LM0605H-8R2MG-D [LEIDITECH]

Carbonyl powder inductor.;
LM0605H-8R2MG-D
型号: LM0605H-8R2MG-D
厂家: Leiditech    Leiditech
描述:

Carbonyl powder inductor.

文件: 总9页 (文件大小:937K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LM0605H-Series(G)-D  
1. Features  
1. Carbonyl powder inductor.  
2. Compact design.  
3. High currentlow DCRhigh efficiency.  
4. Very low acoustic noise and very low leakage flux noise.  
5. High reliability.  
Halogen  
Pb  
Pb-free  
Halogen-free  
6. 100% Lead(Pb) & Halogen-Free and RoHS compliant.  
2. Applications  
Note PC power systemincl. IMVP-6  
DC/DC converter .  
3. Dimensions  
Recommend PC Board Pattern  
C
A
D
L
1R0  
1322  
G
L(mm)  
G(mm)  
H(mm)  
Series  
LM0605H  
A(mm)  
B(mm)  
C(mm)  
D(mm)  
1.8±0.3  
E(mm)  
8.4  
2.5  
3.5  
7.3±0.3  
6.6±0.3  
4.8±0.2  
3.0±0.3  
Note: 1. The above PCB layout reference only.  
2. Recommend solder paste thickness at  
0.15mm and above.  
4. Part Numbering  
LM  
A
0605  
B
H
C
-
1R0  
D
MG  
E
-
D
F
A: Series  
B: Dimension  
C: Type  
D: Inductance  
E: Inductance Tolerance  
F: D/C  
BxC  
Carbonyl Powder  
1R0=1.00uH  
M=±20%  
印字:黑色 1R0 D/C 1322 (13 ,22 週期)(依實際生產日期而定).  
1/9  
Rev 2.0 :12.01.2019  
www.leiditech.com  
LM0605H-Series(G)-D  
5. Specification  
Inductance  
L0 (uH)±20% @ 0 A  
I rms (A)  
Typ.  
I sat (A)  
Typ.  
DCR  
DCR  
Part Number  
(mΩ) Typ.@25(mΩ) Max.@25℃  
23  
22  
20  
19  
31  
30  
27  
25  
3.1  
3.5  
3.6  
3.8  
3.7  
3.9  
4.2  
4.3  
LM0605H-R40MG-D  
LM0605H-R47MG-D  
LM0605H-R56MG-D  
LM0605H-R60MG-D  
LM0605H-R68MG-D  
LM0605H-R82MG-D  
LM0605H-1R0MG-D  
LM0605H-1R2MG-D  
LM0605H-1R5MG-D  
0.40  
0.47  
0.56  
0.60  
0.68  
0.82  
1.00  
1.20  
1.50  
18  
24  
4.0  
4.5  
16.5  
15  
22  
20  
4.6  
6.1  
4.9  
6.5  
14  
12  
18  
6.7  
8.6  
7.5  
9.0  
16.5  
LM0605H-2R2MG-D  
LM0605H-3R3MG-D  
2.20  
3.30  
10  
8
14  
12  
11.2  
19  
12.0  
20.9  
LM0605H-4R7MG-D  
LM0605H-5R6MG-D  
LM0605H-6R5MG-D  
LM0605H-6R8MG-D  
LM0605H-8R2MG-D  
LM0605H-100MG-D  
LM0605H-220MG-D  
Note:  
4.70  
5.60  
6.50  
6.80  
8.20  
10.0  
22.0  
6.5  
6.0  
5.5  
5.5  
5.0  
4.0  
2.5  
10  
9.0  
8.5  
8.5  
8.0  
7.5  
5.5  
28  
43.5  
46  
30.8  
49  
51.5  
51.5  
63  
46  
56  
60  
69  
140  
170  
1. Test frequency : Ls : 100KHz /1.0V.  
2. All test data referenced to 25ambient.  
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.  
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δ T of 40  
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.  
6. The part temperature (ambient + temp rise) should not exceed 125under worst case operating conditions.Circuit design,component,PCB trace size and  
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.  
7. Special inquiries besides the above common used types can be met on your requirement.  
2/9  
Rev 2.0 :12.01.2019  
www.leiditech.com  
LM0605H-Series(G)-D  
6. Material List  
NO  
1
Items  
Core  
Wire  
Clip  
Materials  
Carbonyl Powder.  
2
Polyester Wire or equivalent.  
100% Pb free solder(Ni+Sn---Plating)  
Epoxy resin  
3
4
paint  
Ink  
5
Halogen-free ketone  
7. Reliability and Test Condition  
Item  
Performance  
Test Condition  
Operating temperature  
-40~+125(Including self - temperature rise)  
1.-10~+40,50~60%RH (Product without taping)  
2.-40~+125(on board)  
Storage temperature  
Electrical Performance Test  
Inductance  
HP4284A,CH11025,CH3302,CH1320,CH1320S  
LCR Meter.  
