CBR06C309BAGAC [KEMET]
CBR-SMD RF C0G, Ceramic, High Q, 3 pF, /-0.1 pF, 250 V, 0603, C0G, SMD, Fixed, RF, Ultra High Q, Low ESR, Class I;
| 型号： | CBR06C309BAGAC |
| 厂家： | 
KEMET CORPORATION |
| 描述： | CBR-SMD RF C0G, Ceramic, High Q, 3 pF, /-0.1 pF, 250 V, 0603, C0G, SMD, Fixed, RF, Ultra High Q, Low ESR, Class I |
| 文件： | 总1页 (文件大小：72K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
KEMET Part Number: CBR06C699BAGAC
CBR-SMD RF C0G, Ceramic, High Q, 6.9 pF, +/-0.1 pF, 250 V, 0603, C0G, SMD, Fixed, RF, Ultra High Q, Low ESR, Class I
General Information
Supplier: KEMET
Series: CBR-SMD RF C0G
Style: SMD Chip
Chip Size: 0603
SMD, Fixed, RF, Ultra High Q,
Description:
Low ESR, Class I
Features: Ultra High Q, Low ESR, Class I
RoHS: Yes
Termination: Tin
Marking: No
Miscellaneous: Minimum Q = 938
Notes: Solder Wave or Solder Reflow
Dimensions
L
W
T
1.6mm +/-0.1mm
0.8mm +/-0.1mm
0.8mm +/-0.07mm
0.4mm +/-0.15mm
Specifications
Capacitance: 6.9 pF
Capacitance Tolerance: +/-0.1 pF
Voltage DC: 250 VDC
B
Dielectric Withstanding
500 V
Voltage:
Packaging Specifications
Temperature Range: -55/+125C
Temperature Coefficient: C0G
Dissipation Factor: 0.186%
Packaging: T&R, 180mm, Plastic Tape
Packaging Quantity: 4000
Aging Rate: 0% Loss/Decade Hour
Insulation Resistance: 10 GOhms
Quality Factor: 938
Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute - and
we specifically disclaim - any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the
requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us
with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.
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Generated 10/24/2017 - 3c59b285-2705-40af-a27a-cab2f5ffbc72
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