CG75LSLTE [LITTELFUSE]

Gas Discharge Tube (GDT) Products CG/CG2 Series; 气体放电管（ GDT ）产品CG / CG2系列


型号：	CG75LSLTE
厂家：	LITTELFUSE
描述：	Gas Discharge Tube (GDT) Products CG/CG2 Series 气体放电管（ GDT ）产品CG / CG2系列
文件：	总6页 (文件大小：214K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Gas DischargeTube (GDT) Products

CG/CG2 Series

Description

Littelfuse highly reliable CG/CG2 Series GDTs provide

a high degree of surge protection in a small size ideal

for board level circuit protection.

GDTs function as switches which dissipate a

minimum amount of energy and therefore handle

currents that far surpass other types of transient

voltage protection. Their gas-ﬁlled, rugged ceramic

metal construction make them well suited to adverse

environments.

The CG/CG2 series comes in a variety of forms

including surface mount, core, straight and shaped

leads, to serve a variety of mounting methods.

Agency Approvals

The CG Series (75-110V) is ideal for protection of test

and communication equipment and other devices

in which low voltage limits and extremely low arc

voltages are required.

AGENCY

AGENCY FILE NUMBER

E128662

E320116

The CG2 Series (145V-1000V) is ideal for protecting

equipment where higher voltage limits and holdover

voltages are necessary.

2 Electrode GDT Graphical Symbol

Features

• Rugged Ceramic-Metal

construction

• Meets REA PE-80

• Available in surface

mount, and a variety of

lead options options

• Low Capacitance

(<1.5pf)

Applications

• Communication lines

and equipment

• Instrumentation circuits

• Medical electronics

• ADSL equipment

• CATV equipment

• Test equipment

• Data lines

• Telecom SLIC

protection

• Power supplies

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com for current information.

Revised: November 10, 2009

CG/CG2 Series

Customer should verify actual device performance in their speciﬁc applications.

Gas DischargeTube (GDT) Products

CG/CG2 Series

Electrical Characteristics

Device Speciﬁcations (at 25°C)

Life Ratings

DC Breakdown

in Volts

Impulse Impulse Insulation

Nominal Nominal

Max

Capaci-

Arc

Surge

Life

Break-

down

in Volts

Break-

down In

Volts

Resistance

Impulse

Dischage Holdover Impulse

tance Voltage

Discharge Discharge Current Voltage²Discharge

(on state

(@1MHz)

(@100V/s)

(@500A

10/1000μs)

Voltage)

@1Amp

Min

(9 cycle

@50Hz)

Current

(8/20μs)

Current

(1 Application

@ 10/350μs)

(10x1sec

(@100V/μs) (@1 Kv/μsec)

@50-60Hz)

Part

Number

MIN TYP MAX

MAX

MIN

MAX

TYP

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NOTES:

1. Tested to UL1449 Third Edition

2. Reference REA PE-80, 0.2A. Tested to ITU-T Rec K.12 and REA PE 80 < 150 mSec.

3. Leaded devices = 5x[5(+) or 5 (-)] applications 20kA 8/20μSec. (75 to 600 volt devices.)

MS and Core devices = 10x[5(+) and 5(-)] applications 10kA 8/20μS (800 to 1000 volt devices.)

Product Characteristics

Glow to arc

LS, Axial:

< 0.5Amps

60-160 Volts

transition current

Device: Nickel Plated 2–5 Microns

Lead Wires:Tin Plated 17.5 12.5 Microns

Construction: Ceramic Insulator

GlowVoltage

Core:

Materials

Storage and

Operational

Temperature

Device:Tin Plated 17.5 12.5 Microns.

-40 to +90

Construction: Ceramic Insulator

MS:

Device: DullTin Plated 7–9 Microns

Construction: Ceramic Insulator

Maximum Follow 230 Volts r.m.s, 200 Amps.

On Current¹

(800V and 1000V devices tested to UL1449 3rd edition)

LF Logo, Voltage and date code; Black in

positive print

Product Marking

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com for current information.

Revised: November 10, 2009

CG/CG2 Series

Customer should verify actual device performance in their speciﬁc applications.

