ESTW025A0F4Z [LINEAGEPOWER]

ESTW025A0F Series (Eighth-Brick) DC-DC Converter Power Modules; ESTW025A0F系列(八分之一砖)的DC -DC转换器电源模块
ESTW025A0F4Z
型号: ESTW025A0F4Z
厂家: LINEAGE POWER CORPORATION    LINEAGE POWER CORPORATION
描述:

ESTW025A0F Series (Eighth-Brick) DC-DC Converter Power Modules
ESTW025A0F系列(八分之一砖)的DC -DC转换器电源模块

转换器 电源电路
文件: 总20页 (文件大小:1282K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Data Sheet  
October 11, 2011  
ESTW025A0F Series (Eighth-Brick) DC-DC Converter Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output Current  
Features  
STINGRAY™ SERIES  
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Wide input voltage range: 36-75 Vdc  
Delivers up to 25A Output current  
Monotonic startup into prebiased load  
Output Voltage adjust: 80% to 110% of Vo,nom  
Remote sense  
Constant switching frequency  
Positive remote On/Off logic  
Input under voltage protection  
Output overcurrent and overvoltage protection  
Over-temperature protection  
RoHS Compliant  
Industry standard, DOSA compliant footprint  
57.9mm x 22.8mm x 8.5mm  
Applications  
(2.28 in x 0.9 in x 0.335 in)  
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Distributed power architectures  
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Low profile height and reduced component skyline  
Wireless networks  
Suitable for cold wall cooling using suitable Gap  
Pad applied directly to top side of module  
Access and optical network Equipment  
Enterprise Networks including Power over Ethernet  
(PoE)  
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High efficiency 92% at full load (Vin=48Vdc)  
No thermal derating up to 68°C, 1.0m/s (200 LFM)  
Wide operating temperature range (-40°C to 85°C)  
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Latest generation IC’s (DSP, FPGA, ASIC) and  
Microprocessor powered applications  
Compliant to RoHS EU Directive 2002/95/EC (-Z  
versions)  
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Compliant to ROHS EU Directive 2002/95/EC with  
lead solder exemption (non-Z versions)  
UL* 60950-1, 2nd Ed. Recognized, CSAC22.2 No.  
60950-1-07 Certified, and VDE(EN60950-1, 2nd  
Ed.) Licensed  
Options  
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Negative Remote On/Off logic (-1 option,  
preferred/standard)  
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Surface Mount version (-S option)  
Auto-restart (-4 option, preferred/standard)  
Trimmed leads (-6 or -8 options)  
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CE mark meets 2006/95/EC directive§  
Meets the voltage and current requirements for  
ETSI 300-132-2 and complies with and licensed for  
Basic insulation rating per EN60950-1  
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2250 Vdc Isolation tested in compliance with IEEE  
802.3¤ PoE standards  
ISO**9001 and ISO 14001 certified manufacturing  
facilities  
Description  
The ESTW025A0F series, Eighth-brick power modules are isolated dc-dc converters that can deliver up to 25A of output  
current and provide a precisely regulated output voltage over a wide range of input voltages (Vin = 36 -75Vdc). The  
module achieves typical full load efficiency of 92% at 3.3Vdc output voltage. The open frame modules construction, available  
in both surface-mount and through-hole packaging, enable designers to develop cost- and space-efficient solutions.  
Document No: DS09-013 ver.1.01  
PDF name: ESTW025A0F.pdf  
*
UL is a registered trademark of Underwriters Laboratories, Inc.  
CSA is a registered trademark of Canadian Standards Association.  
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.  
This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.  
IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.  
§
¤
** ISO is a registered trademark of the International Organization of Standards  
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
Absolute Maximum Ratings  
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute  
stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those  
given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can  
adversely affect the device reliability.  
Parameter  
Device  
Symbol  
Min  
Max  
Unit  
Input Voltage  
Continuous  
All  
All  
VIN  
VIN,trans  
TA  
-0.3  
-0.3  
-40  
-40  
80  
100  
85  
Vdc  
Vdc  
°C  
°C  
Transient, operational (100 ms)  
Operating Ambient Temperature  
Maximum Base-plate Operating Temperature  
(see Thermal Considerations section)  
All  
-18H, H  
TC  
110  
Storage Temperature  
All  
All  
Tstg  
-55  
125  
°C  
I/O Isolation voltage (100% factory Hi-Pot tested)  
2250  
Vdc  
Electrical Specifications  
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature  
conditions.  
Parameter  
Device  
Symbol  
Min  
Typ  
Max  
Unit  
Operating Input Voltage  
Maximum Input Current  
(VIN= VIN, min to VIN, max, IO=IO, max  
Input No Load Current  
All  
VIN  
36  
48  
75  
Vdc  
All  
All  
IIN,max  
2.7  
Adc  
)
IIN,No load  
50  
6
mA  
(VIN = VIN, nom, IO = 0, module enabled)  
Input Stand-by Current  
All  
All  
IIN,stand-by  
I2t  
8
1
mA  
A2s  
(VIN = VIN, nom, module disabled)  
Inrush Transient  
Input Reflected Ripple Current, peak-to-peak  
(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max,  
IO= IOmax ; See Test configuration section)  
All  
All  
30  
50  
mAp-p  
dB  
Input Ripple Rejection (120Hz)  
CAUTION: This power module is not internally fused. An input line fuse must always be used.  
