C1808C270CBGALTU [KEMET]
Ceramic Capacitor, Multilayer, Ceramic, 630V, 0.93% +Tol, 0.93% -Tol, C0G, 30ppm/Cel TC, 0.000027uF, Surface Mount, 1808, CHIP;型号: | C1808C270CBGALTU |
厂家: | KEMET CORPORATION |
描述: | Ceramic Capacitor, Multilayer, Ceramic, 630V, 0.93% +Tol, 0.93% -Tol, C0G, 30ppm/Cel TC, 0.000027uF, Surface Mount, 1808, CHIP 电容器 固定电容器 |
文件: | 总19页 (文件大小:1621K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC
(Commercial & Automotive Grade)
Overview
KEMET’s high voltage surface mount MLCCs in C0G dielectric
feature a 125°C maximum operating temperature and are
considered “stable.” The Electronics Industries Alliance (EIA)
characterizes C0G dielectric as a Class I material. Components
of this classification are temperature compensating and are
suited for resonant circuit applications or those where Q and
stability of capacitance characteristics are required. C0G
exhibits no change in capacitance with respect to time and
voltage and boasts a negligible change in capacitance with
reference to ambient temperature. Capacitance change is
limited to ±30ppm/ºC from -55°C to +125°C.
the preferred dielectric choice of design engineers worldwide.
In addition to their use in power supplies, these capacitors
are widely used in industries related to automotive(hybrid),
telecommunications, medical, military, aerospace, semiconductors
and test/diagnostic equipment.
Automotive Grade is available for applications requiring proven,
reliable performance in harsh environments. Whether under-hood
or in-cabin, these capacitors are designed for mission and safety
critical automotive circuits. Stricter testing protocol and inspection
criteria have been established for automotive grade products
in recognition of potentially harsh environmental conditions.
KEMET automotive grade series capacitors meet the demanding
Automotive Electronics Council's AEC–Q200 qualification
These devices exhibit low ESR at high frequencies and find
conventional use as snubbers or filters in applications such as
switching power supplies and lighting ballasts. Their exceptional requirements.
performance at high frequencies has made high voltage MLCC's
Ordering Information
C
1210
C
332
J
C
G
A
C
TU
Case Size Specification/
Capacitance
Code (pF)
Capacitance
Tolerance1
Failure Rate/
Design
Packaging/Grade
(C-Spec)3
Ceramic
Voltage
Dielectric
Termination Finish2
(L" x W")
Series
0805
1206
1210
1808
1812
1825
2220
2225
C = Standard 2 Significant Digits B = ±0.10 pF C = 500 V
+ Number of Zeros C = ±0.25 pF B = 630 V
G = C0G A = N/A
C = 100% Matte Sn Blank = Bulk
L = SnPb (5%
minimum)
TU = 7" Reel
Unmarked
AUTO =
Use 9 for
1.0 – 9.9 pF
D = ±0.5 pF
F = ±1%
G = ±2%
J = ±5%
D = 1,000 V
F = 1,500 V
G = 2,000 V
Z = 2,500 V
H = 3,000 V
Use 8 for
Automotive Grade
7"Reel Unmarked
0.5 – .99 pF
ex. 2.2 pF = 229
ex. 0.5 pF = 508
K = ±10%
M = ±20%
1 Additional capacitance tolerance offerings may be available. Contact KEMET for details.
2 SnPb termination finish option is not available on Automotive Grade product.
2, 3 Additional termination finish options may be available. Contact KEMET for details.
