PMT3(310)25004 [LITTELFUSE]
Surge Protection Circuit, CXSS3, ROHS COMPLIANT, CERAMIC, PACKAGE-3;
| 型号： | PMT3(310)25004 |
| 厂家： | 
LITTELFUSE |
| 描述： | Surge Protection Circuit, CXSS3, ROHS COMPLIANT, CERAMIC, PACKAGE-3 电信 电信集成电路 |
| 文件： | 总3页 (文件大小：121K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Gas DischargeTube (GDT) Products
PMT3(310) Series
PMT3(310) Series
®
Description
Littelfuse three electrode PMT3(310) series GDTs are
designed primarily to protect telecommunications
equipment requiring simultaneous crowbar action
of two signal lines. GDTs function as switches;
dissipating a minimum amount of energy and can
handle much higher currents than other types of
transient voltage protection.
Features
• Rugged ceramic-metal
construction
• Available with or
without leads
Agency Approvals
• Low capacitance (<1.5
pF)
• Available with various
lead spacings
AGENCY
AGENCY FILE NUMBER
• Available with or
without fail-safe clip
•Tested to REA PE-80
®
E128662
Applications
3 Electrode GDT Graphical Symbol
• Telephone interface
• Telephone line cards
• Repeaters
• Modems
• Line test equipment
a =TIP
b = RING
e = GROUND
a
b
(center electrode)
e
Electrical Characteristics
Device Specifications
Life Ratings
Max
Single
Surge
8/20
Max
Single
Surge 10/1000
Surge
Life
DC Breakdown
(I-g)
@500V/μs
DC
DC
AC
Current
AC
Current
Surge
Current
Insulation
Capaci-
tance
(@1Mhz)
Part Number
Voltage Voltage
100 V/
ꢀSec.
Resistance
1kV/
ꢀSec.
11 cycles @ 50Hz 1Sec. 8/20ꢀSec
10/350
ꢀSec
50-60Hz1
x101
x101
ꢀSec1
ꢀSec1
x 4001
Min Typ Max
Min
ꢀꢁꢀꢁꢂȍ
ꢃDWꢂꢄꢁ9ꢅ
PMT3(310)090 72 90 108
500
650
PMT3(310)150 120 150 180
PMT3(310)230 184 230 276
PMT3(310)250 200 250 300
PMT3(310)350 280 350 420
PMT3(310)400 320 400 480
PMT3(310)500 400 500 600
500
600
600
900
900
1100
600
700
1.5 pf
130Amps
20Amps
20kA
25kA
5kA
1kA
ꢀꢁꢀꢁꢂȍ
ꢃDWꢂꢀꢁꢁ9ꢅ
700
1000
1000
1200
NOTES:
1. Total current through center electrode, tested in accordance with ITU-T Rec K.12 and REA PE 80
End of life DC: 50% of minimum initial DC breakdown voltage to 150% of maximum initial DC breakdown voltage limit.
Impulse: less than 150% of initial impulse breakdown down limit.
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
23
PMT3(310) Series
Revised: June 28, 2010
Customer should verify actual device performance in their specific applications.
Gas DischargeTube (GDT) Products
PMT3(310) Series
Product Characteristics
Storage and Operational
Temperature
DullTin Plate 17.5 12.5 Microns
with Ceramic Insulator
-40 to +90°C
Materials
TransverseVoltage (DelayTime)
Tested to ITU-T Rec. K.12
Littelfuse ‘LF’ marking, Voltage and
date code.
