C1812C100JHRAC3225 [KEMET]
Ceramic Capacitor, Ceramic, 3000V, X7R, -/+15ppm/Cel TC, 0.00001uF, 1812;型号: | C1812C100JHRAC3225 |
厂家: | KEMET CORPORATION |
描述: | Ceramic Capacitor, Ceramic, 3000V, X7R, -/+15ppm/Cel TC, 0.00001uF, 1812 电容器 |
文件: | 总9页 (文件大小:1651K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CERAMIC CHIP / HIGH VOLTAGE
KEMET's High Voltage Surface Mount Capacitors are designed to withstand high voltage applications. They
offer high capacitance with low leakage current and low ESR at high frequency. The capacitors have pure tin
(Sn) plated external electrodes for good solderability. X7R dielectrics are not designed for AC line filtering
applications. An insulating coating may be required to prevent surface arcing. These components are RoHS
compliant.
MARKETS
APPLICATIONS
• Switch Mode Power Supply • Power Supply
• Input Filter
• High Voltage Power Supply
• Resonators
• DC-DC Converter
• Tank Circuit
• Snubber Circuit
• LCD Fluorescent Backlight Ballast
• HID Lighting
• Output Filter
• Telecommunications Equipment
• Industrial Equipment/Control
• Medical Equipment/Control
• Computer (LAN/WAN Interface)
• Analog and Digital Modems
• Automotive
• High Voltage Coupling
• High Voltage DC Blocking
• Lighting Ballast
• Voltage Multiplier Circuits
• Coupling Capacitor/CUK
OUTLINE DRAWING
TIN PLATE
L
W
B
T
NICKEL PLATE
S
CONDUCTIVE
METALLIZATION
ELECTRODES
TABLE 1 - DIMENSIONS - MILLIMETERS (in.)
Metric
Code
EIA Size
Code
Band
Separation
L - Length
W - Width
B - Bandwidth
2.0 (0.079)
0.2 (0.008)
1.2 (0.049)
0.2 (0.008)
0.5 (0.02
0.25 (0.010)
2012
3216
3225
4520
4532
4564
5650
5664
0805
1206
1210
1808
1812
1825
2220
2225
0.75 (0.030)
N/A
3.2 (0.126)
0.2 (0.008)
1.6 (0.063)
0.2 (0.008)
0.5 (0.02)
0.25 (0.010)
3.2 (0.126)
0.2 (0.008)
2.5 (0.098)
0.2 (0.008)
0.5 (0.02)
0.25 (0.010)
N/A
4.5 (0.177)
0.3 (0.012)
2.0 (0.079
0.2 (0.008)
0.6 (0.024)
0.35 (0.014)
N/A
4.5 (0.177)
0.3 (0.012)
3.2 (0.126)
0.3 (0.012)
0.6 (0.024)
0.35 (0.014)
N/A
4.5 (0.177)
0.3 (0.012)
6.4 (0.250)
0.4 (0.016)
0.6 (0.024)
0.35 (0.014)
N/A
5.6 (0.224)
0.4 (0.016)
5.0 (0.197)
0.4 (0.016)
0.6 (0.024)
0.35 (0.014)
N/A
5.6 (0.224)
0.4 (0.016)
6.4 (0.250)
0.4 (0.016)
0.6 (0.024)
0.35 (0.014)
N/A
81
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP / HIGH VOLTAGE
C0G DIELECTRIC CAPACITANCE VALUES AND THICKNESS TARGETS (in.)
0805
1206
1210
1808
1812
1825
2220
2225
Series
Max
Thickness
(in)
Capacitance
Tolerance
Cap
pF
*
Cap Code/
Voltage
1.0-2.4 C,D
2.7-5.1 C,D
5.6-9.1 C,D
10 C,D
109-249
K,M 279-519
J,K,M 569-919
J,K,M
J,K,M
J,K,M
J,K,M
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
111
121
131
151
161
181
201
221
241
271
301
331
361
391
431
471
511
561
621
681
751
821
911
102
112
122
132
152
162
182
202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
822
912
103
11 C,D
12 C,D
13 C,D
15 C,D G,J,K,M
16 C,D G,J,K,M
18 C,D G,J,K,M
20 C,D G,J,K,M
22 C,D G,J,K,M
24 C,D G,J,K,M
27
30
33
36
39
43
47
51
56
62
68
75
82
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
91
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1000
1100
1200
1300
1500
1600
1800
2000
2200
2400
2700
3000
3300
3600
3900
4300
4700
5100
5600
6200
6800
7500
8200
9100
10,000
* Contact KEMET Sales Representative for C, D, F & G Capacitance Tolerance availability.
