ESTW025A0F4Z_技术文档

Data Sheet

October 11, 2011

ESTW025A0F Series (Eighth-Brick) DC-DC Converter Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output Current

Features

STINGRAY™ SERIES

.

Wide input voltage range: 36-75 V_dc

Delivers up to 25A Output current

Monotonic startup into prebiased load

Output Voltage adjust: 80% to 110% of V_o,nom

Remote sense

Constant switching frequency

Positive remote On/Off logic

Input under voltage protection

Output overcurrent and overvoltage protection

Over-temperature protection

RoHS Compliant

Industry standard, DOSA compliant footprint

57.9mm x 22.8mm x 8.5mm

Applications

(2.28 in x 0.9 in x 0.335 in)

.

Distributed power architectures

.

Low profile height and reduced component skyline

Wireless networks

Suitable for cold wall cooling using suitable Gap

Pad applied directly to top side of module

Access and optical network Equipment

Enterprise Networks including Power over Ethernet

(PoE)

.

High efficiency 92% at full load (Vin=48V_dc)

No thermal derating up to 68°C, 1.0m/s (200 LFM)

Wide operating temperature range (-40°C to 85°C)

.

Latest generation IC’s (DSP, FPGA, ASIC) and

Microprocessor powered applications

Compliant to RoHS EU Directive 2002/95/EC (-Z

versions)

.

Compliant to ROHS EU Directive 2002/95/EC with

lead solder exemption (non-Z versions)

UL* 60950-1, 2^ndEd. Recognized, CSA^†C22.2 No.

60950-1-07 Certified, and VDE^‡(EN60950-1, 2^nd

Ed.) Licensed

Options

.

Negative Remote On/Off logic (-1 option,

preferred/standard)

.

Surface Mount version (-S option)

Auto-restart (-4 option, preferred/standard)

Trimmed leads (-6 or -8 options)

.

CE mark meets 2006/95/EC directive^§

Meets the voltage and current requirements for

ETSI 300-132-2 and complies with and licensed for

Basic insulation rating per EN60950-1

.

2250 V_dcIsolation tested in compliance with IEEE

802.3^¤PoE standards

ISO^**9001 and ISO 14001 certified manufacturing

facilities

Description

The ESTW025A0F series, Eighth-brick power modules are isolated dc-dc converters that can deliver up to 25A of output

current and provide a precisely regulated output voltage over a wide range of input voltages (Vin = 36 -75V_dc). The

module achieves typical full load efficiency of 92% at 3.3V_dcoutput voltage. The open frame modules construction, available

in both surface-mount and through-hole packaging, enable designers to develop cost- and space-efficient solutions.

Document No: DS09-013 ver.1.01

PDF name: ESTW025A0F.pdf

*

UL is a registered trademark of Underwriters Laboratories, Inc.

CSA is a registered trademark of Canadian Standards Association.

VDE is a trademark of Verband Deutscher Elektrotechniker e.V.

This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.

IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.

†

‡

§

¤

** ISO is a registered trademark of the International Organization of Standards

Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute

stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those

given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can

adversely affect the device reliability.

Parameter

Device

Symbol

Min

Max

Unit

Input Voltage

Continuous

All

V_IN

V_IN,trans

T_A

-0.3

-40

80

100

85

V_dc

°C

Transient, operational (≤100 ms)

Operating Ambient Temperature

Maximum Base-plate Operating Temperature

(see Thermal Considerations section)

All

-18H, H

T_C

110

Storage Temperature

All

T_stg

-55

125

°C



I/O Isolation voltage (100% factory Hi-Pot tested)

2250

V_dc

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature

conditions.

Parameter

Device

Symbol

Min

Typ

Max

Unit

Operating Input Voltage

Maximum Input Current

(V_IN= V_{IN, min}to V_{IN, max}, I_O=I_{O, max}

Input No Load Current

All

V_IN

36

48

75

V_dc

All

I_IN,max

2.7

A_dc

)

I_{IN,No load}

50

6

mA

(V_IN= V_{IN, nom}, I_O= 0, module enabled)

Input Stand-by Current

All

I_IN,stand-by

I²t

8

1

mA

A²s

(V_IN= V_{IN, nom}, module disabled)

Inrush Transient

Input Reflected Ripple Current, peak-to-peak

(5Hz to 20MHz, 1μH source impedance; V_{IN, min}to V_{IN, max,}

I_O= I_Omax; See Test configuration section)

All

30

50

mA_p-p

dB

Input Ripple Rejection (120Hz)

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to an

integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,

however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies

require a fast-acting fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information

provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating

can be used. Refer to the fuse manufacturer’s data sheet for further information.