3 Additional reeling or packaging options may be available. Contact KEMET for details.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
100% Tin or SnPb Plate
L
W
B
T
Nickel Plate
S
Conductive Metalization
Electrodes
EIA
Metric
Size
Code
2012
S
L
W
Width
T
B
Mounting
Technique
Size
Code
0805
1206
1210
Separation
Minimum
0.75 (.030)
Length
Thickness
Bandwidth
2.00 (.079) ±0.20 (.008) 1.25 (.049) ±0.20 (.008)
3.20 (.126) ±0.20 (.008) 1.60 (.063) ±0.20 (.008)
3.20 (.126) ±0.20 (.008) 2.50 (.098) ±0.20 (.008)
4.70 (.185) ±0.50 (.020) 2.00 (.079) ±0.20 (.008)
4.50 (.177) ±0.30 (.012) 3.20 (.126) ±0.30 (.012)
4.50 (.177) ±0.30 (.012) 6.40 (.252) ±0.40 (.016)
5.70 (.224) ±0.40 (.016) 5.00 (.197) ±0.40 (.016)
5.60 (.220) ±0.40 (.016) 6.40 (.248) ±0.40 (.016)
0.50 (0.02) ±0.25 (.010)
0.50 (0.02) ±0.25 (.010)
0.50 (0.02) ±0.25 (.010)
0.60 (.024) ±0.35 (.014)
0.60 (.024) ±0.35 (.014)
0.60 (.024) ±0.35 (.014)
0.60 (.024) ±0.35 (.014)
0.60 (.024) ±0.35 (.014)
Solder Wave or
Solder Reflow
3216
3225
4520
4532
4564
5650
5664
1808
1812
See Table 2 for
Thickness
N/A
Solder Reflow Only
1825
2220
2225
Benefits
• -55°C to +125°C operating temperature range
• RoHS Compliant
• Preferred capacitance solution at line frequencies & into the
MHz range
• EIA 0805, 1206, 1210, 1808, 1812, 1825, 2220, and
2225 case sizes
• DC voltage ratings of 500 V, 630 V,1 KV, 1.5 KV, 2 KV,
2.5 KV, and 3 KV
• No capacitance change with respect to applied rated DC voltage
• Negligible capacitance change with respect to temperature from
-55°C to +125°C
• No capacitance decay with time
• Capacitance offerings ranging from 1 pF to 0.01 μF
• Available capacitance tolerances of ±0.10 pF, ±0.25 pF,
±0.5 pF, ±1%, ±2%, ±5%, ±10%, and ±20%
• No piezoelectric noise
• Non-polar device, minimizing installation concerns
• Commercial & Automotive (AEC-Q200) grades available
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• Extremely low ESR and ESL
• High thermal stability
• SnPb plated termination finish option available upon request (5%
minimum)
• High ripple current capability
Applications
Typical applications include switch mode power supplies (input filters, resonators, tank circuits, snubbed circuits, output filters), high
voltage coupling and DC blocking, lighting ballasts, voltage multiplier circuits, DC/DC converters and coupling capacitors in Ćuk
converters. Markets include power supply, LCD fluorescent backlight ballasts, HID lighting, telecom equipment, industrial and medical
equipment/control, LAN/WAN interface, analog and digital modems, and automotive.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in
Table 4, Performance & Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test
methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional
information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.
Environmental Compliance
RoHS Compliant (excluding SnPb termination finish option).
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
-55°C to +125°C
±30 ppm/ºC
0%
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
150% of rated voltage for voltage rating of < 1,000 V
120% of rated voltage for voltage rating of ≥ 1,000 V