Note: Actual thickness dimensions may be less than stated maximum. Check the KEMET website, www.kemet.com, for additional values and chip sizes available.
82
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP / HIGH VOLTAGE
X7R DIELECTRIC CAPACITANCE VALUES AND THICKNESS TARGETS (in.)
1808
0805
1206
1210
1812
1825
2220
2225
Series
Max
Thickness
(in)
Cap
pF
Capacitance
Tolerance
Cap Code/
Voltage
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
111
121
131
151
181
221
271
331
391
471
561
681
821
102
122
152
182
202
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
623
683
823
104
124
154
184
224
1800
2000
2200
2700
3300
3900
4700
5600
6800
8200
10,000
12,000
15,000
18,000
22,000
27,000
33,000
39,000
47,000
56,000
62,000
68,000
82,000
100,000
120,000
150,000
180,000
220,000
Note: Actual thickness dimensions may be less than stated maximum.
Check the KEMET website, www.kemet.com, for additional values and chip sizes available.
KEMET HIGH VOLTAGE SURFACE MOUNT CHIP (VOLTAGE CODES C,D,F,G,H, and Z)
THICKNESS AND REELING QUANTITIES
Chip size
EIA
Max.
Max.
Tape Width Qty per Reel Qty per Reel
Thickness (in)
Thickness (mm)
(mm)
7" Plastic
2,500
2,000
2,000
1,000
1,000
1,000
1,000
1,000
13" Plastic
10,000
8,000
Metric
2012
3216
3225
4520
4532
4564
5650
5664
0805
1206
0.055
0.065
0.101
0.080
0.067
0.067
0.067
0.067
1.27
1.65
2.57
2.03
1.70
1.70
1.70
1.70
8
8
1210
8
8,000
1808
12
12
12
12
12
4,000
1812/1813
1825
4,000
4,000
2220
4,000
2225
4,000
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
83
CERAMIC CHIP / HIGH VOLTAGE
CAPACITOR ORDERING INFORMATION
C
0805
C
102
K
C
R
A
C
Style
C - Ceramic
Chip Size
0805; 1206; 1210; 1808;
1812; 1825; 2220; 2225
End Metallization
C = Standard
Failure Rate Level
Specification
A = Not Applicable
C - Standard
Capacitance Code, pF
Temperature Characteristic
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
(Use “9” for 1.0 through 9.9 pF)
Designated by Capacitance
Change over Temperature Range
G – (C0G) ( 30ppm/C) (-55°C +125°C)
R – X7R ( 15ꢀ) (-55°C +125°C)
(Use “8” for 0.1 through .99 pF)
Capacitance Tolerance
Voltage
C = 0.25pF*
D = 0.5pF*
F = 1ꢀ*
J = 5ꢀ
K = 10ꢀ
M = 20ꢀ
C = 500V
D = 1000V
F = 1500V
G = 2000V
Z = 2500V
H = 3000V
G = 2ꢀ*
* Contact KEMET Sales for availability.
ELECTRICAL PARAMETERS
Property
Specification
C0G: 1 pF to 0.010 µF
X7R: 10pFto 0.22 µF
Capacitance
25°C, 1.0 0.2 Vrms, 1 kHz (1 MHz for ≤ 1000 pF (C0G only)
C0G: C*, D*, F*, G*, J, K, M
X7R: J, K, M
C0G: 0.1ꢀ Max
* Contact KEMET Sales for availability.
Cap Tolerance
DF
X7R: 2.5ꢀ Max
Voltage Ratings
500 V, 1000 V, 1500 V, 2000 V, 2500 V, 3000 V
Operating Temperature Range
25ºC IR @ 500V
From -55ºC to +125ºC
100 GΩ or 1000 MΩ-µF, whichever is less
10 GΩ or 100 MΩ-µF, whichever is less
125ºC IR @ 500V
-55ºC TCC
X7R: + 15ꢀ
+125ºC TCC
C0G: + 30 ppm / ºC
150ꢀ of Rated Voltage for Rated Voltage <1000 V
120ꢀ of Rated Voltage for Rated Voltage >=1000V
Dielectric Strength
Ripple Current
Consult KEMET Sales Representative
MARKING
These chips are supplied unmarked. If required, they can be supplied LASER-marked at an extra cost.
Details on the marking format is located on page 97.
PACKAGING
KEMET High Voltage Surface Mount MLCC are available packaged in tape and reel configuration, or bulk
bag as outlined on page 83. Please consult factory for waffle packaging options.
SOLDERING PROCESS
The 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. Sizes 1210 and
larger should be limited to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of
pure nickel with an overplating of pure tin (Sn) for excellent solderability and resistance to solder leaching of
the termination.
