IXTT12N150 [LITTELFUSE]
Power Field-Effect Transistor,;![IXTT12N150](http://pdffile.icpdf.com/pdf2/p00273/img/icpdf/IXTT12N150_1636127_icpdf.jpg)
型号: | IXTT12N150 |
厂家: | ![]() |
描述: | Power Field-Effect Transistor, |
文件: | 总5页 (文件大小:175K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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High Voltage
Power MOSFET
VDSS = 1500V
ID25 = 12A
RDS(on) 2.2
IXTT12N150
IXTH12N150
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
TO-268 (IXTT)
G
Symbol
VDSS
Test Conditions
Maximum Ratings
S
TJ = 25C to 150C
TJ = 25C to 150C, RGS = 1M
1500
1500
V
V
D (Tab)
VDGR
VGSS
VGSM
Continuous
Transient
30
40
V
V
TO-247 (IXTH)
ID25
IDM
TC = 25C
TC = 25C, Pulse Width Limited by TJM
12
40
A
A
IA
EAS
TC = 25°C
TC = 25°C
6
A
G
D
D (Tab)
750
mJ
S
dv/dt
PD
IS IDM, VDD VDSS, TJ 150C
TC = 25C
5
V/ns
W
G = Gate
S = Source
D
= Drain
890
Tab = Drain
TJ
TJM
Tstg
- 55 ... +150
150
- 55 ... +150
C
C
C
TL
TSOLD
1.6mm (0.062 in.) From Case for 10s
Plastic Body for 10s
300
260
C
C
Features
Md
Mounting Torque
1.13 / 10
Nm/lb.in.
International Standard Packages
Molding Epoxies Weet UL 94 V-0
Flammability Classification
Fast Intrinsic Diode
Weight
TO-268
TO-247
4.0
6.0
g
g
Low Package Inductance
Symbol
Test Conditions
Characteristic Values
(TJ = 25C, Unless Otherwise Specified)
Min.
1500
2.5
Typ.
Max.
Advantages
BVDSS
VGS(th)
IGSS
VGS = 0V, ID = 1mA
VDS = VGS, ID = 250A
VGS = 30V, VDS = 0V
VDS = VDSS, VGS = 0V
V
V
Easy to Mount
Space Savings
High Power Density
4.5
100 nA
IDSS
25 A
500 A
Applications
TJ = 125C
High Voltage Power Supplies
Capacitor Discharge
Pulse Circuits
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
2.2
DS100425C(6/15)
© 2015 IXYS CORPORATION, All Rights Reserved
IXTT12N150
IXTH12N150
Symbol
Test Conditions
Characteristic Values
TO-268 Outline
(TJ = 25C, Unless Otherwise Specified)
Min.
Typ.
Max.
gfs
VDS = 20V, ID = 0.5 • ID25, Note 1
VGS = 0V, VDS = 25V, f = 1MHz
8
13
S
Ciss
Coss
Crss
3720
240
80
pF
pF
pF
td(on)
tr
td(off)
tf
26
16
53
14
ns
ns
ns
ns
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 2 (External)
Terminals: 1 - Gate
2,4 - Drain
3 - Source
Qg(on)
Qgs
106
17
nC
nC
nC
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
50
RthJC
RthCS
0.14 C/W
C/W
TO-247
0.21
Source-Drain Diode
Symbol
Test Conditions
Characteristic Values
(TJ = 25C, Unless Otherwise Specified)
Min.
Typ.
Max.
IS
VGS = 0V
12
A
A
V
ISM
VSD
Repetitive, Pulse Width Limited by TJM
IF = IS, VGS = 0V, Note 1
48
TO-247 Outline
1.4
trr
1.2
24.5
14.8
μs
A
IF = 6A, -di/dt = 100A/s
IRM
QRM
P
1
2
3
VR = 100V, VGS = 0V
μC
e
Note
1. Pulse test, t 300μs, duty cycle, d 2%.
Terminals: 1 - Gate
2 - Drain
3 - Source
Dim.
Millimeter
Inches
Min. Max.
