SMD1210P600L-12 [LEIDITECH]
Surface-mount Devices;型号: | SMD1210P600L-12 |
厂家: | Leiditech |
描述: | Surface-mount Devices |
文件: | 总8页 (文件大小:391K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SMD1210P150L~750L Series
Surface-mount Devices
Features:
RoHS Compliant & Halogen Free
Faster tripping, 1210 Dimension, Surface mountable, Solid state
Operating Current: 1.5A~7.5A
Maximum Voltage: 6V/12V
Operating Temperature:-40℃~ 85℃
Certification: CSA
Product Dimensions (mm)
A
B
C
D
E
Model
Min
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
Max
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
Min
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
Max
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
Min
0.3
Max
0.7
Min
0.25
Min
0.1
SMD1210P150L
SMD1210P150L-12
SMD1210P175L
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.4
0.4
0.4
0.7
0.7
0.7
0.7
0.7
0.7
0.7
1.0
1.0
1.0
SMD1210P175L-12
SMD1210P190L
SMD1210P190L-12
SMD1210P200L
SMD1210P200L-12
SMD1210P260L
SMD1210P260L-12
SMD1210P300L
1/8
Rev :01.06.2018
www.leiditech.com
SMD1210P150L~750L Series
A
B
C
D
E
Model
Min
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
Max
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
3.43
Min
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
2.35
Max
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
Min
0.4
0.4
0.4
0.4
0.4
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
Max
1.0
1.2
1.2
1.2
1.2
1.2
1.2
1.4
1.4
1.4
1.4
1.4
1.4
1.6
1.6
1.6
1.6
1.6
1.6
1.6
1.6
Min
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
0.25
Min
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
SMD1210P300L-12
SMD1210P350L
SMD1210P350L-12
SMD1210P380L
SMD1210P380L-12
SMD1210P400L
SMD1210P400L-12
SMD1210P450L
SMD1210P450L-12
SMD1210P500L
SMD1210P500L-12
SMD1210P550L
SMD1210P550L-12
SMD1210P600L
SMD1210P600L-12
SMD1210P650L
SMD1210P650L-12
SMD1210P700L
SMD1210P700L-12
SMD1210P750L
SMD1210P750L-12
Recommended Solder Pad Layout Dimensions (mm)
F
G
H
Normal Value
2.5
Device
Normal Value
Normal Value
2.0
1210 Series
1.0
Electrical Characteristics
Maximum
Resistance
Time-to-Trip
Current Time
VMAX
IMAX
(A)
IH
IT
PD
Model
RiMIN
(Ω)
R1MAX
(Ω)
(V)
(A)
(A)
(W)
(A)
8.0
8.0
8.0
(Sec)
2.0
SMD1210P150L
SMD1210P150L-12
SMD1210P175L
6.0
50.0
1.5
1.5
3.0
3.0
3.5
0.8
0.8
0.8
0.010
0.010
0.005
0.060
0.060
0.040
12.0
6.0
50.0
50.0
2.0
1.75
2.0
2/8
Rev :01.06.2018
www.leiditech.com
SMD1210P150L~750L Series
SMD1210P175L-12
SMD1210P190L
12.0
6.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
1.75
1.9
1.9
2.0
2.0
2.6
2.6
3.0
3.0
3.5
3.5
3.8
3.8
4.0
4.0
4.5
4.5
5.0
5.0
5.5
5.5
6.0
6.0
6.5
6.5
7.0
7.0
7.5
7.5
3.5
3.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
1.0
1.0
1.0
1.0
1.0
1.0
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
8.0
2.0
3.0
3.0
3.0
3.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
0.005
0.006
0.006
0.006
0.006
0.003
0.003
0.003
0.003
0.002
0.002
0.002
0.002
0.002
0.002
0.001
0.001
0.001
0.001
0.001
0.001
0.001
0.001
0.001
0.001
0.001
0.001
0.001
0.001
0.040
0.037
0.037
0.035
0.035
0.025
0.025
0.02
8.0
SMD1210P190L-12
SMD1210P200L
12.0
6.0
3.8
8.0
4.0
8.0
SMD1210P200L-12
SMD1210P260L
12.0
6.0
4.0
8.0
5.2
13.0
13.0
15.0
15.0
17.5
17.5
19.0
19.0
20.0
20.0
22.5
22.5
25.0
25.0
27.5
27.5
30.0
30.0
32.5
32.5
35.0
35.0
37.5
37.5