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an  
integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,  
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies  
require a fast-acting fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information  
provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating  
can be used. Refer to the fuse manufacturer’s data sheet for further information.  
LINEAGE POWER  
2
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
Electrical Specifications (continued)  
Parameter  
Device Symbol  
Min  
Typ  
Max  
Unit  
Nominal Output Voltage Set-point  
VIN=VIN, nom, IO=IO, max, TA=25°C)  
All  
All  
VO, set  
VO  
3.250  
3.200  
3.300  
3.350  
3.400  
Vdc  
Vdc  
Output Voltage  
(Over all operating input voltage, resistive load, and  
temperature conditions until end of life)  
Output Regulation  
Line (VIN=VIN, min to VIN, max  
Load (IO=IO, min to IO, max  
Temperature (Tref=TA, min to TA, max  
)
All  
All  
All  
±0.1  
10  
% VO, set  
±0.2  
)
mV  
% VO, set  
)
Output Ripple and Noise on nominal output  
(Co=1uF,ceramic+10uF,tantalum, VIN=VIN, nom ,IO= IO,  
max , TA=TA, min to TA, max  
)
RMS (5Hz to 20MHz bandwidth)  
All  
All  
All  
All  
8
20  
75  
mVrms  
mVpk-pk  
μF  
0
Peak-to-Peak (5Hz to 20MHz bandwidth)  
External Capacitance 1  
40  
CO, max  
Io  
IO, lim  
20,000  
25.0  
Output Current  
0
Adc  
Output Current Limit Inception (Hiccup Mode )  
All  
All  
26.3  
29  
32.5  
Adc  
(VO= 90% of VO, set  
)
Output Short-Circuit Current (VO250mV)  
( Hiccup Mode)  
IO, s/c  
1.6  
Arms  
Efficiency  
VIN= VIN, nom, TA=25°C, IO=IO, max , VO= VO,set  
VIN= VIN, nom, TA=25°C, IO=10A, VO= VO,set  
VIN= VIN, nom, TA=25°C, IO=5A , VO= VO,set  
All  
All  
All  
η
η
η
91.0  
91.0  
85.5  
92.0  
92.0  
87.0  
%
%
%
Switching Frequency  
All  
fsw  
355  
kHz  
Dynamic Load Response  
(Co=1uF,ceramic+220uF,tantalum, dIo/dt=0.1A/s;  
VIN = 48V; TA=25°C)  
Load Change from Io= 50% to 75% or 25% to 50% of  
Io,max  
Peak Deviation  
All  
All  
Vpk  
ts  
127  
200  
mV  
Settling Time (Vo<10% peak deviation)  
s  
1.  
See Note 2 under Feature Specifications.  
Isolation Specifications  
Parameter  
Device Symbol  
Min  
Typ  
1000  
30  
Max  
Unit  
pF  
Isolation Capacitance  
All  
All  
All  
Ciso  
Riso  
All  
Isolation Resistance  
MΩ  
Vdc  
I/O Isolation Voltage (100% factory Hi-pot tested)  
2250  
General Specifications  
Parameter  
Device  
Symbol  
Min  
Typ  
Max  
Unit  
Calculated Reliability based upon Telcordia SR-332  
Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C,  
airflow = 200 lfm, 90% confidence)  
All  
FIT  
229.4  
109/Hours  
All  
MTBF  
4,359,904  
Hours  
g(oz)  
g(oz)  
Weight (Open Frame)  
Weight (with Heatplate)  
All  
All  
22 (0.78)  
35 (1.23)  
LINEAGE POWER  
3
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
Feature Specifications  
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature  
conditions. See Feature Descriptions for additional information.  