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
Dielectric Withstanding Voltage (DWV)
0.1%
Dissipation Factor (DF) Maximum Limit @ 25ºC
Insulation Resistance (IR) Limit @ 25°C
1,000 megohm microfarads or 100 GΩ
(500 VDC applied for 120 ±5 seconds @ 25°C)
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Rated DC
Voltage
Capacitance
Dissipation Factor
(Maximum %)
Capacitance
Insulation
Resistance
Dielectric
C0G
Value
Shift
All
All
0.5
0.3% or ±0.25 pF 10% of Initial Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Table 1A – Capacitance Range/Selection Waterfall (0805 – 1808 Case Sizes)
Series
C0805
C1206
C1210
C1808
Voltage Code
C
B
D
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
Z
H
Cap
Code
Capacitance
Voltage DC
Capacitance
Tolerance
D
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
1.0 – 1.6 pF
1.8 – 4.3 pF
4.7 – 9.1 pF
10 pF
11 pF
12 pF
13 pF
15 pF
16 pF
18 pF
20 pF
22 pF
24 pF
27 pF
30 pF
33 pF
36 pF
39 pF
43 pF
47 pF
51 pF
56 pF
62 pF
68 pF
75 pF
82 pF
109 – 169
189 – 439
479
100
110
B
B
B
B
B
B
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
DG DG DG
DG DG DG
DG DG DG
LB LB LB LB LB LB LB
LB LB LB LB LB LB LB
LB LB LB LB LB LB LB
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LB LB
DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LC LB
DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LC LB
DG DG DG EF EF EF EG EG FG FG FG FM FM LA LA LA LA LB LC LB
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
111
91 pF
100 pF
110 pF
120 pF
130 pF
150 pF
160 pF
180 pF
200 pF
220 pF
240 pF
270 pF
300 pF
330 pF
360 pF
390 pF
430 pF
470 pF
510 pF
121
131
151
DG
DG
DG
DG
DG
DG
DG
EF EF EF EG EG FG FG FG FM FM LA LA LA LA LB LC
EF EF EF EG EG FG FG FG FM FM LA LA LA LA LB LC
EF EF EF EG EG FG FG FG FM FM LA LA LA LA LC LC
EF EF EF EG EG FG FG FG FM FM LA LA LA LA LC LC
161
181
201
221
241
271
301
331
361
391
431
471
EF EG EG EG
EF EG EG EG
EF EG EG EG
EF EG EG EG
EF EG EG EG
EF EG EG EG
EG EG EG EG
EG EG EG EG
EG EG EG
FG FG FG FM FM LA LA LA LA LC LC
FG FG FG FM FM LA LA LA LA LC LC
FG FG FG FM FM LA LA LA LB LC LC
FG FG FG FK FK LA LA LA LB LC LC
FG FG FG FK FK LA LA LA LB LC LC
FG FG FG FK FK LA LA LA LB LC LC
FG FG FG FK FS LA LA LA LB
FG FG FG FK FS LA LA LA LB
FG FM FM FS FS LA LB LB LC
EG EG EG
FG FM FM FS FS LA LB LB LC
511
EG EG EG
FG FM FM FS
LA LB LB LC
C
1210
C
332
J
C
G
A
C
TU
Case Size Specification/
Capacitance
Capacitance
Failure Rate/
Design
Packaging/Grade
C
e
ramic
Voltage
Dielectr
ic
Terminatio
n
Fini
s
h
(L" x W")
Series
Code (pF)
Tolerance
(C-Spec)
0805
C = Standard 2 Significant Digits B = ±0.10 pF C = 500 V
G = C0G A = N/A
C = 100% Matte Sn Blank = Bulk
1206
+ Number of Zeros C = ±0.25 pF B = 630 V
L = SnPb (5%
TU = 7" Reel
1210
1808
1812
Use 9 for
1.0 – 9.9 pF
Use 8 for
D = ±0.5 pF
D = 1,000 V
F = 1,500 V
minimum)
Unmarked
F = ±1%
G = ±2%
AUTO =
G = 2,000 V
Z = 2,500 V
H = 3,000 V
Automotive Grade
7"Reel Unmarked
1825
0.5 – .99 pF
J = ±5%
K = ±10%
2220 ex. 2.2 pF = 229
2225
ex. 0.5 pF = 508
M = ±20%
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013
4
Roll Over for
