CG2145MSSNLSTR [LITTELFUSE]
Surge Protection Circuit, ROHS COMPLIANT PACKAGE-2;型号: | CG2145MSSNLSTR |
厂家: | LITTELFUSE |
描述: | Surge Protection Circuit, ROHS COMPLIANT PACKAGE-2 电信 电信集成电路 |
文件: | 总6页 (文件大小:226K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Gas DischargeTube (GDT) Products
CG/CG2 Series
®
CG/CG2 Series
Description
Littelfuse highly reliable CG/CG2 Series GDTs provide
a high degree of surge protection in a small size ideal
for board level circuit protection.
GDTs function as switches which dissipate a
minimum amount of energy and therefore handle
currents that far surpass other types of transient
voltage protection. Their gas-filled, rugged ceramic
metal construction make them well suited to adverse
environments.
The CG/CG2 series comes in a variety of forms
including surface mount, core, straight and shaped
leads, to serve a variety of mounting methods.
Agency Approvals
The CG Series (75-110V) is ideal for protection of test
and communication equipment and other devices
in which low voltage limits and extremely low arc
voltages are required.
AGENCY
AGENCY FILE NUMBER
E128662
®
E320116
®
The CG2 Series (145V-1000V) is ideal for protecting
equipment where higher voltage limits and holdover
voltages are necessary.
2 Electrode GDT Graphical Symbol
Features
• Rugged Ceramic-Metal
construction
• Meets REA PE-80
• Available in surface
mount, and a variety of
lead options options
• Low Capacitance
(<1.5pf)
Applications
• Communication lines
and equipment
• Instrumentation circuits
• Medical electronics
• ADSL equipment
• CATV equipment
• Test equipment
• Data lines
• Telecom SLIC
protection
• Power supplies
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
27
Revised: November 10, 2009
CG/CG2 Series
Customer should verify actual device performance in their specific applications.
Gas DischargeTube (GDT) Products
CG/CG2 Series