SMD1210P260L-12
SMD1210P300L
12.0
6.0
5.2
6.0
SMD1210P300L-12
SMD1210P350L
12.0
6.0
6.0
0.02
7.0
0.018
0.018
0.016
0.016
0.014
0.014
0.013
0.013
0.012
0.012
0.011
0.011
0.010
0.010
0.009
0.009
0.008
0.008
0.007
0.007
SMD1210P350L-12
SMD1210P380L
12.0
6.0
7.0
7.6
SMD1210P380L-12
SMD1210P400L
12.0
6.0
7.6
8.0
SMD1210P400L-12
SMD1210P450L
12.0
6.0
8.0
9.0
SMD1210P450L-12
SMD1210P500L
12.0
6.0
9.0
10.0
10.0
11.0
11.0
12.0
12.0
13.0
13.0
14.0
14.0
15.0
15.0
SMD1210P500L-12
SMD1210P550L
12.0
6.0
SMD1210P550L-12
SMD1210P600L
12.0
6.0
SMD1210P600L-12
SMD1210P650L
12.0
6.0
SMD1210P650L-12
SMD1210P700L
12.0
6.0
SMD1210P700L-12
SMD1210P750L
12.0
6.0
SMD1210P750L-12
12.0
Thermal Derating Chart-IH (A)
Maximum ambient operating temperature (℃)
Model
-40
-20
0
25
40
50
60
70
85
SMD1210P150L
SMD1210P150L-12
SMD1210P175L
2.25
2.25
2.55
2.55
2.00
2.00
2.33
2.33
1.75
1.75
2.02
2.02
1.50
1.50
1.75
1.75
1.33
1.33
1.53
1.53
1.15
1.15
1.35
1.35
1.05
1.05
1.23
1.23
0.93
0.93
1.07
1.07
0.70
0.70
0.85
0.85
SMD1210P175L-12
3/8
Rev :01.06.2018
www.leiditech.com
SMD1210P150L~750L Series
SMD1210P190L
SMD1210P190L-12
SMD1210P200L
2.81
2.81
2.96
2.96
3.85
3.85
4.40
4.40
5.18
5.18
5.55
5.55
5.92
5.92
6.12
6.12
7.40
7.40
8.14
8.14
8.65
8.65
9.20
9.20
9.84
9.84
10.5
10.5
2.53
2.53
2.67
2.67
3.47
3.47
3.98
3.98
4.67
4.67
5.02
5.02
5.33
5.33
5.39
5.39
6.67
6.67
7.34
7.34
7.91
7.91
8.45
8.45
9.00
9.00
9.65
9.65
2.20
2.20
2.32
2.32
3.02
3.02
3.45
3.45
4.06
4.06
4.35
4.35
4.64
4.64
5.16
5.16
5.80
5.80
6.38
6.38
6.93
6.93
7.45
7.45
7.95
7.95
8.50
8.50
1.90
1.90
2.00
2.00
2.60
2.60
3.00
3.00
3.50
3.50
3.80
3.80
4.00
4.00
4.50
4.50
5.00
5.00
5.50
5.50
6.00
6.00
6.50
6.50
7.00
7.00
7.50
7.50
1.67
1.67
1.76
1.76
2.29
2.29
2.64
2.64
3.08
3.08
3.32
3.32
3.52
3.52
3.85
3.85
4.40
4.40
4.84
4.84
5.23
5.23
5.60
5.60
5.96
5.96
6.40
6.40
1.47
1.47
1.55
1.55
2.01
2.01
2.30
2.30
2.71
2.71
2.92
2.92
3.09
3.09
3.35
3.35
3.87
3.87
4.26
4.26
4.45
4.45
4.65
4.65
4.95
4.95
5.30
5.30
1.34
1.34
1.41
1.41
1.84
1.84
2.15
2.15
2.47
2.47
2.65
2.65
2.83
2.83
3.00
3.00
3.53
3.53
3.88
3.88
4.00
4.00
4.30
4.30
4.50
4.50
4.80
4.80
1.17
1.17
1.23
1.23
1.59
1.59
1.83
1.83
2.15
2.15
2.30
2.30
2.45
2.45
2.36
2.36
3.07
3.07
3.38
3.38
3.63
3.63
3.89
3.89
4.16
4.16
4.45
4.45
0.91
0.91
0.96
0.96
1.25
1.25
1.42
1.42
1.68
1.68
1.81
1.81
1.92
1.92
1.56
1.56
2.40
2.40
2.64
2.64
2.85
2.85
3.00
3.00
3.20
3.20
4.42
4.42
SMD1210P200L-12
SMD1210P260L
SMD1210P260L-12
SMD1210P300L
SMD1210P300L-12
SMD1210P350L
SMD1210P350L-12
SMD1210P380L
SMD1210P380L-12
SMD1210P400L
SMD1210P400L-12
SMD1210P450L
SMD1210P450L-12
SMD1210P500L
SMD1210P500L-12
SMD1210P550L
SMD1210P550L-12
SMD1210P600L
SMD1210P600L-12
SMD1210P650L
SMD1210P650L-12
SMD1210P700L
SMD1210P700L-12
SMD1210P750L
SMD1210P750L-12
Test Procedures and Requirements
Test Item
Test Conditions
Accept/Reject Criteria
Resistance
Initial
In still air at 25℃
RiMIN≤R≤R1MAX
Time to Trip
Holding Current
Trip Cycle Life
Trip Endurance
Specified current, VMAX, 25℃
30min, at IH, 25℃
T≤Maximum Time to Trip
No trip
VMAX, IMAX, 100 cycles
No arcing or burning
No arcing or burning
VMAX, IMAX, 1 hour
4/8
Rev :01.06.2018
www.leiditech.com
SMD1210P150L~750L Series
Physical Characteristics
Terminal Materials
Soldering Zone
Tin-Plated Nickle-copper
Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.
