P0900Q22CLRP [LITTELFUSE]
Q2L Series (C-Rated) SIDACtor㈢ Device; Q2L系列（ C-额定） SIDACtor㈢设备
| 型号： | P0900Q22CLRP |
| 厂家： | 
LITTELFUSE |
| 描述： | Q2L Series (C-Rated) SIDACtor㈢ Device |
| 文件： | 总4页 (文件大小：446K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
®
Teccor brand Protection Thyristors
Surface Mount
Q2L Series (C-Rated) SIDACtor® Device
Description
The Q2L SIDACtor series provides bidirectional transient
voltage protection in a low profile, chip scale package (CSP).
The small package QFN (Quad Flatpak No-Lead) is ideal for
dense board applications such as DSLAMs, T1/E1/J1 cards,
and other telecommunication equipment.
Features
• RoHS compliant
• Chip Scale Package (CSP) sizing
• Wide range of IPP ratings including:
500A for 2x10μs GR 1089 waveform
200A for 5x310/10x700μs ITU/YDT waveform
100A for 10x1000μs GR 1089 waveform
150A for 10x560μs TIA-968-A
Agency Approvals
AGENCY
AGENCY FILE NUMBER
E133083
• Bidirectional transient voltage protection
• Small footprint (QFN)
• Teccor brand SIDACtor technology
Protection solution to meet
• YD/T 950
• YD/T 993
• YD/T 1082
• GR 1089
• IEC 61000-4-5
• ITU K.20/21
• TIA-968-A
Electrical Characteristics
VDRM
@ldrm=5µA
VS
VT
Capacitance
@1MHz, 2V bias
IH
IS
IT
@100V/µs
@IT=1 amp
Part Number
Marking
Volts
Min
6
Volts
Max
25
mAmps mAmps
Min
Amps
Volts
pF
Max
5
Min
35
25
55
50
45
45
40
35
35
30
30
30
25
Max
75
45
85
75
70
70
60
55
50
50
45
45
40
P0080Q22CLRP
P0300Q22CLRP
P0640Q22CLRP
P0720Q22CLRP
P0900Q22CLRP
P1100Q22CLRP
P1300Q22CLRP
P1500Q22CLRP
P1800Q22CLRP
P2300Q22CLRP
P2600Q22CLRP
P3100Q22CLRP
P3500Q22CLRP
P-8C
P03C
P06C
P07C
P09C
P11C
P13C
P15C
P18C
P23C
P26C
P31C
P35C
50
800
800
800
800
800
800
800
800
800
800
800
800
800
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
2.2
25
40
50
5
58
77
150
150
150
150
150
150
150
150
150
150
150
5
65
88
5
75
98
5
90
130
160
180
220
260
300
350
400
5
120
140
170
190
220
275
320
5
5
5
5
5
5
5
• All measurements are made at an ambient temperature of 25°C. IPP applies to -40°C
through +85°C temperature range.
• Listed SIDACtor devices are bidirectional. All electrical parameters and surge ratings
apply to forward and reverse polarities.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
• VS is measured at 100 V/μs.
• Off-state capacitance is measured at 1MHz with a 2 V bias.
Q2L (C-Rated) Series
ꢀ
www.littelfuse.com
©2006 Littelfuse
Telecom Design Guide
Specifications are subject to change without notice.
®
Teccor brand Protection Thyristors
Surface Mount
Surge Ratings
Ipp
di/dt
2x10µs
Amps
Min
1.2x50µs/8x20µs
10x160µs
Amps
Min
10x560µs
Amps
Min
10x1000µs
Amps
Min
Series
Amps
Min
Amps/µs
Max
C
500
400
200
150
100
500
Thermal Considerations
Package
Symbol
Parameter
Value
Unit
QFN
TJ
Operating Junction Temperature Range
Storage Temperature Range
-40 to +150
°C
TS
-65 to +150
120
°C
PIN
1
PIN 2
RuJA
Thermal Resistance: Junction to Ambient
°C/W
tr x td Pulse Waveform
V-I Characteristics
+I
tr = rise time to peak value
td = decay time to half value
Peak
IT
100
Value
IS
IH
Waveform = tr x td
IDRM
-V
+V
50
0
Half Value
VDRM
VT
VS
tr
td
0
t – Time (µs)
-I
Normalized VS Change Versus Junction Temperature
Normalized DC Holding Current Versus Case Temperature
14
12
10
8
2.0
1.8
1.6
1.4
6
25 ˚C
1.2
25 ˚C
4
1.0
0.8
0.6
0.4
2
0
-4
-6
-8
-40 -20
0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
-40 -20
0
20 40 60 80 100 120 140 160
Junction Temperature (TJ) – ˚C
Q2L (C-Rated) Series
Specifications are subject to change without notice.