Electrical Characteristics
Device Specifications (at 25°C)
Life Ratings
DC Breakdown
in Volts
Impulse Impulse Insulation
Nominal Nominal
AC
DC
Max
Capaci-
Arc
Surge
Life
Break-
down
in Volts
Break-
down In
Volts
Resistance
Impulse
AC
Dischage Holdover Impulse
tance Voltage
Discharge Discharge Current Voltage2 Discharge
(on state
(@1MHz)
(@100V/s)
(@500A
10/1000μs)
Voltage)
@1Amp
Min
(9 cycle
@50Hz)
Current
(8/20μs)
Current
Current
(1 Application
@ 10/350μs)
(10x1sec
(@100V/μs) (@1 Kv/μsec)
@50-60Hz)
Part
Number
MIN TYP MAX
MAX
MIN
MAX
TYP
TYP
ꢀꢁꢂꢃ
ꢄꢅ
ꢂꢗ
ꢂꢗ
ꢂꢃ
ꢆꢅ
ꢇꢅꢅ
ꢇꢅꢅ
ꢇꢅꢅ
ꢇꢃꢅ
ꢃꢅꢅ
ꢃꢅꢅ
ꢄꢅꢅ
ꢄꢅꢅ
ꢄꢗꢃ
ꢄꢗꢃ
ꢂꢅꢅ
ꢂꢅꢅ
ꢂꢃꢅ
ꢂꢃꢅ
ꢛꢅꢅ
ꢛꢃꢅ
ꢛꢃꢅ
ꢈꢅꢅꢅ
ꢈꢅꢅꢅ
ꢈꢗꢅꢅ
ꢄꢃꢅ
ꢄꢅꢅ
ꢈꢅꢈꢅꢉꢊ
ꢋꢌꢍꢉꢃꢅꢎꢏ
ꢀꢁꢆꢅ
ꢆꢅ ꢈꢅꢛ
ꢆꢅ ꢈꢅꢛ
ꢃꢗꢉꢎ
ꢇꢘꢙꢉ
ꢀꢁꢆꢅꢉꢜꢝ
ꢀꢁꢈꢈꢅ
ꢄꢅꢅ
ꢛꢛ ꢈꢈꢅ ꢈꢚꢗ
ꢈꢈꢄ ꢈꢇꢃ ꢈꢂꢇ
ꢄꢅꢅ
ꢀꢁꢗꢈꢇꢃ
ꢄꢅꢅ
ꢛꢅꢉꢎ
ꢀꢁꢗꢈꢇꢃꢉꢜꢝ ꢈꢗꢅ ꢈꢇꢃ ꢈꢂꢇ
ꢀꢁꢗꢗꢚꢅ ꢈꢆꢃ ꢗꢚꢅ ꢗꢄꢃ
ꢀꢁꢗꢗꢚꢅꢉꢜꢝ ꢈꢛꢇ ꢗꢚꢅ ꢗꢂꢄ
ꢀꢁꢗꢗꢃꢅ ꢗꢈꢚ ꢗꢃꢅ ꢗꢛꢛ
ꢀꢁꢗꢗꢃꢅꢉꢜꢝ ꢗꢅꢅ ꢗꢃꢅ ꢚꢅꢅ
ꢀꢁꢗꢚꢅꢅ ꢗꢃꢃ ꢚꢅꢅ ꢚꢇꢃ
ꢀꢁꢗꢚꢅꢅꢉꢜꢝ ꢗꢇꢅ ꢚꢅꢅ ꢚꢄꢅ
ꢀꢁꢗꢚꢃꢅ ꢗꢆꢂ ꢚꢃꢅ ꢇꢅꢚ
ꢀꢁꢗꢚꢃꢅꢉꢜꢝ ꢗꢛꢅ ꢚꢃꢅ ꢇꢗꢅ
ꢄꢅꢅ
ꢂꢅꢅ
ꢂꢅꢅ
ꢂꢗꢃ
ꢈꢅꢉꢓꢔꢕꢍꢓꢉ
ꢋꢖꢗꢅꢘꢙꢏꢚ
ꢂꢗꢃ
ꢗꢅꢉꢙ
ꢈꢅꢅꢉꢙ
ꢇꢅꢅ
ꢓꢔꢕꢍꢓ
ꢛꢅꢅ
ꢈꢐꢃꢉꢑꢒ
ꢈꢃꢉꢎ
ꢛꢅꢅ
ꢈꢅꢈꢅꢉꢊ
ꢋꢌꢍꢉꢈꢅꢅꢎꢏ
ꢗꢐꢃꢘꢙꢉ
ꢆꢅꢅ
ꢆꢅꢅ
ꢈꢚꢃꢉꢎ
ꢀꢁꢗꢇꢗꢅ
ꢀꢁꢗꢇꢂꢅ
ꢚꢃꢂ ꢇꢗꢅ ꢇꢛꢚ
ꢇꢅꢅ ꢇꢂꢅ ꢃꢇꢅ
ꢈꢅꢅꢅ
ꢈꢗꢅꢅ
ꢈꢗꢅꢅ
ꢈꢇꢅꢅ
ꢈꢇꢅꢅ
ꢈꢃꢅꢅ
ꢈꢄꢅꢅ
ꢀꢁꢗꢇꢂꢅꢉꢜꢝ ꢚꢂꢄ ꢇꢂꢅ ꢃꢄꢇ
ꢀꢁꢗꢄꢅꢅ ꢃꢈꢅ ꢄꢅꢅ ꢄꢆꢅ
ꢀꢁꢗꢄꢅꢅꢉꢜꢝ ꢇꢛꢅ ꢄꢅꢅ ꢂꢗꢅ
ꢀꢁꢗꢛꢅꢅꢈ
ꢀꢁꢗꢈꢅꢅꢅꢈ
ꢄꢛꢅ ꢛꢅꢅ ꢆꢗꢅ
ꢛꢃꢅ ꢈꢅꢅꢅ ꢈꢈꢃꢅ ꢈꢃꢅꢅ
ꢈꢅꢉꢓꢔꢕꢍꢓꢉ
ꢋꢖꢈꢅꢘꢙꢏ
ꢈꢅꢉꢙ
ꢄꢃꢉꢙ
NOTES:
1. Tested to UL1449 Third Edition
2. Reference REA PE-80, 0.2A. Tested to ITU-T Rec K.12 and REA PE 80 < 150 mSec.
3. Leaded devices = 5x[5(+) or 5 (-)] applications 20kA 8/20μSec. (75 to 600 volt devices.)
MS and Core devices = 10x[5(+) and 5(-)] applications 10kA 8/20μS (800 to 1000 volt devices.)
Product Characteristics
Glow to arc
LS, Axial:
< 0.5Amps
60-160 Volts
transition current
Device: Nickel Plated 2–5 Microns
Lead Wires:Tin Plated 17.5 12.5 Microns
Construction: Ceramic Insulator
GlowVoltage
Core:
Materials
Storage and
Operational
Temperature
Device:Tin Plated 17.5 12.5 Microns.
