HL600-160 [LEIDITECH]
Positive Thermal Coefficent Diodes;
| 型号： | HL600-160 |
| 厂家： | 
Leiditech |
| 描述： | Positive Thermal Coefficent Diodes |
| 文件： | 总2页 (文件大小：642K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HL600-110~160 Series
Positive Thermal Coefficent Diodes
Features：
Radial leaded Devices
Cured,flame retardant epoxy polymer insulating material meets UL94V-0
Rohs compliant and lead-free
Product Dimensions
Fig1
Unit :mm
Model
Dimensions（mm）
Lead material
Tinned matel(mm)
22AWG/Φ0.6
Shape
A(max)
15
B(max)
15
C(max)
D(typ)
5.1
Fig
1
HL600-110
HL600-150
HL600-160
5.5
5.5
5.5
15
15
5.1
22AWG/Φ0.6
1
15
15
5.1
22AWG/Φ0.6
1
Note: Dimensions in the A, B, C are the maximum sizes, all typical values of D is the tolerance of ± 0.75mm.
Thermal Derating Chart- IH（A）
Maximum ambient operating temperatures（℃）
Model
-40℃
-20℃
0℃
25℃
40℃
50℃
60℃
70℃
85℃
HL600 -110
HL600-150
0.162
0.152
0.131
0.11
0.913
0.0803 0.0704
0.0605
0.0462
0.221
0.235
0.207
0.221
0.178
0.190
0.15
0.16
0.125
0.133
0.110
0.117
0.096
0.102
0.825
0.088
0.063
HL600-160
0.0672
Electrical Characteristics
Resistance
(Ω)
Maximum Time to Trip
Model
Ih（A）
It(A)
Vmax interrupt（V） Imax（A） Pd
（W）
Curren（t A） Time（S） Rmin- Rmax
HL600-110
HL600-150
HL600-160
0.11
0.15
0.16
0.22
0.30
0.32
600
600
600
3
3
3
1.0
1.0
1.0
1.0
8
9
6-16
5-14
4-12
1.0
1.0
10
Ih=Hold current:Maximum current at which the device will not interruptin 25℃ still air.
It=Trip current:Minimum current at which the device from low resistance to high resistance in 25℃ still air.
Vmax=Maximum continuous voltage device can withstand without damage at rated current.
Imax=Maximum fault current device can withstand without damage at rated voltage.
Ttrip=Maximum time to trip(s) at assigned current.
Pd=Typical power dissipation:Typical amount of power dissipated from the device when in 25℃ still air environment.
Rmin=Minimum resistance of device at 25℃ prior to tripping.
1/2
Rev :01.06.2018
www.leiditech.com
HL600-110~160 Series
Marking System
HL
Leiditech series product
Environmental Specifications
Test
Conditions
Resistance change
±8% typical
Passive aging
Humidity aging
Thermal shock
SolventResistance
Vibration
+85℃，1000 hours
+85℃，85%R.H.1000 hours
+125℃ to -55℃，10 Times
MIL-STD-202，Method 215F
MIL-STD-202，Method 201
±8% typical
±12% typical
No change
No change
Soldering method
Wave Soldering：
Soldering Temperature:260℃~270℃
Soldering Time:≤3sec.
Soldering Position: Resettable fuse wire and the bottom ≥ 6mm。
Manual soldering：
Soldering Temperature:250℃~280℃
Soldering Time: ≤3sec.
Soldering Position: Resettable fuse wire and the bottom ≥ 6mm。
Packaging and Storage
Packaging quantity
HL600-110～HL600-160200 Pcs/Bag
Storage
The maximum ambient temperature shall not exceed 40℃.Storage temperature higher than 40℃ could result in the
deformation of packaging materials.The maximum relative humidity recommended for storage is 70%.High humidity with
high temperature can accelerate the oxidation of the solder plating on the leads and reduce the solderability of the
components.Sealed plastic bags with desiccant shall be used to reduce the oxidation of the leads and shall only be opened
prior to use.The products shall not be stored in areas where harmful gases containing acid or alkali or other harmful
substancesare present.
Shanghai Leiditech Electronic Co.,Ltd
Email: sale1@leiditech.com
Tel : +86- 021 50828806
Fax : +86- 021 50477059
2/2
Rev :01.06.2018
www.leiditech.com
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