Order Info.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Table 1A – Capacitance Range/Selection Waterfall (0805 – 1808 Case Sizes) cont'd
Series
C0805
C1206
C1210
C1808
Voltage Code
C
B
D
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
Z
H
Cap
Code
Capacitance
Voltage DC
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
1,000 pF
1,100 pF
1,200 pF
1,300 pF
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
3,000 pF
3,300 pF
102
112
122
132
152
162
182
202
222
302
332
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
EG EF¹
FM FM FM
FM FK FK
FM FK FK
FM FS FS
FK FS FS
FK FS FS
FK FS FS
FK
LB LB LB
LC LC LC
LC LC LC
LC LC LC
LC LC LC
LC LC LC
LC LC LC
LC
FK
FS
FS
LC
Voltage VDC
Cap
Code
Capacitance
Voltage Code
C
B
D
C
B
D
F
G
C
B
D
F
G
C
B
D
F
G
Z
H
Series
C0805
C1206
C1210
C1808
Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes)
Series
C1812
C1825
C2220
C2225
Voltage Code
C
B
D
F
G
Z
H
C
B
D
F
G
Z
H
C
B
D
F
G
Z
H
C
B
D
F
G
Z
H
Cap
Capacitance
Code
Voltage DC
Capacitance Tolerance
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
10 pF
11 pF
12 pF
13 pF
15 pF
16 pF
18 pF
20 pF
22 pF
24 pF
27 pF
30 pF
33 pF
36 pF
39 pF
43 pF
47 pF
51 pF
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
B
B
B
C
C
C
C
C
C
C
C
C
C
C
C
C
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
C
1210
C
332
J
C
G
A
C
TU
Case Size Specification/
Capacitance
Capacitance
Failure Rate/
Packaging/Grade
Ceramic
Voltage Dielectric Termination Finish
(L" x W")
Series
Code (pF)
Tolerance
Design
(C-Spec)
0805
C = Standard 2 Significant Digits B = ±0.10 pF C = 500 V
+ Number of Zeros C = ±0.25 pF B = 630 V
G = C0G A = N/A
C = 100% Matte Sn Blank = Bulk
1206
L = SnPb (5%
minimum)
TU = 7" Reel
C
1210
Use 9 for
1.0 – 9.9 pF
Use 8 for
D = ±0.5 pF
F = ±1%
G = ±2%
D = 1,000 V
Unmarked
1808
1812
1825
F = 1,500 V
G = 2,000 V
AUTO =
Automotive Grade
K
0.5 – .99 pF
J = ±5%
K = ±10%
Z = 2,500 V
H = 3,000 V
7"Reel Unmarked
th
2220 ex. 2.2 pF = 229
2225
ex. 0.5 pF = 508
M = ±20%
Th
xx
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013
5
Roll Over for
Order Info.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes) cont'd
Series
C1812
C1825
C2220
C2225
Voltage Code
C
B
D
F
G
Z
H
C
B
D
F
G
Z
H
C
B
D
F
G
Z
H
C
B
D
F
G
Z
H
Cap
Capacitance
Code
Voltage DC
Capacitance Tolerance
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
100 pF
110 pF
120 pF
130 pF
150 pF
160 pF
180 pF
200 pF
220 pF
240 pF
270 pF
300 pF
330 pF
360 pF
390 pF
430 pF
470 pF
510 pF
560 pF
620 pF
680 pF
750 pF
820 pF
910 pF
1,000 pF
1,100 pF
1,200 pF
1,300 pF
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
2,400 pF
2,700 pF
3,000 pF
3,300 pF
3,600 pF
3,900 pF
4,300 pF
4,700 pF
5,100 pF
5,600 pF
6,200 pF
6,800 pF
7,500 pF
101
111
121
131
151
161
181
201
221
241
271
301
331
361
391
431
471
511
561
621
681
751
821
911
102
112
122
132
152
162
182
202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
GH GH GH GH GH GK
GH GH GH GH GH GK
GH GH GH GH GH GK
GH GH GH GH GH GK
GH GH GH GH GH GK
GH GH GH GH GH GK
GK GK GK GK GH GK
GK GK GK GK GK GK
GK GK GK GK GK GK
GK GK GK GK GK GK
GH GH GH GK
GH GH GH GK
GH GH GH GK
GH GH GH GK
GH GH GH GK