Gas DischargeTube (GDT) Products

CG/CG2 Series

Device Dimensions

Leaded 'L' Type Straight Axial Devices

Leaded 'LS' Type Shaped Lead Devices

PROFILE VIEW

TOP VIEW

PROFILE VIEW

TOP VIEW

6.ꢀ7 ꢀ.ꢁ

[0.239 0.012]

8.1ꢀ Max.

[0.319 DIA Max.]

ꢀ.81DIA. TYP.

[0.032]

8.1ꢀDIA. MAX.

[0.319]

8.4ꢀ ꢀ.ꢁ

[0.331 0.012]

6.ꢀ7 ꢀ.15

[0.239 0.006]

ꢀ.8ꢀ

[0.032]

0.004

8.4 ꢀ.ꢁ

[0.331 0.012]

2 Surfaces

ꢀ.4ꢀ ꢀ.ꢀꢁ

[0.0157 0.0012]

9.85 ꢀ.ꢁꢀ

[0.388 0.012]

11.15 ꢀ.ꢁꢀ

[0.439 0.012]

SOLDER PAD LAYOUT

Core Devices

9.85

[0.388]

8.6ꢀ

[0.339]

TOP VIEW

PROFILE VIEW

SEMI–PROFILE VIEW

8.1ꢀ Max.

[0.032 Max.]

6.ꢀ7 ꢀ.15

[0.239 0.0059]

1.8ꢀ

[0.071]

5.89[0.232]

11.65

[0.459]

ꢀ

8 . 1

ꢀ.47 ꢀ.1

[0.019 0.0039]

'MS' Type Devices

TOP VIEW

PROFILE VIEW

SEMI–PROFILE VIEW

8.ꢁꢀ ꢀ.1

[0.327 0.0039]

ꢀ.2

5.58 [0.220]

[0.157 0.0079]

6.ꢀ5 ꢀ.2

[0.238 0.0079]

R5.29 [R0.208]

ꢀ

ꢀ.47 ꢀ.1

[0.019 0.0039]

SOLDER PAD LAYOUT

2.29 [0.090]

8.71 [0.343]

5.89 [0.232]

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com for current information.

Revised: November 10, 2009

CG/CG2 Series

Customer should verify actual device performance in their speciﬁc applications.

Gas DischargeTube (GDT) Products

CG/CG2 Series

Soldering Parameters - Reﬂow Soldering (Surface Mount Devices)

t_P

Reﬂow Condition

-Temperature Min (T_s(min)

Pb – Free assembly

T_P

Critical Zone

_Lto T_P

Ramp-up

)

150°C

T_L

T_S(max)

Pre Heat -Temperature Max (T_s(max)

-Time (Min to Max) (t_s)

)

200°C

t_L

60 – 180 secs

Ramp-down

Average ramp up rate (LiquidusTemp

(T_L) to peak

Preheat

3°C/second max

5°C/second max

T_S(min)

t_S

T_S(max)toT_L- Ramp-up Rate

-Temperature (T_L) (Liquidus) 217°C

Reﬂow

time to peak temperature

(t 25ºC to peak)

-Temperature (t_L)

60 – 150 seconds

260^+0/-5°C

Time

PeakTemperature (T_P)

Time within 5°C of actual peak

Temperature (t_p)

10 – 30 seconds

Ramp-down Rate

6°C/second max

8 minutes Max.

260°C

Time 25°C to peakTemperature (T_P)

Do not exceed

Soldering Parameters -Wave Soldering (Thru-Hole Devices)

Recommended Process Parameters:

ꢁꢀꢀ

28ꢀ

26ꢀ

24ꢀ

22ꢀ

2ꢀꢀ

18ꢀ

16ꢀ

14ꢀ

12ꢀ

1ꢀꢀ

8ꢀ

Wave Parameter

Lead-Free Recommendation

Preheat:

(Typical Industry Recommendation)

(Depends on Flux ActivationTemperature)

Temperature Minimum:

Temperature Maximum:

PreheatTime:

100° C

150° C

60-180 seconds

Solder PotTemperature:

Solder DwellTime:

280° C Maximum

2-5 seconds

6ꢀ

4ꢀ

2ꢀ

ꢀ

Time (Seconds)

Preheat Time

Cooling Time

Dwell Time

Soldering Parameters - Hand Soldering

Solder IronTemperature: 350° C +/- 5°C

HeatingTime: 5 seconds max.