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2

Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

Electrical Specifications (continued)

Parameter

Device Symbol

Min

Typ

Max

Unit

Nominal Output Voltage Set-point

V_IN=V_{IN, nom}, I_O=I_{O, max}, T_A=25°C)

All

V_{O, set}

V_O

3.250

3.200

3.300

3.350

3.400

V_dc

Output Voltage



(Over all operating input voltage, resistive load, and

temperature conditions until end of life)

Output Regulation

Line (V_IN=V_{IN, min}to V_{IN, max}

Load (I_O=I_{O, min}to I_{O, max}

Temperature (T_ref=T_{A, min}to T_{A, max}

)

All

±0.1

10

% V_{O, set}



±0.2

)

mV

% V_{O, set}

)

Output Ripple and Noise on nominal output

(Co=1uF,ceramic+10uF,tantalum, V_IN=V_{IN, nom},I_O= I_O,

_max, T_A=T_{A, min}to T_{A, max}

)

RMS (5Hz to 20MHz bandwidth)

All

8

20

75

mV_rms

mV_pk-pk

μF



0

Peak-to-Peak (5Hz to 20MHz bandwidth)

External Capacitance ¹

40



C_{O, max}

I_o

I_{O, lim}

20,000

25.0

Output Current

0

A_dc

Output Current Limit Inception (Hiccup Mode )

All

26.3

29

32.5

A_dc

(V_O= 90% of V_{O, set}

)

Output Short-Circuit Current (V_O≤250mV)

( Hiccup Mode)

I_{O, s/c}

1.6

A_rms

Efficiency

V_IN= V_{IN, nom}, T_A=25°C, I_O=I_{O, max ,}V_O= V_O,set

V_IN= V_{IN, nom}, T_A=25°C, I_O=10A_,V_O= V_O,set

V_IN= V_{IN, nom}, T_A=25°C, I_O=5A _,V_O= V_O,set

All

η

91.0

85.5

92.0

87.0

%

Switching Frequency

All

f_sw

355

kHz

Dynamic Load Response

(Co=1uF,ceramic+220uF,tantalum, dI_o/dt=0.1A/s;

V_IN= 48V; T_A=25°C)

Load Change from Io= 50% to 75% or 25% to 50% of

I_o,max

Peak Deviation

All

V_pk

t_s

127

200

mV



Settling Time (Vo<10% peak deviation)

s

1.

See Note 2 under Feature Specifications.

Isolation Specifications

Parameter

Device Symbol

Min



Typ

1000

30

Max



Unit

pF

Isolation Capacitance

All

C_iso

R_iso

All

Isolation Resistance

MΩ

V_dc



I/O Isolation Voltage (100% factory Hi-pot tested)

2250



General Specifications

Parameter

Device

Symbol

Min

Typ

Max

Unit

Calculated Reliability based upon Telcordia SR-332

Issue 2: Method I Case 3 (I_O=80%I_{O, max}, T_A=40°C,

airflow = 200 lfm, 90% confidence)

All

FIT

229.4

10⁹/Hours

All

MTBF

4,359,904

Hours

g(oz)

Weight (Open Frame)

Weight (with Heatplate)

All

22 (0.78)

35 (1.23)

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Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

Feature Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature

conditions. See Feature Descriptions for additional information.

Parameter

Device

Symbol

Min

Typ

Max

Unit

Remote On/Off Signal Interface

(V_IN=V_{IN, min}to V_{IN, max}; open collector or equivalent,

Signal referenced to V_IN-terminal)

Negative Logic: device code suffix “1”

Logic Low = module On, Logic High = module Off

Positive Logic: No device code suffix required

Logic Low = module Off, Logic High = module On

Logic Low - Remote On/Off Current

All

I_on/off

V_on/off

I_on/off

0.15

0.6

mA

V_dc

μA



-0.7

2.4



Logic Low - On/Off Voltage

Logic High Voltage – (Typ = Open Collector)

Logic High maximum allowable leakage current

Turn-On Delay¹and Rise Times

15.0

25

(I_O=I_{O, max ,}V_IN=V_{IN, nom,}T_A= 25^oC)

Case 1: Input power is applied for >1 second and then

the On/Off input is set to ON (T_delay= time from instant

All

T_delay

―

12

20

―

msec

On/Off signal is ON until V_O= 10% of V_{O, set}

)

Case 2: On/Off input is set to Logic Low (Module

ON) and then input power is applied (T_delay= time

T_delay

―

at which V_IN= V_{IN, min}until V_o=10% of V_O,set

Output voltage Rise time (time for V_oto rise from 10%

of V_o,setto 90% of V_{o, set}

)