Refer to standard electrical characteristics list.  
DCR  
CH16502,Agilent33420A Micro-Ohm Meter.  
Saturation DC Current (Isat) will cause L0  
to drop L(%)  
Saturation Current (Isat)  
Approximately L30%.  
Approximately T40℃  
Heat Rated Current (Irms) will cause the coil temperature rise  
T() without core loss.  
1.Applied the allowed DC current  
Heat Rated Current (Irms)  
2.Temperature measured by digital surface thermometer  
Reliability Test  
Preconditioning:  
Run  
through  
IR  
reflow  
for  
2
times.( IPC/JEDEC  
J-STD-020DClassification Reflow Profiles)  
Temperature125±2 (Inductor)  
Life Test  
Applied currentrated current  
Duration1000±12hrs  
Measured at room temperature after placing for 24±2 hrs  
Preconditioning:  
Run  
through  
IR  
reflow  
for  
2
times.( IPC/JEDEC  
J-STD-020DClassification Reflow Profiles  
Load Humidity  
Humidity85±2R.H,  
Temperature85±2 ℃  
Duration1000hrs Min. with 100% rated current  
Measured at room temperature after placing for 24±2 hrs  
Preconditioning: Run through IR reflow for  
2
times.( IPC/JEDEC J-STD-020DClassification Reflow  
Profiles  
1. Baked at50for 25hrs, measured at room temperature  
after placing for 4 hrs.  
2. Raise temperature to 65±290-100%RH in 2.5hrs, and  
AppearanceNo damage.  
keep 3 hours, cool down to 25in 2.5hrs.  
Moisture Resistance  
Inductancewithin±10% of initial value  
QShall not exceed the specification value.  
3. Raise temperature to 65±290-100%RH in 2.5hrs, and  
keep 3 hours, cool down to 25in  
RDCwithin ±15% of initial value and shall not  
exceed the specification value  
2.5hrs,keep at 25for 2 hrs then keep at -10for 3 hrs  
4. Keep at 2580-100%RH for 15min and vibrate at the  
frequency of 10 to 55 Hz to 10 Hz, measure at  
room temperature after placing for 1~2 hrs.  
Preconditioning:  
Run  
through  
IR  
reflow  
for  
2
times.( IPC/JEDEC J-STD-020DClassification  
Reflow Profiles  
Condition for 1 cycle  
Thermal  
shock  
Step1-40±230±5min  
Step225±2℃ ≦ 0.5min  
Step3125±230±5min  
Number of cycles500  
Measured at room temperature after placing for 24±2 hrs  
Oscillation Frequency: 102K10Hz for 20 minutes  
EquipmentVibration checker  
Total Amplitude:1.52mm±10%  
Vibration  
Testing Time : 12 hours(20 minutes, 12 cycles each of 3  
orientations)。  
3/9  
Rev 2.0 :12.01.2019  
www.leiditech.com  
LM0605H-Series(G)-D  
Item  
Performance  
Test Condition  
Peak  
value  
(g’s)  
Normal  
duration (D)  
(ms)  
Velocity  
change  
(Vi)ft/sec  
Wave  
form  
Type  
Shock  
AppearanceNo damage.  
SMD  
Lead  
50  
50  
11  
11  
Half-sine  
Half-sine  
11.3  
11.3  
Inductancewithin±10% of initial value  
QShall not exceed the specification value.  
RDCwithin ±15% of initial value and shall not  
Shall be mounted on a FR4 substrate of the  
following dimensions: >=0805:40x100x1.2mm  
<0805:40x100x0.8mm  
Bending depth: >=0805:1.2mm  
<0805:0.8mm  
exceed the specification value  
Bending  
duration of 10 sec.  
Preheat: 150,60sec.。  
Solder: Sn96.5% Ag3% Cu0.5%  
More than 95% of the terminal electrode should  
Temperature: 245±5℃。  
be covered with solder。  
Solderability  
Flux for lead free: Rosin. 9.5%。  
Dip time: 4±1sec。  
Depth: completely cover the termination  
Number of heat cycles: 1  
Temperature  
Temperature  
Time(s)  
10 ±1  
ramp/immersion  
Resistance  
to Soldering  
Heat  
(°C)  
and emersion rate  
260 ±5(solder  
temp)  
25mm/s ±6 mm/s  
Preconditioning:  
Run  
through  
IR  
