LTC1622CS8 [Linear]

Low Input Voltage Current Mode Step-Down DC/DC Controller; 低输入电压电流模式降压型DC / DC控制器
LTC1622CS8
型号: LTC1622CS8
厂家: Linear    Linear
描述:

Low Input Voltage Current Mode Step-Down DC/DC Controller
低输入电压电流模式降压型DC / DC控制器

开关 光电二极管 控制器
文件: 总16页 (文件大小:222K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LTC1622  
Low Input Voltage  
Current Mode Step-Down  
DC/DC Controller  
U
FEATURES  
DESCRIPTIO  
The LTC®1622 is a constant frequency current mode step-  
downDC/DCcontrollerprovidingexcellentACandDCload  
and line regulation. The device incorporates an accurate  
undervoltage feature that shuts the LTC1622 down when  
the input voltage falls below 2V.  
High Efficiency  
Constant Frequency 550kHz Operation  
VIN Range: 2V to 10V  
Multiampere Output Currents  
OPTI-LOOPTM Compensation Minimizes COUT  
Selectable, Burst ModeOperation  
TheLTC1622boastsa±1.9%outputvoltageaccuracyand  
consumes only 350µA of quiescent current. For applica-  
tions where efficiency is a prime consideration and the  
load current varies from light to heavy, the LTC1622 can  
be configured for Burst ModeTM operation. Burst Mode  
operation enhances low current efficiency and extends  
battery run time. Burst Mode operation is inhibited during  
synchronizationorwhentheSYNC/MODEpinispulledlow  
to reduce noise and possible RF interference.  
Low Dropout Operation: 100% Duty Cycle  
Synchronizable up to 750kHz  
Current Mode Operation for Excellent Line and Load  
Transient Response  
Low Quiescent Current: 350µA  
Shutdown Mode Draws Only 15µA Supply Current  
±1.9% Reference Accuracy  
Available in 8-Lead MSOP  
U
High constant operating frequency of 550kHz allows the  
use of a small inductor. The device can also be synchro-  
nized up to 750kHz for special applications. The high  
frequency operation and the available 8-lead MSOP pack-  
age create a high performance solution in an extremely  
small amount of PCB area.  
APPLICATIO S  
1- or 2-Cell Li-Ion Powered Applications  
Cellular Telephones  
Wireless Modems  
Portable Computers  
Distributed 3.3V, 2.5V or 1.8V Power Systems  
To further maximize the life of the battery source, the  
P-channel MOSFET is turned on continuously in dropout  
(100% duty cycle). In shutdown, the device draws a mere  
15µA.  
Scanners  
Battery-Powered Equipment  
, LTC and LT are registered trademarks of Linear Technology Corporation.  
Burst Mode and OPTI-LOOP are a trademarks of Linear Technology Corporation.  
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TYPICAL APPLICATIO  
Efficiency vs Load Current with  
Burst Mode Operation Enabled  
100  
V
IN  
2.5V TO 8.5V  
V
= 4.2V  
IN  
8
C1  
R2  
10µF  
10V  
90  
80  
70  
60  
50  
40  
V
IN  
SENSE  
0.03Ω  
V
= 3.3V  
IN  
2
1
7
I
TH  
R1  
PDRV  
Si3443DV  
10k  
L1  
V
= 6V  
IN  
LTC1622  
SYNC/MODE  
4.7µH  
C3  
220pF  
V
2.5V  
1.5A  
OUT  
5
6
V
= 8.4V  
IN  
D1  
IR10BQ015  
R3  
159k  
4
+
C2  
RUN/SS  
GND  
47µF  
470pF  
V
FB  
R4  
75k  
6V  
3
V
R
= 2.5V  
OUT  
SENSE  
= 0.03  
C1: TAIYO YUDEN CERAMIC EMK325BJ106MNT L1: MURATA LQN6C-4R7  
1622 F01a  
C2: SANYO POSCAP 6TPA47M  
R2: DALE WSL-1206 0-03Ω  
1
10  
100  
1000  
5000  
D1: INTERNATIONAL RECTIFIER IR10BQ015  
LOAD CURRENT (mA)  
1622 F01b  
Figure 1. High Efficiency Step-Down Converter  
1
LTC1622  
ABSOLUTE MAXIMUM RATINGS  
Input Supply Voltage (VIN).........................0.3V to 10V  
RUN/SS Voltage .......................................0.3V to 2.4V  
SYNC/MODE Voltage ................................. 0.3V to VIN  
SENSEVoltage .......................................... 2.4V to VIN  
PDRV Peak Output Current (<10µs) ......................... 1A  
Storage Ambient Temperature Range ... 65°C to 150°C  
W W  
U W  
(Note 1)  
Operating Temperature Range  
Commercial ............................................ 0°C to 70°C  
Industrial ........................................... 45°C to 85°C  
Junction Temperature (Note 2)............................. 125°C  
Lead Temperature (Soldering, 10 sec).................. 300°C  
U
W U  
PACKAGE/ORDER INFORMATION  
ORDER PART  
ORDER PART  
TOP VIEW  
NUMBER  
NUMBER  
TOP VIEW  
SENSE  
1
2
3
4
8
7
6
5
V
IN  
LTC1622CS8  
LTC1622IS8  
LTC1622CMS8  
SENSE  
1
2
3
8 V  
IN  
I
PDRV  
TH  
I
V
7 PDRV  
TH  
FB  
6 GND  
5 SYNC/MODE  
V
GND  
FB  
RUN/SS 4  
RUN/SS  
SYNC/MODE  
MS8 PART MARKING  
LTDB  
S8 PART MARKING  
MS8 PACKAGE  
8-LEAD PLASTIC MSOP  
TJMAX = 125°C, θJA = 250°C/ W  
S8 PACKAGE  
8-LEAD PLASTIC SO  
TJMAX = 125°C, θJA = 150°C/ W  
1622  
1622I  
Consult factory for Military grade parts.  