-40 to +90
Construction: Ceramic Insulator
MS:
Device: DullTin Plated 7–9 Microns
Construction: Ceramic Insulator
Maximum Follow 230 Volts r.m.s, 200 Amps.
On Current1
(800V and 1000V devices tested to UL1449 3rd edition)
LF Logo, Voltage and date code; Black in
positive print
Product Marking
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
28
Revised: November 10, 2009
CG/CG2 Series
Customer should verify actual device performance in their specific applications.
Gas DischargeTube (GDT) Products
CG/CG2 Series
Device Dimensions
Leaded 'L' Type Straight Axial Devices
Leaded 'LS' Type Shaped Lead Devices
PROFILE VIEW
TOP VIEW
PROFILE VIEW
TOP VIEW
6.ꢀ7 ꢀ.ꢁ
[0.239 0.012]
8.1ꢀ Max.
[0.319 DIA Max.]
ꢀ.81DIA. TYP.
[0.032]
8.1ꢀDIA. MAX.
[0.319]
8.4ꢀ ꢀ.ꢁ
[0.331 0.012]
6.ꢀ7 ꢀ.15
[0.239 0.006]
ꢀ.8ꢀ
[0.032]
0.004
8.4 ꢀ.ꢁ
[0.331 0.012]
62
2
2 Surfaces
ꢀ.4ꢀ ꢀ.ꢀꢁ
[0.0157 0.0012]
9.85 ꢀ.ꢁꢀ
[0.388 0.012]
11.15 ꢀ.ꢁꢀ
[0.439 0.012]
SOLDER PAD LAYOUT
Core Devices
9.85
[0.388]
8.6ꢀ
[0.339]
TOP VIEW
PROFILE VIEW
SEMI–PROFILE VIEW
8.1ꢀ Max.
[0.032 Max.]
6.ꢀ7 ꢀ.15
[0.239 0.0059]
1.8ꢀ
[0.071]
5.89[0.232]
11.65
[0.459]
.
ꢀ
x
8 . 1
ꢀ.47 ꢀ.1
[0.019 0.0039]
'MS' Type Devices
TOP VIEW
PROFILE VIEW
SEMI–PROFILE VIEW
8.ꢁꢀ ꢀ.1
[0.327 0.0039]
4
ꢀ.2
5.58 [0.220]
[0.157 0.0079]
6.ꢀ5 ꢀ.2
[0.238 0.0079]
R5.29 [R0.208]
ø
0
ꢀ
ꢀ.47 ꢀ.1
[0.019 0.0039]
SOLDER PAD LAYOUT
2.29 [0.090]
8.71 [0.343]
5.89 [0.232]
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
29
Revised: November 10, 2009
CG/CG2 Series
Customer should verify actual device performance in their specific applications.
Gas DischargeTube (GDT) Products
CG/CG2 Series
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
tP
Reflow Condition
-Temperature Min (Ts(min)
Pb – Free assembly
TP
Critical Zone
L to TP
Ramp-up
T
)
150°C
TL
TS(max)
Pre Heat -Temperature Max (Ts(max)
-Time (Min to Max) (ts)
)
200°C
tL
60 – 180 secs
Ramp-down
Average ramp up rate (LiquidusTemp
(TL) to peak
Preheat
3°C/second max
5°C/second max
TS(min)
tS
TS(max) toTL - Ramp-up Rate
-Temperature (TL) (Liquidus) 217°C
25
Reflow
time to peak temperature
(t 25ºC to peak)
-Temperature (tL)
60 – 150 seconds
260+0/-5 °C
Time
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
10 – 30 seconds
Ramp-down Rate
6°C/second max
8 minutes Max.
260°C
Time 25°C to peakTemperature (TP)
Do not exceed
Soldering Parameters -Wave Soldering (Thru-Hole Devices)
Recommended Process Parameters:
ꢁꢀꢀ
28ꢀ
26ꢀ
24ꢀ
22ꢀ
2ꢀꢀ
18ꢀ
16ꢀ
14ꢀ
12ꢀ
1ꢀꢀ
8ꢀ
Wave Parameter
Lead-Free Recommendation
Preheat:
(Typical Industry Recommendation)
(Depends on Flux ActivationTemperature)
Temperature Minimum:
Temperature Maximum:
PreheatTime:
100° C
150° C
60-180 seconds
Solder PotTemperature:
Solder DwellTime:
280° C Maximum
2-5 seconds
6ꢀ
4ꢀ
2ꢀ
ꢀ
Time (Seconds)
Preheat Time
Cooling Time
Dwell Time
Soldering Parameters - Hand Soldering
Solder IronTemperature: 350° C +/- 5°C
HeatingTime: 5 seconds max.