Parameter  
Device  
Symbol  
Min  
Typ  
Max  
Unit  
Remote On/Off Signal Interface  
(VIN=VIN, min to VIN, max ; open collector or equivalent,  
Signal referenced to VIN- terminal)  
Negative Logic: device code suffix “1”  
Logic Low = module On, Logic High = module Off  
Positive Logic: No device code suffix required  
Logic Low = module Off, Logic High = module On  
Logic Low - Remote On/Off Current  
All  
All  
All  
All  
Ion/off  
Von/off  
Von/off  
Ion/off  
0.15  
0.6  
mA  
Vdc  
Vdc  
μA  
-0.7  
2.4  
Logic Low - On/Off Voltage  
Logic High Voltage – (Typ = Open Collector)  
Logic High maximum allowable leakage current  
Turn-On Delay1 and Rise Times  
15.0  
25  
(IO=IO, max , VIN=VIN, nom, TA = 25oC)  
Case 1: Input power is applied for >1 second and then  
the On/Off input is set to ON (Tdelay = time from instant  
All  
All  
Tdelay  
12  
20  
msec  
msec  
On/Off signal is ON until VO = 10% of VO, set  
)
Case 2: On/Off input is set to Logic Low (Module  
ON) and then input power is applied (Tdelay = time  
Tdelay  
at which VIN = VIN, min until Vo=10% of VO,set  
Output voltage Rise time (time for Vo to rise from 10%  
of Vo,set to 90% of Vo, set  
)
All  
All  
Trise  
4
msec  
)
Output voltage overshoot – Startup  
IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 oC  
Prebias Output Load Performance:  
5
% VO, set  
Output Start up characteristic  
All  
All  
All  
All  
All  
All  
All  
Monotonic  
-15  
Back Bias current drawn from output (Module Enabled)  
Remote Sense Range  
mAdc  
% VO, set  
% VO, set  
Vdc  
VSENSE  
10  
+10  
5.1  
Output Voltage Adjustment Range  
Output Overvoltage Protection (CO=470μF)2  
Overtemperature Protection – Hiccup Auto Restart  
Input Undervoltage Lockout  
Turn-on Threshold  
-20  
3.9  
VO, limit  
Tref  
125  
OC  
VUVLO  
34.0  
32.0  
2.0  
35.5  
Vdc  
Vdc  
Vdc  
30.5  
1.0  
Turn-off Threshold  
Hysteresis  
1.  
2.  
The module has an adaptable extended Turn-On Delay interval, Tdelay, of 25mS. The extended Tdelay will occur when the module restarts  
following the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and  
then back to normal.  
The module requires a minimum of 470 μF external output capacitor to prevent shutdown during full load to no load transients and to avoid  
exceeding the OVP maximum limits during startup into open loop fault conditions.  
LINEAGE POWER  
4
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
Characteristic Curves  
The following figures provide typical characteristics for the ESTW025A0F (3.3V, 25A) at 25oC. The figures are  
identical for either positive or negative remote On/Off logic.  
OUTPUT CURRENT, IO (A)  
TIME, t (200µs/div)  
Figure 4. Transient Response to 0.1A/µS Dynamic  
Load Change from 50% to 75% to 50% of full load.  
Figure 1. Converter Efficiency versus Output Current.  
TIME, t (10ms/div)  
TIME, t (2s/div)  
Figure 2. Typical output ripple and noise (VIN = VIN,NOM,  
Io = Io,max).  
Figure 5. Typical Start-up Using Remote On/Off,  
negative logic version shown (VIN = VIN,NOM, Io = Io,max).  
TIME, t (200µs/div)  
TIME, t (5ms/div)  
Figure 3. Transient Response to 0.1A/µS Dynamic  
Load Change from 25% to 50% to 25% of full load.  
Figure 6. Typical Start-up Using Input Voltage (VIN =  
VIN,NOM, Io = Io,max).  
LINEAGE POWER  
5
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
Test Configurations  
Design Considerations  
Input Filtering  
CURRENT PROBE  
Vin+  
TO OSCILLOSCOPE  
The power module should be connected to a low  
ac-impedance source. Highly inductive source  
impedance can affect the stability of the power  
module. For the test configuration in Figure 7 a 100μF  
electrolytic capacitor (ESR<0.7at 100kHz), mounted  
close to the power module helps ensure the stability of  
the unit. Consult the factory for further application  
guidelines.  
LTEST  
12μH  
CS 220μF  
100μF  
E.S.R.<0.1  
@ 20°C 100kHz  
Vin-  
Safety Considerations  
For safety-agency approval of the system in which the  
power module is used, the power module must be  
installed in compliance with the spacing and  
separation requirements of the end-use safety agency  
standard, i.e. UL60950-1, CSA C22.2 No.60950-1,  
and VDE0805-1(IEC60950-1).  
NOTE: Measure input reflected ripple current with a simulated  
source inductance (LTEST) of 12μH. Capacitor CS offsets  
possible battery impedance. Measure current as shown  
above.  
Figure 7. Input Reflected Ripple Current Test  
Setup.  
COPPER STRIP  
If the input source is non-SELV (ELV or a hazardous  
voltage greater than 60 Vdc and less than or equal to  
75Vdc), for the module’s output to be considered as  
meeting the requirements for safety extra-low voltage  
(SELV), all of the following must be true:  
VO(+)  
VO(–)  
RESISTIVE  
LOAD  
SCOPE  
.
The input source is to be provided with reinforced  
insulation from any other hazardous voltages,  
including the ac mains.  
0.01uF  
10uF  
0.1uF  
GROUND PLANE  
NOTE: All voltage measurements to be taken at the module  
terminals, as shown above. If sockets are used then  
Kelvin connections are required at the module terminals  
to avoid measurement errors due to socket contact  
resistance.  
.
One VIN pin and one VOUT pin are to be grounded,  
or both the input and output pins are to be kept  
floating.  
.
.
The input pins of the module are not operator  
accessible.  
Figure 8. Output Ripple and Noise Test Setup.  
Another SELV reliability test is conducted on the  
whole system (combination of supply source and  
subject module), as required by the safety  
agencies, to verify that under a single fault,  
hazardous voltages do not appear at the  
module’s output.  