ELECTRICAL CHARACTERISTICS The denotes specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VIN = 4.2V  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
I
Feedback Current  
(Note 3) V = 0.8V  
10  
70  
nA  
VFB  
FB  
V
Regulated Feedback Voltage  
(Note 3) Commercial Grade  
(Note 3) Industrial Grade  
0.785  
0.780  
0.8  
0.8  
0.815  
0.820  
V
V
FB  
V
Output Overvoltage Lockout  
Referenced to Nominal V  
4
7.5  
10.5  
0.08  
%
OVL  
OUT  
V  
Reference Voltage Line Regulation  
Output Voltage Load Regulation  
V
= 4.2V to 8.5V (Note 3)  
IN  
0.04  
%/V  
OSENSE  
V
Measured in Servo Loop; V = 0.2V to 0.625V  
Measured in Servo Loop; V = 0.9V to 0.625V  
0.3  
0.3  
0.5  
0.5  
%
%
LOADREG  
ITH  
ITH  
I
Input DC Supply Current  
Burst Mode Inhibited  
Sleep Mode  
(Note 4)  
S
V
V
V
V
= 2.3V  
450  
350  
15  
µA  
µA  
µA  
µA  
IN  
= 0V, V  
= 2.4V  
400  
30  
10  
ITH  
SYNC/MODE  
= 0V  
Shutdown  
Shutdown  
RUN/SS  
RUN/SS  
= 0V, V = V  
– 0.1V  
4
IN  
UVLO  
V
RUN/SS Threshold  
Commercial Grade  
Industrial Grade  
0.4  
0.3  
0.7  
0.7  
0.9  
1.0  
V
V
RUN/SS  
I
f
Soft-Start Current Source  
Oscillator Frequency  
V
= 0V  
RUN/SS  
1
2.5  
5
µA  
RUN/SS  
OSC  
V
V
= 0.8V  
475  
75  
550  
110  
625  
140  
kHz  
kHz  
FB  
FB  
= 0V  
V
V
SYNC/MODE Threshold  
Undervoltage Lockout  
V
Ramping Down  
SYNC/MODE  
1
1.5  
V
SYNC/MODE  
UVLO  
V
V
Ramping Down  
Ramping Up  
1.55  
1.92  
1.97  
2.3  
2.36  
V
V
IN  
IN  
2
LTC1622  
The denotes specifications which apply over the full operating  
ELECTRICAL CHARACTERISTICS  
temperature range, otherwise specifications are at TA = 25°C. VIN = 4.2V  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
PDRV t  
PDRV t  
Gate Drive Rise Time  
Gate Drive Fall Time  
C
C
= 3000pF  
= 3000pF  
80  
100  
140  
140  
ns  
ns  
r
f
LOAD  
LOAD  
V  
SENSE(MAX)  
Maximum Current Sense Voltage  
80  
110  
140  
mV  
Note 1: Absolute Maximum Ratings are those values beyond which the life  
of a device may be impaired.  
Note 3: The LTC1622 is tested in a feedback loop that servos V to the  
FB  
feedback point for the error amplifier (V = 0.8V).  
ITH  
Note 2: T is calculated from the ambient temperature T and power  
Note 4: Dynamic supply current is higher due to the gate charge being  
delivered at the switching frequency.  
J
A
dissipation P according to the following formula:  
D
LTC1622CS8; T = T + (P • 150°C/W),  
J
A
D
LTC1622CMS8; T = T + (P • 250°C/W)  
J
A
D
W
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TYPICAL PERFORMANCE CHARACTERISTICS  
Shutdown Current  
vs Supply Voltage  
Maximum Current Sense Voltage  
vs Duty Cycle  
RUN/SS Current vs Supply Voltage  
45  
40  
35  
30  
25  
20  
15  
10  
5
3.50  
3.00  
2.50  
2.00  
1.50  
1.00  
110  
100  
90  
V
IN  
= 4.2V  
UNSYNC  
80  
70  
60  
50  
40  
0
30  
6
7
2
3
4
5
6
7
8
9
10  
60 70  
DUTY CYCLE (%)  
2
3
4
5
8
9
10  
20 30  
100  
40 50  
80 90  
SUPPLY VOLTAGE (V)  
SUPPLY VOLTAGE (V)  
1622 G01  
1622 G02  
1622 G03  
Normalized Oscillator Frequency  
vs Temperature  
Reference Voltage  
vs Temperature  
Undervoltage Lockout Voltage  
vs Temperature  
10.0  
7.5  
0.810  
0.805  
0.800  
0.795  
0.790  
0.785  
0.780  
0.775  
2.10  
2.05  
2.00  
1.95  
1.90  
1.85  
1.80  
1.75  
V
IN  
= 4.2V  
V
= 4.2V  
IN  
5.0  
2.5  
0
–2.5  
–5.0  
–7.5  
–10.0  
25 45 65  
5
TEMPERATURE (°C)  
–55 –35 –15  
25 45 65  
5
TEMPERATURE (°C)  
85 105 125  
25 45 65  
5
TEMPERATURE (°C)  
–55 –35 –15  
85 105 125  
–55 –35 –15  
85 105 125  
1622 G04  
1622 G05  
1622 G06  
3
LTC1622  
W
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TYPICAL PERFORMANCE CHARACTERISTICS  
Efficiency vs Load Current for  
Figure 1 with Burst Mode  
Operation Defeated  
Load Step Transient Response  
Burst Enabled  
Load Step Transient Response  
Burst Inhibited  
100  
90  
80  
70  
60  
50  
40  
V
= 3.3V  
IN  
V
= 4.2V  
IN  
V
= 6V  
IN  
V
= 8.4V  
IN  
ILOAD = 50mA TO 1.2A  
VIN = 4.2V  
ILOAD = 50mA TO 1.2A  
VIN = 4.2V  
V
R
= 2.5V  
= 0.03  
OUT  
SENSE  
1622 G08  
1622 G09  
1
10  
100  
1000  
LOAD CURRENT (mA)  
1622 G07  
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PIN FUNCTIONS  
SENSE(Pin 1): The Negative Input to the Current Com-  
parator.  
SYNC/MODE (Pin 5): This pin performs three functions.  
Greater than 2V on this pin allows Burst Mode operation  
at low load currents, while grounding or applying a clock  
signal on this pin defeats Burst Mode operation. An  
external clock between 625kHz and 750kHz applied to this  
pin forces the LTC1622 to operate at the external clock  
frequency. Do not attempt to synchronize below 625kHz.  
Pin 5 has an internal 1µA pull-up current source.  
ITH (Pin 2): Error Amplifier Compensation Point. The  
current comparator threshold increases with this control  
voltage. Nominal voltage range for this pin is 0V to 1.2V.  
VFB (Pin 3): Receives the feedback voltage from an exter-  
nal resistive divider across the output capacitor.  
RUN/SS (Pin 4): Combination of Soft-Start and Run  
Control Inputs. A capacitor to ground at this pin sets the  
ramptimetofulloutputcurrent. Thetimeisapproximately  
0.45s/µF. Forcing this pin below 0.4V causes all circuitry  
to be shut down.  