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
ꢁꢀ
Revised: November 10, 2009
CG/CG2 Series
Customer should verify actual device performance in their specific applications.
Gas DischargeTube (GDT) Products
CG/CG2 Series
Packaging Dimensions
For 'L' Type Axial Lead Items
<1.2 Max. Lead Bend
254.0 - 356.0
[10.0 - 14.0]
<0.ꢁ Max
Direction of Feed
0.0
15]
52.4
[2.063]
22.ꢁ
[0.ꢁ9ꢁ]
6.4
[0.252]
5.0 Pitch
[0.197]
Core and 'MS' Type Items
275.0
[10.83]
10x4 0.1 = 40 0.2
[10 x 0.157 0.004 = 1.575 0.008]
100.0
[3.94]
1.75 0.1
[0.069 0.004]
4
0.1
1.5 DIA. MAX.
[0.059]
0.4 0.05
[0.016 0.002]
76.0
[2.99]
[0.157 0.004]
25.0
[0.98]
7.5 0.1
[0.295 0.004]
8.5 0.1
[0.335 0.004]
17.7
[0.697]
16 +0.3 / -0.1
[0.630 +0.012 / -0.004]
Direction of Feed
1.5 DIA. MAX.
[0.059]
12 0.1
[0.472 0.004]
8.6 0.1
[0.339 0.004]
For 'LS' Type Shaped Lead Items
275.0
[10.ꢁ2]
10x4 0.1 ꢀ 40 0.2
[10x.157 0.004 ꢀ 1.575 0.00ꢁ]
100.0
[3.93]
1.75 0.1
[0.069 0.004]
1.5 DIA. MAX.
[0.059]
4
0.1
0.5 0.05
[0.020 0.002]
[0.157 0.004]
76.0
[2.99]
25.0
[0.9ꢁ]
1.9
[0.075]
11.5 0.1
[0.453 0.004]
11.75 0.1
[0.463 0.004]
ꢁ
0.1
24 +0.3 / -0.1
[0.945 +0.019 / -0.004]
25.7
[1.01]
[0.315 0.004]
Direction of Feed
0.5 0.01
[0.020 0.004]
1.5 DIA. MAX.
[0.059]
9
0.1
16 0.1
[0.630 0.004]
[0.354 0.004]
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
ꢁ1
CG/CG2 Series
Revised: November 10, 2009
Customer should verify actual device performance in their specific applications.
Gas DischargeTube (GDT) Products
CG/CG2 Series
Part Numbering System and Ordering Information
CG2 XXX XX * XX
Series
CG -- for 75, 90, or 110V
CG2 -- for 145V to 1000V
Examples:
CG75 -- A non-leaded 75V device
Breakdown Voltage
CG22ꢁꢀL -- A leaded 230V device
75
9ꢀ
11ꢀ
145
2ꢁꢀ
25ꢀ
ꢁꢀꢀ
ꢁ5ꢀ
47ꢀ
6ꢀꢀ
8ꢀꢀ
CG28ꢀꢀLTR -- A leaded 800V device, tape-and-reel (per EIA standard RS-296-D)
Notes:
CG/CG2 devices with other breakdown voltages in the 75-1000 V range are available upon request.
1ꢀꢀꢀ
Lead Option Code
(Blank) = No Leads / Core
L = Straight Leads
LS = Shaped Leads
MS = Surface Mount
Option Code*
SN = denotes different DC Breakover
Voltage Limit. Please refer to Electrical
Characteristics table for additional
information.
Packaging Option Code
(Blank) = No Leads / Core, Bulk Bag - 400 pcs
L(Blank) = Straight Lead, Tray - 50 pcs
LTR = Straight Lead, Tape & Reel per EIA RS-296-E - 500 per reel
LTE = Straight Lead, Tape & Reel per IEC 60286-1 - 500 per reel
LSTR = Shaped Lead (see LS dimensions), Tape & Reel - 500 per reel
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
ꢁ2
CG/CG2 Series
Revised: November 10, 2009
Customer should verify actual device performance in their specific applications.
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