LTST-C190KSKT [LITEON]

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LTST-C190KSKT
型号: LTST-C190KSKT
厂家: LITE-ON TECHNOLOGY CORPORATION    LITE-ON TECHNOLOGY CORPORATION
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Property of Lite-On Only
精简版,关于财产只有

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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
Features  
* Meet ROHS, Green Product.  
* Ultra bright AlInGaP Chip LED.  
* Package In 8mm Tape On 7" Diameter Reels.  
* Compatible With Automatic Placement Equipment.  
* Compatible With Infrared And Vapor Phase Reflow Solder Process.  
* EIA STD package.  
* I.C. compatible.  
Package Dimensions  
Part No.  
Lens  
Source Color  
Water Clear  
LTST-C190KSKT  
AllnGaP Yellow  
Notes:  
1. All dimensions are in millimeters (inches).  
2. Tolerance is ± 0.10 mm (.004") unless otherwise noted.  
Part No. : LTST-C190KSKT  
BNS-OD-C131/A4  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
R
Absolute Maximum Ratings At Ta=25  
Parameter  
LTST-C190KSKT  
75  
Unit  
mW  
Power Dissipation  
Peak Forward Current  
(1/10 Duty Cycle, 0.1ms Pulse Width)  
80  
mA  
DC Forward Current  
30  
0.4  
5
mA  
mA/°C  
V
Derating Linear From 50°C  
Reverse Voltage  
Operating Temperature Range  
Storage Temperature Range  
Wave Soldering Condition  
Infrared Soldering Condition  
Vapor Phase Soldering Condition  
-55°C to + 85°C  
-55°C to + 85°C  
260°C For 5 Seconds  
260°C For 5 Seconds  
215°C For 3 Minutes  
Part No. : LTST-C190KSKT  
BNS-OD-C131/A4  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
Suggestion Profile:  
(1) Suggestion IR Reflow Profile For Normal Process  
(2) Suggestion IR Reflow Profile For Pb Free Process  
Recom m ended Profile Betw een Assem ble And Heat-Resistance Line  
The Profile is available that m ust to use SnAg  
C u  
solder paste  
Part No. : LTST-C190KSKT  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
R
Electrical Optical Characteristics At Ta=25  
Part No.  
LTST-  
Parameter  
Luminous Intensity  
Viewing Angle  
Symbol  
IV  
Min.  
28.0  
Typ.  
-
Max.  
180.0  
Unit  
mcd  
deg  
nm  
nm  
nm  
V
Test Condition  
IF = 20mA  
Note 1  
C190KSKT  
C190KSKT  
C190KSKT  
C190KSKT  
C190KSKT  
C190KSKT  
C190KSKT  
C190KSKT  
130  
588  
-
Note 2 (Fig.6)  
2
1/2  
P
Measurement  
@Peak (Fig.1)  
Peak Emission Wavelength  
Dominant Wavelength  
Spectral Line Half-Width  
Forward Voltage  
IF = 20mA  
Note 3  
584.5  
1.80  
597.0  
d
15  
-
VF  
2.40  
10  
IF = 20mA  
VR = 5V  
Reverse Current  
IR  
C
A
VF = 0  
f = 1MHZ  
Capacitance  
40  
PF  
Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the  
CIE eye-response curve.  
2.  
3. The dominant wavelength,  
single wavelength which defines the color of the device.  
1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.  
d is derived from the CIE chromaticity diagram and represents the  
Part No. : LTST-C190KSKT  
BNS-OD-C131/A4  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
Bin Code List  
Forward Voltage  
Bin Code  
Unit: V @20mA  
Max.  
Min.  
1.80  
2.10  
F2  
F3  
2.10  
2.40  
Tolerance on each Forward Voltage bin is +/-0.1 volt  
Luminous Intensity  
Bin Code  
Unit : mcd @20mA  
Min.  
28.0  
45.0  
71.0  
112.0  
Max.  
45.0  
N
P
71.0  
Q
R
112.0  
180.0  
Tolerance on each Intensity bin is +/-15%  
Dominant Wavelength  
Bin Code  
Unit : nm @20mA  
Max.  
Min.  
584.5  
587.0  
589.5  
592.0  
594.5  
H
J
587.0  
589.5  
K
L
592.0  
594.5  
M
597.0  
Tolerance for each Dominate Wavelength bin is +/- 1nm  
Part No. : LTST-C190KSKT  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
Typical Electrical  
/
Optical Characteristics Curves  
(25 °C Ambient Temperature Unless Otherwise Noted)  
Part No. : LTST-C190KSKT  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
Cleaning  
Do not use unspecified chemical liquid to clean LED they could harm the package.  
If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature for  
less one minute.  
Suggest Soldering Pad Dimensions  
Package Dimensions Of Tape And Reel  
Notes:  
1. All dimensions are in millimeters (inches).  
Part No. : LTST-C190KSKT  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
Notes:  
1. Empty component pockets sealed with top cover tape.  
2. 7 inch reel-3000 pieces per reel.  
3. Minimum packing quantity is 500 pcs for remainders.  
4. The maximum number of consecutive missing lamps is two.  
5. In accordance with ANSI/EIA 481-1-A-1994 specifications.  
Part No. : LTST-C190KSKT  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
CAUTIONS  
1. Application  
The LEDs described here are intended to be used for ordinary electronic equipment (such as office  
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance  
for information on applications in which exceptional reliability is required, particularly when the failure  
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,  
traffic control equipment, medical and life support systems and safety devices).  
2. Storage  
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.  
It is recommended that LEDs out of their original packaging are IR-reflowed within one week.  
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a  
sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.  
LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C  
for at least 24 hours before solder assembly.  
3. Cleaning  
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.  
