidus)  
Reflow  
217°C  
t 25˚C to Peak  
Time (t)  
-Time (min to max) (ts)  
ꢅꢃꢀoꢀꢆꢂꢃꢀTFDPOET  
PeakTemperature (TP)  
260+0/-5 °C  
Time within 5°C of actual peak  
Temperature (tp)  
Flow/Wave Soldering (Solder Dipping)  
ꢈꢃꢀoꢀꢉꢃꢀTFDPOET  
PeakTemperature :  
DippingTime :  
Soldering :  
265OC  
Ramp-down Rate  
6°C/second max  
8 minutes Max.  
280°C  
10 seconds  
1 time  
Time 25°C to peakTemperature (TP)  
Do not exceed  
Physical Specifications  
Environmental Specifications  
Weight  
Case  
0.003oz., 0.093g  
Temperature Cycle  
Pressure Cooker  
HighTemp. Storage  
HTRB  
JESD22-A104  
JEDEC DO-214AA molded plastic body  
over glass passivated junction.  
JESD 22-A102  
JESD22-A103  
JESD22-A108  
JESD22-A106  
Color band denotes cathode except  
Bidirectional  
Polarity  
MatteTin-plated leads. Solderable per  
JESD22-B102D.  
Terminal  
Thermal Shock  
Dimensions  
DO-214AA (SMB J-Bend)  
Inches  
Millimeters  
Min Max  
Dimensions  
Min  
Max  
Cathode Band  
A
B
C
D
E
F
0.077  
0.160  
0.130  
0.084  
0.030  
-
0.086  
0.180  
0.155  
0.096  
0.060  
0.008  
0.220  
0.012  
1.950  
4.060  
3.300  
2.130  
0.760  
-
2.200  
4.570  
3.940  
2.440  
1.520  
0.203  
5.590  
0.305  
C
A
B
H
G
H
0.205  
0.006  
5.210  
0.152  
D
F
E
G
©2009 Littelfuse, Inc.  
21  
SACB Series  
Specifications are subject to change without notice.  
Please refer to http://www.Littelfuse.com/series/SACB.html for current information.  
Revision: January 09, 2009  
TransientVoltage Suppression Diodes  
Surface Mount – 500W > SACB series  
Part Numbering System  
Part Marking System  
Cathode Band  
SACB XX  
Series Type  
Stand Off Voltage  
F
Littelfuse Logo  
Product Type  
Packaging  
Component  
Package  
Packaging  
Option  
Part number  
Quantity  
Packaging Specification  
SACBXX  
DO-214AA  
3000  
5BQFꢀꢊꢀ3FFMꢀoꢀꢆꢈNNꢋꢆꢌwꢀUBQF  
EIA STD RS-481  
Schematic  
Transient  
Voltage  
Suppressor  
Diode  
©2009 Littelfuse, Inc.  
22  
SACB Series  
Specifications are subject to change without notice.  
Please refer to http://www.Littelfuse.com/series/SACB.html for current information.  
Revision: January 09, 2009  

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