All

T_rise

4

―

msec

)

Output voltage overshoot – Startup

I_O= I_{O, max}; V_IN=V_{IN, min}to V_{IN, max}, T_A= 25 ^oC

Prebias Output Load Performance:

―

5

% V_{O, set}

Output Start up characteristic

All

Monotonic

-15

Back Bias current drawn from output (Module Enabled)

Remote Sense Range

mA_dc

% V_{O, set}

V_dc

V_SENSE

10

+10

5.1



Output Voltage Adjustment Range

Output Overvoltage Protection (C_O=470μF)²

Overtemperature Protection – Hiccup Auto Restart

Input Undervoltage Lockout

Turn-on Threshold

-20

3.9



V_{O, limit}

T_ref

125

^OC

V_UVLO

34.0

32.0

2.0

35.5



V_dc



30.5

1.0

Turn-off Threshold

Hysteresis



1.

2.

The module has an adaptable extended Turn-On Delay interval, T_delay, of 25mS. The extended T_delaywill occur when the module restarts

following the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and

then back to normal.

The module requires a minimum of 470 μF external output capacitor to prevent shutdown during full load to no load transients and to avoid

exceeding the OVP maximum limits during startup into open loop fault conditions.

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Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

Characteristic Curves

The following figures provide typical characteristics for the ESTW025A0F (3.3V, 25A) at 25^oC. The figures are

identical for either positive or negative remote On/Off logic.

OUTPUT CURRENT, I_O(A)

TIME, t (200µs/div)

Figure 4. Transient Response to 0.1A/µS Dynamic

Load Change from 50% to 75% to 50% of full load.

Figure 1. Converter Efficiency versus Output Current.

TIME, t (10ms/div)

TIME, t (2s/div)

Figure 2. Typical output ripple and noise (V^IN= VIN,NOM,

I^o= Io,max).

Figure 5. Typical Start-up Using Remote On/Off,

negative logic version shown (VIN = VIN,NOM, Io = Io,max).

TIME, t (200µs/div)

TIME, t (5ms/div)

Figure 3. Transient Response to 0.1A/µS Dynamic

Load Change from 25% to 50% to 25% of full load.

Figure 6. Typical Start-up Using Input Voltage (VIN =

V^IN,NOM, Io = Io,max).

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Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

Test Configurations

Design Considerations

Input Filtering

CURRENT PROBE

Vin+

TO OSCILLOSCOPE

The power module should be connected to a low

ac-impedance source. Highly inductive source

impedance can affect the stability of the power

module. For the test configuration in Figure 7 a 100μF

electrolytic capacitor (ESR<0.7 at 100kHz), mounted

close to the power module helps ensure the stability of

the unit. Consult the factory for further application

guidelines.

L_TEST

12μH

C_S220μF

100μF

E.S.R.<0.1

@ 20°C 100kHz

Vin-

Safety Considerations

For safety-agency approval of the system in which the

power module is used, the power module must be

installed in compliance with the spacing and

separation requirements of the end-use safety agency

standard, i.e. UL60950-1, CSA C22.2 No.60950-1,

and VDE0805-1(IEC60950-1).

NOTE: Measure input reflected ripple current with a simulated

source inductance (L_TEST) of 12μH. Capacitor C_Soffsets

possible battery impedance. Measure current as shown

above.

Figure 7. Input Reflected Ripple Current Test

Setup.

COPPER STRIP

If the input source is non-SELV (ELV or a hazardous

voltage greater than 60 Vdc and less than or equal to

75Vdc), for the module’s output to be considered as

meeting the requirements for safety extra-low voltage

(SELV), all of the following must be true:

V_O(+)

V_O(–)

RESISTIVE

LOAD

SCOPE

.

The input source is to be provided with reinforced

insulation from any other hazardous voltages,

including the ac mains.

0.01uF

10uF

0.1uF

GROUND PLANE

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then

Kelvin connections are required at the module terminals

to avoid measurement errors due to socket contact

resistance.

.

One V_INpin and one V_OUTpin are to be grounded,

or both the input and output pins are to be kept

floating.

.

The input pins of the module are not operator

accessible.

Figure 8. Output Ripple and Noise Test Setup.

Another SELV reliability test is conducted on the

whole system (combination of supply source and

subject module), as required by the safety

agencies, to verify that under a single fault,

hazardous voltages do not appear at the

module’s output.

R_distributionR_contact

R_contactR_distribution

Vin+

Vout+

R_LOAD

Note: Do not ground either of the input pins of the

module without grounding one of the output

pins. This may allow a non-SELV voltage to

appear between the output pins and ground.

