LSRFVG9553/TR1 [LIGITEK]
SURFACE MOUNT LED TAPE AND REEL; 表面安装型LED卷带
| 型号： | LSRFVG9553/TR1 |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | SURFACE MOUNT LED TAPE AND REEL |
| 文件： | 总9页 (文件大小：145K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SURFACE MOUNT LED TAPE AND REEL
LSRFVG9553/TR1
DATA SHEET
SRFVG9553/TR1
DOC. NO : QW0905-L
REV
: A
DATE
:
31 - Oct. - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.
Page 1/8
LSRFVG9553/TR1
Package Dimensions
3.5
3.2
1.85
3.0
0.7±0.05
0.7±0.05
0.7±0.05
4
1
3
2
2.8
2.2
0.7±0.05
0.6
SRF
VG
1.85
-
+
3
4
0.95
+
2 -
1
1.3
0.8
0.8
Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted.
2.Specifications are subject to change without notice.
Carrier Type Dimensions
2.0
0.23
4.0
1.55
1.75
5.5
12.0±0.3
4.06
9.3
Polarity
4.0
3.12
2.24
Note : The tolerances unless mentioned is ±0.2mm,Angle ± 0.5. Unit=mm.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/8
PART NO. LSRFVG9553/TR1
Reel Dimensions
16.0±1.0
ψ178±2.0
14.2±1.0
74.0±1.5
Description
12.0mm tape,7"reel
Quantity/Reel
1500 devices
Part No.
LSRFVG9553/TR1
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
3/8
PART NO. : LSRFVG9553/TR1
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
SRF
30
VG
30
IF
IFP
PD
Ir
Forward Current
mA
mA
mW
Peak Forward Current
Duty 1/10@10KHz
90
120
100
Power Dissipation
75
Reverse Current @5V
μA
10
Electrostatic Discharge
Operating Temperature
ESD
2000
---
V
℃
℃
Topr
-40 ~ +85
Tstg
Tsol
Storage Temperature
Soldering Temperature
-40 ~ +100
Max 260℃ for 5 sec Max
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
Luminous
intensity
Dominant
Viewing
angle
2θ 1/2
(deg)
Spectral
halfwidth
△λnm
Peak
wave
length
λPnm
wave
length
λDnm
COLOR
@
20
mA(V) @20mA(mcd)
PART NO
MATERIAL
Typ.
Lens
Emitted
Min. Max. Min.
80
630
----
20
30
190
44
120
120
Red
AlGaInP
GaP
1.5
2.4
----
Water Clear
LSRFVG9553/TR1
20
Green
1.7
2.6
565
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO.LSRFVG9553/TR1
4/8
Typical Electro-Optical Characteristics Curve
SRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1000
3.0
2.5
2.0
100
10
1.5
1.0
0.5
1.0
0.1
0.0
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
2.5
1.2
1.1
1.0
0.9
0.8
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
550
600
650
700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO.
5/8
LSRFVG9553/TR1
Typical Electro-Optical Characteristics Curve
VG CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1000
100
3.5
3.0
2.5
2.0
1.5
10
1.0
0.5
0.0
1.0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
1.2
2.5
2.0
1.1
1.0
1.5
1.0
0.5
0.9
0.8
0.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80 100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
500
550
600
650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
6/8
PART NO. :
LSRFVG9553/TR1
Soldering Iron:
Basic spec is ≦5 sec when 260℃. If temperature is higher, time should be shorter(+10 ℃ → -1sec).
Power dissipation of iron should be smaller than 15W,and temperature should be controllable.
Surface temperature of the device should be under 230 ℃.
Soldering heat
Soldering heat Max. 260 ℃
245±5℃ within 5 sec
Preheat
120 ~ 150℃
120 ~ 180 sec
Reflow Temp/Time
Temp.
(℃)
220
Rising
Cooling
+5℃/sec
-5℃/sec
Preheat
150
120
Time
60 ~ 120 sec
5sec
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
7/8
PART NO. :
LSRFVG9553/TR1
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH<60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH<60%,
they should be treated at 60 ℃±5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd
current should not be allowed to change by more than 40 % of its desired value.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
8/8
PART NO. :
LSRFVG9553/TR1
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
相关型号：
©2020 ICPDF网 联系我们和版权申明