RECOMMENDED SOLDER PAD DIMENSIONS
T (Total Length)
S (Separation
W (Pad Width)
L (Pad Length)
Chip Size
mm
3.30
4.50
4.50
5.90
5.90
5.90
7.00
7.00
in.
mm
0.70
1.50
1.50
2.30
2.30
2.30
3.30
3.30
in.
mm
in.
mm
1.30
1.50
1.50
1.80
1.80
1.80
1.85
1.85
in.
0805
1206
1210
1808
1812
1825
2220
2225
0.130
0.177
0.177
0.232
0.232
0.232
0.276
0.276
0.028
0.059
0.059
0.091
0.091
0.091
0.130
0.130
1.60
2.00
2.90
2.40
3.70
6.90
5.50
6.80
0.063
0.079
0.114
0.094
0.146
0.272
0.217
0.268
0.051
0.059
0.059
0.071
0.071
0.071
0.073
0.073
84
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
for details on reeling quantities for commercial chips
and page 87 for MIL-PRF-55681 chips.
Anti-Static Reel
®
Embossed Carrier*
Chip Orientation
0402 and 0603 case sizes
in Pocket
KEMET
available on punched paper only.
(except 1825 Commercial, and 1825 & 2225 Military)
Embossment
8mm ± .30
(.315 ± .012")
Anti-Static Cover Tape
178mm (7.00")
or
330mm (13.00")
or
(.10mm (.004") Max Thickness)
12mm ± .30
(.472 ± .012")
* Punched paper carrier used for 0402 and 0603 case size.
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
Reflow Solder
Wave Solder
Y(ref) Smin
Grid
Placement
Dimension
0402
Z
G
X
Y(ref) C(ref)
Z
G
X
Not Recommended
2.14 0.28 0.74 0.93 1.21
2.78 0.68 1.08 1.05 1.73
3.30 0.70 1.60 1.30 2.00
4.50 1.50 2.00 1.50 3.00
4.50 1.50 2.90 1.50 3.00
5.90 2.30 3.70 1.80 4.10
5.90 2.30 6.90 1.80 4.10
7.00 3.30 5.50 1.85 5.15
7.00 3.30 6.80 1.85 5.15
Courtyard
0603
3.18 0.68 0.80 1.25 1.93
3.70 0.70 1.10 1.50 2.20
4.90 1.50 1.40 1.70 3.20
4.90 1.50 2.00 1.70 3.20
C
0805
1206
1210
1812
1825
X
Not Recommended
2220
2225
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
G
Y
Z
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
93
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Performance Notes
1. Cover Tape Break Force: 1.0 Kg Minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
8 mm
Peel Strength
0.1 Newton to 1.0 Newton (10g to 100g)
12 mm
0.1 Newton to 1.3 Newton (10g to 130g)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier
tape shall be 165ꢀ to 180ꢀ from the plane of the carrier tape. During peeling, the carrier and/or cover tape
shall be pulled at a velocity of 300 10 mm/minute.
3. Reel Sizes: Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")
reels (with C-7280). Note that 13” reels are preferred.
4. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.
Refer to EIA-556.
Embossed Carrier Tape Configuration: Figure 1
Table 1 — EMBOSSED TAPE DIMENSIONS (Metric will govern)
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E
P0
P2
T Max
T1 Max
8 mm
and
12 mm
1.5
+0.10 -0.0
(0.059
1.75 0.10
4.0 0.10
2.0 0.05
0.600
0.100
(0.069 0.004) (0.157 0.004) (0.079 0.002) (0.024)
(0.004)
+0.004, -0.0)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
B1 Max.
Note 1
D1 Min.
Note 2
F
P1
R Min. T2 Max
Note 3
W
A0B0K0
Note 4
8 mm
Single
4.4
1.0
3.5 0.05
4.0 0.10
25.0
2.5
8.0 0.30
(4 mm)
(0.173)
(0.039) (0.138 0.002) (0.157 0.004) (0.984) (0.098) (.315 0.012)
12 mm
Double
(8 mm)
8.2
(0.323)
1.5 5.5 0.05 8.0 0.10 30.0 4.6 12.0 0.30
(0.059) (0.217 0.002) (0.315 0.004) (1.181) (0.181) (0.472 0.012)
NOTES
1. B1 dimension is a reference dimension for tape feeder clearance only.
2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of
embossment location and hole location shall be applied independent of each other.
3. Tape with components shall pass around radius “R” without damage (see sketch A). The minimum trailer length (Fig. 2) may require
additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)
4. The cavity defined by A0, B0, and K0 shall be configured to surround the part with sufficient clearance such that the chip does not pro-
trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical
restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm
maximum in the pocket (not applicable to vertical clearance.)