Level 2a, per IPC/JEDEC J-STD 020C
Moisture Sensitivity
Environmental Specifications
Test Item
Test Conditions
85℃,1000 hours
Resistance Change
±10% typical
Passive Aging
Humidity Aging
85℃/85%RH.100 hours
MIL-STD-202,Method 107G
+85℃/-40℃,20 times
±5% typical
Thermal Shock
-30% typical
Solvent Resistance
Vibration
MIL-STD-202,Method 215
ML-STD-883C,Test Condition A
No change
No change
Electrical Specifications
IH=Hold current: Maximum current at which the device will not interrupt in 25℃ still air.
IT=Trip current: Minimum current at which the device from low resistance to high resistance in 25℃ still air.
VMAX=Maximum continuous voltage device can withstand without damage at rated current.
IMAX=Maximum fault current device can withstand without damage at rated voltage.
Maximum Time-to-trip: Maximum time to trip at assigned current.
PD=Typical power dissipation: Typical amount of power dissipated from the device when in 25℃ still air environment.
RiMIN=Minimum resistance of device at 25℃ prior to tripping.
R1MAX = Maximum device resistance is measured one hour post reflow.
Solder Reflow Profiles
5/8
Rev :01.06.2018
www.leiditech.com
SMD1210P150L~750L Series
Profile Feature
Pb-Free Assembly
Average ramp up rate(TsMAX to Tp)
Preheat
3℃/second max.
●Temperature min.(TsMIN
●Temperature max.( TsMAX
●Time (TsMIN to TsMAX
)
150℃
)
200℃
)
60-120 seconds
Time maintained above:
●Temperature (TL)
●Time (TL)
217℃
60-150 seconds
Peak/Classification temperature (TP)
Time within 5℃ of actual peak temperature
Time (TP)
260℃
30 seconds max.
3℃/second max.
8 minutes max.
Ramp down rate
Time 25℃ to peak temperature
● Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free.
● Devices are not designed to be wave soldered to the bottom side of the board.
● Recommended maximum paste thickness is 0.25mm (0.010inch).
● Devices can be cleaned using standard industry methods and solvents.
Note 1: All temperature refer to topside of the package,measured on the package body surface.
Note 2: If reflow temperature exceed the recommended profile,devices may not meet the performance requirements.
6/8
Rev :01.06.2018
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SMD1210P150L~750L Series
Tape Specifications and Reel Dimensions
Coverning Specifications
EIA 481-1
W
8.0 ± 0.3
4.0 ± 0.10
4.0± 0.10
2.0 ± 0.05
2.82 ± 0.10
3.46 ± 0.10
1.55 ± 0.05
3.50± 0.05
1.75 ± 0.10
0.25 ± 0.10
390
P0
P1
P2
A0
B0
D0
F
E1
T
Leader min.
Trailer min.
160
Reel Dimensions
A
N
178±1.0
59±1
W1
W2
8.5+1.0/-0.2
12.0±1
7/8
Rev :01.06.2018
www.leiditech.com
SMD1210P150L~750L Series
Storage
The maximum ambient temperature shall not exceed 40℃.Storage temperatures higher than 40℃ could result in the
deformation of packaging materials. The maximum relative humidity recommended for storage is 70%.High humidity with
high temperature can accelerate the oxidation the oxidation of the solder plating on the termination and reduce the
solderability of the components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination
and shall only be opened prior to use, the products shall not be stored in areas where harmful gases containing sulfur of
chlorine are present.
Warning
• Please read this specification before using the product.
• Use PPTC beyond the maximum ratings or improper use may result in device damage, electrical arcing and flame.
• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be
used when repeated fault conditions or prolonged trip events are anticipated.
• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended
electronic, thermal, and mechanical procedures for electronic components.
• Use PPTC with a large inductance in circuit will generate a circuit voltage above the rated voltage of the PPTC.
• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.
• Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the
performance of the devices. PPTC can be cleaned by standard methods.
• Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper
board layouts or reflow profile could negatively impact solderability performance of our devices.
Shanghai Leiditech Electronic Co.,Ltd
Email: sale1@leiditech.com
Tel : +86- 021 50828806
Fax : +86- 021 50477059
8/8
Rev :01.06.2018
www.leiditech.com
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