reflow  
for  
2
times.( IPC/JEDEC J-STD-020DClassification  
Reflow Profiles  
With the component mounted on a PCB with the device to  
be tested, apply a force  
(>0805:1kg , <=0805:0.5kg)to the side of a device being  
tested. This force shall be  
AppearanceNo damage.  
Inductancewithin±10% of initial value  
QShall not exceed the specification value.  
RDCwithin ±15% of initial value and shall not  
applied for 60 +1 seconds. Also the force shall be applied  
gradually as not to apply a  
exceed the specification value  
shock to the component being tested.  
Terminal  
Strength  
Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours  
of recovery under the standard condition.  
4/9  
Rev 2.0 :12.01.2019  
www.leiditech.com  
LM0605H-Series(G)-D  
8. Soldering and Mounting  
(1) Soldering  
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused  
by the difference in coefficients of expansion between solder, chip and substrate. terminations are suitable for re-flow  
soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering  
tools.  
(2) Solder re-flow:  
Recommended temperature profiles for re-flow soldering in Figure 1.  
(3) Soldering Iron:  
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that  
a soldering iron must be employed the following precautions are recommended.  
Preheat circuit and products to 150℃  
Never contact the ceramic with the iron tip  
Use a 20 watt soldering iron with tip diameter of 1.0mm  
355tip temperature (max)  
1.0mm tip diameter (max)  
Limit soldering time to 4~5sec.  
Reflow Soldering  
Iron Soldering  
PRE-HEATING  
SOLDERING  
NATURAL  
COOLING  
PRE-HEATING  
SOLDERING  
NATURAL  
COOLING  
within 4~5s  
TP(260/ 10s max.)  
350  
150  
217  
60~150s  
200  
150  
60~180s  
480s max.  
Gradual cooling  
Over 60s  
25  
TIME(sec.)  
TIME( sec.)  
Iron Soldering times: 1 times max.  
Fig.2  
Reflow times: 3 times max.  
Fig.1  
5/9  
Rev 2.0 :12.01.2019  
www.leiditech.com  
LM0605H-Series(G)-D  
9. Packaging Information  
(1) Reel Dimension  
COVER TAPE  
2.00.5  
Type  
A(mm) B(mm) C(mm) D(mm)  
13”x16mm  
16.4+2/-0  
13+0.5/-0.2  
330  
100±2  
A
EMBOSSED CARRIER  
(2) Tape Dimension  
Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) W(mm) F(mm) t(mm) D(mm)  
LM  
0605  
7.7±0.1  
7.0±0.1  
5.3±0.1  
12.0±0.1  
16±0.3  
7.5±0.1  
0.35±0.05  
1.5±0.1  
(3) Packaging Quantity  
LM  
0605  
Chip / Reel  
Inner box  
Carton  
800  
1600  
6400  
(4) Tearing Off Force  
The force for tearing off cover tape is 10 to 130 grams in the arrow  
direction under the following conditions(referenced  
ANSI/EIA-481-C-2003 of 4.11 stadnard).  
F
Top cover tape  
Room Temp.  
Room Humidity  
(%)  
Room atm  
(hPa)  
Tearing Speed  
mm/min  
()  
Base tape  
5~35  
45~85  
860~1060  
300  
6/9  
Rev 2.0 :12.01.2019  
www.leiditech.com  
LM0605H-Series(G)-D  
10. Typical Performance Curves  
LM0605H-R40  
LM0605H-R47  
LM0605H-R56  
0.7  
0.56  
0.42  
0.28  
0.14  
0
100  
80  
60  
40  
20  
0
0.8  
0.6  
0.4  
0.2  
0
80  
70  
60  
50  
40  
30  
20  
10  
0
1
0.8  
0.6  
0.4  
0.2  
0
80  
70  
60  
50  
40  
30  
20  
10  
0
0
6.2  
12.4  
18.6  
24.8  
31  
0
6
12  
18  
24  
30  
0
6.75  
13.5  
20.25  
16.5  
13.5  
27  
DC CURRENT(A)  
DC CURRENT(A)  
DC CURRENT(A)  
LM0605H-R82  
LM0605H-R60  
LM0605H-R68  
1.6  
1.2  
0.8  
0.4  
0
80  
1
0.8  
0.6  
0.4  
0.2  
0
50  
40  
30  
20  
10  
0
1.2  
0.9  
0.6  
0.3  
0
80  
70  
60  
50  