94
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Embossed Carrier Tape Configuration (cont.)
20°
Sketch D: Tape Camber (Top View)
1mm (0.039) Max.
1mm (0.039) Max.
250mm (9.843)
Allowable camber to be 1 mm/250 mm.
400mm (15.75) Min.
Figure 2:
Tape Leader
& Trailer
Dimensions
(Metric
Dimensions
Will Govern)
Figure 3: Reel Dimensions (Metric Dimensions will govern)
Table 2 – REEL DIMENSIONS (Metric will govern)
Tape Size
A Max
B* Min
C
D* Min
N Min
W1
W2 Max
W3
8 mm
330.0
(12.992)
1.5
13.0 0.20
20.2
(0.795)
50.0
(1.969)
See
8.4
+1.5, -0.0
(0.331
14.4
(0.567)
7.9 Min
(0.311)
10.9 Max
(0.429)
(0.059) (0.512 0.008)
Note 3
+0.059, -0.0)
12 mm
330.0
(12.992)
1.5
13.0 0.20
20.2
(0.795)
Table 1
12.4
+2.0, -0.0
(0.488
18.4
(0.724)
11.9 Min
(0.469)
15.4 Max
(0.606)
(0.059) (0.512 0.008)
+0.078, -0.0)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
95
CERAMIC CHIP CAPACITORS
Packaging Information
Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):
10 pitches cumulative
P0
tolerance on tape
± 0.2 (± 0.008)
T
D0
P2
E
Top
Tape
Cover
A0
Bottom
Tape
Cover
F
W
B0
G2
T1
P1
Center lines
of cavity
Max. Cavity Size
See Note 1
Table 1
User Direction of Feed
Table 1: 8 & 12mm PunchedTape
(Metric Dimensions Will Govern)
Constant Dimensions - Millimeters (Inches)
Tape
Size
D
P
P
T
G
G
2
E
R Min.
0
0
2
1
1
8mm
and
12mm
1.5
1.75 ± 0.10
4.0 ± 0.10
2.0 ± 0.05
0.10 0.75 0.75 25 (.984)
(.004) (.030) (.030) See Note 2
+0.10, -0.0
(.059
(.069 ± 0.004) (.157 ± 0.004) (.079 ± 0.002) Max. Min. Min.
Table 1
+0.004, -0.0)
Table 1: 8 & 12mm PunchedTape
(Metric Dimensions Will Govern)
Variable Dimensions - Millimeters (Inches)
Tape
Size
P
W
A B
0 0
T
F
1
8mm
1/2
2.0 ± 0.10
1.1mm (.043)
Max. for Paper
Base Tape and
1.6mm (.063)
Max. for Non-
Paper Base
(.079 ± .004)
3.5 ± 0.05
8.0 ± ±0.3
See Note 1
Table 1
Pitch See Require-
ments
(.138 ± .002)
(.315 ± ±0.012)
Section 3.3 (d)
8mm
4.0 ± 0.10
(0.157 ± .004)
Compositions.
See Note 3.
12mm
12mm
4.0 ± 0.10
5.5 ± 0.05
12.0 ± 0.3
(0.157 ± .004)
8.0 ± 0.10
(.217 ± .002)
(.472 ± .012)
Double (0.315 ± .004)
Pitch
Note:
1. A , B and T determined by the maximum dimensions to the ends of the terminals extending from the
0
0
body and/or the body dimensions of the component. The clearance between the ends of the terminals or
body of the component to the sides and depth of the cavity (A , B and T) must be within 0.05mm (.002)
0
0
minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component
within the cavity of not more than 20 degrees (see sketches A and B).
2. Tape with components shall pass around radius "R" without damage.
3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.
Sketch C:
Component Rotation - Top View
Maximum
Sketch B:
R
(Min.)
Max. Component
Rotation - Front
component rotation.
Sketch A:
Bending Radius
See Note 2
Table 1
20°
Cross Sectional View
Typical
component
center line
20°
96
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORS
Packaging Information
Table 2 – Capacitance Values Available
In Bulk Cassette Packaging
Bulk Cassette Packaging (Ceramic Chips only)
(Meets Dimensional Requirements IEC-286-6 and EIAJ 7201)
Min. Max.