GND (Pin 6): Ground Pin.  
PDRV (PIN 7): Gate Drive for the External P-Channel  
MOSFET. This pin swings from 0V to VIN.  
VIN (Pin 8): Main Supply Pin. Must be closely decoupled  
to ground Pin 6.  
4
LTC1622  
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FUNCTIONAL DIAGRA  
Y = “0” ONLY WHEN X IS A CONSTANT “1”  
OTHERWISE Y = “1”  
V
IN  
V
CC  
BURST DEFEAT  
Y
X
1µA  
SLOPE  
COMP  
SYNC/  
5
MODE  
OSC  
0.36V  
0.3V  
V
IN  
1
+
8
SENSE  
V
3
FB  
+
EN  
FREQ  
+
SHIFT  
SLEEP  
0.8V  
REF  
+
V
IN  
V
+
0.12V  
EA  
ICOMP  
BURST  
g
m
= 0.5m  
2.5µA  
V
IN  
SWITCHING  
0.8V  
REFERENCE  
2
LOGIC  
AND  
S
RUN/  
I
TH  
RUN/SS  
4
V
SOFT-START  
R
Q
BLANKING  
CIRCUIT  
IN  
V
REF  
0.8V  
PDRV  
7
R
S1  
UVLO  
TRIP = 1.97V  
+
OV  
6
V
+ 60mV  
REF  
GND  
SHUTDOWN  
1622 BD  
U
(Refer to Functional Diagram)  
OPERATIO  
Main Control Loop  
current source to charge up the soft-start capacitor CSS.  
When CSS reaches 0.7V, the main control loop is enabled  
with the ITH voltage clamped at approximately 5% of its  
maximum value. As CSS continues to charge, ITH is gradu-  
ally released allowing normal operation to resume.  
TheLTC1622isaconstantfrequencycurrentmodeswitch-  
ing regulator. During normal operation, the external  
P-channel power MOSFET is turned on each cycle when  
the oscillator sets the RS latch (RS1) and turned off when  
the current comparator (ICOMP) resets the latch. The peak  
inductor current at which ICOMP resets the RS latch is  
controlledbythevoltageontheITH pin, whichistheoutput  
of the error amplifier EA. An external resistive divider  
connected between VOUT and ground allows EA to receive  
an output feedback voltage VFB. When the load current  
increases, it causes a slight decrease in VFB relative to the  
0.8V reference, which in turn causes the ITH voltage to  
increase until the average inductor current matches the  
new load current.  
Comparator OV guards against transient overshoots  
>7.5% by turning off the P-channel power MOSFET and  
keeping it off until the fault is removed.  
Burst Mode Operation  
The LTC1622 can be enabled to go into Burst Mode  
operationatlowloadcurrentssimplybyleavingtheSYNC/  
MODE pin open or connecting it to a voltage of at least 2V.  
In this mode, the peak current of the inductor is set as if  
VITH = 0.36V (at low duty cycles) even though the voltage  
at the ITH pin is at lower value. If the inductor’s average  
current is greater than the load requirement, the voltage at  
The main control loop is shut down by pulling the RUN/SS  
pin low. Releasing RUN/SS allows an internal 2.5µA  
5
LTC1622  
U
(Refer to Functional Diagram)  
OPERATIO  
the ITH pin will drop. When the ITH voltage goes below  
0.12V, the sleep signal goes high, turning off the external  
MOSFET. The sleep signal goes low when the ITH voltage  
rises above 0.22V and the LTC1622 resumes normal  
operation. The next oscillator cycle will turn the external  
MOSFET on and the switching cycle repeats.  
Short-Circuit Protection  
Whentheoutputisshortedtoground, thefrequencyofthe  
oscillator will be reduced to about 110kHz. This lower  
frequency allows the inductor current to safely discharge,  
thereby preventing current runaway. The oscillator’s fre-  
quency will gradually increase to its nominal value when  
the feedback voltage increases above 0.65V. Note that  
synchronization is inhibited until the feedback voltage  
goes above 0.3V.  
Frequency Synchronization  
The LTC1622 can be externally driven by a TTL/CMOS  
compatibleclocksignalupto750kHz. Donot synchronize  
the LTC1622 below its maximum default operating fre-  
quency of 625kHz as this may cause abnormal operation  
and an undesired frequency spectrum. The LTC1622 is  
synchronized to the rising edge of the clock. The external  
clock pulse width must be at least 100ns and not more  
than the period minus 200ns.  
Overvoltage Protection  
As a further protection, the overvoltage comparator in the  
LTC1622 will turn the external MOSFET off when the  
feedback voltage has risen 7.5% above the reference  
voltage of 0.8V. This comparator has a typical hysteresis  
of 35mV.  
Synchronization is inhibited when the feedback voltage is  
below 0.3V. This is to prevent inductor current buildup  
under short-circuit conditions. Burst Mode operation is  
deactivated when the LTC1622 is externally driven by a  
clock.  
Slope Compensation and Peak Inductor Current  
The inductor’s peak current is determined by:  
V
ITH  
I =  
PK  
10 R  
Dropout Operation  
SENSE  
(
)
When the input supply voltage decreases towards the  
output voltage, the rate of change of inductor current  
during the ON cycle decreases. This reduction means that  
the P-channel MOSFET will remain on for more than one  
oscillator cycle since the inductor current has not ramped  
up to the threshold set by EA. Further reduction in input  
supplyvoltagewilleventuallycausetheP-channelMOSFET  
tobeturnedon100%, i.e., DC. Theoutputvoltagewillthen  
be determined by the input voltage minus the voltage drop  
across the MOSFET, the sense resistor and the inductor.  
when the LTC1622 is operating below 40% duty cycle.  
However, once the duty cycle exceeds 40%, slope com-  
pensation begins and effectively reduces the peak induc-  
torcurrent. Theamountofreductionisgivenbythecurves  
in Figure 2.  
110  
100  
90  
80  
70  
60  
Undervoltage Lockout  
I
= 0.4I  
PK  
RIPPLE  
50  
40  
30  
20  
10  
AT 5% DUTY CYCLE  
= 0.2I  
TopreventoperationoftheP-channelMOSFETbelowsafe  
input voltage levels, an undervoltage lockout is incorpo-  
rated into the LTC1622. When the input supply voltage  
drops below 2V, the P-channel MOSFET and all circuitry is  
turned off except the undervoltage block, which draws  
only several microamperes.  