GH GH GH GK
GH GH GH
GH GH GH
GH GK GK
GH GK GK
GH GK GK
GK GK GK
GK GK GK
GK GK GK
GK GK GK
HE HE HE HE HE HE HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
HE HE HE HE HE HE HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF
HE HE HE HE HE HE HG JP JP JP JP JP JP JP KE KE KE KE KE KE KF
HE HE HE HE HE HE HG JP JP JP JP JP JP JP KE KE KE KE KE KE KF
HE HE HE HE HE HE HG JP JP JP JP JP JP JP KE KE KE KE KE KE KF
HE HE HE HE HE HE HG JE JE JE JE JE JP JP KE KE KE KE KE KE KF
HE HE HE HE HE HE HG JE JE JE JE JE JP JP KE KE KE KE KE KE KF
HE HE HE HE HE HE HG JE JE JE JE JE JP JP KE KE KE KE KE KE KF
HE HE HE HE HE HE
HE HE HE HE HE HE
HE HE HE HE HE HE
HE HE HE HE HG HE
HE HE HE HE HG HE
HE HE HE HE HG HG
HE HE HE HG HG HG
HE HE HE HG HG HG
HE HE HE HG HG HG
HE HE HE HG HG HG
HE HE HE HG HG
HE HE HE HG HG
HE HE HE HG
HE HE HE HG
HE HG HG HG
HE HG HG HG
HE HG HG
JE JE JE JE JE JP
JE JE JE JE JE JP
JP JP JP JP JP JP
JP JP JP JP JP JP
JP JP JP JP JP JP
JE JE JE JP JP JP
JE JE JE JP JP JP
JE JE JE JP JP JP
JE JP JP JP JP JP
JE JP JP JP JP JP
JE JP JP JP JP
JE JP JP JP JP
JE JP JP JP
JE JP JP JP
JE JP JP JP
JE JP JP JP
JE JP JP
KE KE KE KE KE KE KF
KF KF KF KF KE KE KF
KF KF KF KF KE KE KF
KF KF KF KF KE KE KF
KF KF KF KF KE KF
KF KF KF KF KE KF
KE KE KE KF KE KF
KE KE KE KF KE KF
KE KE KE KF KE KF
KE KE KE KF KE KF
KE KE KE KF KF KF
KE KE KE KF KF KF
KE KE KE KF KF
KE KE KE KF KF
KE KE KE KF
KE KE KE KF
KE KE KE KF
KE KE KE KF
KE KE KE
GK GK GK
GK
HE HG HG
JE JP JP
HE HG HG
JP JP JP
GK
HE HG HG
JP JP JP
KE KE KE
GK
HG HG HG
JP JP JP
KE KE KE
GK
HG HG HG
JP JP JP
KE KE KE
GK
HG HG HG
JP JP JP
KE KF KF
GK
HG HG HG
JP JP JP
KE KF KF
HG HG HG
JP JP JP
KE KF KF
HG HG HG
JP JP JP
KE KF KF
HG
JP JP JP
KE KF KF
HG
JP JP JP
KE KF KF
HG
JP
KE KF KF
HG
JP
KE KF KF
HG
JP
KF
C
1
2
10
C
332
J
C
G
A
C
TU
Case Size Specification/
Capacitance
Capacitance
Tolerance
Failure Rate/
Design
Packaging/Grade
(C-Spec)
Ceramic
Voltage
Dielectric
Termination Finish
(L" x W")
Series
Code (pF)
C
0805
1206
1210
C = Standard 2 Significant Digits B = ±0.10 pF C = 500 V
G = C0G A = N/A
C = 100% Matte Sn Blank = Bulk
TU = 7" Reel
+ Number of Zeros C = ±0.25 pF B = 630 V
Use 9 for D = ±0.5 pF D = 1,000 V
L = SnPb (5%
minimum)
Unmarked
AUTO =
Automotive Grade
7"Reel Unmarked
K
1808
1.0 – 9.9 pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
F = 1,500 V
G = 2,000 V
Z = 2,500 V
H = 3,000 V
th
1812 Use 8 for
Th
1825
0.5 – .99 pF
ex. 2.2 pF = 229
ex. 0.5 pF = 508
xx
2220
2225
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013
6
Roll Over for
Order Info.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Table 2 – Chip Thickness/Packaging Quantities
Paper Quantity
7" Reel 13" Reel
Plastic Quantity
7" Reel 13" Reel
Thickness Case Thickness ±
Code
Size
Range (mm)
DG
EF
EG
FG
FM
FK
FS
LA
LB
LC
GH
GK
HE
HG
JE
0805
1206
1206
1210
1210
1210
1210
1808
1808
1808
1812
1812
1825
1825
2220
2220
2225
2225
1.25 ± 0.15
1.20 ± 0.15
1.60 ± 0.15
1.25 ± 0.15
1.70 ± 0.20
2.10 ± 0.20
2.50 ± 0.20
1.40 ± 0.15
1.60 ± 0.15
2.00 ± 0.15
1.40 ± 0.15
1.60 ± 0.20
1.40 ± 0.15
1.60 ± 0.20
1.40 ± 0.15
1.60 ± 0.20
1.40 ± 0.15
1.60 ± 0.20