Cap Cap
Size Dielectric Voltage Value Value
Case
53.3*
Unit: mm
* Reference
0402
0603
0805
All
All
All
All
All
All
All
All
0.1
10*
1.5 ±
2.0 ±
3.0 ±
0
0
0.1
0.2
0
C0G
200
100
50
109 181
109 331
109 102
X7R
Y5V
200
100
50
221 392
221 103
221 273
221 104
221 104
25
16
25
16
104 224
104 224
5.0*
110 ± 0.7
Table 1 – Capacitor Dimensions for Bulk
Cassette Packaging – Millimeters
Metric EIA
Size Size
Code Code
Minimum
Length
L
Width
W
Thickness Bandwidth Separation
Number of
Pcs/Cassette
T
B
S
1005 0402 1.0 ± 0.05 0.5 ± 0.05
1608 0603 1.6 ± 0.07 0.8 ± 0.07
0.5 ± .05
0.8 ± .07
0.2 to 0.4
0.2 to 0.5
0.5 to 0.75
0.3
50,000
15,000
10,000
0.7
2012 0805 2.0 ± 0.10 1.25 ± 0.10 0.6 ± .10
0.75
Terminations: KEMET nickel barrier layer with a tin overplate.
CAPACITOR MARKING TABLE
(Marking Optional - Not Available
for 0402 Size or Y5V Dielectric)
Capacitance (pF) For Various Numeral Identifiers
Numeral
Laser marking is available as an extra-cost option for
most KEMET ceramic chips. Such marking is two
sided, and includes a K to identify KEMET, followed by
two characters (per EIA-198 - see table below) to
identify the capacitance value. Note that marking is
not available for size 0402 nor for any Y5V chip. In
addition, the 0603 marking option is limited to the K
only.
Alpha
9
0
1
2
3
4
5
6
7
Character
A
B
C
D
E
F
G
H
J
0.10 1.0 10 100 1000 10,000 100,000 1,000,000 10,000,000
0.11 1.1 11 110 1100 11,000 110,000 1,100,000 11,000,000
0.12 1.2 12 120 1200 12,000 120,000 1,200,000 12,000,000
0.13 1.3 13 130 1300 13,000 130,000 1,300,000 13,000,000
0.15 1.5 15 150 1500 15,000 150,000 1,500,000 15,000,000
0.16 1.6 16 160 1600 16,000 160,000 1,600,000 16,000,000
0.18 1.8 18 180 1800 18,000 180,000 1,800,000 18,000,000
0.20 2.0 20 200 2000 20,000 200,000 2,000,000 20,000,000
0.22 2.2 22 220 2200 22,000 220,000 2,200,000 22,000,000
0.24 2.4 24 240 2400 24,000 240,000 2,400,000 24,000,000
0.27 2.7 27 270 2700 27,000 270,000 2,700,000 27,000,000
0.30 3.0 30 300 3000 30,000 300,000 3,000,000 30,000,000
0.33 3.3 33 330 3300 33,000 330,000 3,300,000 33,000,000
0.36 3.6 36 360 3600 36,000 360,000 3,600,000 36,000,000
0.39 3.9 39 390 3900 39,000 390,000 3,900,000 39,000,000
0.43 4.3 43 430 4300 43,000 430,000 4,300,000 43,000,000
0.47 4.7 47 470 4700 47,000 470,000 4,700,000 47,000,000
0.51 5.1 51 510 5100 51,000 510,000 5,100,000 51,000,000
0.56 5.6 56 560 5600 56,000 560,000 5,600,000 56,000,000
0.62 6.2 62 620 6200 62,000 620,000 6,200,000 62,000,000
0.68 6.8 68 680 6800 68,000 680,000 6,800,000 68,000,000
0.75 7.5 75 750 7500 75,000 750,000 7,500,000 75,000,000
0.82 8.2 82 820 8200 82,000 820,000 8,200,000 82,000,000
0.91 9.1 91 910 9100 91,000 910,000 9,100,000 91,000,000
0.25 2.5 25 250 2500 25,000 250,000 2,500,000 25,000,000
0.35 3.5 35 350 3500 35,000 350,000 3,500,000 35,000,000
0.40 4.0 40 400 4000 40,000 400,000 4,000,000 40,000,000
0.45 4.5 45 450 4500 45,000 450,000 4,500,000 45,000,000
0.50 5.0 50 500 5000 50,000 500,000 5,000,000 50,000,000
0.60 6.0 60 600 6000 60,000 600,000 6,000,000 60,000,000
0.70 7.0 70 700 7000 70,000 700,000 7,000,000 70,000,000
0.80 8.0 80 800 8000 80,000 800,000 8,000,000 80,000,000
0.90 9.0 90 900 9000 90,000 900,000 9,000,000 90,000,000
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
a
b
d
e
f
m
n
t
Example shown is 1,000 pF capacitor.
KA3
y
97
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
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