Rdistribution Rcontact  
Rcontact Rdistribution  
Vin+  
Vout+  
RLOAD  
Note: Do not ground either of the input pins of the  
module without grounding one of the output  
pins. This may allow a non-SELV voltage to  
appear between the output pins and ground.  
VO  
VIN  
Rdistribution Rcontact  
Rcontact Rdistribution  
Vin-  
Vout-  
The power module has extra-low voltage (ELV)  
outputs when all inputs are ELV.  
NOTE: All voltage measurements to be taken at the module  
terminals, as shown above. If sockets are used then  
Kelvin connections are required at the module terminals  
to avoid measurement errors due to socket contact  
resistance.  
All flammable materials used in the manufacturing of  
these modules are rated 94V-0, or tested to the  
UL60950 A.2 for reduced thickness.  
For input voltages exceeding 60 Vdc but less than or  
equal to 75 Vdc, these converters have been  
evaluated to the applicable requirements of BASIC  
INSULATION between secondary DC MAINS  
DISTRIBUTION input (classified as TNV-2 in Europe)  
and unearthed SELV outputs.  
Figure 9. Output Voltage and Efficiency Test  
Setup.  
VO. IO  
Efficiency  
=
x
100 %  
VIN. IIN  
The input to these units is to be provided with a  
maximum 5 A fast-acting fuse in the ungrounded lead.  
LINEAGE POWER  
6
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
be increased, which at the same output current would  
increase the power output of the module. Care should  
be taken to ensure that the maximum output power of  
the module remains at or below the maximum rated  
power (Maximum rated power = Vo,set x Io,max).  
Feature Description  
Remote On/Off  
Two remote on/off options are available. Positive logic  
turns the module on during a logic high voltage on the  
ON/OFF pin, and off during a logic low. Negative logic  
remote On/Off, device code suffix “1”, turns the  
module off during a logic high and on during a logic  
low.  
SENSE(+)  
SENSE()  
VI(+)  
VI(-)  
VO(+)  
VO(–)  
IO  
SUPPLY  
LOAD  
II  
Vin+  
Vout+  
CONTACT  
RESISTANCE  
CONTACT AND  
DISTRIBUTION LOSSE  
Ion/off  
ON/OFF  
TRIM  
Figure 11. Circuit Configuration for remote  
sense .  
Von/off  
Input Undervoltage Lockout  
At input voltages below the input undervoltage lockout  
limit, the module operation is disabled. The module  
will only begin to operate once the input voltage is  
raised above the undervoltage lockout turn-on  
Vout-  
Vin-  
threshold, VUV/ON  
.
Figure 10. Remote On/Off Implementation.  
Once operating, the module will continue to operate  
until the input voltage is taken below the undervoltage  
To turn the power module on and off, the user must  
supply a switch (open collector or equivalent) to  
control the voltage (Von/off) between the ON/OFF  
terminal and the VIN(-) terminal (see Figure 10). Logic  
low is 0V Von/off 1.2V. The maximum Ion/off during a  
logic low is 1mA, the switch should maintain a logic  
low level while sinking this current.  
turn-off threshold, VUV/OFF  
.
Overtemperature Protection  
To provide protection under certain fault conditions,  
the unit is equipped with a thermal shutdown circuit.  
The unit will shutdown if the thermal reference point  
Tref (Figure 13), exceeds 125oC (typical), but the  
thermal shutdown is not intended as a guarantee that  
the unit will survive temperatures beyond its rating.  
The module can be restarted by cycling the dc input  
power for at least one second or by toggling the  
remote on/off signal for at least one second. If the  
auto-restart option (4) is ordered, the module will  
automatically restart upon cool-down to a safe  
temperature.  
During a logic high, the typical maximum Von/off  
generated by the module is 15V, and the maximum  
allowable leakage current at Von/off = 5V is 1μA.  
If not using the remote on/off feature:  
For positive logic, leave the ON/OFF pin open.  
For negative logic, short the ON/OFF pin to VIN(-).  
Remote Sense  
Output Overvoltage Protection  
Remote sense minimizes the effects of distribution  
losses by regulating the voltage at the remote-sense  
connections (See Figure 11). The voltage between the  
remote-sense pins and the output terminals must not  
exceed the output voltage sense range given in the  
Feature Specifications table:  
The output over voltage protection scheme of the  
modules has an independent over voltage loop to  
prevent single point of failure. This protection feature  
latches in the event of over voltage across the output.  
Cycling the on/off pin or input voltage resets the  
latching protection feature. If the auto-restart option  
(4) is ordered, the module will automatically restart  
upon an internally programmed time elapsing.  
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] 0.5 V  
Although the output voltage can be increased by both  
the remote sense and by the trim, the maximum  
increase for the output voltage is not the sum of both.  
The maximum increase is the larger of either the  
remote sense or the trim.  