I
RIPPLE  
PK  
AT 5% DUTY CYCLE  
V
IN  
= 4.2V  
UNSYNC  
0
10 20 30 40 50 60 70 80 90 100  
DUTY CYCLE (%)  
1622 F02  
Figure 2. Maximum Output Current vs Duty Cycle  
6
LTC1622  
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APPLICATIONS INFORMATION  
The basic LTC1622 application circuit is shown in Figure  
V
OUT. The inductor’s peak-to-peak ripple current is given  
1. External component selection is driven by the load  
by:  
requirementandbeginswiththeselectionofLandRSENSE  
Next, the Power MOSFET and the output diode D1 are  
selected followed by CIN and COUT  
.
V V  
V
+ V  
IN  
OUT OUT D  
I
=
RIPPLE  
V + V  
f L  
( )  
.
IN  
D
wherefistheoperatingfrequency.Acceptinglargervalues  
of IRIPPLE allows the use of low inductances, but results in  
higher output voltage ripple and greater core losses. A  
reasonable starting point for setting ripple current is  
RSENSE Selection for Output Current  
RSENSE is chosen based on the required output current.  
Withthecurrentcomparatormonitoringthevoltagedevel-  
oped across RSENSE, the threshold of the comparator  
determines the inductor’s peak current. The output cur-  
rent the LTC1622 can provide is given by:  
I
RIPPLE =0.4(IOUT(MAX)).Remember,themaximumIRIPPLE  
occurs at the maximum input voltage.  
With Burst Mode operation selected on the LTC1622, the  
ripple current is normally set such that the inductor  
current is continuous during the burst periods. Therefore,  
the peak-to-peak ripple current should not exceed:  
0.08  
I
RIPPLE  
I
=
OUT  
R
2
SENSE  
where IRIPPLE is the inductor peak-to-peak ripple current  
(see Inductor Value Calculation section).  
0.036  
I
RIPPLE  
R
SENSE  
A reasonable starting point for setting ripple current is  
IRIPPLE = (0.4)(IOUT). Rearranging the above equation, it  
becomes:  
This implies a minimum inductance of:  
V V + V  
V
IN  
OUT  
OUT  
D
L
=
1
MIN  
R
=
for Duty Cycle < 40%  
V + V  
SENSE  
0.036  
IN  
D
15 I  
f
OUT  
( )(  
)
R
SENSE  
However,foroperationthatisabove40%dutycycle,slope  
compensation has to be taken into consideration to select  
the appropriate value to provide the required amount of  
current. Using Figure 2, the value of RSENSE is:  
(Use VIN(MAX) = VIN)  
A smaller value than LMIN could be used in the circuit;  
however, the inductor current will not be continuous  
during burst periods.  
SF  
R
=
SENSE  
Inductor Core Selection  
15  
I
100  
)(  
( )(  
)
OUT  
Once the value for L is known, the type of inductor must be  
selected. High efficiency converters generally cannot  
affordthecorelossfoundinlowcostpowderedironcores,  
forcing the use of more expensive ferrite, molypermalloy  
or Kool Mu® cores. Actual core loss is independent of core  
size for a fixed inductor value, but it is very dependent on  
inductance selected. As inductance increases, core losses  
go down. Unfortunately, increased inductance requires  
more turns of wire and therefore copper losses will  
increase. Ferritedesignshaveverylowcorelossesandare  
Inductor Value Calculation  
The operating frequency and inductor selection are inter-  
related in that higher operating frequencies permit the use  
of a smaller inductor for the same amount of inductor  
ripplecurrent. However, thisisattheexpenseofefficiency  
due to an increase in MOSFET gate charge losses.  
The inductance value also has a direct effect on ripple  
current. The ripple current, IRIPPLE, decreases with higher  
inductance or frequency and increases with higher VIN or  
Kool Mu is a registered trademark of Magnetics, Inc.  
7
LTC1622  
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APPLICATIONS INFORMATION  
In applications where the maximum duty cycle is less than  
100%andtheLTC1622isincontinuousmode,theRDS(ON)  
is governed by:  
preferred at high switching frequencies, so design goals  
canconcentrateoncopperlossandpreventingsaturation.  
Ferrite core materials saturate “hard,” which means that  
the inductance collapses abruptly when the peak design  
current is exceeded. This results in an abrupt increase in  
inductor ripple current and consequently, output voltage  
ripple. Do not allow the core to saturate!  
P
P
R
DS(ON)  
2
OUT  
1+ δp  
DC I  
(
)
(
)
where DC is the maximum operating duty cycle of the  
LTC1622.  
Molypermalloy (from Magnetics, Inc.) is a very good, low  
losscorematerialfortoroids,butitismoreexpensivethan  
ferrite. A reasonable compromise from the same manu-  
facturer is Kool Mu. Toroids are very space efficient,  
especially when you can use several layers of wire.  
Because they generally lack a bobbin, mounting is more  
difficult. However, newsurfacemountabledesignsthatdo  
not increase the height significantly are available.  
When the LTC1622 is operating in continuous mode, the  
MOSFET power dissipation is:  
2
) (  
V
OUT + VD  
PMOSFET  
=
IOUT 1+ δp RDS(ON)  
(
)
V + VD  
IN  
2
+K V  
IOUT CRSS  
f
(
IN) (  
)(  
)( )  
Power MOSFET Selection  
An external P-channel power MOSFET must be selected  
for use with the LTC1622. The main selection criteria for  
the power MOSFET are the threshold voltage VGS(TH) and  
the “on” resistance RDS(ON),reverse transfer capacitance  
CRSS and total gate charge.  
where K is a constant inversely related to gate drive  
current. Because of the high switching frequency, the  
second term relating to switching loss is important not to  
overlook. The constant K = 3 can be used to estimate the  
contributions of the two terms in the MOSFET dissipation  
equation.  
Since the LTC1622 is designed for operation down to low  
inputvoltages,asublogiclevelthresholdMOSFET(RDS(ON)  
guaranteed at VGS = 2.5V) is required for applications that  
workclosetothisvoltage.WhentheseMOSFETsareused,  
makesurethattheinputsupplytotheLTC1622islessthan  
the absolute maximum MOSFET VGS rating, typically 8V.  
The gate drive voltage levels are from ground to VIN.  
Output Diode Selection  
The catch diode carries load current during the off-time.  
