LA38B-82-DBK-PF [LIGITEK]
LED ARRAY; LED阵列
| 型号： | LA38B-82-DBK-PF |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | LED ARRAY |
| 文件： | 总6页 (文件大小：124K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED ARRAY
Pb
Lead-Free Parts
LA38B-82/DBK-PF
DATA SHEET
DOC. NO : QW0905-LA38B-82/DBK-PF
REV
:
:
A
DATE
13 - Sep.- 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/5
PART NO. LA38B-82/DBK-PF
Package Dimensions
3.8
4.0
3.0
3.8
15.8±0.5
11.5
□
0.5
TYP
3.5±0.5
2.54TYP
-
+
3.8
LDBK4840
3.0
3.8
1.5MAX
1.0
□0.5
TYP
25.0MIN
1.0MIN
2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA38B-82/DBK-PF
Page 2/5
Absolute Maximum Ratings at Ta=25 ℃
Ratings
DBK
Symbol
Parameter
UNIT
30
IF
IFP
Forward Current
mA
mA
Peak Forward Current
Duty 1/10@10KHz
100
mW
μA
Power Dissipation
120
PD
Ir
Reverse Current @5V
Electrostatic Discharge( * )
Operating Temperature
Storage Temperature
50
ESD
Topr
Tstg
150
V
-20 ~ +80
-30 ~ +100
℃
℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
*
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
@20mA(V)
Luminous
intensity
@20mA(mcd)
Dominant
wave
length
Viewing
angle
2θ 1/2
(deg)
Spectral
halfwidth
△λnm
COLOR
MATERIAL
InGaN/GaN
PART NO
λDnm
Typ.
Typ.
90
Emitted
Blue
Lens
Blue Diffused
Max. Min.
LA38B-82/DBK-PF
470
30
3.5 4.0 50
110
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2.The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA38B-82/DBK-PF
Page 3/5
Typical Electro-Optical Characteristics Curve
DBK CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1000
100
10
1
0 1
1.0
2.0
3.0
4.0
5.0
1
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
2.5
2.0
1.1
1.0
1.5
1.0
0.5
0.0
0.9
0.8
-40
-20
0
20
40
60
80
100
-40 -20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
400
450
500
550
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA38B-82/DBK-PF
Page 4/5
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to case)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to case)
Temp(°C)
260°C3sec Max
260°
5°/sec
max
120°
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. LA38B-82/DBK-PF
5/5
Reliability Test:
Reference
Description
Test Item
Test Condition
Standard
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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