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com for current information.

ꢁꢀ

Revised: November 10, 2009

CG/CG2 Series

Customer should verify actual device performance in their speciﬁc applications.

Gas DischargeTube (GDT) Products

CG/CG2 Series

Packaging Dimensions

For 'L' Type Axial Lead Items

<1.2 Max. Lead Bend

254.0 - 356.0

[10.0 - 14.0]

<0.ꢁ Max

Direction of Feed

0.0

15]

52.4

[2.063]

22.ꢁ

[0.ꢁ9ꢁ]

6.4

[0.252]

5.0 Pitch

[0.197]

Core and 'MS' Type Items

275.0

[10.83]

10x4 0.1 = 40 0.2

[10 x 0.157 0.004 = 1.575 0.008]

100.0

[3.94]

1.75 0.1

[0.069 0.004]

0.1

1.5 DIA. MAX.

[0.059]

0.4 0.05

[0.016 0.002]

76.0

[2.99]

[0.157 0.004]

25.0

[0.98]

7.5 0.1

[0.295 0.004]

8.5 0.1

[0.335 0.004]

17.7

[0.697]

16 +0.3 / -0.1

[0.630 +0.012 / -0.004]

Direction of Feed

1.5 DIA. MAX.

[0.059]

12 0.1

[0.472 0.004]

8.6 0.1

[0.339 0.004]

For 'LS' Type Shaped Lead Items

275.0

[10.ꢁ2]

10x4 0.1 ꢀ 40 0.2

[10x.157 0.004 ꢀ 1.575 0.00ꢁ]

100.0

[3.93]

1.75 0.1

[0.069 0.004]

1.5 DIA. MAX.

[0.059]

0.1

0.5 0.05

[0.020 0.002]

[0.157 0.004]

76.0

[2.99]

25.0

[0.9ꢁ]

1.9

[0.075]

11.5 0.1

[0.453 0.004]

11.75 0.1

[0.463 0.004]

ꢁ

0.1

24 +0.3 / -0.1

[0.945 +0.019 / -0.004]

25.7

[1.01]

[0.315 0.004]

Direction of Feed

0.5 0.01

[0.020 0.004]

1.5 DIA. MAX.

[0.059]

0.1

16 0.1

[0.630 0.004]

[0.354 0.004]

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com for current information.

ꢁ1

CG/CG2 Series

Revised: November 10, 2009

Customer should verify actual device performance in their speciﬁc applications.

Gas DischargeTube (GDT) Products

CG/CG2 Series

Part Numbering System and Ordering Information

CG2 XXX XX * XX

Series

CG -- for 75, 90, or 110V

CG2 -- for 145V to 1000V

Examples:

CG75 -- A non-leaded 75V device

Breakdown Voltage

CG22ꢁꢀL -- A leaded 230V device

9ꢀ

11ꢀ

145

2ꢁꢀ

25ꢀ

ꢁꢀꢀ

ꢁ5ꢀ

47ꢀ

6ꢀꢀ

8ꢀꢀ

CG28ꢀꢀLTR -- A leaded 800V device, tape-and-reel (per EIA standard RS-296-D)

Notes:

CG/CG2 devices with other breakdown voltages in the 75-1000 V range are available upon request.

1ꢀꢀꢀ

Lead Option Code

(Blank) = No Leads / Core

L = Straight Leads

LS = Shaped Leads

MS = Surface Mount

Option Code*

SN = denotes different DC Breakover

Voltage Limit. Please refer to Electrical

Characteristics table for additional

information.

Packaging Option Code

(Blank) = No Leads / Core, Bulk Bag - 400 pcs

L(Blank) = Straight Lead, Tray - 50 pcs

LTR = Straight Lead, Tape & Reel per EIA RS-296-E - 500 per reel

LTE = Straight Lead, Tape & Reel per IEC 60286-1 - 500 per reel

LSTR = Shaped Lead (see LS dimensions), Tape & Reel - 500 per reel

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com for current information.

ꢁ2

CG/CG2 Series

Revised: November 10, 2009

Customer should verify actual device performance in their speciﬁc applications.

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