V_O

V_IN

R_distributionR_contact

R_contactR_distribution

Vin-

Vout-

The power module has extra-low voltage (ELV)

outputs when all inputs are ELV.

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then

Kelvin connections are required at the module terminals

to avoid measurement errors due to socket contact

resistance.

All flammable materials used in the manufacturing of

these modules are rated 94V-0, or tested to the

UL60950 A.2 for reduced thickness.

For input voltages exceeding 60 Vdc but less than or

equal to 75 Vdc, these converters have been

evaluated to the applicable requirements of BASIC

INSULATION between secondary DC MAINS

DISTRIBUTION input (classified as TNV-2 in Europe)

and unearthed SELV outputs.

Figure 9. Output Voltage and Efficiency Test

Setup.

V_O. I_O

Efficiency

=

x

100 %



V_IN. I_IN

The input to these units is to be provided with a

maximum 5 A fast-acting fuse in the ungrounded lead.

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Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

be increased, which at the same output current would

increase the power output of the module. Care should

be taken to ensure that the maximum output power of

the module remains at or below the maximum rated

power (Maximum rated power = Vo,set x Io,max).

Feature Description

Remote On/Off

Two remote on/off options are available. Positive logic

turns the module on during a logic high voltage on the

ON/OFF pin, and off during a logic low. Negative logic

remote On/Off, device code suffix “1”, turns the

module off during a logic high and on during a logic

low.

SENSE(+)

SENSE(–)

V^I(+)

V^I(-)

VO(+)

V^O(–)

IO

SUPPLY

LOAD

I^I

Vin+

Vout+

CONTACT

RESISTANCE

CONTACT AND

DISTRIBUTION LOSSE

I_on/off

ON/OFF

TRIM

Figure 11. Circuit Configuration for remote

sense .

V_on/off

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout

limit, the module operation is disabled. The module

will only begin to operate once the input voltage is

raised above the undervoltage lockout turn-on

Vout-

Vin-

threshold, V_UV/ON

.

Figure 10. Remote On/Off Implementation.

Once operating, the module will continue to operate

until the input voltage is taken below the undervoltage

To turn the power module on and off, the user must

supply a switch (open collector or equivalent) to

control the voltage (V_on/off) between the ON/OFF

terminal and the V_IN(-) terminal (see Figure 10). Logic

low is 0V ≤ V_on/off≤ 1.2V. The maximum I_on/offduring a

logic low is 1mA, the switch should maintain a logic

low level while sinking this current.

turn-off threshold, V_UV/OFF

.

Overtemperature Protection

To provide protection under certain fault conditions,

the unit is equipped with a thermal shutdown circuit.

The unit will shutdown if the thermal reference point

Tref (Figure 13), exceeds 125^oC (typical), but the

thermal shutdown is not intended as a guarantee that

the unit will survive temperatures beyond its rating.

The module can be restarted by cycling the dc input

power for at least one second or by toggling the

remote on/off signal for at least one second. If the

auto-restart option (4) is ordered, the module will

automatically restart upon cool-down to a safe

temperature.

During a logic high, the typical maximum V_on/off

generated by the module is 15V, and the maximum

allowable leakage current at V_on/off= 5V is 1μA.

If not using the remote on/off feature:

For positive logic, leave the ON/OFF pin open.

For negative logic, short the ON/OFF pin to V_IN(-).

Remote Sense

Output Overvoltage Protection

Remote sense minimizes the effects of distribution

losses by regulating the voltage at the remote-sense

connections (See Figure 11). The voltage between the

remote-sense pins and the output terminals must not

exceed the output voltage sense range given in the

Feature Specifications table:

The output over voltage protection scheme of the

modules has an independent over voltage loop to

prevent single point of failure. This protection feature

latches in the event of over voltage across the output.

Cycling the on/off pin or input voltage resets the

latching protection feature. If the auto-restart option

(4) is ordered, the module will automatically restart

upon an internally programmed time elapsing.

[V_O(+) – V_O(–)] – [SENSE(+) – SENSE(–)]  0.5 V

Although the output voltage can be increased by both

the remote sense and by the trim, the maximum

increase for the output voltage is not the sum of both.

The maximum increase is the larger of either the

remote sense or the trim.

