LM1265HP2R7MG-D [LEIDITECH]
Carbonyl Powder;型号: | LM1265HP2R7MG-D |
厂家: | Leiditech |
描述: | Carbonyl Powder |
文件: | 总6页 (文件大小:1042K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LM1265H-Series(G)-D
1. Features
1. Carbonyl Powder.
2. Compact design.
Halogen
3. High current,low DCR,high efficiency.
4. Very low acoustic noise and very low leakage flux noise.
5. High reliability.
Pb
Pb-free
Halogen-free
6. 100% Lead(Pb)-Free and RoHS compliant.
7. AEC-Q200 Grade 1 qualified (–40℃ to +125℃ ambient)
2. Applications
Note PC power system,incl. IMVP-6
DC/DC converter .
3. Dimensions
C
A
D
A`
330
1150
leadframe
D
A
A`
C
Recommend PC Board Pattern
L
1R5
1150
E
B
G
non-leadframe
Series
LM1265HP
Type
A(mm)
A'(mm)
B(mm)
C(mm)
D(mm)
E(mm)
4.7±0.3
L(mm) G(mm) H(mm)
14.2
8.0
5.0
leadframe
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness
at 0.15mm and above.
13.5±0.5 12.5±0.3 12.5±0.3 6.2±0.3
2.3±0.3
non-leadframe
4. Part Numbering
LM
A
1265
B
HP
C
-
330
D
MG
E
-
D
F
A: Series
B: Dimension
C: Type
BxC
HP:H:Carbonyl Powder,P:PAD broaden.
D: Inductance
E: Inductance Tolerance
330=33uH
M=±20%.
F: 印 D/C
印字:黑色.330 及 D/C 1150 (11 年,50 週期)(依實際生產日期而定)
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LM1265H-Series(G)-D
5. Specification
Inductance
L0 (uH)±20%
@ 0 A
DCR
(mΩ) Typ.
@25℃
DCR
(mΩ) Max.
@25℃
I rms (A)
Typ.
I sat (A)
Typ.
Part Number
Type
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
non-leadframe
leadframe
LM1265HP-R15MG-D
LM1265HP-R22MG-D
LM1265HP-R30MG-D
LM1265HP-R33MG-D
LM1265HP-R36MG-D
LM1265HP-R40MG-D
LM1265HP-R47MG-D
LM1265HP-R50MG-D
LM1265HP-R56MG-D
LM1265HP-R68MG-D
LM1265HP-R82MG-D
LM1265HP-1R0MG-D
LM1265HP-1R2MG-D
LM1265HP-1R5MG-D
LM1265HP-1R8MG-D
LM1265HP-2R2MG-D
LM1265HP-2R7MG-D
LM1265HP-3R3MG-D
LM1265HP-4R7MG-D
LM1265HP-5R6MG-D
LM1265HP-6R8MG-D
LM1265HP-8R2MG-D
LM1265HP-100MG-D
LM1265HP-130MG-D
LM1265HP-150MG-D
LM1265HP-220MG-D
LM1265HP-330MG-D
LM1265HP-470MG-D
LM1265HP-680MG-D
LM1265HP-101MG-D
0.15
0.22
0.30
0.33
0.36
0.40
0.47
0.50
0.56
0.68
0.82
1.00
1.20
1.50
1.80
2.20
2.70
3.30
4.70
5.60
6.80
8.20
10.0
13.0
15.0
22.0
33.0
47.0
68.0
100
55
53
48
46
45
44
41
40
37
35
33
30
28
27
24
22
20
18
13.5
12.5
11.5
10.5
10.0
9
118
112
72
68
66
64
63
60
58
55
50
48
47
45
40
37
32
30
28
23
18
16
15.5
13
13
12
11
0.49
0.47
0.6
0.60
0.60
0.72
0.8
0.9
1.0
1.2
1.25
1.2
1.5
1.9
2.3
2.4
3.0
4.0
4.2
5.5
6.8
8.4
10
0.65
0.7
0.7
0.9
0.92
1.05
1.25
1.5
1.7
1.9
2.5
3.6
leadframe
3.8
leadframe
4.3
leadframe
5.7
leadframe
7.0
leadframe
8.5
leadframe
9.5
11.5
15.5
16.5
24
leadframe
12
leadframe
13.2
21
leadframe
leadframe
9
23.2
32.5
48
28
leadframe
9
37
leadframe
8
58
leadframe
6.5
4.8
4.2
9.5
7.8
5.5
76
90
leadframe
110
145
130
165
leadframe
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δ T of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 20%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
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LM1265H-Series(G)-D
6. Material List
5
5
4
3
2
1
NO
1
Items
Materials
NO
1
Items
Materials
Core Carbonyl Powder.
Core Carbonyl Powder.
2
Wire Polyester Wire or equivalent.
2
Wire Polyester Wire or equivalent.
Solder 100% Pb free solder
3
Clip 100% Pb free solder(Ni+Sn---Plating)
3
4
Ink
Halogen-free ketone
4
Ink
Halogen-free ketone
5
paint Epoxy resin
5
paint Epoxy resin
7. Reliability and Test Condition
Item
Performance
Test Condition
Operating temperature
-40~+125℃ (Including self - temperature rise)
1. -10~+40℃,50~60%RH (Product with taping)
2. -40~+125℃(on board)
Storage temperature
Electrical Performance Test
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
Inductance
Refer to standard electrical characteristics list.
DCR
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation DC Current (Isat) will cause L0
to drop △ L(%)
Saturation Current (Isat)
Approximately △ L20%.