< 0.2μSec
Product Marking
ArcVoltage
~ 10 to 35 Volts
Glow to arc
transition current
~ 1Amp
HoldoverVoltage
Tested to ITU-T Rec. K.12 & REA PE 80
< 150mS
GlowVoltage
~ 60-200 Volts
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
tP
Reflow Condition
-Temperature Min (Ts(min)
Pb – Free assembly
TP
Critical Zone
Ramp-up
TL to TP
)
150°C
TL
TS(max)
Pre Heat -Temperature Max (Ts(max)
-Time (Min to Max) (ts)
)
200°C
tL
60 – 180 secs
Ramp-down
Average ramp up rate (LiquidusTemp
(TL) to peak
Preheat
3°C/second max
TS(min)
tS
TS(max) toTL - Ramp-up Rate
5°C/second max
217°C
-Temperature (TL) (Liquidus)
Reflow
25
time to peak temperature
(t 25ºC to peak)
-Temperature (tL)
60 – 150 seconds
260+0/-5 °C
Time
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
10 – 30 seconds
Soldering Parameters - Hand Soldering
Ramp-down Rate
6°C/second max
8 minutes Max.
260°C
Solder IronTemperature: 350° C +/- 5°C
HeatingTime: 5 seconds max.
Time 25°C to peakTemperature (TP)
Do not exceed
Soldering Parameters -Wave Soldering (Thru-Hole Devices)
Recommended Process Parameters:
300
280
260
240
220
200
180
160
140
120
100
80
Wave Parameter
Lead-Free Recommendation
Preheat:
(Typical Industry Recommendation)
(Depends on Flux ActivationTemperature)
Temperature Minimum:
Temperature Maximum:
PreheatTime:
100° C
150° C
60-180 seconds
Solder PotTemperature:
Solder DwellTime:
280° C Maximum
2-5 seconds
60
40
20
0
Note: Surge Arrestors with a Failsafe mechanism should be
individually examined after soldering
Time (Seconds)
Preheat Time
Cooling Time
Dwell Time
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
24
Revised: June 28, 2010
PMT3(310) Series
Customer should verify actual device performance in their specific applications.
Gas DischargeTube (GDT) Products
PMT3(310) Series
Packaging
Device Dimensions
NOTE: Failsafe option dimensions shown in green.
DeviceType
Description
Quantity
Type 01 - Surface Mount Core
Mounting Area
9.0
[0.354]
Type 01
Type 04
Type 06
Type 14
100pcs/tray x 5 trays per carton
100pcs/tray x 5 trays per carton
100pcs/tray x 5 trays per carton
50pcs/tray x 5 trays per carton
500
500
500
250
11.8
[0.464]
10.10
[0.398]
8.1
[0.319]
0.3mm
Minimum
Gap
9.9
[0.354]
Part Numbering System
PMT3(310) XXX XX X
Type 04 - Shaped Radial Leads
Series
PMT3(310)
12.4
1
[0.488 0.039]
Mounting Area
9.0
[0.354]
11.8
[0.464]
Breakdown Voltage
10.10
[0.398]
090 = 90V
8.1.
[0.319]
150 = 150V
230 = 230V
250 = 250V
350 = 350V
400 = 400V
500 = 500V
0.3mm
Minimum
Gap
9.9
[0.354]
15
[0.590]
Device Type
See Dimensions section:
01 = Type 01
04 = Type 04
16.8
[0.661]
1.0 DIA.
[0.039]
4.4
[0.173]
06 = Type 06
14 = Type 14
Packaging Option Code
Blank = No Failsafe
4.4 0.3
[0.173 0.12]
4.4 0.3
[0.173 0.12]
F = With Failsafe
Type 06 - Straight Radial Leads
14.7
[0.579]
Mounting Area
9.0
[0.354]
11.8
[0.464]
10.10
[0.398]
8.1 DIA. MAX.
[0.319]
0.3mm
Minimum
Gap
9.9
[0.354]
15
[0.590]
1.0 DIA.
[0.039]
16.8
[0.661]
6.35 0.5
[0.25 0.25]
6.35 0.5
[0.25 0.25]
Type 14 - Straight "T" Leads
50
3
[1.968 0.118 ]
Mounting Area
9.0
[0.354]
11.8
[0.464]
10.10
[0.398]
8.1 DIA. MAX.
[0.319]
0.3mm
Minimum
Gap
23.8
[0.937]
22
[0.866]
1.0 DIA.
[0.039]
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
25
PMT3(310) Series
Revised: June 28, 2010
Customer should verify actual device performance in their specific applications.
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