The average diode current is therefore dependent on the  
P-channel switch duty cycle. At high input voltages the  
diode conducts most of the time. As VIN approaches VOUT  
the diode conducts only a small fraction of the time. The  
most stressful condition for the diode is when the output  
is short circuited. Under this condition the diode must  
safelyhandleIPEAK atcloseto100%dutycycle. Therefore,  
itisimportanttoadequatelyspecifythediodepeakcurrent  
and average power dissipation so as not to exceed the  
diode ratings.  
The required minimum RDS(ON) of the MOSFET is gov-  
erned by its allowable power dissipation. For applications  
that may operate the LTC1622 in dropout, i.e., 100% duty  
cycle, at its worst case the required RDS(ON) is given by:  
P
P
R
=
DS(ON)DC=100%  
2
I
(
1+ δp  
) (  
)
OUT(MAX)  
Under normal load conditions, the average current con-  
ducted by the diode is:  
where PP is the allowable power dissipation and δp is the  
temperature dependency of RDS(ON). (1 + δp) is generally  
given for a MOSFET in the form of a normalized RDS(ON) vs  
temperature curve, but δp = 0.005/°C can be used as an  
approximation for low voltage MOSFETs.  
V V  
IN  
OUT  
I =  
I
OUT  
D
V + V  
IN  
D
8
LTC1622  
U
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APPLICATIONS INFORMATION  
The allowable forward voltage drop in the diode is calcu-  
lated from the maximum short-circuit current as:  
1
VOUT IRIPPLE ESR +  
8fCOUT  
P
D
where f is the operating frequency, COUT is the output  
capacitance and IRIPPLE is the ripple current in the induc-  
tor. The output ripple is highest at maximum input voltage  
since IL increases with input voltage.  
V ≈  
F
I
SC(MAX)  
where PD is the allowable power dissipation and will be  
determined by efficiency and/or thermal requirements.  
The choice of using a smaller output capacitance in-  
creases the output ripple voltage due to the frequency  
dependent term, but can be compensated for by using  
capacitors of very low ESR to maintain low ripple voltage.  
TheITH pinOPTI-LOOPcompensationcomponentscanbe  
optimized to provide stable, high performance transient  
response regardless of the output capacitors selected.  
A fast switching diode must also be used to optimize  
efficiency. Schottky diodes are a good choice for low  
forwarddropandfastswitchingtimes. Remembertokeep  
lead length short and observe proper grounding (see  
Board Layout Checklist) to avoid ringing and increased  
dissipation.  
CIN and COUT Selection  
Manufacturers such as Nichicon, United Chemicon and  
Sanyoshouldbeconsideredforhighperformancethrough-  
hole capacitors. The OS-CON semiconductor dielectric  
capacitor available from Sanyo has the lowest ESR (size)  
product of any aluminum electrolytic at a somewhat  
higher price. Once the ESR requirement for COUT has been  
met, the RMS current rating generally far exceeds the  
In continuous mode, the source current of the P-channel  
MOSFET is a square wave of duty cycle (VOUT + VD)/  
(VIN + VD). To prevent large voltage transients, a low ESR  
input capacitor sized for the maximum RMS current must  
beused. ThemaximumRMScapacitorcurrentisgivenby:  
1/2  
]
IRIPPLE(P-P) requirement.  
V
V V  
OUT  
(
)
OUT IN  
[
C Required I  
I  
In surface mount applications, multiple capacitors may  
have to be paralleled to meet the ESR or RMS current  
handling requirements of the application. Aluminum elec-  
trolytic and dry tantalum capacitors are both available in  
surfacemountconfigurations. Inthecaseoftantalum, itis  
critical that the capacitors are surge tested for use in  
switching power supplies. An excellent choice is the AVX  
TPS, AVX TPSV and KEMET T510 series of surface mount  
tantalum, available in case heights ranging from 2mm to  
4mm.OthercapacitortypesincludeSanyoOS-CON,Sanyo  
POSCAP, Nichicon PL series and the Panasonic SP series.  
IN  
RMS MAX  
V
IN  
This formula has a maximum at VIN = 2VOUT, where IRMS  
= IOUT/2. This simple worst-case condition is commonly  
usedfordesignbecauseevensignificantdeviationsdonot  
offer much relief. Note that capacitor manufacturer’s  
ripplecurrentratingsareoftenbasedon2000hoursoflife.  
This makes it advisable to further derate the capacitor, or  
to choose a capacitor rated at a higher temperature than  
required. Several capacitors may be paralleled to meet the  
size or height requirements in the design. Due to the high  
operating frequency of the LTC1622, ceramic capacitors  
can also be used for CIN. Always consult the manufacturer  
if there is any question.  
Low Supply Operation  
Although the LTC1622 can function down to 2V, the  
maximum allowable output current is reduced when VIN  
decreasesbelow3V.Figure3showstheamountofchange  
as the supply is reduced down to 2V. Also shown in  
Figure3istheeffectofVIN onVREF asVIN goesbelow2.3V.  
Remember the maximum voltage on the ITH pin defines  
The selection of COUT is driven by the required effective  
series resistance (ESR). Typically, once the ESR require-  
ment is satisfied, the capacitance is adequate for filtering.  
The output ripple (VOUT) is approximated by:  
9
LTC1622  
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APPLICATIONS INFORMATION  
101  
is limiting the efficiency and which change would produce  
the most improvement. Efficiency can be expressed as:  
V
REF  
100  
99  
98  
97  
96  
95  
Efficiency = 100% – (η1 + η2 + η3 + ...)  
V
ITH  
where η1, η2, etc. are the individual losses as a percent-  
age of input power.  
Although all dissipative elements in the circuit produce  
losses, four main sources usually account for most of the  
losses in LTC1622 circuits: 1) LTC1622 DC bias current,  
2) MOSFET gate charge current, 3) I2R losses, 4) voltage  
drop of the output diode and 5) transition losses.  
2.0  
2.2  
2.4  
2.6  
2.8  
3.0  
INPUT VOLTAGE (V)  
1622 F03  
1. The VIN current is the DC supply current, given in the  
electricalcharacteristics, thatexcludesMOSFETdriver  
and control currents. VIN current results in a small loss  
which increases with VIN.  
Figure 3. Line Regulation of VREF and VITH  
the maximum current sense voltage that sets the maxi-  
mum output current.  
2. MOSFET gate charge current results from switching  
the gate capacitance of the power MOSFET. Each time  
a MOSFET gate is switched from low to high to low  
again,apacketofchargedQmovesfromVIN toground.  