40  
30  
20  
10  
0
70  
60  
50  
40  
30  
20  
10  
0
0
5
10  
15  
20  
25  
0
5.5  
11  
16.5  
22  
0
5.5  
11  
22  
DC CURRENT(A)  
DC CURRENT(A)  
DC CURRENT(A)  
LM0605H-1R0  
LM0605H-1R2  
LM0605H-1R5  
2
1.5  
1
80  
70  
60  
50  
40  
30  
20  
10  
0
2
1.5  
1
80  
3
2.4  
1.8  
1.2  
0.6  
0
80  
70  
60  
50  
40  
30  
20  
10  
0
70  
60  
50  
40  
30  
20  
10  
0
0.5  
0
0.5  
0
0
0
0
0
5
10  
15  
20  
0
5
10  
15  
20  
0
4.5  
9
18  
DC CURRENT(A)  
DC CURRENT(A)  
DC CURRENT(A)  
LM0605H-2R2  
LM0605H-3R3  
LM0605H-4R7  
4
3
2
1
0
80  
70  
60  
50  
40  
30  
20  
10  
0
6
4.5  
3
80  
70  
60  
50  
40  
30  
20  
10  
0
8
6
4
2
0
80  
70  
60  
50  
40  
30  
20  
10  
0
1.5  
0
3.5  
7
10.5  
6.75  
6
14  
0
3
6
9
12  
0
2
4
6
8
10  
DC CURRENT(A)  
DC CURRENT(A)  
DC CURRENT(A)  
LM0605H-5R6  
LM0605H-6R8  
LM0605H-8R2  
10  
8
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
12  
9
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
16  
12  
8
80  
70  
60  
50  
40  
30  
20  
10  
0
6
6
4
3
4
2
0
0
0
2.25  
4.5  
9
0
2.25  
4.5  
6.75  
9
0
2
4
6
8
DC CURRENT(A)  
DC CURRENT(A)  
DC CURRENT(A)  
LM0605H-100  
LM0605H-220  
20  
16  
12  
8
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
40  
30  
20  
10  
0
200  
160  
120  
80  
4
40  
0
0
2
4
8
0
1.1  
2.2  
3.3  
4.4  
5.5  
DC CURRENT(A)  
DC CURRENT(A)  
7/9  
Rev 2.0 :12.01.2019  
www.leiditech.com  
LM0605H-Series(G)-D  
11. Inductance vs. Frequency Curves  
LM0605H-R47  
LM0605H-R56  
0.9  
LM0605H-R40  
0.9  
0.72  
0.54  
0.36  
0.18  
0
0.8  
0.6  
0.4  
0.2  
0
0.72  
0.54  
0.36  
0.18  
0
1
10  
100  
1000  
1
10  
100  
1000  
1
10  
100  
1000  
FREQUENCY(KHz)  
FREQUENCY(KHz)  
FREQUENCY(KHz)  
LM0605H-R68  
LM0605H-R82  
LM0605H-R60  
1.2  
1.6  
1.28  
0.96  
0.64  
0.32  
0
1
0.8  
0.6  
0.4  
0.2  
0
0.96  
0.72  
0.48  
0.24  
0
1
10  
100  
1000  
1
10  
100  
1000  
1
10  
100  
1000  
FREQUENCY(KHz)  
FREQUENCY(KHz)  
LM0605H-1R5  
LM0605H-1R0  
LM0605H-1R2  
2.6  
2
1.5  
1
2
2.08  
1.56  
1.04  
0.52  
0
1.6  
1.2  
0.8  
0.4  
0
0.5  
0
1
10  
100  
1000  
1
10  
100  
1000  
1
10  
100  
1000  
FREQUENCY(KHz)  
LM0605H-2R2  
LM0605H-3R3  
LM0605H-4R7  
5
5
4
3
2
1
8
4
3
2
1
0
6.4  
4.8  
3.2  
1.6  
0
0
1
1
10  
100  
1000  
10  
100  
1000  
1
10  
100  
1000  
FREQUENCY(KHz)  
FREQUENCY(KHz)  
FREQUENCY(KHz)  
LM0605H-5R6  
LM0605H-6R8  
LM0605H-8R2  
11.6  
9.28  
6.96  
4.64  
2.32  
0
11.6  
9.28  
6.96  
4.64  
2.32  
0
16  
12.8  
9.6  
6.4  
3.2  
0
1
10  
100  
1000  
1
10  
100  
1000  
1
10  
100  
1000  
FREQUENCY(KHz)  
FREQUENCY(KHz)  
8/9  
Rev 2.0 :12.01.2019  
www.leiditech.com  
LM0605H-Series(G)-D  
LM0605H-220  
LM0605H-100  
.2  
45  
19.2  
15.36  
11.52  
7.68  
3.84  
0
36.16  
27.12  
18.08  
9.04  
0
1
10  
100  
1000  
1
10  
100  
1000  
FREQUENCY(KHz)  
Shanghai Leiditech Electronic Co.,Ltd  
Email: sale1@leiditech.com  
Tel : +86- 021 50828806  
Fax : +86- 021 50477059  
9/9  
Rev 2.0 :12.01.2019  
www.leiditech.com  

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SI9137

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137DB

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137LG

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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VISHAY

SI9122E

500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

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VISHAY