0
0
2,500
2,500
2,000
2,500
2,000
2,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
10,000
10,000
8,000
10,000
8,000
8,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
JP
KE
KF
7" Reel
13" Reel
7" Reel
13" Reel
Thickness
Code
Case
Size
Thickness ±
Range (mm)
Paper Quantity
Plastic Quantity
Package quantity based on finished chip thickness specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
EIA
Size
Code
Metric
Size
Code
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0805
1206
1210
12101
1808
1812
1825
2220
2225
2012
3216
3225
3225
4520
4532
4564
5650
5664
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1.60
1.60
1.50
2.30
2.15
2.15
2.75
2.70
1.35
1.35
1.60
1.75
1.60
1.60
1.70
1.70
1.90
2.80
2.90
2.30
3.60
6.90
5.50
6.90
5.60
5.65
5.60
7.40
6.90
6.90
8.20
8.10
2.90
3.80
3.90
3.30
4.60
7.90
6.50
7.90
1.50
1.50
1.40
2.20
2.05
2.05
2.65
2.60
1.15
1.15
1.40
1.55
1.40
1.40
1.50
1.50
1.80
2.70
2.80
2.20
3.50
6.80
5.40
6.80
4.70
4.70
4.70
6.50
6.00
6.00
7.30
7.20
2.30
3.20
3.30
2.70
4.00
7.30
5.90
7.30
1.40
1.40
1.30
2.10
1.95
1.95
2.55
2.50
0.95
0.95
1.20
1.35
1.20
1.20
1.30
1.30
1.70
2.60
2.70
2.10
3.40
6.70
5.30
6.70
4.00
4.00
4.00
5.80
5.30
5.30
6.60
6.50
2.00
2.90
3.00
2.40
3.70
7.00
5.60
7.00
1 Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Soldering Profile:
• KEMET recommends following the guidelines outlined in IPC / JEDEC J–STD–020
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Board Flex
JIS–C–6429
Magnification 50 X. Conditions:
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
Solderability
J–STD–002
c) Method D, category 3 @ 260°C
Temperature Cycling
Biased Humidity
JESD22 Method JA–104
MIL–STD–202 Method 103
1,000 cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and 200 VDC maximum. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at
24 hours +/- 2 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours +/- 2 hours
after test conclusion.
Moisture Resistance
Thermal Shock
MIL–STD–202 Method 106
MIL–STD–202 Method 107
-55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20 seconds. Dwell
time – 15 minutes. Air – Air.
High Temperature Life MIL–STD–202 Method 108 1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with rated voltage applied.
Storage Life
Vibration
MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.
5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure
MIL–STD–202 Method 204 points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10 – 2,000 Hz
Mechanical Shock
MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Construction
Reference
Item
Material
A
B
C
D
E
Finish
100% Matte Sn SnPb (5% min)
Termination
System
Barrier Layer
Base Metal
Ni
Cu
Inner Electrode
Dielectric Material
Ni
CaZrO3
Note: Image is exaggerated in order to clearly identify all components of construction.
Capacitor Marking (Optional):
Laser marking option is not available on:
• C0G, Ultra Stable X8R and Y5V dielectric devices
• EIA 0402 case size devices
• EIA 0603 case size devices with Flexible Termination option.
• KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
®
Embossed Plastic* or
Punched Paper Carrier.