The resulting dQ/dt is a current out of VIN which is  
typically much larger than the DC supply current. In  
continuous mode, IGATECHG = f(Qp).  
Setting Output Voltage  
The LTC1622 develops a 0.8V reference voltage between  
thefeedback(Pin3)terminalandground(seeFigure4).By  
selecting resistor R1, a constant current is caused to flow  
throughR1andR2tosettheoutputvoltage. Theregulated  
output voltage is determined by:  
3. I2R losses are predicted from the DC resistances of the  
MOSFET, inductor and current shunt. In continuous  
mode the average output current flows through L but  
is “chopped” between the P-channel MOSFET in series  
withRSENSE andtheoutputdiode.TheMOSFETRDS(ON)  
plus RSENSE multiplied by duty cycle can be summed  
with the resistance of the inductor to obtain I2R losses.  
R2  
R1  
V
= 0.8 1+  
OUT  
For most applications, a 30k resistor is suggested for R1.  
To prevent stray pickup, an optional 100pF capacitor is  
suggested across R1 located close to LTC1622.  
4. The output diode is a major source of power loss at  
high currents and gets worse at high input voltages.  
The diode loss is calculated by multiplying the forward  
voltage drop times the diode duty cycle multiplied by  
theloadcurrent. Forexample, assumingadutycycleof  
50% with a Schottky diode forward voltage drop of  
0.4V, the loss increases from 0.5% to 8% as the load  
current increases from 0.5A to 2A.  
V
OUT  
R2  
R1  
LTC1622  
3
V
FB  
100pF  
1622 F04  
Figure 4. Setting Output Voltage  
Efficiency Considerations  
5. Transition losses apply to the external MOSFET and  
increase with higher operating frequencies and input  
voltages. Transition losses can be estimated from:  
The efficiency of a switching regulator is equal to the  
output power divided by the input power times 100%. It is  
oftenusefultoanalyzeindividuallossestodeterminewhat  
10  
LTC1622  
U
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APPLICATIONS INFORMATION  
Transition Loss = 3(VIN)2IO(MAX) RSS  
(f)  
C
V
OUT  
LTC1622  
R2  
R1  
Other losses including CIN and COUT ESR dissipative  
losses, and inductor core losses, generally account for  
less than 2% total additional loss.  
+
I
V
FB  
TH  
D
FB  
Run/Soft-Start Function  
1622 F05  
The RUN/SS pin is a dual purpose pin that provides the  
soft-startfunctionandameanstoshutdowntheLTC1622.  
Soft-start reduces input surge current from VIN by gradu-  
ally increasing the internal current limit. Power supply  
sequencing can also be accomplished using this pin.  
Figure 5. Foldback Current Limiting  
Design Example  
Assume the LTC1622 is used in a single lithium-ion  
battery-poweredcellularphoneapplication.TheVIN willbe  
operating from a maximum of 4.2V down to a minimum of  
2.7V. Load current requirement is a maximum of 1.5A but  
most of the time it will be on standby mode, requiring only  
2mA. Efficiency at both low and high load current is  
important. Output voltage is 2.5V.  
An internal 2.5µA current source charges up an external  
capacitor CSS. When the voltage on the RUN/SS reaches  
0.7V the LTC1622 begins operating. As the voltage on  
RUN/SS continues to ramp from 0.7V to 1.8V, the internal  
current limit is also ramped at a proportional linear rate.  
The current limit begins near 0A (at VRUN/SS = 0.7V) and  
ends at 0.1/RSENSE (VRUN/SS 1.8V). The output current  
thus ramps up slowly, reducing the starting surge current  
required from the input power supply. If the RUN/SS has  
been pulled all the way to ground, there will be a delay  
before the current limit starts increasing and is given by:  
In the above application, Burst Mode operation is enabled  
by connecting Pin 5 to VIN.  
V
+ V  
D
+ V  
D
OUT  
Maximum Duty Cycle =  
= 93%  
V
IN(MIN)  
t
DELAY = 2.8 • 105 • CSS in seconds  
From Figure 2, SF = 57%.  
Pulling the RUN/SS pin below 0.4V puts the LTC1622 into  
a low quiescent current shutdown (IQ < 15µA).  
Use the curve of Figure 2 since the operating frequency is  
the free running frequency of the LTC1622.  
Foldback Current Limiting  
SF  
0.57  
RSENSE  
=
=
= 0.0253Ω  
As described in the Output Diode Selection, the worst-  
case dissipation occurs with a short-circuited output  
when the diode conducts the current limit value almost  
continuously. To prevent excessive heating in the diode,  
foldback current limiting can be added to reduce the  
current in proportion to the severity of the fault.  
15  
100  
15 1.5A  
( )(  
I
( )( OUT)(  
)
)
In the application, a 0.025resistor is used. For the  
inductor, the required value is:  
4.2 2.5  
0.036  
2.5 + 0.3  
4.2 + 0.3  
L
=
= 1.33µH  
MIN  
Foldback current limiting is implemented by adding diode  
DFB (1N4148orequivalent)betweentheoutputandtheITH  
pin as shown in Figure 5. In a hard short (VOUT = 0V), the  
current will be reduced to approximately 50% of the  
maximum output current.  
550kHz  
0.025  
In the application, a 3.9µH inductor is used to reduce  
inductor ripple current and thus, output voltage ripple.  
For the selection of the external MOSFET, the RDS(ON)  
mustbeguaranteedat2.5VsincetheLTC1622hastowork  
11  
LTC1622  
U
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APPLICATIONS INFORMATION  
down to 2.7V. Let’s assume that the MOSFET dissipation  
is to be limited to PP = 250mW and its thermal resistance  
is 50°C/W. Hence the junction temperature at TA = 25°C  
will be 37.5°C and δp = 0.005 (37.5 – 25) = 0.0625. The  
required RDS(ON) is then given by:  
layout diagram in Figure 6. Check the following in your  
layout:  
1. IstheSchottkydiodecloselyconnectedbetweenground  
at (–) lead of CIN and drain of the external MOSFET?  
2. Does the (+) plate of CIN connect to the sense resistor  
as closely as possible? This capacitor provides AC  
current to the MOSFET.  
P
2
P
R
= 0.11Ω  
DS(ON)  
DC I  
1+ δp  
(
) (  
)
OUT  
3. Is the input decoupling capacitor (0.1µF) connected  
The P-channel MOSFET requirement can be met by an  
Si6433DQ.  
closely between VIN (Pin 8) and ground (Pin 6)?  