Overcurrent Protection

To provide protection in a fault (output overload)

condition, the unit is equipped with internal

current limiting circuitry and can endure current

limiting continuously. At the point of current limit

inception, the unit enters hiccup mode. If the unit is

The amount of power delivered by the module is

defined as the voltage at the output terminals

multiplied by the output current. When using remote

sense and trim, the output voltage of the module can

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Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

the output voltage set point. The following equation

determines the required external resistor value to

obtain a percentage output voltage change of Δ%:

Feature Descriptions (continued)

not configured with auto–restart, then it will latch off

following the over current condition. The module can

be restarted by cycling the dc input power for at least

one second or by toggling the remote on/off signal for

at least one second. If the unit is configured with the

auto-restart option (4), it will remain in the hiccup

mode as long as the overcurrent condition exists; it

operates normally, once the output current is brought

back into its specified range. The average output

5.11V

 (100  %)





511

o,set

R_trimup





10.22 







1.225 %

%















V_desired V_{o, set}

Where

 % 

 100

V_{o, set}

For example, to trim-up the output voltage of the

module by 5% to 3.465V, R_trim-upis calculated is as

follows:

current during hiccup is 10% I_{O, max}

.

Output Voltage Programming

 %  5

Trimming allows the output voltage set point to be

increased or decreased, this is accomplished by

connecting an external resistor between the TRIM pin

and either the V_O(+) pin or the V_O(-) pin.

5.11  3.3  (100  5) 511





R_{trim up}





 10.22 









1.225  5

5

R_trimup 176.7

The voltage between the V_O(+) and V_O(–) terminals

must not exceed the minimum output overvoltage

protection value shown in the Feature Specifications

table. This limit includes any increase in voltage due

to remote-sense compensation and output voltage

set-point adjustment trim.

V_IN(+)

V_O(+)

V_OTRIM

V_O(-)

R_trim-up

ON/OFF

LOAD

Although the output voltage can be increased by both

the remote sense and by the trim, the maximum

increase for the output voltage is not the sum of both.

The maximum increase is the larger of either the

remote sense or the trim. The amount of power

delivered by the module is defined as the voltage at

the output terminals multiplied by the output current.

When using remote sense and trim, the output voltage

of the module can be increased, which at the same

output current would increase the power output of the

module. Care should be taken to ensure that the

maximum output power of the module remains at or

below the maximum rated power (Maximum rated

power = V_O,setx I_O,max).

R_trim-down

V_IN(-)

Figure 12. Circuit Configuration to Trim Output

Voltage.

Connecting an external resistor (R_trim-down) between

the TRIM pin and the V_O(-) (or Sense(-)) pin

decreases the output voltage set point. To maintain

set point accuracy, the trim resistor tolerance should

be ±1.0%.

The following equation determines the required

external resistor value to obtain a percentage output

voltage change of Δ%

511





R_{trim  down}



 10 .22 









%









V_o,set V_desired

Where





% 

 100

V_o,set

For example, to trim-down the output voltage of the

module by 8% to 3.036V, Rtrim-down is calculated as

follows:

%  8

511

8





R_trimdown



10.22 









R_{trim down} 53.655

Connecting an external resistor (R_trim-up) between the

TRIM pin and the V_O(+) (or Sense (+)) pin increases

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Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

for natural convection and up to 2.0 m/s (400 ft./min)

forced airflow, are shown in Figure 15.

Thermal Considerations

The power modules operate in a variety of thermal

environments; however, sufficient cooling should be

provided to help ensure reliable operation.

Considerations include ambient temperature, airflow,

module power dissipation, and the need for increased

reliability. A reduction in the operating temperature of

the module will result in an increase in reliability. The

thermal data presented here is based on physical

measurements taken in a wind tunnel.

The thermal reference points, T_ref1,T_ref2and T_ref3used

in the specifications for open frame modules are

shown in Figures 13a and 13b. For reliable operation

these temperatures should not exceed 125^oC, 110^oC

and 105^oC respectively.

AMBIENT TEMEPERATURE, T_A(^oC)

Figure 15. Output Current Derating for the Open

Frame Module; Airflow in the Transverse Direction

from Vout(+) to Vout(-); Vin =48V.

Heat Transfer via Conduction

The module can also be used in a sealed environment

with cooling via conduction from the module’s top

surface through a gap pad material to a cold wall, as

shown in Figure 16. The output current derating

versus cold wall temperature, when using a gap pad

such as Bergquist GP2500S20, is shown in Figure 17.

Figure 13a. T_{ref 1}Temperature Measurement

Location for Open Frame Module.

Figure 13b. T_{ref 2}and T_{ref 3}Temperature

Measurement Locations for Open Frame Module.

Figure 16. Cold Wall Mounting

The thermal reference point, T_ref, used in the

specifications for modules with heatplate is shown in

Figure 14. For reliable operation this temperature

should not exceed 110^oC.