4. Soldering  
Recommended soldering conditions:  
Reflow soldering  
120~150°C  
120 sec. Max. Pre-heat time  
Wave Soldering  
100°C Max.  
60 sec. Max. Soldering time 3 sec. Max.  
Soldering iron  
Pre-heat  
Pre-heat time  
Peak temperature 260°C Max.  
Pre-heat  
Temperature 300°C Max.  
Solder wave  
260°C Max.  
10 sec. Max.  
(one time only)  
Soldering time  
5 sec. Max.  
Soldering time  
5. Drive Method  
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs  
connected in parallel in an application, it is recommended that a current limiting resistor be incorporated  
in the drive circuit, in series with each LED as shown in Circuit A below.  
Circuit model A  
Circuit model B  
LED  
LED  
(A) Recommended circuit.  
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics  
of those LEDs.  
6. ESD (Electrostatic Discharge)  
Static Electricity or power surge will damage the LED.  
Suggestions to prevent ESD damage:  
¢ Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.  
¢ All devices, equipment, and machinery must be properly grounded.  
¢ Work tables, storage racks, etc. should be properly grounded.  
¢ Use ion blower to neutralize the static charge which might have built up on surface of the LED’s  
plastic lens as a result of friction between LEDs during storage and handling.  
Part No. : LTST-C190KSKT  
BNS-OD-C131/A4  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward  
voltage, or “ no lightup ” at low currents.  
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.  
The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.  
7. Reliability Test  
Test Item  
Classification  
Test Condition  
Reference Standard  
Ta= Under Room Temperature As Per Data Sheet  
Maximum Rating  
*Test Time= 1000HRS (-24HRS,+72HRS)*@20mA.  
MIL-STD-750D:1026  
MIL-STD-883D:1005  
JIS C 7021:B-1  
Operation Life  
High Temperature  
High Humidity  
Storage  
IR-Reflow In-Board, 2 Times  
Ta= 65±5 ,RH= 90 95%  
MIL-STD-202F:103B  
JIS C 7021:B-11  
Endurance  
Test  
*
Test Time= 240HRS±2HRS  
High Temperature Ta= 105±5  
Storage  
Test Time= 1000HRS (-24HRS,+72HRS)  
MIL-STD-883D:1008  
JIS C 7021:B-10  
*
Low Temperature Ta= -55±5  
JIS C 7021:B-12  
Storage  
Test Time=1000HRS (-24HRS,+72H RS)  
*
MIL-STD-202F:107D  
MIL-STD-750D:1051  
MIL-STD-883D:1010  
JIS C 7021:A-4  
105  
25  
-55  
25  
Temperature  
Cycling  
30mins 5mins  
10 Cycles  
30mins 5mins  
IR-Reflow In-Board, 2 Times  
MIL-STD-202F:107D  
MIL-STD-750D:1051  
MIL-STD-883D:1011  
Thermal  
Shock  
85 ± 5  
-40  
± 5  
10mins  
10mins 10 Cycles  
MIL-STD-202F:210A  
MIL-STD-750D:2031  
JIS C 7021:A-1  
T.sol= 260 ± 5  
Dwell Time= 10 ± 1secs  
Solder  
Resistance  
Ramp-up rate(183  
Temp. maintain at 125(±25)  
Temp. maintain above 183  
to Peak) +3 / second max  
MIL-STD-750D:2031.2  
J-STD-020  
120 seconds max  
60-150 seconds  
IR-Reflow  
Normal Process  
Peak temperature range 235 +5/-0  
Time within 5°C of actual Peak Temperature (tp)  
10-30 seconds  
Environmental  
Test  
Ramp-down rate +6 /second max  
Ramp-up rate(217 to Peak) +3 / second max  
Temp. maintain at 175(±25) 180 seconds max  
Temp. maintain above 217 60-150 seconds  
Peak temperature range 260 +0/-5  
Time within 5°C of actual Peak Temperature (tp)  
20-40 seconds  
MIL-STD-750D:2031.2  
J-STD-020  
IR-Reflow  
Pb Free Process  
Ramp-down rate +6 /second max  
MIL-STD-202F:208D  
MIL-STD-750D:2026  
MIL-STD-883D:2003  
IEC 68 Part 2-20  
T.sol= 235 ± 5  
Immersion time 2±0.5 sec  
Immersion rate 25±2.5 mm/sec  
Solderability  
Coverage  
95% of the dipped surface  
JIS C 7021:A-2  
8. Others  
The appearance and specifications of the product may be modified for improvement without prior notice.  
Part No. : LTST-C190KSKT  
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LITE-ON TECHNOLOGY CORPORATION  
P r o p e r t y o f L i t e - O n O n l y  
9. Suggested Checking List  
Training and Certification  
1. Everyone working in a static-safe area is ESD-certified?  
2. Training records kept and re-certification dates monitored?  
Static-Safe Workstation & Work Areas  
1. Static-safe workstation or work-areas have ESD signs?  
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?  
3. All ionizer activated, positioned towards the units?  
4. Each work surface mats grounding is good?  
Personnel Grounding  
1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel  
strap or conductive shoes with conductive flooring?  
2. If conductive footwear used, conductive flooring also present where operator stand or walk?  
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?  
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?  
5. All wrist strap or heel strap checkers calibration up to date?  
Note: *50V for Blue LED.  
Device Handling  
1. Every ESDS items identified by EIA-471 labels on item or packaging?  
2. All ESDS items completely inside properly closed static-shielding containers when not at  
static-safe workstation?  
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?  
4. All flexible conductive and dissipative package materials inspected before reuse or recycles?  
Others  
1. Audit result reported to entity ESD control coordinator?  
2. Corrective action from previous audits completed?  
3. Are audit records complete and on file?  
Part No. : LTST-C190KSKT  
BNS-OD-C131/A4  
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