4. Connect the end of RSENSE as close to VIN (Pin 8) as  
possible. The VIN pin is the SENSE+ of the current  
comparator.  
5. Is the trace from the SENSE(Pin 1) to the Sense  
resistor kept short? Does the trace connect close to  
The requirement for the Schottky diode is the most strin-  
gent when VOUT = 0V, i.e., short circuit. With a 0.025Ω  
RSENSE resistor, the short-circuit current through the  
Schottky is 0.1/0.025 = 4A. An MBRS340T3 Schottky  
diode is chosen. With 4A flowing through, the diode is  
rated with a forward voltage of 0.4V. Therefore, the worst-  
case power dissipated by the diode is 1.6W. The addition  
of DFB (Figure 5) will reduce the diode dissipation to  
approximately 0.8W.  
RSENSE  
?
6. Keep the switching node, SW, away from sensitive  
small signal nodes.  
7. Does the VFB pin connect directly to the feedback  
resistors? The resistive divider R1 and R2 must be  
connected between the (+) plate of COUT and signal  
ground. Optional capacitor C1 should be located as  
close as possible to the LTC1622.  
The input capacitor requires an RMS current rating of at  
least 0.75A at temperature, and COUT will require an ESR  
of 0.1for optimum efficiency.  
PC Board Layout Checklist  
R1andR2shouldbelocatedascloseaspossibletothe  
LTC1622. R2 should connect to the output as close to  
the load as practicable.  
When laying out the printed circuit board, the following  
checklist should be used to ensure proper operation of the  
LTC1622. These items are illustrated graphically in the  
V
IN  
+
R
SENSE  
C
IN  
1
2
3
4
8
7
6
5
SENSE  
V
IN  
M1  
0.1µF  
I
TH  
PDRV  
LTC1622  
GND  
L1  
SW  
V
OUT  
V
FB  
R
ITH  
+
C
SYNC/  
MODE  
OUT  
RUN/  
SS  
C1  
C
ITH  
C
SS  
QUIET SGND  
R1  
R2  
1622 F06  
BOLD LINES INDICATE HIGH CURRENT PATHS  
Figure 6. LTC1622 Layout Diagram (See PC Board Layout Checklist)  
12  
LTC1622  
U
TYPICAL APPLICATIONS  
LTC1622 1.8V/1.5A Regulator with Burst Mode Operation Disabled  
C1  
47µF  
16V  
V
IN  
+
2.5V TO  
8.5V  
U1  
R2  
0.025Ω  
1
2
8
7
6
5
1
2
3
4
8
7
6
5
SENSE  
V
IN  
L1  
3.3µH  
V
1.8V  
1.5A  
OUT  
I
TH  
PDRV  
LTC1622  
GND  
R3  
R1  
93.1k  
+
3
4
V
FB  
C2  
10K  
220µF  
C3  
6V  
SYNC/  
MODE  
RUN/  
SS  
R4  
75k  
220pF  
C4  
560pF  
1622 TA01  
C1: AVX TPSD476M016R0150  
C2: AVX TPSD227M006R0100  
L1: MURATA LQN6C3R3  
R2: DALE WSL-1206 0.025Ω  
U1: INTERNATIONAL RECTIFIER FETKY TM IRF7422D2  
LTC1622 2.5V/2A Regulator with Burst Mode Operation Enabled  
V
IN  
3.3V TO  
8.5V  
+
C1  
R2  
47µF  
16V  
× 2  
1
2
3
4
8
7
6
SENSE  
0.02Ω  
V
IN  
I
PDRV  
LTC1622  
TH  
M1  
L1  
4.7µH  
D1  
V
OUT  
V
GND  
2.5V  
2A  
FB  
R1  
10k  
R3  
RUN/  
SS  
158k  
C2  
+
5
SYNC/  
MODE  
150µF  
6V  
C3  
220pF  
R4  
75k  
× 2  
C4  
560pF  
1622 TA02  
C1: AVX TPSD476M016R0150  
C2: SANYO POSCAP 6TPA47M  
D1: MOTOROLA MBR320T3  
L1: COILCRAFT D03316-472  
M1: SILICONIX Si3443DV  
R2: DALE WSL-2010 0.02Ω  
FETKY is a trademark of International Rectifier Corporation.  
13  
LTC1622  
TYPICAL APPLICATIONS  
U
LTC1622 2.5V/3A Regulator with External Frequency Synchronization  
V
IN  
3.3V TO  
8.5V  
C1  
+
+
R2  
47µF  
16V  
× 2  
1
2
3
4
8
7
6
5
0.01Ω  
SENSE  
V
IN  
I
TH  
PDRV  
LTC1622  
GND  
M1  
L1  
4.7µH  
D1  
V
OUT  
V
FB  
R1  
10k  
2.5V  
3A  
R3  
C2  
SYNC/  
MODE  
RUN/  
SS  
158k  
100µF  
6.3V  
× 2  
C3  
220pF  
650kHz  
1.5V  
R4  
75k  
C4  
560pF  
P-P  
1622 TA03  
C1: AVX TPSD476M016R0150  
C2: AVX TPSD107M010R0065  
D1: MOTOROLA MBR320T3  
L1: COILCRAFT D03316-472  
M1: SILICONIX Si3443DV  
R2: DALE WSL-2512 0.01Ω  
Zeta Converter with Foldback Current Limit  
V
IN  
2.5V TO  
8.5V  
C1  
+
R2  
D2  
1N4818  
47µF  
16V  
× 2  
1
2
3
4
8
7
6
5
0.04Ω  
SENSE  
V
IN  
I
PDRV  
LTC1622  
TH  
Si3441DV  
L1B  
6.2µH  
V
OUT  
V
GND  
FB  
3.3V  
+
R1  
47k  
+
C2  
R3  
D1  
47µF  
16V  
100µF  
RUN/  
SS  
SYNC/  
MODE  
232k  
L1A  
6.2µH  
10V  
C3  
470pF  
C4  
0.1µF  
R4  
75k  
1622 TA04  
V
I
IN  
OUT(MAX)  
(A)  
C1: AVX TPSD476M016R0150  
C2: AVX TPSD107M010R0080  
D1: MOTOROLA MBRS320T3  
2
3
(V)  
2.5  
3.3  
5.0  
6.0  
8.4  
0.45  
0.70  
0.95  
1.00  
1.05  
L1A  
L1B  
TOP VIEW  
L1A, L1B: BH ELECTRONICS BH511-1012  
4
1
R2: DALE WSL-1206 0.04Ω  
14  
LTC1622  
U
PACKAGE DESCRIPTION Dimensions in inches (millimeters) unless otherwise noted.  