2
www.littelfuse.com
©2006 Littelfuse
Telecom Design Guide
®
Teccor brand Protection Thyristors
Surface Mount
Soldering Parameters
Liquidus
260
220
Soak Stage
190
150
0
60 to 90
120
50 to 150
Time(s)
Physical Specifications
Environmental Specifications
Operating/Storage
Terminal Material
Lead Solderability
Matte Tin-plated Copper
ANSI/J-STD-002
-40° C to ~ +150°C
Temperature
125° C, 1000 hours
Meet Spec
Passive Aging
+85°C, 85% R.H. 1000 hours
Meet Spec
Humidity Aging
Thermal Shock
Solvent Resistance
Vibration
MIL-STD-202 Method 107G
+85°C/-40°C 100 times
Meet spec
MIL-STD-202, Method 215
No Change
MIL-STD-883C, Method 2007.1,
Condition A
No Change
Dimensions
BOTTOM VIEW
TOP VIEW
Inches
Millimeters
C
E
A
J
Dimensions
Min
Typ
Max
0.134
0.134
0.083
0.019
0.096
0.043
0.008
0.012
0.012
0.071
0.053
0.103
0.090
Min
Typ
Max
3.400
3.400
2.100
0.485
2.430
1.100
0.200
0.300
0.300
1.810
1.353
2.620
2.280
2.54
(.100”)
1.50
(.059”)
A
B
0.126
0.126
0.075
0.011
0.088
0.035
0.000
0.004
0.004
0.063
0.045
0.095
0.082
0.130
0.130
0.079
0.015
0.092
0.039
0.004
0.008
0.008
0.067
0.049
0.099
0.086
3.200
3.200
1.900
0.285
2.230
0.900
0.000
0.100
0.100
1.610
1.153
2.420
2.080
3.300
3.300
2.000
0.385
2.330
1.000
0.100
0.200
0.200
1.710
1.253
2.520
2.180
B
F
1.27
(.050”)
C
Recommended
Soldering Pad Outline
(Reference Only)
H
END VIEW
SIDE VIEW
E
F
*Reference Tech Brief
(EC642) for soldering
recommendations
M1
K2
M2
N2
K1
N1
H
J
K1
K2
M1
M2
N1
N2
Q2L (C-Rated) Series
ꢁ
www.littelfuse.com
©2006 Littelfuse
Telecom Design Guide
Specifications are subject to change without notice.
®
Teccor brand Protection Thyristors
Surface Mount
Part Marking System
Part Numbering System
Pxxx0Q22CLRP
PACKING STYLE
DEVICE TYPE
P: SIDACtor
First Line: Product Name (see marking in table)
Second Line: Lot number
RP : Standard: Embossed carrier tape
and reel per EIA 481-1, 12mm tape in 13” reel,
5,000 pieces per reel
MEDIAN VOLTAGE
xxx
: xxx volts
CONSTRUCTION VARIATION
0 : Single SIDACtor chip used
as a single device
L : RoHS Compliant
SURGE Ipp Rating
C : 500AMP 2x10µs
100AMP 10x1000µs
PACKAGE TYPE
Q22 : QFN, 3.3mm x 3.3mm, two leaded package
Packaging
Package
Type
Packing
Added
Industry
Description
Embossed Carrier Reel Pack
Quantity
Suffix
Standard
QFN
5000
RP
EIA-481-1
Tape and Reel Specification
Inches
Minimum
Millimeters
Symbols
Description
C
Maximum
12.992
N/A
Minimum
Maximum
330.0
N/A
A
D
N
A
B
Reel Diameter
N/A
N/A
1.50
12.80
20.20
50.00
12.40
3.50
3.50
1.50
1.50
1.65
10.15
5.45
1.00
3.90
7.90
1.95
0.25
11.50
9.10
1
W
B
Drive Spoke Width
Arbor Hole Diameter
Drive Spoke Diameter
Hub Diameter
0.059
0.504
0.795
1.969
0.488
0.138
0.138
0.059
0.059
0.065
0.400
0.215
0.039
0.153
0.311
0.077
0.010
0.453
0.358
C
0.531
N/A
13.50
N/A
Reel Dimension
D
N
N/A
N/A
W1
A0
B0
D0
D1
E1
E2
F
Reel Inner Width at Hub
Pocket Width at bottom
Pocket Length at bottom
Feed Hole Diameter
Pocket Hole Diameter
Feed hole position 1
Feed hole position 2
Feed hole center-Pocket hole
Pocket Depth
0.567
0.146
0.146
0.063
N/A
14.40
3.70
D
0
CARRIER TAPEE
1
P
0
T
D
1
P
2
3.70
B
0
F
W
E
2
W
0
1.60
K
0
P1
N/A
A
0
COVER TAPE
0.073
0.408
0.219
0.051
0.161
0.319
0.081
0.014
0.484
0.366
1.85
Tape Dimension Items
10.35
5.55
COVER TAPE
CARRIER TAPE
END
START
K0
P0
P1
P2
T
1.30
TRAILER
LEADER
400mm MIN
Feed Hole Pitch
4.10
160mm MIN
Component Spacing
Feed hole center-Pocket hole
Carrier Tape Thickness
Embossed Carrier Tape Width
Cover Tape Width
8.10
Tape Leader and Trailer Dimensions
2.05
0.35
W
W0
12.30
9.30
Q2L (C-Rated) Series
ꢂ
www.littelfuse.com
©2006 Littelfuse
Telecom Design Guide
Specifications are subject to change without notice.
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