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
KEMET
Sprocket Holes
Embossment or Punched Cavity
8 mm, 12 mm
or 16 mm Carrier Tape
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
178 mm (7.00")
or
330 mm (13.00")
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration – Embossed Plastic & Punched Paper (mm)
EIA Case Size
01005 – 0402
0603 – 1210
Tape Size (W)*
Pitch (P1)*
8
8
2
4
1805 – 1808
12
12
12
16
8
4
≥ 1812
8
KPS 1210
8
KPS 1812 & 2220
Array 0508 & 0612
12
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
T
T
P2
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
2
E
1
Po
ØDo
Ao
F
Ko
W
E
2
B
1
Bo
S
1
P
1
T
1
Embossment
For cavity size,
see Note 1 Table 4
Center Lines of Cavity
ØD
1
Cover Tape
is for tape feeder reference only,
including draft concentric about B
B
1
o
.
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
D1 Minimum
Note 1
1.0
(0.039)
R Reference S1 Minimum
T
T1
Tape Size
8 mm
D0
E1
P0
P2
Note 2
Note 3
Maximum
Maximum
25.0
(0.984)
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm
16 mm
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
1.5
(0.059)
30
(1.181)
Variable Dimensions — Millimeters (Inches)
B1 Maximum
Note 4
4.35
(0.171)
E2
T2
W
Tape Size
8 mm
Pitch
F
P1
A0,B0 & K0
Minimum
6.25
(0.246)
Maximum
2.5
(0.098)
Maximum
8.3
(0.327)
3.5 ±0.05
(0.138 ±0.002) (0.157 ±0.004)
4.0 ±0.10
Single (4 mm)
Single (4 mm) &
Double (8 mm)
8.2
10.25
5.5 ±0.05
8.0 ±0.10
4.6
12.3
12 mm
16 mm
Note 5
(0.323)
(0.404)
(0.217 ±0.002) (0.315 ±0.004)
(0.181)
(0.484)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05 12.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
Triple (12 mm)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
P2
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
E
1
Po
ØDo
0
A
F
W
2
E
0
B
Bottom Cover Tape
P
1
G
Cavity Size,
See
1
T
1
T
Top Cover Tape
Center Lines of Cavity
Note 1, Table 7
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
R Reference
Note 2
Tape Size
8 mm
D0
E1
P0
P2
T1 Maximum
G Minimum
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002) (0.004) Maximum
0.10
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
Pitch
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B0
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
8.3
(0.327)
8.3
Half (2 mm)
Single (4 mm)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
1.1
(0.098)
Note 1
8 mm
(0.157 ±0.004)
(0.327)
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
8 mm
Peel Strength
0.1 to 1.0 Newton (10 to 100 gf)
0.1 to 1.3 Newton (10 to 130 gf)
12 and 16 mm
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
°
°
T
s
Width (mm) Rotation (
)
8,12
16 – 200
20
10
Bo
Tape
Maximum
°
S
Width (mm) Rotation (
)
8,12
16 – 56
72 – 200
20
10
5
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
Figure 5 – Bending Radius
Embossed
Carrier
Punched
Carrier
8 mm & 12 mm Tape
16 mm Tape
0.5 mm maximum
0.5 mm maximum
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius,
W3 (Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
See Note
W
2 (Measured at hub)
D
(See Note)
A
N
C
(Arbor hole
W
1 (Measured at hub)
diameter)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
B
(see Note)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
A
B Minimum
C
D Minimum
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
N Minimum
W1
W2 Maximum
W3
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
50
(1.969)
12.4 +2.0/-0.0
18.4
Shall accommodate tape width
without interference
12 mm
16 mm
(0.488 +0.078/-0.0)
(0.724)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Carrier Tape
Round Sprocket Holes
Punched Carrier
8 mm & 12 mm only
START
END
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
100 mm
Minimum Leader
400 mm Minimum
Trailer
160 mm Minimum
Components
Top Cover Tape
Figure 8 – Maximum Camber