COLDPLATE TEMEPERATURE, T_C(^oC)

Figure 17. Derated Output Current versus Cold

Wall Temperature with local ambient temperature

around module at 85C; Vin=48V.

Figure 14. T_refTemperature Measurement

Location for Module with Heatplate.

Heat Transfer via Convection

Please refer to the Application Note “Thermal

Characterization Process For Open-Frame Board-

Mounted Power Modules” for a detailed discussion of

thermal aspects including maximum device

temperatures.

Increased airflow over the module enhances the heat

transfer via convection. Derating curves, showing the

maximum output current that can be delivered by

each module versus local ambient temperature (T^A)

LINEAGE POWER

9

Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

Surface Mount Information

the plating on the connection to ensure a reliable

solder joint. There are several types of SMT reflow

technologies currently used in the industry. These

surface mount power modules can be reliably

soldered using natural forced convection, IR (radiant

infrared), or a combination of convection/IR. For

reliable soldering the solder reflow profile should be

established by accurately measuring the modules CP

connector temperatures.

Pick and Place

The ESTW025A0F modules use an open frame

construction and are designed for a fully automated

assembly process. The modules are fitted with a

label designed to provide a large surface area for pick

and place operations. The label meets all the

requirements for surface mount processing, as well as

safety standards, and is able to withstand reflow

temperatures of up to 300^oC. The label also carries

product information such as product code, serial

number and the location of manufacture.

300

Peak Temp 235^oC

250

Cooling

zone

Heat zone

max 4^oCs^-1

200

150

10 0

50

1- 4 ^oCs^-1

Soak zone

30-240s

T

_limabove

205^oC

Preheat zone

max4^oCs^-1

0

Figure 18. Pick and Place Location.

Nozzle Recommendations

REFLOW TIME (S)

Figure 19. Reflow Profile for Tin/Lead (Sn/Pb)

process.

The module weight has been kept to a minimum by

using open frame construction. Even so, these

modules have a relatively large mass when compared

to conventional SMT components. Variables such as

nozzle size, tip style, vacuum pressure and placement

speed should be considered to optimize this process.

The minimum recommended nozzle diameter for

reliable operation is 6mm. The maximum nozzle outer

diameter, which will safely fit within the allowable

component spacing, is 9 mm.

240

235

230

225

220

215

210

205

200

Oblong or oval nozzles up to 11 x 9 mm may also be

used within the space available.

Tin Lead Soldering

0

10

20

30

40

50

60

Figure 20. Time Limit Curve Above 205^oC for

Tin/Lead (Sn/Pb) process

The ESTW025A0F power modules are lead free

modules and can be soldered either in a lead-free

solder process or in a conventional Tin/Lead (Sn/Pb)

process. It is recommended that the customer review

data sheets in order to customize the solder reflow

profile for each application board assembly. The

following instructions must be observed when

soldering these units. Failure to observe these

instructions may result in the failure of or cause

damage to the modules, and can adversely affect

long-term reliability.

Lead Free Soldering

The –Z version of the ESTW025A0F modules are

lead-free (Pb-free) and RoHS compliant and are both

forward and backward compatible in a Pb-free and a

SnPb soldering process. Failure to observe the

instructions below may result in the failure of or cause

damage to the modules and can adversely affect

long-term reliability.

In a conventional Tin/Lead (Sn/Pb) solder process

peak reflow temperatures are limited to less than

235^oC. Typically, the eutectic solder melts at 183^oC,

wets the land, and subsequently wicks the device

connection. Sufficient time must be allowed to fuse

Reflow Soldering Information

The surface mountable modules in the

ESTW025A0F-S family use our newest SMT

LINEAGE POWER

10

Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

should not be broken until time of use. Once the

original package is broken, the floor life of the product

at conditions of  30°C and 60% relative humidity

varies according to the MSL rating (see J-STD-033A).

The shelf life for dry packed SMT packages will be a

minimum of 12 months from the bag seal date, when

stored at the following conditions: < 40° C, < 90%

relative humidity.

Surface Mount Information (continued)

technology called “Column Pin” (CP) connectors.

Figure 19 shows the new CP connector before and

after reflow soldering onto the end-board assembly.

ESTW Board

Post Solder Cleaning and Drying

Considerations

Insulator

Post solder cleaning is usually the final circuit board

assembly process prior to electrical board testing. The

result of inadequate cleaning and drying can affect

both the reliability of a power module and the

testability of the finished circuit board assembly. For

guidance on appropriate soldering, cleaning and

drying procedures, refer to Lineage Power Board

Mounted Power Modules: Soldering and Cleaning

Application Note (AN04-001).

Solder Ball

End assembly PCB

Figure 21. Column Pin Connector Before and After

Reflow Soldering .