Approximately △ T40℃
Heat Rated Current (Irms) will cause the coil temperature rise
△ T(℃) without core loss.
1.Applied the allowed DC current
Heat Rated Current (Irms)
2.Temperature measured by digital surface thermometer
Reliability Test
Preconditioning:
Run
through
IR
reflow
for
2
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles)
Temperature: 125±2 ℃(Inductor)
Life Test
Applied current:rated current
Duration:1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Preconditioning:
Run
through
IR
reflow
for
2
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Load Humidity
Humidity:85±2﹪ R.H,
Temperature:85℃±2 ℃
Duration:1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Preconditioning: Run through IR reflow for
2
times.( IPC/JEDEC J-STD-020DClassification Reflow
Profiles
1. Baked at50℃ for 25hrs, measured at room temperature
after placing for 4 hrs.
Appearance:No damage.
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
Moisture Resistance
RDC:within ±15% of initial value and shall not
exceed the specification value
3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25℃ 80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning:
Run
through
IR
reflow
for
2
times.( IPC/JEDEC J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Thermal
shock
Step1:-40±2℃ 30±5min
Step2:25±2℃ ≦ 0.5min
Step3:125±2℃ 30±5min
Number of cycles: 500
Measured at room temperature after placing for 24±2 hrs
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LM1265H-Series(G)-D
Oscillation Frequency: 10~2K~10Hz for 20 minutes
Equipment: Vibration checker
Total Amplitude:1.52mm±10%
Vibration
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
Item
Performance
Test Condition
Peak
value
(g’s)
Normal
duration (D)
(ms)
Velocity
change
(Vi)ft/sec
Wave
form
Type
Shock
Appearance:No damage.
SMD
Lead
50
50
11
11
Half-sine
Half-sine
11.3
11.3
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805:40x100x1.2mm
<0805:40x100x0.8mm
Bending depth: >=0805:1.2mm
<0805:0.8mm
exceed the specification value
Bending
duration of 10 sec.
Preheat: 150℃,60sec.。
Solder: Sn96.5% Ag3% Cu0.5%
More than 95% of the terminal electrode should
Temperature: 245±5℃。
be covered with solder。
Solderability
Flux for lead free: Rosin. 9.5%。
Dip time: 4±1sec。
Depth: completely cover the termination
Number of heat cycles: 1
Temperature
Temperature
Resistance
to Soldering
Heat
Time(s)
10 ±1
ramp/immersion
(°C)
and emersion rate
260 ±5(solder
temp)
25mm/s ±6 mm/s
Preconditioning:
Run
through
IR
reflow
for
2
times.( IPC/JEDEC J-STD-020DClassification
Reflow Profiles
With the component mounted on a PCB with the device to
be tested, apply a force
(>0805:1kg , <=0805:0.5kg)to the side of a device being
tested. This force shall be
Appearance:No damage.
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
applied for 60 +1 seconds. Also the force shall be applied
gradually as not to apply a
exceed the specification value
shock to the component being tested.
Terminal
Strength
Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours
of recovery under the standard condition.
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LM1265H-Series(G)-D
8. Soldering and Mounting
(1) Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. TAI-TECH terminations are suitable for
re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air
soldering tools.
(2) Solder re-flow:
Recommended temperature profiles for re-flow soldering in Figure 1.
(3) Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
‧
Preheat circuit and products to 150℃
‧
Never contact the ceramic with the iron tip
‧
Use a 20 watt soldering iron with tip diameter of 1.0mm
‧
355℃ tip temperature (max)
‧
1.0mm tip diameter (max)
‧
Limit soldering time to 4~5sec.
Reflow Soldering
Iron Soldering
PRE-HEATING
SOLDERING
NATURAL
COOLING
PRE-HEATING
SOLDERING
NATURAL
COOLING
within 4~5s
TP(260℃ / 10s max.)
350
150
217
60~150s
200
150
60~180s
480s max.
Gradual cooling
Over 60s
25
TIME(sec.)
TIME( sec.)
Iron Soldering times: 1 times max.
Fig.2
Reflow times: 3 times max.
Fig.1
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LM1265H-Series(G)-D
9. Packaging Information
(1) Reel Dimension
COVER TAPE
2.0∮0.5
Type
A(mm) B(mm) C(mm) D(mm)
13”x24mm
24.4+2/-0
13+0.5/-0.2
330
100±2
A
EMBOSSED CARRIER
(2) Tape Dimension
Az
Series Size Bo(mm) Bz(mm) Ao(mm) Az(mm) Ko(mm) P(mm) W(mm) F(mm)
t(mm)
LM
1265
14.1±0.1
13.0±0.1
12.9±0.1
7.0±0.1
7.0±0.1
16.0±0.1
24±0.3
11.5±0.1
0.35±0.05
(3) Packaging Quantity
LM
1265
Chip / Reel
Inner box
Carton
500
1000
4000
(4) Tearing Off Force
The force for tearing off cover tape is 10 to 130 grams in the arrow
direction under the following conditions(referenced
ANSI/EIA-481-C-2003 of 4.11 stadnard).
F
Top cover tape
Room Temp.
Room Humidity
(%)
Room atm
(hPa)
Tearing Speed
mm/min
(℃)
Base tape
5~35
45~85
860~1060
300
Shanghai Leiditech Electronic Co.,Ltd
Email: sale1@leiditech.com
Tel : +86- 021 50828806
Fax : +86- 021 50477059
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