Elongated sprocket holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
KEMET Corporation
World Headquarters
Europe
Asia
Southern Europe
Paris, France
Tel: 33-1-4646-1006
Northeast Asia
Hong Kong
Tel: 852-2305-1168
2835 KEMET Way
Simpsonville, SC 29681
Sasso Marconi, Italy
Tel: 39-051-939111
Shenzhen, China
Tel: 86-755-2518-1306
Mailing Address:
P.O. Box 5928
Greenville, SC 29606
Beijing, China
Central Europe
Landsberg, Germany
Tel: 49-8191-3350800
Tel: 86-10-5829-1711
www.kemet.com
Tel: 864-963-6300
Fax: 864-963-6521
Shanghai, China
Tel: 86-21-6447-0707
Kamen, Germany
Tel: 49-2307-438110
Corporate Offices
Fort Lauderdale, FL
Tel: 954-766-2800
Taipei, Taiwan
Tel: 886-2-27528585
Northern Europe
Bishop’s Stortford, United Kingdom
Tel: 44-1279-460122
North America
Southeast Asia
Singapore
Southeast
Tel: 65-6586-1900
Lake Mary, FL
Tel: 407-855-8886
Espoo, Finland
Tel: 358-9-5406-5000
Penang, Malaysia
Tel: 60-4-6430200
Northeast
Wilmington, MA
Tel: 978-658-1663
Bangalore, India
Tel: 91-806-53-76817
Central
Novi, MI
Tel: 248-994-1030
West
Milpitas, CA
Tel: 408-433-9950
Mexico
Guadalajara, Jalisco
Tel: 52-33-3123-2141
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not
assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of
KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Other KEMET Resources
Tools
Resource
Location
Configure A Part: CapEdge
SPICE & FIT Software
http://capacitoredge.kemet.com
http://www.kemet.com/spice
http://www.kemet.com/keask
http://www.kemet.com:8080/elc
Search Our FAQs: KnowledgeEdge
Electrolytic LifeCalculator
Product Information
Resource
Location
Products
Technical Resources (Including Soldering Techniques)
RoHS Statement
http://www.kemet.com/products
http://www.kemet.com/technicalpapers
http://www.kemet.com/rohs
Quality Documents
http://www.kemet.com/qualitydocuments
Product Request
Resource
Location
http://www.kemet.com/sample
http://www.kemet.com/kits
Sample Request
Engineering Kit Request
Contact
Resource
Location
Website
Contact Us
Investor Relations
Call Us
www.kemet.com
http://www.kemet.com/contact
http://www.kemet.com/ir
1-877-MyKEMET
Twitter
http://twitter.com/kemetcapacitors
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) are subject to change without notice.
All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we
specifically disclaim – any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the requisite
experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the
use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.
Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur.
Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or
redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not
be required.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)
Digitally signed by Jeannette Calvo
DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing
Communications, cn=Jeannette Calvo, email=jeannettecalvo@kemet.com
Date: 2013.01.11 12:03:56 -05'00'
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1009_C0G_HV_SMD • 1/8/2013 19
相关型号:
C1808C270CCGACTU
Ceramic Capacitor, Multilayer, Ceramic, 500V, 0.93% +Tol, 0.93% -Tol, C0G, 30ppm/Cel TC, 0.000027uF, Surface Mount, 1808, CHIP, ROHS COMPLIANT
KEMET
C1808C270CCGAL
Ceramic Capacitor, Multilayer, Ceramic, 500V, 0.93% +Tol, 0.93% -Tol, C0G, 30ppm/Cel TC, 0.000027uF, Surface Mount, 1808, CHIP
KEMET
C1808C270CDGACTU
Ceramic Capacitor, Multilayer, Ceramic, 1000V, 0.93% +Tol, 0.93% -Tol, C0G, 30ppm/Cel TC, 0.000027uF, Surface Mount, 1808, CHIP, ROHS COMPLIANT
KEMET
C1808C270CDGAL
Ceramic Capacitor, Multilayer, Ceramic, 1000V, 0.93% +Tol, 0.93% -Tol, C0G, 30ppm/Cel TC, 0.000027uF, Surface Mount, 1808, CHIP
KEMET
C1808C270CFGALTU
Ceramic Capacitor, Multilayer, Ceramic, 1500V, 0.93% +Tol, 0.93% -Tol, C0G, 30ppm/Cel TC, 0.000027uF, Surface Mount, 1808, CHIP
KEMET
©2020 ICPDF网 联系我们和版权申明