LSD5165F-XX-PF [LIGITEK]
LED Display;
| 型号： | LSD5165F-XX-PF |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | LED Display |
| 文件： | 总9页 (文件大小：151K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SINGLE DIGIT LED DISPLAY (0.56 Inch)
Pb
Lead-Free Parts
LSD515/65F-XX-PF
DATA SHEET
DOC. NO : QW0905-LSD515/65F-XX-PF-08
REV.
: A
19 - Jul.
- 2009
DATE
:
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
1/8
PART NO. LSD515/65F-XX-PF
Page
Package Dimensions
12.6
8.0
(0.496")
(0.315")
PIN 10
PIN 6
14.2
19.0
15.24
(0.56")
(0.748")
(0.60")
PIN 1
PIN 5
ψ1.7(0.067")
LSD515/65F-XX-PF
LIGITEK
A
F
B
G
E
C
4.3±0.5
Ø0.51
TYP.
DP
D
2.46X4=
9.84(0.387")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD515/65F-XX-PF
Page 2/8
Internal Circuit Diagram
LSD5155F-XX-PF
3,8
DP
A B C D E F G
7 6 4 2 1 9 10 5
LSD5165F-XX-PF
3,8
DP
A B C D E F G
7 6 4 2 1 9 10 5
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD515/65F-XX-PF
Page 3/8
Electrical Connection
PIN NO.
1.
LSD5155F-XX-PF
PIN NO.
1.
LSD5165F-XX-PF
Anode E
Cathode E
2.
Anode D
2.
Cathode D
3.
Common Cathode
Anode C
3.
Common Anode
C
4.
4.
Cathode
Cathode
Cathode
Cathode
5.
Anode DP
Anode B
5.
DP
B
6.
6.
A
A
7.
Anode
7.
8.
Common Cathode
Anode F
8.
Common Anode
Cathode F
9.
9.
10.
Anode G
10.
Cathode G
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD515/65F-XX-PF
Page 4/8
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Red
Symbol
Parameter
UNIT
Forward Current Per Chip
IF
25
mA
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
IFP
75
Power Dissipation Per Chip
mW
65
10
PD
Ir
μA
Reverse Current Per Any Chip
Electrostatic Discharge( * )
Operating Temperature
Storage Temperature
ESD
Topr
Tstg
2000
V
-25 ~ +85
-25 ~ +85
℃
℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
*
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Part Selection And Application Information(Ratings at 25℃)
Electrical
common
cathode
or anode
CHIP
λD △λ
Vf(v)
Typ.
Iv(mcd)
Typ.
Max. Min.
IV-M
2:1
PART NO
(nm)
(nm)
Material Emitted
Min.
Common
Cathode
LSD5155F-XX-PF
LSD5165F-XX-PF
AlGaInP Red
630
20
1.5 1.8
15.25 26
2.4
Common
Anode
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
5/8
Page
PART NO. LSD515/65F-XX-PF
Test Condition For Each Parameter
Symbol
Unit
volt
Test Condition
If=20mA
If=10mA
If=20mA
If=20mA
Vr=5V
Parameter
Forward Voltage Per Chip
Vf
Iv
Luminous Intensity Per Chip
Dominant Wavelength
mcd
nm
λD
△λ
Ir
Spectral Line Half-Width
nm
Reverse Current Any Chip
Luminous Intensity Matching Ratio
μA
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD515/65F-XX-PF
Page 6/8
Typical Electro-Optical Characteristics Curve
SRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
60
2.0
1.0
0.0
50
40
30
20
10
0
0
0.5
1.0
1.5
2.0
2.5
3.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
2.5
2.0
1.1
1.0
1.5
1.0
0.9
0.8
0.5
0.0
-20
0
20
40
60
80
-20
0
20
40
60
80
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
550
600
650
700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD515/65F-XX-PF
Page 7/8
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350 °C Max
Soldering Time:3 Seconds Max(One time only)
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260 °C
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
Temp(°C)
260°C3sec Max
260°
5°/sec
max
120°
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 8/8
PART NO. LSD515/65F-XX-PF
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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