LSRFSBKS2663/R1-PF [LIGITEK]
BIPOLAR TYPE LED LAMPS; 双极型LED灯
| 型号： | LSRFSBKS2663/R1-PF |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | BIPOLAR TYPE LED LAMPS |
| 文件： | 总7页 (文件大小：122K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
BIPOLAR TYPE LED LAMPS
Pb
Lead-Free Parts
LSRFSBKS2663/R1-PF
DATA SHEET
DOC. NO : QW0905-:LSRFSBKS2663/R1-PF
REV.
:
:
A
17 - Oct. - 2008
DATE
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LSRFSBKS2663/R1-PF
Page
PART NO.
1/6
Package Dimensions
2.9
3.3
3.1
4.3
1.5MAX
SBKS
SRF
25.0MIN
1.0MIN
□0.5
TYP
1
2
2.54TYP
1
2
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
60°
100% 75% 50% 25% 0 25% 50% 75%100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page2/6
PART NO. LSRFSBKS2663/R1-PF
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
SRF
30
SBK-S
30
IF
IFP
Forward Current
mA
mA
mW
Peak Forward Current
Duty 1/10@10KHz
90
100
120
500
50
Power Dissipation
PD
ESD
Ir
75
V
Electrostatic Discharge( * )
Reverse Current @5V
Operating Temperature
Storage Temperature
2000
10
μA
℃
Topr
Tstg
-20 ~ +80
-30 ~ +100
℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
*
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Dominant
Luminous
intensity
@20mA(mcd)
Spectral
halfwidth
△λnm
Forward
voltage
@20mA(V)
Viewing
angle
2θ 1/2
(deg)
wave
length
λDnm
COLOR
MATERIAL
AlGaInP
PART NO
Typ.
Typ.
220 350
90 160
Emitted
Red
Lens
Min.
1.5
Max. Min.
630
475
20
26
40
40
---- 2.4
LSRFSBKS2663/R1-PF
Water Clear
InGaN/SiC Blue
----
3.5 4.2
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. LSRFSBKS2663/R1-PF
3/6
Typical Electro-Optical Characteristics Curve
SRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
1000
3.0
2.5
2.0
100
10
1.5
1.0
0.5
0.0
1.0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
2.5
1.2
1.1
1.0
0.9
0.8
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
550
600
650
700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LSRFSBKS2663/R1-PF
Page 4/6
PART NO.
Typical Electro-Optical Characteristics Curve
SBK-S CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
30
25
20
15
10
5
1.5
1.25
1.0
0.75
0.5
0.25
0
0
1
2
3
4
5
0
5
10
15
20
25
30
Forward Current(mA)
Forward Voltage(V)
Fig.4 Relative Intensity vs. Wavelength
Fig.3 Forward Current vs. Temperature
40
1.0
30
20
10
0
0.5
0
75
Ambient Temperature(℃)
0
25
50
100
380 430
480 530 580 630 680
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LSRFSBKS2663/R1-PF
PART NO.
Page 5/6
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(°C)
260°C3sec Max
260°
5°/sec
max
120°
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. LSRFSBKS2663/R1-PF
6/6
Reliability Test:
Reference
Description
Test Item
Test Condition
Standard
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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