Overcurrent Protection  
To provide protection in a fault (output overload)  
condition, the unit is equipped with internal  
current limiting circuitry and can endure current  
limiting continuously. At the point of current limit  
inception, the unit enters hiccup mode. If the unit is  
The amount of power delivered by the module is  
defined as the voltage at the output terminals  
multiplied by the output current. When using remote  
sense and trim, the output voltage of the module can  
LINEAGE POWER  
7
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
the output voltage set point. The following equation  
determines the required external resistor value to  
obtain a percentage output voltage change of Δ%:  
Feature Descriptions (continued)  
not configured with auto–restart, then it will latch off  
following the over current condition. The module can  
be restarted by cycling the dc input power for at least  
one second or by toggling the remote on/off signal for  
at least one second. If the unit is configured with the  
auto-restart option (4), it will remain in the hiccup  
mode as long as the overcurrent condition exists; it  
operates normally, once the output current is brought  
back into its specified range. The average output  
5.11V  
(100  %)  
511  
o,set  
Rtrimup  
10.22   
1.225 %  
%  
Vdesired Vo, set  
Where  
%   
100  
Vo, set  
For example, to trim-up the output voltage of the  
module by 5% to 3.465V, Rtrim-up is calculated is as  
follows:  
current during hiccup is 10% IO, max  
.
Output Voltage Programming  
% 5  
Trimming allows the output voltage set point to be  
increased or decreased, this is accomplished by  
connecting an external resistor between the TRIM pin  
and either the VO(+) pin or the VO(-) pin.  
5.11 3.3 (100 5) 511  
Rtrim up  
10.22   
1.225 5  
5
Rtrimup 176.7  
The voltage between the VO(+) and VO(–) terminals  
must not exceed the minimum output overvoltage  
protection value shown in the Feature Specifications  
table. This limit includes any increase in voltage due  
to remote-sense compensation and output voltage  
set-point adjustment trim.  
VIN(+)  
VO(+)  
VOTRIM  
VO(-)  
Rtrim-up  
ON/OFF  
LOAD  
Although the output voltage can be increased by both  
the remote sense and by the trim, the maximum  
increase for the output voltage is not the sum of both.  
The maximum increase is the larger of either the  
remote sense or the trim. The amount of power  
delivered by the module is defined as the voltage at  
the output terminals multiplied by the output current.  
When using remote sense and trim, the output voltage  
of the module can be increased, which at the same  
output current would increase the power output of the  
module. Care should be taken to ensure that the  
maximum output power of the module remains at or  
below the maximum rated power (Maximum rated  
power = VO,set x IO,max).  
Rtrim-down  
VIN(-)  
Figure 12. Circuit Configuration to Trim Output  
Voltage.  
Connecting an external resistor (Rtrim-down) between  
the TRIM pin and the VO(-) (or Sense(-)) pin  
decreases the output voltage set point. To maintain  
set point accuracy, the trim resistor tolerance should  
be ±1.0%.  
The following equation determines the required  
external resistor value to obtain a percentage output  
voltage change of Δ%  
511  
Rtrim down  
10 .22   
%  
Vo,set Vdesired  
Where  
%   
100  
Vo,set  
For example, to trim-down the output voltage of the  
module by 8% to 3.036V, Rtrim-down is calculated as  
follows:  
% 8  
511  
8
Rtrimdown  
10.22   
Rtrim down 53.655  
Connecting an external resistor (Rtrim-up) between the  
TRIM pin and the VO(+) (or Sense (+)) pin increases  
LINEAGE POWER  
8
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
for natural convection and up to 2.0 m/s (400 ft./min)  
forced airflow, are shown in Figure 15.  
Thermal Considerations  
The power modules operate in a variety of thermal  
environments; however, sufficient cooling should be  
provided to help ensure reliable operation.  
Considerations include ambient temperature, airflow,  
module power dissipation, and the need for increased  
reliability. A reduction in the operating temperature of  
the module will result in an increase in reliability. The  
thermal data presented here is based on physical  
measurements taken in a wind tunnel.  
The thermal reference points, Tref1,Tref2 and Tref3 used  
in the specifications for open frame modules are  
shown in Figures 13a and 13b. For reliable operation  
these temperatures should not exceed 125oC, 110oC  
and 105oC respectively.  
AMBIENT TEMEPERATURE, TA (oC)  
Figure 15. Output Current Derating for the Open  
Frame Module; Airflow in the Transverse Direction  
from Vout(+) to Vout(-); Vin =48V.  
Heat Transfer via Conduction  
The module can also be used in a sealed environment  
with cooling via conduction from the module’s top  
surface through a gap pad material to a cold wall, as  
shown in Figure 16. The output current derating  
versus cold wall temperature, when using a gap pad  
such as Bergquist GP2500S20, is shown in Figure 17.  
Figure 13a. Tref 1 Temperature Measurement  
Location for Open Frame Module.  
Figure 13b. Tref 2 and Tref 3 Temperature  
Measurement Locations for Open Frame Module.  
Figure 16. Cold Wall Mounting  
The thermal reference point, Tref, used in the  
specifications for modules with heatplate is shown in  
Figure 14. For reliable operation this temperature  
should not exceed 110oC.  
COLDPLATE TEMEPERATURE, TC (oC)  
Figure 17. Derated Output Current versus Cold  
Wall Temperature with local ambient temperature  
around module at 85C; Vin=48V.  
Figure 14. Tref Temperature Measurement  
Location for Module with Heatplate.  
