JISC7021A-4 [LITEON]
Meet ROHS, Green Product Ultra bright A1InGaP Chip LED; 符合ROHS ，绿色产品采用超高亮A1InGaP贴片LED
| 型号： | JISC7021A-4 |
| 厂家： | 
LITE-ON TECHNOLOGY CORPORATION |
| 描述： | Meet ROHS, Green Product Ultra bright A1InGaP Chip LED |
| 文件： | 总11页 (文件大小：718K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
Features
* Meet ROHS, Green Product.
* Ultra bright AlInGaP Chip LED.
* Package In 8mm Tape On 7" Diameter Reels.
* EIA STD package.
* I.C. compatible.
* Compatible With Automatic Placement Equipment.
* Compatible With Infrared And Vapor Phase Reflow Solder Process.
Package Dimensions
Part No.
Lens
Source Color
AllnGaP Orange
LTST-C170KFKT
Water Clear
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ± 0.10 mm (.004") unless otherwise noted.
Part No. : LTST-C170KFKT
BNS-OD-C131/A4
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
℃
Absolute Maximum Ratings At Ta=25
LTST-C170KFKT
75
Parameter
Unit
mW
Power Dissipation
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
80
mA
mA
DC Forward Current
30
0.4
5
°
°
Derating Linear From 50 C
mA/ C
Reverse Voltage
V
° °
-55 C to + 85 C
Operating Temperature Range
Storage Temperature Range
Wave Soldering Condition
Infrared Soldering Condition
Vapor Phase Soldering Condition
°
°
-55 C to + 85 C
°
260 C For 5 Seconds
°
260 C For 5 Seconds
°
215 C For 3 Minutes
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
Suggestion Profile:
(1) Suggestion IR Reflow Profile For Normal Process
(2) Suggestion IR Reflow Profile For Pb Free Process
Recom m ended Profile Betw een Assem ble And Heat-Resistance Line
The Profile is available that m ust to use SnAg
Cu
solder paste
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
℃
Electrical Optical Characteristics At Ta=25
Part No.
LTST-
Parameter
Luminous Intensity
Viewing Angle
Symbol
IV
Min.
Typ.
90.0
130
611
605
17
Max.
Unit
mcd
deg
nm
nm
nm
V
Test Condition
IF = 20mA
Note 1
C170KFKT
45.0
θ
C170KFKT
C170KFKT
C170KFKT
C170KFKT
C170KFKT
C170KFKT
C170KFKT
Note 2 (Fig.6)
2
1/2
Measurement
@Peak (Fig.1)
λ
Peak Emission Wavelength
Dominant Wavelength
Spectral Line Half-Width
Forward Voltage
P
d
λ
Note 3
Δλ
VF
IR
2.0
2.4
IF = 20mA
VR = 5V
μ
Reverse Current
100
A
VF = 0
f = 1MHZ
Capacitance
C
40
PF
Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the
CIE eye-response curve.
θ
2.
3. The dominant wavelength,
single wavelength which defines the color of the device.
1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
λ
d is derived from the CIE chromaticity diagram and represents the
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
Bin Code List
Luminous Intensity
Bin Code
Unit : mcd @20mA
Min.
45.0
Max.
71.0
P
Q
R
S
71.0
112.0
180.0
280.0
112.0
180.0
Tolerance on each Intensity bin is +/-15%
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
Typical Electrical
/
Optical Characteristics Curves
(25 °C Ambient Temperature Unless Otherwise Noted)
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
Cleaning
Do not use unspecified chemical liquid to clean LED they could harm the package.
If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature
for less one minute.
Suggest Soldering Pad Dimensions
Package Dimensions Of Tape And Reel
Notes:
1. All dimensions are in millimeters (inches).
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
Notes:
1. Empty component pockets sealed with top cover tape.
2. 7 inch reel-3000 pieces per reel.
3. Minimum packing quantity is 500 pcs for remainders.
4. The maximum number of consecutive missing lamps is two.
5. In accordance with ANSI/EIA 481-1-A-1994 specifications.
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within one week.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a
sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than a week should be baked at about 60 deg C
for at least 24 hours before solder assembly.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.
4. Soldering
Recommended soldering conditions:
Reflow soldering
120~150°C
120 sec. Max. Pre-heat time
Wave Soldering
100°C Max.
60 sec. Max. Soldering time 3 sec. Max.
Soldering iron
Pre-heat
Pre-heat time
Peak temperature 240°C Max.
Pre-heat
Temperature 300°C Max.
Solder wave
260°C Max.
10 sec. Max.
(one time only)
Soldering time
10 sec. Max.
Soldering time
5. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be incorporated
in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs.
6. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
All devices, equipment, and machinery must be properly grounded.
Work tables, storage racks, etc. should be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LED’s
plastic lens as a result of friction between LEDs during storage and handling.
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward
voltage, or “ no lightup ” at low currents.
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.
The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.
7. Reliability Test
Test Item
Classification
Test Condition
Reference Standard
Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)*@20mA.
MIL-STD-750D:1026
MIL-STD-883D:1005
JIS C 7021:B-1
Operation Life
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90～95%
*Test Time= 240HRS±2HRS
MIL-STD-202F:103B
JIS C 7021:B-11
Endurance
Test
Ta= 105±5℃
*Test Time= 1000HRS (-24HRS,+72HRS)
High Temperature
Storage
MIL-STD-883D:1008
JIS C 7021:B-10
Ta= -55±5℃
*Test Time=1000HRS (-24HRS,+72H RS)
Low Temperature
Storage
JIS C 7021:B-12
MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1010
JIS C 7021:A-4
105℃ ～ 25℃ ～ -55℃ ～ 25℃
Temperature
Cycling
30mins 5mins
10 Cycles
30mins 5mins
IR-Reflow In-Board, 2 Times
85 ± 5℃ ～ -40℃ ± 5℃
MIL-STD-202F:107D
MIL-STD-750D:1051
MIL-STD-883D:1011
Thermal
Shock
10mins
10mins 10 Cycles
MIL-STD-202F:210A
MIL-STD-750D:2031
JIS C 7021:A-1
T.sol= 260 ± 5℃
Dwell Time= 10 ± 1secs
Solder
Resistance
Ramp-up rate(183℃ to Peak) +3℃/ second max
Temp. maintain at 125(±25)℃ 120 seconds max
Temp. maintain above 183℃ 60-150 seconds
Peak temperature range 235℃+5/-0℃
Time within 5°C of actual Peak Temperature (tp)
10-30 seconds
MIL-STD-750D:2031.2
J-STD-020C
IR-Reflow
Normal Process
Environmental
Test
Ramp-down rate +6℃/second max
Ramp-up rate(217℃to Peak) +3℃/ second max
Temp. maintain at 175(±25)℃180 seconds max
Temp. maintain above 217℃60-150 seconds
Peak temperature range 260℃+0/-5℃
Time within 5°C of actual Peak Temperature (tp)
20-40 seconds
MIL-STD-750D:2031.2
J-STD-020C
IR-Reflow
Pb Free Process
Ramp-down rate +6℃/second max
MIL-STD-202F:208D
MIL-STD-750D:2026
MIL-STD-883D:2003
IEC 68 Part 2-20
T.sol= 235 ± 5℃
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Coverage ≧95% of the dipped surface
Solderability
JIS C 7021:A-2
8. Others
The appearance and specifications of the product may be modified for improvement without prior notice.
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LITE-ON TECHNOLOGY CORPORATION
P r o p e r t y o f L i t e - O n O n l y
9. Suggested Checking List
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel
strap or conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at
static-safe workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycles?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
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