LSRFDGM3392 [LIGITEK]

DURL COLOR LED LAMPS; DURL彩色LED灯


型号：	LSRFDGM3392
厂家：	LIGITEK ELECTRONICS CO., LTD.
描述：	DURL COLOR LED LAMPS DURL彩色LED灯
文件：	总7页 (文件大小：125K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

DURL COLOR LED LAMPS

Lead-Free Parts

LSRFDGM3392

DATA SHEET

DOC. NO : QW0905-

LSRFDGM3392

REV.

: A

DATE

15 - Sep.- 2007

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

Page 1/6

PART NO. LSRFDGM3392

Package Dimensions

5.9

5.0

7.6

8.6

10.5±0.5

1.5

MAX

DGM

SRF

□0.5

TYP

18.0MIN

2.0MIN

1.ANODE GREEN

2.COMMON CATHODE

3.ANODE RED

2.0MIN

2.54TYP

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.

2.Specifications are subject to change without notice.

Directivity Radiation

0°

-30°

30°

-60°

60°

100% 75% 50% 25%

25% 50% 75%100%

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

Page

2/6

LSRFDGM3392

PART NO.

Absolute Maximum Ratings at Ta=25 ℃

Ratings

Symbol

Parameter

UNIT

SRF

DGM

IFP

Forward Current

Peak Forward Current

Duty 1/10@10KHz

100

120

Power Dissipation

μA

Reverse Current @5V

Electrostatic Discharge

Operating Temperature

Storage Temperature

ESD

Topr

Tstg

2000

150

-20 ~ +80

℃

-30 ~ +100

Typical Electrical & Optical Characteristics (Ta=25 ℃)

Forward

voltage

Luminous

intensity

Peak Dominant

Viewing

angle

2θ 1/2

(deg)

Spectral

halfwidth

△λnm

wave

length

λDnm

wave

length

λPnm

COLOR

mA(V) @20mA(mcd)

PART NO

MATERIAL

Typ.

Emitted

Red

Lens

Min.

1.5

Max. Min.

Typ.

---

----

630

525

160 300

2.4

4.0

AlGaInP

LSRFDGM3392

White Diffused

518

1100 1800

Green

InGaN/GaN

---

3.5

Note : 1.The forward voltage data did not including ±0.1V testing tolerance.

2. The luminous intensity data did not including ±15% testing tolerance.

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

PART NO. LSRFDGM3392

Page

3/6

Typical Electro-Optical Characteristics Curve

SRF CHIP

Fig.1 Forward current vs. Forward Voltage

Fig.2 Relative Intensity vs. Forward Current

1000

3.5

3.0

2.5

2.0

100

1.0

0.1

1.5

1.0

0.5

1.0

1.5

2.0

2.5

3.0

1.0

100

1000

Forward Current(mA)

Forward Voltage(V)

Fig.3 Forward Voltage vs. Temperature

Fig.4 Relative Intensity vs. Temperature

3.0

1.2

2.5

2.0

1.5

1.0

0.5

1.1

1.0

0.9

0.8

-40

-20

-0

100

-40

-20

-0

100

Ambient Temperature(℃)

Fig.5 Relative Intensity vs. Wavelength

1.0

0.5

550

600

650

700

Wavelength (nm)

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

PART NO. LSRFDGM3392

Page4/6

Typical Electro-Optical Characteristics Curve

DGM CHIP

Fig.1 Forward current vs. Forward Voltage

Fig.2 Relative Intensity vs. Forward Current

3.0

2.5

2.0

1000

100

1.5

1.0

0.5

0.0

0.1

1.0

2.0

3.0

4.0

5.0

1.0

100

1000

Forward Current(mA)

Forward Voltage(V)

Fig.3 Forward Voltage vs. Temperature

Fig.4 Relative Intensity vs. Temperature

1.2

1.1

3.0

2.5

2.0

1.5

1.0

0.9

0.8

0.5

0.0

-40

-20

100

-40

-20

100

Ambient Temperature(℃)

Fig.5 Relative Intensity vs. Wavelength

1.0

0.5

0.0

450

500

550

600

Wavelength (nm)

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

LSRFDGM3392

PART NO.

Page 5/6

Soldering Condition(Pb-Free)

1.Iron:

Soldering Iron:30W Max

Temperature 350 °C Max

Soldering Time:3 Seconds Max(One time only)

Distance:2mm Min(From solder joint to body)

2.Wave Soldering Profile

Dip Soldering

Preheat: 120°C Max

Preheat time: 120seconds Max

Ramp-up

2°C/sec(max)

Ramp-Down:-5°C/sec(max)

Solder Bath:260°C Max

Dipping Time:3 seconds Max

Distance:2mm Min(From solder joint to body)

Temp(°C)

260°C3sec Max

260°

5°/sec

max

120°

2°/sec

25°

0°

max

100

250

Time(sec)

200

Preheat

120 Seconds Max

Note: 1.Wave solder should not be made more than one time.

2.You can just only select one of the soldering conditions as above.

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

PART NO. LSRFDGM3392

Page 6/6

Reliability Test:

Reference

Standard

Description

Test Item

Test Condition

1.Under Room Temperature

2.If=20mA

3.t=1000 hrs (-24hrs, +72hrs)

This test is conducted for the purpose

of detemining the resistance of a part

in electrical and themal stressed.

MIL-STD-750: 1026

MIL-STD-883: 1005

JIS C 7021: B-1

Operating Life Test

The purpose of this is the resistance of

the device which is laid under condition

of high temperature for hours.

High Temperature

Storage Test

1.Ta=105 ℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

MIL-STD-883:1008

JIS C 7021: B-10

The purpose of this is the resistance

of the device which is laid under

condition of low temperature for hours.

Low Temperature

Storage Test

1.Ta=-40℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

JIS C 7021: B-12

1.Ta=65℃±5℃

2.RH=90%~95%

3.t=240hrs ±2hrs

High Temperature

High Humidity Test

The purpose of this test is the resistance

of the device under tropical for hours.

MIL-STD-202:103B

JIS C 7021: B-11

The purpose of this is the resistance of

the device to sudden extreme changes

in high and low temperature.

1.Ta=105 ℃±5℃&-40℃±5℃

(10min) (10min)

2.total 10 cycles

MIL-STD-202: 107D

MIL-STD-750: 1051

MIL-STD-883: 1011

Thermal Shock Test

This test intended to determine the

thermal characteristic resistance

of the device to sudden exposures

at extreme changes in temperature

when soldering the lead wire.

MIL-STD-202: 210A

MIL-STD-750: 2031

JIS C 7021: A-1

Solder Resistance

Test

1.T.Sol=260 ℃±5℃

2.Dwell time= 10 ±1sec.

MIL-STD-202: 208D

MIL-STD-750: 2026

MIL-STD-883: 2003

JIS C 7021: A-2

This test intended to see soldering well

performed or not.

1.T.Sol=230 ℃±5℃

2.Dwell time=5 ±1sec

Solderability Test

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