Heat Transfer via Convection  
Please refer to the Application Note “Thermal  
Characterization Process For Open-Frame Board-  
Mounted Power Modules” for a detailed discussion of  
thermal aspects including maximum device  
temperatures.  
Increased airflow over the module enhances the heat  
transfer via convection. Derating curves, showing the  
maximum output current that can be delivered by  
each module versus local ambient temperature (TA)  
LINEAGE POWER  
9
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
Surface Mount Information  
the plating on the connection to ensure a reliable  
solder joint. There are several types of SMT reflow  
technologies currently used in the industry. These  
surface mount power modules can be reliably  
soldered using natural forced convection, IR (radiant  
infrared), or a combination of convection/IR. For  
reliable soldering the solder reflow profile should be  
established by accurately measuring the modules CP  
connector temperatures.  
Pick and Place  
The ESTW025A0F modules use an open frame  
construction and are designed for a fully automated  
assembly process. The modules are fitted with a  
label designed to provide a large surface area for pick  
and place operations. The label meets all the  
requirements for surface mount processing, as well as  
safety standards, and is able to withstand reflow  
temperatures of up to 300oC. The label also carries  
product information such as product code, serial  
number and the location of manufacture.  
300  
Peak Temp 235oC  
250  
Cooling  
zone  
Heat zone  
max 4oCs-1  
200  
150  
10 0  
50  
1- 4 oCs-1  
Soak zone  
30-240s  
T
lim above  
205oC  
Preheat zone  
max4oCs-1  
0
Figure 18. Pick and Place Location.  
Nozzle Recommendations  
REFLOW TIME (S)  
Figure 19. Reflow Profile for Tin/Lead (Sn/Pb)  
process.  
The module weight has been kept to a minimum by  
using open frame construction. Even so, these  
modules have a relatively large mass when compared  
to conventional SMT components. Variables such as  
nozzle size, tip style, vacuum pressure and placement  
speed should be considered to optimize this process.  
The minimum recommended nozzle diameter for  
reliable operation is 6mm. The maximum nozzle outer  
diameter, which will safely fit within the allowable  
component spacing, is 9 mm.  
240  
235  
230  
225  
220  
215  
210  
205  
200  
Oblong or oval nozzles up to 11 x 9 mm may also be  
used within the space available.  
Tin Lead Soldering  
0
10  
20  
30  
40  
50  
60  
Figure 20. Time Limit Curve Above 205oC for  
Tin/Lead (Sn/Pb) process  
The ESTW025A0F power modules are lead free  
modules and can be soldered either in a lead-free  
solder process or in a conventional Tin/Lead (Sn/Pb)  
process. It is recommended that the customer review  
data sheets in order to customize the solder reflow  
profile for each application board assembly. The  
following instructions must be observed when  
soldering these units. Failure to observe these  
instructions may result in the failure of or cause  
damage to the modules, and can adversely affect  
long-term reliability.  
Lead Free Soldering  
The –Z version of the ESTW025A0F modules are  
lead-free (Pb-free) and RoHS compliant and are both  
forward and backward compatible in a Pb-free and a  
SnPb soldering process. Failure to observe the  
instructions below may result in the failure of or cause  
damage to the modules and can adversely affect  
long-term reliability.  
In a conventional Tin/Lead (Sn/Pb) solder process  
peak reflow temperatures are limited to less than  
235oC. Typically, the eutectic solder melts at 183oC,  
wets the land, and subsequently wicks the device  
connection. Sufficient time must be allowed to fuse  
Reflow Soldering Information  
The surface mountable modules in the  
ESTW025A0F-S family use our newest SMT  
LINEAGE POWER  
10  
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
should not be broken until time of use. Once the  
original package is broken, the floor life of the product  
at conditions of 30°C and 60% relative humidity  
varies according to the MSL rating (see J-STD-033A).  
The shelf life for dry packed SMT packages will be a  
minimum of 12 months from the bag seal date, when  
stored at the following conditions: < 40° C, < 90%  
relative humidity.  
Surface Mount Information (continued)  
technology called “Column Pin” (CP) connectors.  
Figure 19 shows the new CP connector before and  
after reflow soldering onto the end-board assembly.  
ESTW Board  
Post Solder Cleaning and Drying  
Considerations  
Insulator  
Post solder cleaning is usually the final circuit board  
assembly process prior to electrical board testing. The  
result of inadequate cleaning and drying can affect  
both the reliability of a power module and the  
testability of the finished circuit board assembly. For  
guidance on appropriate soldering, cleaning and  
drying procedures, refer to Lineage Power Board  
Mounted Power Modules: Soldering and Cleaning  
Application Note (AN04-001).  
Solder Ball  
End assembly PCB  
Figure 21. Column Pin Connector Before and After  
Reflow Soldering .  
