LSD1015-6SBKS-XX [LIGITEK]
SINGLE DIGIT LED DISPLAY (1.0 Inch); 个位数LED显示屏（ 1.0英寸）
| 型号： | LSD1015-6SBKS-XX |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | SINGLE DIGIT LED DISPLAY (1.0 Inch) |
| 文件： | 总8页 (文件大小：114K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SINGLE DIGIT LED DISPLAY (1.0 Inch)
LSD1015/6SBKS-XX
DATA SHEET
DOC. NO : QW0905-LSD1015/6SBKS-XX
REV.
: A
DATE
: 15 - Oct.- 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD1015/6SBKS-XX
Page 1/7
Package Dimensions
22.8(0.898")
8.9(0.35")
A1 A2
LSD1015/6SBKS-XX
LIGITEK
F H I J B
G1 G2
33.0
(1.299")
25.4
(1.0")
27.75
(1.093")
M L K
E
C
PIN NO.1
D2 D1
1.8(0.071")
8.5
(0.335")
6.05±0.5
18.1(0.713")
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/7
PART NO. LSD1015/6SBKS-XX
Internal Circuit Diagram
LSD1015SBKS-XX
6,18
E
9
H J K
3 23 15
RDP
A1 A2 B C D1 D2
2 22 21 16 14 10
F G1 G2
4 7 19
L M I LDP
12 11 24 1
13
LSD1016SBKS-XX
6,18
A1 A2 B C D1 D2 E F G1 G2 H J K L M I LDPRDP
2 22 21 16 14 10 9 4 7 19 3 23 15 12 11 24 1 13
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/7
PART NO.LSD1015/6SBKS-XX
Electrical Connection
PIN NO.
LSD1015SBKS-XX
PIN NO.
LSD1016SBKS-XX
Cathode LDP
Cathode A1
Cathode H
Cathode F
No Pin
Anode LDP
Anode A1
Anode H
Anode F
No Pin
1
2
3
4
5
1
2
3
4
5
6
7
8
Common Cathode
Anode G1
No Pin
6
7
8
Commom Anode
Cathode G1
No Pin
9
Anode E
Anode D2
Anode M
Anode L
Anode RDP
Anode D1
Anode K
Anode C
No Pin
Common Cathode
Anode G2
No Pin
Anode B
Anode A2
Anode J
9
Cathode E
Cathode D2
Cathode M
Cathode L
Cathode RDP
Cathode D1
Cathode K
Cathode C
No Pin
Commom Anode
Cathode G2
No Pin
Cathode B
Cathode A2
Cathode J
Cathode I
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Anode I
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD1015/6SBKS-XX
Page 4/7
Absolute Maximum Ratings at Ta=25 ℃
Ratings
SBKS
30
Symbol
Parameter
UNIT
Forward Current Per Chip
IF
mA
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
IFP
100
Power Dissipation Per Chip
mW
120
50
PD
μA
Reverse Current Per Any Chip
Electrostatic Discharge( * )
Ir
ESD
Topr
Tstg
2000
V
Operating Temperature
Storage Temperature
-25 ~ +85
-25 ~ +85
℃
℃
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
*
Part Selection And Application Information(Ratings at 25℃)
Electrical
common
cathode
or anode
CHIP
λD △λ
(nm) (nm)
Vf(v)
Iv(mcd)
Typ.
Max. Min.
IV-M
2:1
PART NO
Typ.
3.5
Material Emitted
Common
Cathode
LSD1015SBKS-XX
LSD1016SBKS-XX
Blue
475
26
4.2
10.5 18.0
InGaN/SiC
Common
Anode
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD1015/6SBKS-XX
Page 5/7
Test Condition For Each Parameter
Symbol
Vf
Unit
volt
Test Condition
If=20mA
If=10mA
If=20mA
If=20mA
Vr=5V
Parameter
Forward Voltage Per Chip
Luminous Intensity Per Chip
Dominant Wavelength
Iv
mcd
nm
λD
△λ
Ir
Spectral Line Half-Width
nm
Reverse Current Any Chip
Luminous Intensity Matching Ratio
μA
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSD1015/6SBKS-XX
Page 6/7
Typical Electro-Optical Characteristics Curve
SBK-S CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
30
25
20
15
10
5
1.5
1.25
1.0
0.75
0.5
0.25
0
0
1
2
3
4
5
0
5
10
15
20
25
30
Forward Current(mA)
Forward Voltage(V)
Fig.4 Relative Intensity vs. Wavelength
Fig.3 Forward Current vs. Temperature
40
1.0
30
20
10
0
0.5
0
0
25
50
75
100
380 430
480 530 580 630 680
Wavelength (nm)
Ambient Temperature(℃)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
7/7
PART NO. LSD1015/6SBKS-XX
Page
Reliability Test:
Reference
Description
Test Item
Test Condition
Standard
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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