MS8 Package  
8-Lead Plastic MSOP  
(LTC DWG # 05-08-1660)  
0.118 ± 0.004*  
(3.00 ± 0.102)  
8
7
6
5
0.118 ± 0.004**  
(3.00 ± 0.102)  
0.193 ± 0.006  
(4.90 ± 0.15)  
1
2
3
4
0.040 ± 0.006  
(1.02 ± 0.15)  
0.034 ± 0.004  
(0.86 ± 0.102)  
0.007  
(0.18)  
0° – 6° TYP  
SEATING  
PLANE  
0.012  
(0.30)  
REF  
0.021 ± 0.006  
(0.53 ± 0.015)  
0.006 ± 0.004  
(0.15 ± 0.102)  
0.0256  
(0.65)  
BSC  
MSOP (MS8) 1098  
* DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH,  
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE  
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.  
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE  
S8 Package  
8-Lead Plastic Small Outline (Narrow 0.150)  
(LTC DWG # 05-08-1610)  
0.189 – 0.197*  
(4.801 – 5.004)  
7
5
8
6
0.150 – 0.157**  
(3.810 – 3.988)  
0.228 – 0.244  
(5.791 – 6.197)  
1
3
4
2
0.010 – 0.020  
(0.254 – 0.508)  
× 45°  
0.053 – 0.069  
(1.346 – 1.752)  
0.004 – 0.010  
(0.101 – 0.254)  
0.008 – 0.010  
(0.203 – 0.254)  
0°– 8° TYP  
0.016 – 0.050  
(0.406 – 1.270)  
0.050  
(1.270)  
BSC  
0.014 – 0.019  
(0.355 – 0.483)  
TYP  
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE  
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD  
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE  
SO8 1298  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.  
15  
LTC1622  
TYPICAL APPLICATION  
U
Small Footprint 3.3V/1A Regulator  
Efficiency vs Load Current  
100  
90  
80  
70  
60  
50  
V
IN  
3.3V TO  
8.5V  
V
= 3.5V  
IN  
+
+
C1  
R2  
10µF  
16V  
0.025Ω  
1
2
3
4
8
7
6
5
SENSE  
V
IN  
CERAMIC  
L1  
2.2µH  
I
PDRV  
V
= 4.2V  
IN  
M1  
TH  
LTC1622  
GND  
V
3.3V  
1A  
OUT  
V
= 6V  
IN  
V
FB  
R1  
R3  
232k  
10k  
SYNC/  
MODE  
D1  
RUN/  
SS  
C2  
47µF  
6V  
C3  
220pF  
C4  
560pF  
R4  
75k  
V
R
= 3.3V  
OUT  
SENSE  
= 0.025  
1622 TA05  
1
10  
100  
1000  
C1: MURATA CERAMIC GRM235Y5V106Z  
C2: SANYO POSCAP 6TPA47M  
D1: MOTOROLA MBRS120LT3  
L1: COILCRAFT D01608C-222  
M1: SILICONIX Si3443DY  
R2: DALE WSL-2010 0.025Ω  
LOAD CURRENT (mA)  
1622 TA05b  
Efficiency vs Load Current With LTC1622  
Configured as Boost Converter  
Boost Converter 3.3V/2.5A  
100  
V
R
= 5V  
SENSE  
OUT  
1
8
V
IN  
3.3V  
= 0.015  
SENSE  
V
IN  
+
C1  
R2  
C6  
90  
80  
70  
60  
50  
100µF  
10V  
0.015Ω  
2
3
4
7
6
5
0.1µF  
V
= 3.3V  
I
TH  
PDRV  
IN  
LTC1622  
C3  
V
5V  
2.5A  
OUT  
470pF  
L1  
4.6µH  
V
FB  
GND  
R3  
M1  
SYNC/  
MODE  
RUN/  
SS  
105k  
C2  
R1  
33k  
+
220µF  
10V  
D1  
R4  
20k  
C5  
150pF  
C4  
0.1µF  
×2  
Si6801DQ  
1622 TA06a  
C1, C2: SANYO POSCAP TPB SERIES M1: SILICONIX Si3442DV  
0.001  
0.01  
0.1  
1
D1: MOTOROLA MBRD835L  
L1: SUMIDA CEP123-4R6  
R2: DALE WS-L2512 0.015Ω  
LOAD CURRENT (mA)  
1622 TA06b  
RELATED PARTS  
PART NUMBER  
LTC1147 Series  
LT1375/LT1376  
DESCRIPTION  
COMMENTS  
High Efficiency Step-Down Switching Regulator Controllers  
1.5A, 500kHz Step-Down Switching Regulators  
100% DC, 3.5V V 16V, HV Version Has 20V  
IN  
IN  
High Frequency, Small Inductor, High Efficiency  
LTC1436/LTC1436-PLL High Efficiency, Low Noise, Synchronous Step-Down Converters  
24-Pin Narrow SSOP, 3.5V V 36V  
IN  
LTC1438/LTC1439  
LTC1474/LTC1475  
LTC1624  
Dual, Low Noise, Synchronous Step-Down Converters  
Low Quiescent Current Step-Down DC/DC Converters  
High Efficiency SO-8 N-Channel Switching Regulator Controller  
Low Voltage, High Efficiency Step-Down DC/DC Converter  
Low Voltage, Monolithic Synchronous Step-Down Regulator  
Dual High Efficiency 2-Phase Step-Down Controller  
SOT-23 Current Mode Step-Down Controller  
Multiple Output Capability, 3.5V V 36V  
IN  
Monolithic, MSOP, I  
= 10µA  
OUT  
8-Pin N-Channel Drive, 3.5V V 36V  
IN  
LTC1626  
Monolithic, Constant Off-Time, 2.5V V 6V  
IN  
LTC1627/LTC1707  
LTC1628  
Low Supply Voltage Range: 2.65V to 8V, 0.5A  
Antiphase Drive, 3.5V V 36V, Protection  
IN  
LTC1772  
6-Lead SOT-23, 2.5V V 9.8V, 550kHz  
IN  
LTC1735  
High Efficiency, Low Noise Synchronous Switching Controller  
Burst Mode Operation, Protection, 3.5V V 36V  
IN  
1622f LT/TP 0100 4K • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
16  
LINEAR TECHNOLOGY CORPORATION 1998  
(408)432-1900 FAX:(408)434-0507 www.linear-tech.com  

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