The CP is constructed from a solid copper pin with an  
integral solder ball attached, which is composed of  
tin/lead (Sn63/Pb37) solder for non-Z codes, or  
Sn/Ag3.8/Cu0.7 (SAC) solder for –Z codes. The CP  
connector design is able to compensate for large  
amounts of co-planarity and still ensure a reliable  
SMT solder joint. Typically, the eutectic solder melts  
at 183oC (Sn/Pb solder) or 217-218 oC (SAC solder),  
wets the land, and subsequently wicks the device  
connection. Sufficient time must be allowed to fuse  
the plating on the connection to ensure a reliable  
solder joint. There are several types of SMT reflow  
technologies currently used in the industry. These  
surface mount power modules can be reliably  
soldered using natural forced convection, IR (radiant  
infrared), or a combination of convection/IR.  
300  
Per J-STD-020 Rev. C  
Peak Temp 260°C  
250  
Cooling  
200  
Zone  
* Min. Time Above 235°C  
15 Seconds  
150  
Heating Zone  
*Time Above 217°C  
1°C/Second  
60 Seconds  
100  
50  
0
Reflow Time (Seconds)  
Pb-free Reflow Profile  
Figure 22. Recommended linear reflow profile  
using Sn/Ag/Cu solder.  
Power Systems will comply with J-STD-020 Rev. C  
(Moisture/Reflow Sensitivity Classification for  
Nonhermetic Solid State Surface Mount Devices) for  
both Pb-free solder profiles and MSL classification  
procedures. This standard provides a recommended  
forced-air-convection reflow profile based on the  
volume and thickness of the package (table 4-2). The  
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).  
The recommended linear reflow profile using  
Sn/Ag/Cu solder is shown in Figure 22.  
Through-Hole Lead-Free Soldering  
Information  
The RoHS-compliant through-hole products use the  
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant  
components. They are designed to be processed  
through single or dual wave soldering machines. The  
pins have a RoHS-compliant finish that is compatible  
with both Pb and Pb-free wave soldering processes.  
A maximum preheat rate of 3C/s is suggested. The  
wave preheat process should be such that the  
temperature of the power module board is kept below  
210C. For Pb solder, the recommended pot  
MSL Rating  
The ESTW025A0F modules have a MSL rating of 2a.  
Storage and Handling  
temperature is 260C, while the Pb-free solder pot is  
270C max. Not all RoHS-compliant through-hole  
products can be processed with paste-through-hole  
Pb or Pb-free reflow process. If additional information  
is needed, please consult with your Lineage Power  
representative for more details.  
The recommended storage environment and handling  
procedures for moisture-sensitive surface mount  
packages is detailed in J-STD-033 Rev. A (Handling,  
Packing, Shipping and Use of Moisture/Reflow  
Sensitive Surface Mount Devices). Moisture barrier  
bags (MBB) with desiccant are required for MSL  
ratings of 2 or greater. These sealed packages  
LINEAGE POWER  
11  
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
EMC Considerations  
The filter circuit schematic and plots in Figure 23 shows a suggested configuration as tested to meet the conducted  
emission limits of EN55022 Class B.  
Note: Customer is ultimately responsible for the proper selection, component rating and verification of the suggested  
parts based on the end application.  
Figure 23. EMC Considerations  
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).  
LINEAGE POWER  
12  
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
Mechanical Outline for Through-Hole Module  
Dimensions are in millimeters and [inches].  
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)  
x.xx mm 0.25 mm [x.xxx in 0.010 in.]  
*Top side label includes Lineage Power name, product designation and date code.  
Top  
View*  
Side  
View  
*For optional pin lengths, see Table 2, Device Options  
Bottom  
View  
Pin  
1
Function  
Vi(+)  
2
3
ON/OFF  
Vi(-)  
4
Vo(-)  
5
6
SENSE(-)  
TRIM  
7
8
SENSE(+)  
Vo(+)  
LINEAGE POWER  
13  
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
Mechanical Outline for Surface Mount Module  
Dimensions are in millimeters and [inches].  
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)  
x.xx mm 0.25 mm [x.xxx in 0.010 in.]  
* Top side label includes Lineage Power name, product designation and date code.  
Top  
View*  
Side  
View  
Bottom  
View  
Pin  
1
Function  
Vi(+)  
2
3
ON/OFF  
Vi(-)  
4
Vo(-)  
5
6
SENSE(-)  
TRIM  
7
8
SENSE(+)  
Vo(+)  
LINEAGE POWER  
14  
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
Mechanical Outline for Through-Hole Module with 1/8th Heat Plate (-H Option)  
Dimensions are in millimeters and [inches].  
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)  
x.xx mm 0.25 mm [x.xxx in 0.010 in.]  
Top  
View  
Side  
View  
*For optional pin lengths, see Table 2, Device Coding Scheme and Options  
Bottom  
View*  
Pin Function  
1
2
3
4
5
6
7
8
Vi(+)  
ON/OFF  
Vi(-)  
Vo(-)  
SENSE(-)  
TRIM  
SENSE(+)  
Vo(+)  
LINEAGE POWER  
15  
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
Mechanical Outline for Through-Hole Module with 1/4th Heat Plate (-18H Option)  
Dimensions are in millimeters and [inches].  
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)  
x.xx mm 0.25 mm [x.xxx in 0.010 in.]  
