AAF5060QBFSURZGS [KINGBRIGHT]
T1-1/2 TRIPLE COLOR LED, HYR-GRE-BLU, 4mm, 6 X 5 MM, ROHS COMPLIANT PACKAGE-6;
| 型号： | AAF5060QBFSURZGS |
| 厂家： | 
KINGBRIGHT CORPORATION |
| 描述： | T1-1/2 TRIPLE COLOR LED, HYR-GRE-BLU, 4mm, 6 X 5 MM, ROHS COMPLIANT PACKAGE-6 光电 |
| 文件： | 总7页 (文件大小：276K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
5.0mm x 6.0mm FULL COLOR LED LAMP
Part Number: AAF5060QBFSURZGS
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
Blue
Hyper Red
Green
SENSITIVE
DEVICES
Features
Description
z Outstanding material efficiency.
z Reliable and rugged.
The Blue source color devices are made with InGaN Light
Emitting Diode.
z Low power consumption.
z Can produce any color in visible spectrum, including
white light.
The Hyper Red source color devices are made with Al-
GaInP on GaAs substrate Light Emitting Diode.
The Green source color devices are made with InGaN
on Sapphire Light Emitting Diode.
z Moisture sensitivity level : level 3.
z RoHS compliant.
Static electricity and surge damage the LEDS.
It is recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs.
All devices, equipment and machinery must be electrically
grounded.
Package Dimensions
數位簽署者：yalin
DN：cn=yalin,o,
ou=SPEC 專用,
email=yalin@ yalin.
com,c=<無>
yal
日期 2010.10.08
10:24:24+08'00'
in
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the leads emerge from the package.
4. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
SPEC NO: DSAL0959
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/06/2010
DRAWN: F.F.Zhou
PAGE: 1 OF 7
CHECKED: Allen Liu
ERP: 1201007045
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter
of the nozzle should be as large as possible.
5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
SPEC NO: DSAL0959
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/06/2010
DRAWN: F.F.Zhou
PAGE: 2 OF 7
CHECKED: Allen Liu
ERP: 1201007045
Selection Guide
Iv (mcd) [2]
Viewing
@ 30mA *50mA Angle [1]
Part No.
Dice
Lens Type
Min.
280
Typ.
400
2θ1/2
Blue (InGaN)
AAF5060QBFSURZGS
Notes:
Hyper Red (AlGaInP)
Green (InGaN)
Water Clear
*480
650
*800
1200
100°
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. *Luminous intensity with asterisk is measured at 50mA; Luminous intensity/ luminous Flux: +/-15%.
Electrical / Optical Characteristics at TA=25°C
Symbol
Parameter
Device
Typ.
Max.
Units
Test Conditions
Blue
Hyper Red
Green
461
650
515
λpeak
Peak Wavelength
nm
IF=20mA
Blue
Hyper Red
Green
465
630
525
λD [1]
Δλ1/2
C
Dominant Wavelength
Spectral Line Half-width
Capacitance
nm
nm
pF
V
IF=20mA
IF=20mA
Blue
Hyper Red
Green
25
27
30
Blue
Hyper Red
Green
100
45
45
VF=0V;f=1MHz
IF=20mA
Blue
Hyper Red
Green
3.3
1.9
3.3
4
2.5
4.1
VF [2]
IR
Forward Voltage
Blue
Hyper Red
Green
50
10
50
Reverse Current
uA
VR=5V
Notes:
1.Wavelength: +/-1nm.
2. Forward Voltage: +/-0.1V.
Absolute Maximum Ratings at TA=25°C
Parameter
Blue
Hyper Red
Green
Units
mW
mA
mA
V
Power dissipation[2]
350
50
DC Forward Current
30
30
Peak Forward Current [1]
Reverse Voltage
150
185
5
150
Operating / Storage Temperature
Lead Solder Temperature [3]
Lead Solder Temperature [4]
-40°C To +85°C
260°C For 3 Seconds
260°C For 5 Seconds
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. Within 350mW at all chips are lightened.
3. 2mm below package base.
4. 5mm below package base.
SPEC NO: DSAL0959
APPROVED: WYNEC
REV NO: V.1
CHECKED: Allen Liu
DATE: OCT/06/2010
DRAWN: F.F.Zhou
PAGE: 3 OF 7
ERP: 1201007045
AAF5060QBFSURZGS
Blue
SPEC NO: DSAL0959
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/06/2010
DRAWN: F.F.Zhou
PAGE: 4 OF 7
CHECKED: Allen Liu
ERP: 1201007045
Hyper Red
SPEC NO: DSAL0959
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/06/2010
DRAWN: F.F.Zhou
PAGE: 5 OF 7
CHECKED: Allen Liu
ERP: 1201007045
Green
SPEC NO: DSAL0959
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/06/2010
DRAWN: F.F.Zhou
PAGE: 6 OF 7
CHECKED: Allen Liu
ERP: 1201007045
PACKING & LABEL SPECIFICATIONS
AAF5060QBFSURZGS
SPEC NO: DSAL0959
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/06/2010
DRAWN: F.F.Zhou
PAGE: 7 OF 7
CHECKED: Allen Liu
ERP: 1201007045
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