The CP is constructed from a solid copper pin with an

integral solder ball attached, which is composed of

tin/lead (Sn₆₃/Pb₃₇) solder for non-Z codes, or

Sn/Ag_3.8/Cu_0.7(SAC) solder for –Z codes. The CP

connector design is able to compensate for large

amounts of co-planarity and still ensure a reliable

SMT solder joint. Typically, the eutectic solder melts

at 183^oC (Sn/Pb solder) or 217-218 ^oC (SAC solder),

wets the land, and subsequently wicks the device

connection. Sufficient time must be allowed to fuse

the plating on the connection to ensure a reliable

solder joint. There are several types of SMT reflow

technologies currently used in the industry. These

surface mount power modules can be reliably

soldered using natural forced convection, IR (radiant

infrared), or a combination of convection/IR.

300

Per J-STD-020 Rev. C

Peak Temp 260°C

250

Cooling

200

Zone

* Min. Time Above 235°C

15 Seconds

150

Heating Zone

*Time Above 217°C

1°C/Second

60 Seconds

100

50

0

Reflow Time (Seconds)

Pb-free Reflow Profile

Figure 22. Recommended linear reflow profile

using Sn/Ag/Cu solder.

Power Systems will comply with J-STD-020 Rev. C

(Moisture/Reflow Sensitivity Classification for

Nonhermetic Solid State Surface Mount Devices) for

both Pb-free solder profiles and MSL classification

procedures. This standard provides a recommended

forced-air-convection reflow profile based on the

volume and thickness of the package (table 4-2). The

suggested Pb-free solder paste is Sn/Ag/Cu (SAC).

The recommended linear reflow profile using

Sn/Ag/Cu solder is shown in Figure 22.

Through-Hole Lead-Free Soldering

Information

The RoHS-compliant through-hole products use the

SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant

components. They are designed to be processed

through single or dual wave soldering machines. The

pins have a RoHS-compliant finish that is compatible

with both Pb and Pb-free wave soldering processes.

A maximum preheat rate of 3C/s is suggested. The

wave preheat process should be such that the

temperature of the power module board is kept below

210C. For Pb solder, the recommended pot

MSL Rating

The ESTW025A0F modules have a MSL rating of 2a.

Storage and Handling

temperature is 260C, while the Pb-free solder pot is

270C max. Not all RoHS-compliant through-hole

products can be processed with paste-through-hole

Pb or Pb-free reflow process. If additional information

is needed, please consult with your Lineage Power

representative for more details.

The recommended storage environment and handling

procedures for moisture-sensitive surface mount

packages is detailed in J-STD-033 Rev. A (Handling,

Packing, Shipping and Use of Moisture/Reflow

Sensitive Surface Mount Devices). Moisture barrier

bags (MBB) with desiccant are required for MSL

ratings of 2 or greater. These sealed packages

LINEAGE POWER

11

Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

EMC Considerations

The filter circuit schematic and plots in Figure 23 shows a suggested configuration as tested to meet the conducted

emission limits of EN55022 Class B.

Note: Customer is ultimately responsible for the proper selection, component rating and verification of the suggested

parts based on the end application.

Figure 23. EMC Considerations

For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).

LINEAGE POWER

12

Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

Mechanical Outline for Through-Hole Module

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

*Top side label includes Lineage Power name, product designation and date code.

Top

View*

Side

View

*For optional pin lengths, see Table 2, Device Options

Bottom

View

1

Function

Vi(+)

2

3

ON/OFF

Vi(-)

4

Vo(-)

5

6

SENSE(-)

TRIM

7

8

SENSE(+)

Vo(+)

LINEAGE POWER

13

Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

Mechanical Outline for Surface Mount Module

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

* Top side label includes Lineage Power name, product designation and date code.

Top

View*

Side

View

Bottom

View

1

Function

Vi(+)

2

3

ON/OFF

Vi(-)

4

Vo(-)

5

6

SENSE(-)

TRIM

7

8

SENSE(+)

Vo(+)

LINEAGE POWER

14

Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

Mechanical Outline for Through-Hole Module with 1/8th Heat Plate (-H Option)

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Top

View

Side

View

*For optional pin lengths, see Table 2, Device Coding Scheme and Options

Bottom

View*

Pin Function

1

2

3

4

5

6

7

8

Vi(+)

ON/OFF

Vi(-)

Vo(-)

SENSE(-)

TRIM

SENSE(+)

Vo(+)

LINEAGE POWER

15

Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

Mechanical Outline for Through-Hole Module with 1/4th Heat Plate (-18H Option)

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

1

Function

Vi(+)

2

3

ON/OFF

Vi(-)

4

Vo(-)

5

6

SENSE(-)

TRIM

7

8

SENSE(+)

Vo(+)

LINEAGE POWER

16

Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

Recommended Pad Layout

Dimensions are in millimeters and [inches].

Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

SMT Recommended Pad Layout (Component Side View)

LINEAGE POWER

17

Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

TH Recommended Pad Layout (Component Side View)

LINEAGE POWER

18

Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

Packaging Details

Tray Specification

The surface mount versions of the ESTW025A0F

modules (suffix –S) are supplied as standard in

the plastic tray shown in Figure 24. The tray has

external dimensions of 135.1mm(W) x 321.8mm(L) x

12.42mm(H) or 5.319in(W) x 12.669in(L) x 0.489in(H).

Material

Antistatic coated PVC

10¹²/sq

Max surface resistivity

Color

Clear

Capacity

12 power modules

48 pcs (1 box of 4 full trays)

Min order quantity

Each tray contains a total of 12 power modules. The

trays are self-stacking and each shipping box will

contain 4 full trays plus one empty hold down tray

giving a total number of 48 power modules.

Figure 24. Surface Mount Packaging Tray.

LINEAGE POWER

19

Data Sheet

ESTW025A0F Series Eighth-Brick Power Modules

36–75Vdc Input; 3.3Vdc Output; 25A Output

October 11, 2011

Ordering Information

Please contact your Lineage Power Sales Representative for pricing, availability and optional features.

Table 1. Device Codes

Output

Voltage Current

Output

On/Off

Logic

Connector

Type

Product Codes

Input Voltage

Comcodes

ESTW025A0F41Z

ESTW025A0F41-HZ

ESTW025A0F41-SZ

ESTW025A0F641

ESTW025A0F4Z

48V (36-75Vdc)

3.3V

25A

Negative

Positive

Negative

Positive

Through hole

Surface Mount

Through hole

CC109158498

CC109159505

CC109159496

CC109159125

CC109168118

CC109169363

ESTW025A0F641Z

ESTW025A0F841Z

CC109167367

CC109172846

ESTW025A0F64-18HZ 48V (36-75Vdc)

Table 2. Device Options

Character and Position

Characteristic

Form Factor

Definition

E = Eighth Brick

E

Family Designator

Input Voltage

ST

ST = Stingray Series

W = Wide Range, 36V-75V

W

Output Current

Output Voltage

025A0

025A0 = 025.0 Amps Maximum Output Current

F = 3.3V nominal

F

Omit = Default Pin Length shown in Mechanical Outline Figures

6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)

8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.)

Omit = Latching Mode

4 = Auto-restart following shutdown (Overcurrent/Overvoltage)

Omit = Positive Logic

Pin Length

6

8

Action following

Protective

4

On/Off Logic

1

1 = Negative Logic

Customer Specific

XY = Customer Specific Modified Code, Omit for Standard Code

XY

Omit = Standard open Frame Module

H = 1/8th Brick size heat plate, for

use with heat sinks (not available with –S option)

H

Mechanical Features

18H = 1/4th Brick size heat plate with unthreaded inserts for

use in coldwall applications (not available with –S option)

18H

S = Surface mount connections

Omit = RoHS 5/6, Lead Based Solder Used

Z Z = RoHS 6/6 Compliant, Lead free

RoHS

Asia-Pacific Headquarters

Tel: +65 6593 7211

Europe, Middle-East and Africa Headquarters

Tel: +49 89 878067-280

World Wide Headquarters

Lineage Power Corporation

601 Shiloh Road, Plano, TX 75074, USA

+1-800-526-7819

(Outside U.S.A.: +1-972-244-9428)

www.lineagepower.com

India Headquarters

Tel: +91 80 28411633

e-mail: techsupport1@lineagepower.com

Lineage Power reser ves the right to make c hanges to the product(s) or information contained herei n without notice. N o liability is ass umed as a res ult of their use or

application. No rights under any patent accompany the sale of any suc h produc t(s) or infor mati on.

Lineage Power DC-DC products are protected under various patents. Information on these patents is availabl e at www.lineagepower.com/patents.

Document No: DS09-013 ver.1.01

PDF name: ESTW025A0F.pdf


型号：	ESTW025A0F4Z
厂家：	LINEAGE POWER CORPORATION
描述：	ESTW025A0F Series (Eighth-Brick) DC-DC Converter Power Modules ESTW025A0F系列（八分之一砖）的DC -DC转换器电源模块转换器电源电路
文件：	总20页 (文件大小：1282K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ESTW025A0F4Z [LINEAGEPOWER]

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