Pin  
1
Function  
Vi(+)  
2
3
ON/OFF  
Vi(-)  
4
Vo(-)  
5
6
SENSE(-)  
TRIM  
7
8
SENSE(+)  
Vo(+)  
LINEAGE POWER  
16  
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
Recommended Pad Layout  
Dimensions are in millimeters and [inches].  
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)  
x.xx mm 0.25 mm [x.xxx in 0.010 in.]  
SMT Recommended Pad Layout (Component Side View)  
LINEAGE POWER  
17  
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
TH Recommended Pad Layout (Component Side View)  
LINEAGE POWER  
18  
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
Packaging Details  
Tray Specification  
The surface mount versions of the ESTW025A0F  
modules (suffix –S) are supplied as standard in  
the plastic tray shown in Figure 24. The tray has  
external dimensions of 135.1mm(W) x 321.8mm(L) x  
12.42mm(H) or 5.319in(W) x 12.669in(L) x 0.489in(H).  
Material  
Antistatic coated PVC  
1012/sq  
Max surface resistivity  
Color  
Clear  
Capacity  
12 power modules  
48 pcs (1 box of 4 full trays)  
Min order quantity  
Each tray contains a total of 12 power modules. The  
trays are self-stacking and each shipping box will  
contain 4 full trays plus one empty hold down tray  
giving a total number of 48 power modules.  
Figure 24. Surface Mount Packaging Tray.  
LINEAGE POWER  
19  
Data Sheet  
ESTW025A0F Series Eighth-Brick Power Modules  
36–75Vdc Input; 3.3Vdc Output; 25A Output  
October 11, 2011  
Ordering Information  
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.  
Table 1. Device Codes  
Output  
Voltage Current  
Output  
On/Off  
Logic  
Connector  
Type  
Product Codes  
Input Voltage  
Comcodes  
ESTW025A0F41Z  
ESTW025A0F41-HZ  
ESTW025A0F41-SZ  
ESTW025A0F641  
ESTW025A0F4Z  
48V (36-75Vdc)  
48V (36-75Vdc)  
48V (36-75Vdc)  
48V (36-75Vdc)  
48V (36-75Vdc)  
48V (36-75Vdc)  
48V (36-75Vdc)  
3.3V  
3.3V  
3.3V  
3.3V  
3.3V  
3.3V  
3.3V  
3.3V  
25A  
25A  
25A  
25A  
25A  
25A  
25A  
25A  
Negative  
Negative  
Negative  
Negative  
Positive  
Negative  
Negative  
Positive  
Through hole  
Through hole  
Surface Mount  
Through hole  
Through hole  
Through hole  
Through hole  
Through hole  
CC109158498  
CC109159505  
CC109159496  
CC109159125  
CC109168118  
CC109169363  
ESTW025A0F641Z  
ESTW025A0F841Z  
CC109167367  
CC109172846  
ESTW025A0F64-18HZ 48V (36-75Vdc)  
Table 2. Device Options  
Character and Position  
Characteristic  
Form Factor  
Definition  
E = Eighth Brick  
E
Family Designator  
Input Voltage  
ST  
ST = Stingray Series  
W = Wide Range, 36V-75V  
W
Output Current  
Output Voltage  
025A0  
025A0 = 025.0 Amps Maximum Output Current  
F = 3.3V nominal  
F
Omit = Default Pin Length shown in Mechanical Outline Figures  
6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)  
8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.)  
Omit = Latching Mode  
4 = Auto-restart following shutdown (Overcurrent/Overvoltage)  
Omit = Positive Logic  
Pin Length  
6
8
Action following  
Protective  
4
On/Off Logic  
1
1 = Negative Logic  
Customer Specific  
XY = Customer Specific Modified Code, Omit for Standard Code  
XY  
Omit = Standard open Frame Module  
H = 1/8th Brick size heat plate, for  
use with heat sinks (not available with –S option)  
H
Mechanical Features  
18H = 1/4th Brick size heat plate with unthreaded inserts for  
use in coldwall applications (not available with –S option)  
18H  
S = Surface mount connections  
Omit = RoHS 5/6, Lead Based Solder Used  
Z Z = RoHS 6/6 Compliant, Lead free  
RoHS  
Asia-Pacific Headquarters  
Tel: +65 6593 7211  
Europe, Middle-East and Africa Headquarters  
Tel: +49 89 878067-280  
World Wide Headquarters  
Lineage Power Corporation  
601 Shiloh Road, Plano, TX 75074, USA  
+1-800-526-7819  
(Outside U.S.A.: +1-972-244-9428)  
www.lineagepower.com  
India Headquarters  
Tel: +91 80 28411633  
e-mail: techsupport1@lineagepower.com  
Lineage Power reser ves the right to make c hanges to the product(s) or information contained herei n without notice. N o liability is ass umed as a res ult of their use or  
application. No rights under any patent accompany the sale of any suc h produc t(s) or infor mati on.  
Lineage Power DC-DC products are protected under various patents. Information on these patents is availabl e at www.lineagepower.com/patents.  
© 2011 Lineage Power Corporation, (Plano, Texas) All International Rights Reser ved.  
Document No: DS09-013 ver.1.01  
PDF name: ESTW025A0F.pdf  

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