Min. Max.
A
A1
A2
4.7
2.2
2.2
5.3
2.54
2.6
.185 .209
.087 .102
.059 .098
b
b1
b2
1.0
1.65
2.87
1.4
2.13
3.12
.040 .055
.065 .084
.113 .123
C
D
E
.4
.8
.016 .031
.819 .845
.610 .640
20.80 21.46
15.75 16.26
e
5.20
5.72 0.205 0.225
L
L1
19.81 20.32
4.50
.780 .800
.177
P 3.55
3.65
.140 .144
Q
5.89
6.40 0.232 0.252
R
S
4.32
6.15 BSC
5.49
.170 .216
242 BSC
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
by one or moreof the following U.S. patents: 4,860,072 5,017,508
4,881,106 5,034,796
4,835,592 4,931,844
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1 6,683,344
6,534,343
6,583,505
6,727,585
6,710,405 B2 6,759,692
6,710,463
7,005,734 B2 7,157,338B2
7,063,975 B2
6,771,478 B2 7,071,537
IXTT12N150
IXTH12N150
Fig. 1. Output Characteristics @ TJ = 25ºC
Fig. 2. Output Characteristics @ TJ = 125ºC
14
12
10
8
8
7
6
5
4
3
2
1
0
V
= 10V
7V
GS
V
= 10V
GS
6V
6V
5.5V
5V
5V
6
4
2
4V
0
0
5
10
15
20
25
30
0
5
10
15
20
25
30
VDS - Volts
VDS - Volts
Fig. 3. RDS(on) Normalized to ID = 6A Value vs.
Junction Temperature
Fig. 4. RDS(on) Normalized to ID = 6A Value vs.
Drain Current
3.4
3.0
2.6
2.2
1.8
1.4
1.0
0.6
0.2
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
V
= 10V
GS
V
= 10V
GS
T
J
= 125ºC
I
= 12A
D
I
= 6A
D
T
J
= 25ºC
-50
-25
0
25
50
75
100
125
150
0
2
4
6
8
10
12
14
TJ - Degrees Centigrade
ID - Amperes
Fig. 5. Maximum Drain Current vs.
Case Temperature
Fig. 6. Input Admittance
14
12
10
8
14
12
10
8
T
J
= 125ºC
25ºC
- 40ºC
6
6
4
4
2
2
0
0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
-50
-25
0
25
50
75
100
125
150
TC - Degrees Centigrade
VGS - Volts
© 2015 IXYS CORPORATION, All Rights Reserved
IXTT12N150
IXTH12N150
Fig. 8. Forward Voltage Drop of Intrinsic Diode
Fig. 7. Transconductance
22
20
18
16
14
12
10
8
40
35
30
25
20
15
10
5
T
J
= - 40ºC
25ºC
125ºC
T
J
= 125ºC
6
T
J
= 25ºC
0.9
4
2
0
0
0.3
0.4
0.5
0.6
0.7
0.8
1.0
0
2
4
6
8
10
12
14
VSD - Volts
ID - Amperes
Fig. 10. Capacitance
Fig. 9. Gate Charge
10
9
8
7
6
5
4
3
2
1
0
10,000
1,000
100
V
= 700V
DS
I
I
= 6A
D
G
C
iss
= 10mA
C
C
oss
rss
= 1 MHz
5
f
10
0
10
15
20
25
30
35
40
0
10
20
30
40
50
60
70
80
90
100
110
VDS - Volts
QG - NanoCoulombs
Fig. 11. Forward-Bias Safe Operating Area
Fig. 12. Maximum Transient Thermal Impedance
100
10
1
1
25µs
R
Limit
DS(on)
0.1
100µs
1ms
0.01
T
= 150ºC
= 25ºC
J
T
C
10ms
DC
Single Pulse
0.1
0.001
10
100
1,000
10,000
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS REF: T_12N150 (8M) 5-23-11
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
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IXTT170N10P
Power Field-Effect Transistor, 170A I(D), 100V, 0.009ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-268AA, TO-268, 3 PIN
LITTELFUSE
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